WO2008126215A1 - Bond and its bonding method - Google Patents

Bond and its bonding method Download PDF

Info

Publication number
WO2008126215A1
WO2008126215A1 PCT/JP2007/056591 JP2007056591W WO2008126215A1 WO 2008126215 A1 WO2008126215 A1 WO 2008126215A1 JP 2007056591 W JP2007056591 W JP 2007056591W WO 2008126215 A1 WO2008126215 A1 WO 2008126215A1
Authority
WO
WIPO (PCT)
Prior art keywords
terminal
plane
soft copper
bond
bonding method
Prior art date
Application number
PCT/JP2007/056591
Other languages
French (fr)
Japanese (ja)
Inventor
Katsumi Yoshinaga
Tadayuki Iwanaga
Kenkichi Ohyama
Keita Shiotani
Original Assignee
Showa Tecs Co., Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Tecs Co., Ltd filed Critical Showa Tecs Co., Ltd
Priority to JP2008526704A priority Critical patent/JP4524324B2/en
Priority to PCT/JP2007/056591 priority patent/WO2008126215A1/en
Publication of WO2008126215A1 publication Critical patent/WO2008126215A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
    • H01R4/64—Connections between or with conductive parts having primarily a non-electric function, e.g. frame, casing, rail
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/11—End pieces or tapping pieces for wires, supported by the wire and for facilitating electrical connection to some other wire, terminal or conductive member
    • H01R11/16—End pieces terminating in a soldering tip or socket

Abstract

A rail bond (1) comprises a terminal (2) which is a flat copper plate, a soft copper strand (5) formed by twisting a plurality of soft copper wires, and a fixing portion (4) for connecting the soft copper strand (5) with the terminal. On the plane of the terminal being boded to the side face of a rail for vehicle, a plurality of linear grooves (3) are intersecting at a substantially right angle to form a plurality of rectangular divisions on the plane. The grooves (3) do not stop within the plane but the opposite ends of the continuous groove extend up to the circumferential edge of the terminal.
PCT/JP2007/056591 2007-03-28 2007-03-28 Bond and its bonding method WO2008126215A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2008526704A JP4524324B2 (en) 2007-03-28 2007-03-28 Bond and bond bonding method
PCT/JP2007/056591 WO2008126215A1 (en) 2007-03-28 2007-03-28 Bond and its bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/056591 WO2008126215A1 (en) 2007-03-28 2007-03-28 Bond and its bonding method

Publications (1)

Publication Number Publication Date
WO2008126215A1 true WO2008126215A1 (en) 2008-10-23

Family

ID=39863398

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/056591 WO2008126215A1 (en) 2007-03-28 2007-03-28 Bond and its bonding method

Country Status (2)

Country Link
JP (1) JP4524324B2 (en)
WO (1) WO2008126215A1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013214423A (en) * 2012-04-02 2013-10-17 Showa Tekkusu:Kk Rail-bond
JP2014073511A (en) * 2012-10-04 2014-04-24 Shingo Kizai Co Ltd Method for welding rail bond
WO2015037112A1 (en) * 2013-09-13 2015-03-19 株式会社昭和テックス Rail bond
JP2016105419A (en) * 2016-02-24 2016-06-09 株式会社昭和テックス Rail-bond

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5945869U (en) * 1982-09-17 1984-03-27 水野貴金属株式会社 Pins for electronic device connection terminals
JP2004273403A (en) * 2003-03-10 2004-09-30 Nichiyu Giken Kogyo Co Ltd Rail bond terminal, method of mounting it, and fixture for mounting it
WO2006112473A1 (en) * 2005-04-20 2006-10-26 Showa Tecs Co., Ltd. Bond and joining method for bond

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5945869U (en) * 1982-09-17 1984-03-27 水野貴金属株式会社 Pins for electronic device connection terminals
JP2004273403A (en) * 2003-03-10 2004-09-30 Nichiyu Giken Kogyo Co Ltd Rail bond terminal, method of mounting it, and fixture for mounting it
WO2006112473A1 (en) * 2005-04-20 2006-10-26 Showa Tecs Co., Ltd. Bond and joining method for bond

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013214423A (en) * 2012-04-02 2013-10-17 Showa Tekkusu:Kk Rail-bond
JP2014073511A (en) * 2012-10-04 2014-04-24 Shingo Kizai Co Ltd Method for welding rail bond
WO2015037112A1 (en) * 2013-09-13 2015-03-19 株式会社昭和テックス Rail bond
JP2016105419A (en) * 2016-02-24 2016-06-09 株式会社昭和テックス Rail-bond

Also Published As

Publication number Publication date
JP4524324B2 (en) 2010-08-18
JPWO2008126215A1 (en) 2010-07-22

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