WO2008126078A3 - System and method for generating a finite elements model of a pcb - Google Patents

System and method for generating a finite elements model of a pcb Download PDF

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Publication number
WO2008126078A3
WO2008126078A3 PCT/IL2008/000492 IL2008000492W WO2008126078A3 WO 2008126078 A3 WO2008126078 A3 WO 2008126078A3 IL 2008000492 W IL2008000492 W IL 2008000492W WO 2008126078 A3 WO2008126078 A3 WO 2008126078A3
Authority
WO
WIPO (PCT)
Prior art keywords
finite elements
components
board
pcb
component
Prior art date
Application number
PCT/IL2008/000492
Other languages
French (fr)
Other versions
WO2008126078A2 (en
Inventor
Abraham Varon-Weinryb
Original Assignee
Expert Dynamics Ltd
Abraham Varon-Weinryb
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Expert Dynamics Ltd, Abraham Varon-Weinryb filed Critical Expert Dynamics Ltd
Publication of WO2008126078A2 publication Critical patent/WO2008126078A2/en
Publication of WO2008126078A3 publication Critical patent/WO2008126078A3/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/20—Design optimisation, verification or simulation
    • G06F30/23—Design optimisation, verification or simulation using finite element methods [FEM] or finite difference methods [FDM]
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2113/00—Details relating to the application field
    • G06F2113/18—Chip packaging

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Evolutionary Computation (AREA)
  • Geometry (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Management, Administration, Business Operations System, And Electronic Commerce (AREA)
  • Complex Calculations (AREA)

Abstract

The invention relates to a system for producing a finite elements model of a PCB assembly, which comprises: (a) finite elements components library which comprises a collection of finite elements data sets relating to various components existing in the market; (b) a PCB layout file which comprises at least the geometry of the board and a components list containing for each component on the board the identification of that component and the component exact location and orientation on the board; and (c) a finite elements model generator for: receiving said PCB layout file; based on said components list, extracting from the library for at least a portion of the components on the board, finite elements data sets, each data set corresponds to a component; and, given said geometry details of the board, said components list, and said components data sets as extracted from the library, generating by the finite elements model generator a finite elements meshed model of the PCB assembly.
PCT/IL2008/000492 2007-04-12 2008-04-10 System and method for generating a finite elements model of a pcb WO2008126078A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IL182526A IL182526A0 (en) 2007-04-12 2007-04-12 System and method for generating a finite elements model
IL182526 2007-04-12

Publications (2)

Publication Number Publication Date
WO2008126078A2 WO2008126078A2 (en) 2008-10-23
WO2008126078A3 true WO2008126078A3 (en) 2009-06-11

Family

ID=39796850

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IL2008/000492 WO2008126078A2 (en) 2007-04-12 2008-04-10 System and method for generating a finite elements model of a pcb

Country Status (2)

Country Link
IL (1) IL182526A0 (en)
WO (1) WO2008126078A2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107784142B (en) * 2016-08-31 2021-10-19 株洲中车时代半导体有限公司 Thermal simulation method of semiconductor power component

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5986481B2 (en) * 2012-11-05 2016-09-06 住友ゴム工業株式会社 How to create a simulation model
GB201520361D0 (en) 2015-11-18 2015-12-30 Romax Technology Ltd Driveline modeller
CN109002592B (en) * 2018-06-26 2022-09-16 安徽理工大学 Full-automatic modeling method for random pitting pits in plate solid finite element model
CN111967214A (en) * 2020-08-14 2020-11-20 上海佳研实业有限公司 Software system capable of realizing printed circuit board aided design
CN117131832B (en) * 2023-10-23 2024-02-02 巨霖科技(上海)有限公司 Method and device for constructing simulation component and storage medium

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0892331A2 (en) * 1997-07-18 1999-01-20 Fujitsu Limited Apparatus for setting heating condition in heating furnace and thermal analyzer for object to be heated in heating furnace
US20020144228A1 (en) * 2000-01-04 2002-10-03 Fujitsu Limited Method and apparatus for designing printed-circuit board
US20050289497A1 (en) * 2004-06-29 2005-12-29 Sharp Kabushiki Kaisha Layout designing/characteristic analyzing apparatus for a wiring board

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0892331A2 (en) * 1997-07-18 1999-01-20 Fujitsu Limited Apparatus for setting heating condition in heating furnace and thermal analyzer for object to be heated in heating furnace
US20020144228A1 (en) * 2000-01-04 2002-10-03 Fujitsu Limited Method and apparatus for designing printed-circuit board
US20050289497A1 (en) * 2004-06-29 2005-12-29 Sharp Kabushiki Kaisha Layout designing/characteristic analyzing apparatus for a wiring board

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
GODFREY W M ET AL: "Interactive thermal modeling of electronic circuit boards", IEEE TRANSACTIONS ON COMPONENTS, HYBRIDS, AND MANUFACTURING TECHNOLOGY USA, vol. 16, no. 8, December 1993 (1993-12-01), pages 978 - 985, XP002499938, ISSN: 0148-6411 *
KANG E ET AL: "Intelligent finite element mesh generation", ENGINEERING WITH COMPUTERS USA, vol. 11, no. 2, 1995, pages 70 - 82, XP002500377, ISSN: 0177-0667 *
ZHOU W X ET AL: "CAD-based analysis tools for electronic packaging design. (A new modeling methodology for a virtual development environment)", PRESENTED AT ADVANCES IN ELECTRONIC PACKAGING 1997, 15 June 1997 (1997-06-15) - 19 June 1997 (1997-06-19), pages 1 - 9, XP002499939, ISBN: 0-7918-1559-5 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107784142B (en) * 2016-08-31 2021-10-19 株洲中车时代半导体有限公司 Thermal simulation method of semiconductor power component

Also Published As

Publication number Publication date
WO2008126078A2 (en) 2008-10-23
IL182526A0 (en) 2007-09-20

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