WO2008123550A1 - ビーム加工装置およびビーム観察装置 - Google Patents
ビーム加工装置およびビーム観察装置 Download PDFInfo
- Publication number
- WO2008123550A1 WO2008123550A1 PCT/JP2008/056598 JP2008056598W WO2008123550A1 WO 2008123550 A1 WO2008123550 A1 WO 2008123550A1 JP 2008056598 W JP2008056598 W JP 2008056598W WO 2008123550 A1 WO2008123550 A1 WO 2008123550A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- hollow member
- processing apparatus
- outputting
- hollow
- work
- Prior art date
Links
- 238000012544 monitoring process Methods 0.000 title abstract 3
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/18—Vacuum locks ; Means for obtaining or maintaining the desired pressure within the vessel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/16—Vessels; Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/305—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching
- H01J37/3053—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching for evaporating or etching
- H01J37/3056—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching for evaporating or etching for microworking, e. g. etching of gratings or trimming of electrical components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/16—Vessels
- H01J2237/162—Open vessel, i.e. one end sealed by object or workpiece
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/16—Vessels
- H01J2237/166—Sealing means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/26—Electron or ion microscopes
- H01J2237/28—Scanning microscopes
Landscapes
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Laser Beam Processing (AREA)
Abstract
本発明は、小形化が可能でかつコストの低減が可能なビーム加工装置またはビーム観察装置を提供することを目的とする。 本発明のビーム加工装置またはビーム観察装置は、ビーム出射源と、ワーク(2)に向けてビームを出射する出射部(25a)を有しビーム出射源からワーク(2)に向かうビームが通過するビーム通過部材(25)と、ワーク(2)が固定される固定面(6a)を有し所定方向へ移動可能な固定部材(6)と、3次元方向に変形可能にかつ中空状に形成され、ビーム通過部材(25)が内部に配置される中空部材(23)とを備えている。中空部材(23)は、少なくとも、互いに接続される第1の中空部材(26)と第2の中空部材(27)とから構成されている。また、中空部材(23)の一端には開口部(37)が形成され、中空部材(23)の一端は固定面に当接するとともに、中空部材(23)の内部は真空状態とされる。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007096994A JP2008257929A (ja) | 2007-04-03 | 2007-04-03 | ビーム加工装置およびビーム観察装置 |
JP2007-096994 | 2007-04-03 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008123550A1 true WO2008123550A1 (ja) | 2008-10-16 |
Family
ID=39831023
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/056598 WO2008123550A1 (ja) | 2007-04-03 | 2008-04-02 | ビーム加工装置およびビーム観察装置 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP2008257929A (ja) |
WO (1) | WO2008123550A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109243952A (zh) * | 2018-10-26 | 2019-01-18 | 长沙埃福思科技有限公司 | 双真空室离子束修形加工系统及修形加工方法 |
WO2023094088A1 (en) * | 2021-11-29 | 2023-06-01 | Asml Netherlands B.V. | Platform for charged particle apparatus and components within a charged particle apparatus |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004327302A (ja) * | 2003-04-25 | 2004-11-18 | Sony Corp | 電子顕微鏡 |
JP2006244720A (ja) * | 2005-02-28 | 2006-09-14 | Jeol Ltd | ビーム装置 |
JP2006294481A (ja) * | 2005-04-13 | 2006-10-26 | Hitachi High-Technologies Corp | 荷電粒子線装置 |
JP2007019045A (ja) * | 2003-09-10 | 2007-01-25 | Hitachi High-Technologies Corp | 小型電子銃 |
JP2007188821A (ja) * | 2006-01-16 | 2007-07-26 | Univ Osaka Sangyo | ハンディ電子顕微鏡 |
-
2007
- 2007-04-03 JP JP2007096994A patent/JP2008257929A/ja active Pending
-
2008
- 2008-04-02 WO PCT/JP2008/056598 patent/WO2008123550A1/ja active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004327302A (ja) * | 2003-04-25 | 2004-11-18 | Sony Corp | 電子顕微鏡 |
JP2007019045A (ja) * | 2003-09-10 | 2007-01-25 | Hitachi High-Technologies Corp | 小型電子銃 |
JP2006244720A (ja) * | 2005-02-28 | 2006-09-14 | Jeol Ltd | ビーム装置 |
JP2006294481A (ja) * | 2005-04-13 | 2006-10-26 | Hitachi High-Technologies Corp | 荷電粒子線装置 |
JP2007188821A (ja) * | 2006-01-16 | 2007-07-26 | Univ Osaka Sangyo | ハンディ電子顕微鏡 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109243952A (zh) * | 2018-10-26 | 2019-01-18 | 长沙埃福思科技有限公司 | 双真空室离子束修形加工系统及修形加工方法 |
CN109243952B (zh) * | 2018-10-26 | 2024-02-27 | 长沙埃福思科技有限公司 | 双真空室离子束修形加工系统及修形加工方法 |
WO2023094088A1 (en) * | 2021-11-29 | 2023-06-01 | Asml Netherlands B.V. | Platform for charged particle apparatus and components within a charged particle apparatus |
Also Published As
Publication number | Publication date |
---|---|
JP2008257929A (ja) | 2008-10-23 |
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