WO2008123670A1 - Appareil d'éclairage par del à dissipation de chaleur sans ventilateur - Google Patents

Appareil d'éclairage par del à dissipation de chaleur sans ventilateur Download PDF

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Publication number
WO2008123670A1
WO2008123670A1 PCT/KR2008/001784 KR2008001784W WO2008123670A1 WO 2008123670 A1 WO2008123670 A1 WO 2008123670A1 KR 2008001784 W KR2008001784 W KR 2008001784W WO 2008123670 A1 WO2008123670 A1 WO 2008123670A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat dissipating
heat
lighting apparatus
led lighting
pcb
Prior art date
Application number
PCT/KR2008/001784
Other languages
English (en)
Inventor
Young Ho Yoo
Original Assignee
Fawoo Technology Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020070035259A external-priority patent/KR100778235B1/ko
Priority claimed from KR1020070065295A external-priority patent/KR20090001140A/ko
Application filed by Fawoo Technology Co., Ltd. filed Critical Fawoo Technology Co., Ltd.
Publication of WO2008123670A1 publication Critical patent/WO2008123670A1/fr

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/61—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using light guides
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode

Definitions

  • the present invention relates, in general, to an LED lighting apparatus and, more particularly, to a heat dissipating LED lighting apparatus without a fan, in which a heat dissipating means has the shape of a disc that has at a center thereof a light source unit, thus providing a large heat dissipating part that allows heat to be smoothly dissipated even in a windless space which is not ventilated, therefore efficiently dissipating heat generated by LEDs without using a blowing fan, and maximizing the lifespan and quality of the apparatus.
  • an LED Light Emitting Diode
  • a conventional light source has a smaller size and a longer lifespan than a conventional light source, and directly converts electric energy into light energy, so that power consumption is low, thus affording high luminous intensity having superior energy efficiency, and has a fast response time.
  • various lighting apparatuses using LEDs as the light source have been developed.
  • a conventional LED lighting apparatus 100 includes a light source unit having a plurality of LEDs 111 which are mounted on a PCB 113, a heat dissipating means 130 which is attached to the PCB, and a housing 150 which accommodates the light source unit and the heat dissipating means.
  • a power connection part 151 is provided on the housing, and connects the PCB 113 to power.
  • the heat dissipating means 130 having the shape of a vertical cylinder, is provided around the housing.
  • heat dissipating fins 133 protrude from the circumference of the heat dissipating means at regular intervals, so that the heat dissipating fins 133 and gaps 131 are alternately disposed.
  • the heat dissipating means 130 has the shape of a cylinder around which the heat dissipating fins 133 and the gaps 131 are arranged at regular intervals. This construction excellently performs a heat dissipating operation in an environment that is well ventilated, because of the increase in surface area resulting from the formation of the heat dissipating fins 133.
  • the temperature difference between the lower portion 133a, which is adjacent to the PCB 113, and the upper portion 133b, which is farthest from the PCB is less than 10% (see FIG. 12).
  • the temperature difference between the heat dissipating fins 133 and the gaps 131 is less than 10% (see FIG. 13).
  • the conventional heat dissipating means substantially loses its heat dissipating function, as is known from the slight temperature difference between the lower portion 133a, which is near the PCB, and the upper portion 133b, which is distant from the PCB.
  • the prior art has proposed a method of flowing current that is lower than rated current through the PCB, thus reducing the thermal load.
  • the method is problematic in that the brightness of the LEDs is reduced, so that the number of LEDs must be increased to meet the preset illuminance of the lighting apparatus. Thus, electric energy is wasted, and the manufacturing cost is increased because of the increase in the number of LEDs.
  • the lifespan of the LEDs is about 50,000 hours, whereas the lifespan of the blowing fan is only about 10,000 hours.
  • the blowing fan considerably reduces the lifespan of the LED lighting apparatus, and generates noise, so that it is impossible to use the LED lighting apparatus in a quiet room.
  • the surface of the heat dissipating means may be covered with dust because of the blowing operation, so that heat dissipating efficiency is reduced.
  • an object of the present invention is to provide a heat dissipating LED lighting apparatus without a fan, in which a heat dissipating means has the shape of a disc that has at a center thereof a light source unit, thus providing a large heat dissipating part that allows heat to be smoothly dissipated even in a windless space which is not ventilated, therefore efficiently dissipating heat generated by LEDs without using a blowing fan, and maximizing the lifespan and quality of the apparatus.
  • Another object of the present invention is to provide a heat dissipating LED lighting apparatus without a fan, in which power is automatically cut off when a heat dissipating means is covered with dust, so that heat dissipating performance is deteriorated, or when the surrounding temperature exceeds a preset upper temperature limit, thus preventing heat of high temperature from being generated, and affording easy maintenance.
  • the present invention provides a heat dissipating LED lighting apparatus without a fan, including a light source unit having a PCB and a plurality of LEDs (Light Emitting Diodes) mounted to the PCB, a heat dissipating means attached to the PCB to dissipate heat from the light source unit, and a housing coupled to the heat dissipating means and having a screw- or plug-type power connection part, wherein the heat dissipating means includes a disc-shaped heat dissipating means having on a central portion thereof a heat absorbing part, which is attached to the PCB and is coupled to the housing, with a heat dissipating part extending outwards from a circumference of the heat absorbing part in a shape of a disc.
  • the heat dissipating means includes a disc-shaped heat dissipating means having on a central portion thereof a heat absorbing part, which is attached to the PCB and is coupled to the housing, with a heat dissi
  • a heat dissipating LED lighting apparatus without a fan is constructed so that a heat dissipating means has the shape of a disc that has at a center thereof a light source unit, thus providing a large heat dissipating part that allows heat to be smoothly dissipated even in a windless space which is not ventilated, therefore efficiently dissipating heat generated by LEDs without using a blowing fan, and maximizing the lifespan and quality of the apparatus.
  • a heat dissipating LED lighting apparatus without a fan is constructed so that power is automatically cut off when a heat dissipating means is covered with dust, so that heat dissipating performance is deteriorated, or when the surrounding temperature exceeds a preset upper temperature limit, thus preventing heat of high temperature from being generated, and affording easy maintenance.
  • FIG. 1 is a perspective view showing the construction of an LED lighting apparatus, according to an embodiment of the present invention
  • FIG. 2 is a sectional view of FIG. 1 ;
  • FIG. 3 is a view showing the construction of an LED lighting apparatus, according to an embodiment of the present invention
  • FIG. 4 is a perspective view showing a disc-shaped heat dissipating means, according to an embodiment of the present invention
  • FIG. 5 is a sectional view showing an LED lighting apparatus equipped with the disc-shaped heat dissipating means of FIG. 4
  • FIG. 6 is a sectional view showing the construction of an LED lighting apparatus, according to an embodiment of the present invention
  • FIG. 7 is a bottom view of FIG. 6;
  • FIG. 8 is a sectional view showing the construction of an LED lighting apparatus, according to an embodiment of the present invention.
  • FIG. 9 is a sectional view showing the construction of an LED lighting apparatus, according to an embodiment of the present invention.
  • FIG. 10 is a sectional view showing the construction of an LED lighting apparatus, according to an embodiment of the present invention.
  • FIG. 11 is a plan view showing a disc-shaped heat dissipating means of FIG. 10;
  • FIG. 12 is a view showing the construction of a conventional LED lighting apparatus.
  • FIG. 13 is a bottom view of FIG. 12.
  • FIG. 1 is a perspective view showing the construction of an LED lighting apparatus according to an embodiment of the present invention
  • FIG. 2 is a sectional view of FIG. 1.
  • the heat dissipating LED lighting apparatus 1 without a fan includes a light source unit 10, a heat dissipating means, and a housing 50.
  • the light source unit has a PCB 13, and a plurality of LEDs (Light Emitting Diodes) 11 which are mounted to the PCB.
  • the heat dissipating means is attached to the PCB 13 to dissipate heat from the light source unit 10.
  • the housing 50 is coupled to the heat dissipating means, and has a screw- or plug-type power connection part 51.
  • the heat dissipating means comprises a disc-shaped heat dissipating means 30.
  • the heat dissipating part 33 comprises a plane on which scratched parts
  • the scratched parts 331, each having a V-shaped cross-section are continuously formed on at least one of front and back surfaces of the heat dissipating part 33.
  • each scratched part 331, comprising a V-shaped notch has the shape of an isosceles right triangle.
  • a right-angle portion of the isosceles right triangle corresponds to the vertical angle ⁇ of the V-shaped notch (see FIG. 2).
  • the vertical angle ⁇ preferably ranges from about 110° to 60°.
  • Each scratched part 331 may have shapes other than the V-shaped notch.
  • the scratched parts 331 are formed in the shape of a concentric circle or spiral, and form an uneven part having very shallow depressions.
  • the uneven part of the present invention which is formed by the scratched parts, is different from a conventional uneven part which is formed by heat dissipating fins and gaps between the dissipating fins and has relatively deep depressions.
  • the heat dissipating part 33 is provided to form a step with the heat absorbing part 31 (see FIGS. 2 and 3) or is provided on an extension surface of the heat absorbing part (see FIGS. 4 and 5), with a cable hole 35 formed in the heat absorbing part 31.
  • the heat dissipating part 33 of the heat dissipating means 30 is arranged parallel to the PCB 13, so that the heat dissipating part may have the shape of a horizontal disc (see FIGS. 1 and 2).
  • the heat dissipating part may have the shape of a cover which is upwardly inclined (see FIG. 3) or is downwardly curved (see FIGS. 4 and 5).
  • the heat dissipating part 33 includes a horizontal part 332 which is parallel to the PCB 13, and a non-horizontal part 333 which is bent to be inclined relative to the horizontal part 332 or to be perpendicular to the horizontal part.
  • ventilation holes 334 are radially formed in the horizontal part 332.
  • LED lighting apparatus may further include at least one subsidiary heat dissipating member 30a which is connected to at least one of an upper portion and a lower portion of the disc-shaped heat dissipating means 30.
  • the subsidiary heat dissipating member 30a has the shape of a cup, and includes a fastening part 37 which is detachably fastened to the disc-shaped heat dissipating means 30.
  • the subsidiary heat dissipating member 30a has the shape of a cup which is cut at the bottom thereof and has scratched parts 331 on the surface thereof, and is connected or adhered to the disc-shaped heat dissipating means in order to efficiently perform a heat exchange process.
  • the subsidiary heat dissipating member may be secured to an aluminum spacer 83 or an aluminum fastening ring 85.
  • the subsidiary heat dissipating member 30a is useful when the diameter of the discshaped heat dissipating means is small. As shown in FIG. 9, when the subsidiary heat dissipating member is mounted to the lower portion of the disc-shaped heat dissipating means 30, the subsidiary heat dissipating member serves as a lighting shade which is used to focus the light of the LEDs.
  • the disc-shaped heat dissipating means 30 has a plurality of heat dissipating fins 336 which are radially provided on the heat dissipating part 33 in such a way as to protrude therefrom.
  • Each heat dissipating fin 336 may have the shape of a rib which is formed such that its height is gradually reduced in a direction from an inner position to an outer position.
  • the heat dissipating fins 33 are arranged to be spaced apart from each other.
  • a temperature sensor 21 is mounted to the heat absorbing part 31 of the disc-shaped heat dissipating means 30, and controls the LEDs so that they are turned off when the heat absorbing part 31 exceeds a preset temperature.
  • FIG. 3 is a view showing the power connection part 51, which is constructed to be mounted to a plug-type socket.
  • the power connection part 51 is constructed to be mounted to a screw-type socket.
  • Reference numeral '15' of the drawings denotes a drive part of a halogen lamp (see
  • FIG. 3 or an adapter which converts AC current into DC current.
  • Reference numeral '36' denotes fastening holes (see FIG. 3)
  • reference numeral '70' denotes a light guiding and diffusing means which changes point light of the LEDs into surface light.
  • the present invention is characterized in that heat dissipating fins are omitted from the heat dissipating means 30, and the heat dissipating part 33 has the shape of a disc which extends from the PCB 13 in the radial direction thereof while being parallel to or inclined or curved relative to the PCB.
  • the heat dissipating part 33 has no heat dissipating fins and gaps, and is not vertically installed. That is, the heat dissipating part 33 of the present invention has the shape of a disc, thus ensuring a heat dissipating area for smoothly dissipating heat even in a windless space.
  • the heat dissipating area is equal to a value obtained by multiplying a circumference and a height.
  • the heat dissipating area is equal to 3.14 times the square of the increased radius. As such, the present invention remarkably increases the heat dissipating area.
  • the heat dissipating part has the shape of a vertical cylinder surrounding the housing
  • the inner surface of the heat dissipating part faces the PCB, which emits heat, so that heat dissipating efficiency is very low.
  • the heat dissipating part 30 extends horizontally from the PCB 13 so that the radius of the heat dissipating part is increased, and both front and back surfaces of the heat dissipating part 30 are exposed to ambient temperature.
  • heat dissipating efficiency is considerably high.
  • the scratched parts 331 are formed on the surface of the heat dissipating part 33.
  • each scratched part 331 comprises a V-shaped notch having an isosceles triangular shape and the vertical angle ⁇ of the scratched part is 90°, assuming that the length Ll of the hypotenuse of the V-shaped notch is 2, the length L2 of each side is .
  • the increase in the surface area due to the V-shaped notch is times the length of the hypotenuse.
  • the V-shaped notches are continuously formed. Consequently, the surface area of the heat dissipating part is increased by a factor of about 1.414.
  • the heat dissipating area is doubled.
  • the pitch between the V-shaped notches is reduced, the vertical angle ⁇ is reduced.
  • the heat dissipating area which prevents heat from staying in each V-shaped notch, is increased, and thus the heat dissipating operation is efficiently performed.
  • each V-shaped notch is an acute angle, for example,
  • the scratched parts 331 are continuously formed on the heat dissipating part, thus considerably increasing the heat-dissipating surface area, and preventing air from remaining, therefore allowing heat generated by the LEDs to be smoothly dissipated, without using a blowing fan, in an environment in which air is not ventilated and remains.
  • the subsidiary heat dissipating member 30a is additionally mounted to the disc-shaped heat dissipating means 30, the heat dissipating capacity is further increased to cope with a large amount of heat which is generated by the light source unit.
  • the subsidiary heat dissipating member 30a is mounted to the lower portion of the disc-shaped heat dissipating means 30, the subsidiary heat dissipating member serves as a lighting shade which improves heat dissipating performance and prevents light from diffusing over a wide range.
  • the present invention provides a heat dissipating LED lighting apparatus without a fan, in which a heat dissipating means has the shape of a disc that has at a center thereof a light source unit, thus providing a large heat dissipating part that allows heat to be smoothly dissipated even in a windless space which is not ventilated, therefore efficiently dissipating heat generated by LEDs without using a blowing fan, and maximizing the lifespan and quality of the apparatus.
  • the present invention provides a heat dissipating LED lighting apparatus without a fan, in which power is automatically cut off when a heat dissipating means is covered with dust, so that heat dissipating performance is deteriorated, or when the surrounding temperature exceeds a preset upper temperature limit, thus preventing heat of high temperature from being generated, and affording easy maintenance.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

L'invention concerne un appareil d'éclairage par DEL à dissipation de chaleur sans ventilateur. L'appareil d'éclairage comprend une unité de source de lumière qui a une carte de circuits imprimés et plusieurs DEL montées sur la carte de circuits imprimés, un moyen de dissipation de chaleur qui est fixé à la carte de circuits imprimés pour dissiper la chaleur provenant de l'unité de source de lumière, et un boîtier qui est couplé au moyen de dissipation de chaleur et a une partie de connexion de puissance de type à vis ou à douille. Ici, le moyen de dissipation de chaleur comprend un moyen de dissipation de chaleur en forme de disque ayant sur une partie centrale de celui-ci une partie d'absorption de chaleur, qui est fixée à la carte de circuits imprimés et est couplée au boîtier, avec une partie de dissipation de chaleur s'étendant vers l'extérieur à partir d'une périphérie de la partie d'absorption de chaleur dans une forme de disque. La partie de dissipation de chaleur comprend un plan sur lequel des parties rayées sont formées de façon compacte et non régulière.
PCT/KR2008/001784 2007-04-10 2008-03-31 Appareil d'éclairage par del à dissipation de chaleur sans ventilateur WO2008123670A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR1020070035259A KR100778235B1 (ko) 2007-04-10 2007-04-10 무팬(無 ｆａｎ) 방열 엘이디 조명기구
KR10-2007-0035259 2007-04-10
KR1020070065295A KR20090001140A (ko) 2007-06-29 2007-06-29 무팬(無 Ｆａｎ) 방열 엘이디 조명기구
KR10-2007-0065295 2007-06-29

Publications (1)

Publication Number Publication Date
WO2008123670A1 true WO2008123670A1 (fr) 2008-10-16

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ID=39831107

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2008/001784 WO2008123670A1 (fr) 2007-04-10 2008-03-31 Appareil d'éclairage par del à dissipation de chaleur sans ventilateur

Country Status (1)

Country Link
WO (1) WO2008123670A1 (fr)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011037878A1 (fr) * 2009-09-25 2011-03-31 Cree, Inc. Dispositif d'éclairage pourvu d'un ou de plusieurs éléments de dissipateur thermique amovibles
EP2339232A1 (fr) * 2009-12-24 2011-06-29 Sieled Lampe pour projecteur et projecteur muni d'une telle lampe
WO2011092191A1 (fr) * 2010-01-26 2011-08-04 Arm Concept 5 Dispositif d'éclairage par diodes leds
WO2012020013A1 (fr) * 2010-08-10 2012-02-16 Osram Ag Plaquette de circuits imprimés comportant au moins une source de lumière à semi-conducteurs, support pour la plaquette, système composé de la plaquette et du support et procédé pour fixer la plaquette sur le support
CN102798007A (zh) * 2012-07-23 2012-11-28 贵州光浦森光电有限公司 一种以散热器为安装界面的led筒灯
CN102954378A (zh) * 2012-11-05 2013-03-06 中国科学院半导体研究所 高光功率密度led光源模块
CN104595764A (zh) * 2009-11-09 2015-05-06 Lg伊诺特有限公司 照明装置
US9562680B2 (en) 2009-11-09 2017-02-07 LG Innotek., Ltd. Lighting device
CN107559677A (zh) * 2017-09-21 2018-01-09 佛山市深研信息技术有限公司 一种基于商场大楼外用散热效果好的led大灯

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR980004082U (ko) * 1997-11-07 1998-03-30 민광기 형광등 및 안정기 고정장치
KR20040027642A (ko) * 2004-02-19 2004-04-01 (주) 케이티지 하이브리드 ic형 led 전등
KR20040037523A (ko) * 2002-10-29 2004-05-07 중부전기전자주식회사 엘이디형 조명기구

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR980004082U (ko) * 1997-11-07 1998-03-30 민광기 형광등 및 안정기 고정장치
KR20040037523A (ko) * 2002-10-29 2004-05-07 중부전기전자주식회사 엘이디형 조명기구
KR20040027642A (ko) * 2004-02-19 2004-04-01 (주) 케이티지 하이브리드 ic형 led 전등

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011037878A1 (fr) * 2009-09-25 2011-03-31 Cree, Inc. Dispositif d'éclairage pourvu d'un ou de plusieurs éléments de dissipateur thermique amovibles
US9464801B2 (en) 2009-09-25 2016-10-11 Cree, Inc. Lighting device with one or more removable heat sink elements
CN104595764A (zh) * 2009-11-09 2015-05-06 Lg伊诺特有限公司 照明装置
US9562680B2 (en) 2009-11-09 2017-02-07 LG Innotek., Ltd. Lighting device
EP2339232A1 (fr) * 2009-12-24 2011-06-29 Sieled Lampe pour projecteur et projecteur muni d'une telle lampe
FR2954809A1 (fr) * 2009-12-24 2011-07-01 Siebec Lampe pour projecteur et projecteur muni d'une telle lampe
WO2011092191A1 (fr) * 2010-01-26 2011-08-04 Arm Concept 5 Dispositif d'éclairage par diodes leds
WO2012020013A1 (fr) * 2010-08-10 2012-02-16 Osram Ag Plaquette de circuits imprimés comportant au moins une source de lumière à semi-conducteurs, support pour la plaquette, système composé de la plaquette et du support et procédé pour fixer la plaquette sur le support
US9103536B2 (en) 2010-08-10 2015-08-11 Osram Gmbh Assembly having a semiconductor light source and support for a printed circuit board, and method for mounting the assembly
CN102798007A (zh) * 2012-07-23 2012-11-28 贵州光浦森光电有限公司 一种以散热器为安装界面的led筒灯
CN102954378A (zh) * 2012-11-05 2013-03-06 中国科学院半导体研究所 高光功率密度led光源模块
CN107559677A (zh) * 2017-09-21 2018-01-09 佛山市深研信息技术有限公司 一种基于商场大楼外用散热效果好的led大灯

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