WO2008122335A3 - Apparatus for measurement of substrates - Google Patents

Apparatus for measurement of substrates Download PDF

Info

Publication number
WO2008122335A3
WO2008122335A3 PCT/EP2008/001817 EP2008001817W WO2008122335A3 WO 2008122335 A3 WO2008122335 A3 WO 2008122335A3 EP 2008001817 W EP2008001817 W EP 2008001817W WO 2008122335 A3 WO2008122335 A3 WO 2008122335A3
Authority
WO
WIPO (PCT)
Prior art keywords
measurement
carrier
flushing
substrate
objective
Prior art date
Application number
PCT/EP2008/001817
Other languages
French (fr)
Other versions
WO2008122335A2 (en
Inventor
Ulrich Stroessner
Gerd Klose
Albrecht Hof
Monika Frey
Original Assignee
Zeiss Carl Sms Gmbh
Ulrich Stroessner
Gerd Klose
Albrecht Hof
Monika Frey
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zeiss Carl Sms Gmbh, Ulrich Stroessner, Gerd Klose, Albrecht Hof, Monika Frey filed Critical Zeiss Carl Sms Gmbh
Publication of WO2008122335A2 publication Critical patent/WO2008122335A2/en
Publication of WO2008122335A3 publication Critical patent/WO2008122335A3/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70933—Purge, e.g. exchanging fluid or gas to remove pollutants
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
    • G03F1/84—Inspecting
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature

Landscapes

  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Toxicology (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
  • Instruments For Measurement Of Length By Optical Means (AREA)

Abstract

The invention relates to an apparatus for measurement of substrates, comprising a carrier (2) for receiving the substrate to be measured; a measurement objective which images onto a detector a portion of the substrate held by the carrier (2); a measurement device by which the position of the carrier (2) is imaged onto a detector (12); a measurement device by which the position of the carrier (2) holding the substrate is determined relative to the measurement objective, with the measurement device comprising at least one laser interferometer (5) for position determination; a first flushing device which passes a first flushing medium in a laminar flow through the apparatus for generating a constant measurement atmosphere, as well as an adjustment device by which the carrier (2) can be moved relative to the measurement objective. In such an apparatus, a second flushing device is provided which passes a second flushing medium through the region of the measurement device in which the at least one laser interferometer (5) is located.
PCT/EP2008/001817 2007-04-05 2008-03-07 Apparatus for measurement of substrates WO2008122335A2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US91037707P 2007-04-05 2007-04-05
US60/910,377 2007-04-05
DE200710034942 DE102007034942A1 (en) 2007-04-05 2007-07-24 Device for measuring substrates
DE102007034942.6 2007-07-24

Publications (2)

Publication Number Publication Date
WO2008122335A2 WO2008122335A2 (en) 2008-10-16
WO2008122335A3 true WO2008122335A3 (en) 2009-05-28

Family

ID=39744339

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2008/001817 WO2008122335A2 (en) 2007-04-05 2008-03-07 Apparatus for measurement of substrates

Country Status (3)

Country Link
DE (1) DE102007034942A1 (en)
TW (1) TW200907289A (en)
WO (1) WO2008122335A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102001226B1 (en) * 2012-11-12 2019-07-25 삼성디스플레이 주식회사 Laser induced thermal imaging apparatus and laser induced thermal imaging method

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0498499A1 (en) * 1991-02-07 1992-08-12 ASM Lithography B.V. Method of and device for repetitively imaging a mask pattern on a substrate
DE19628969C1 (en) * 1996-07-18 1997-10-02 Leica Mikroskopie & Syst Coordinate position measuring device using dual-beam interferometer
EP0838728A2 (en) * 1996-10-24 1998-04-29 Nikon Corporation Precision stage interferometer system with air duct
US20040022694A1 (en) * 1998-02-25 2004-02-05 Canon Kabushiki Kaisha Processing apparatus, measuring apparatus, and device manufacturing method
US20040156026A1 (en) * 2000-12-27 2004-08-12 Nikon Corporation Exposure apparatus and exposure method
US20060055899A1 (en) * 2004-09-10 2006-03-16 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US20060279743A1 (en) * 2005-05-13 2006-12-14 Vistec Semiconductor Systems Gmbh Measuring device and method for determining relative positions of a positioning stage configured to be moveable in at least one direction
DE102005052758A1 (en) * 2005-11-04 2007-05-16 Leica Microsystems Substrate holding device for use in a position measuring device
DE102005052757A1 (en) * 2005-11-04 2007-05-31 Vistec Semiconductor Systems Gmbh Device for measuring the position of an object with a laser interferometer system

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1204838B (en) * 1960-11-24 1965-11-11 Olympus Optical Co Interference comparator
DE3447488A1 (en) * 1984-10-19 1986-05-07 Canon K.K., Tokio/Tokyo PROJECTION DEVICE
EP0302124A1 (en) * 1987-08-03 1989-02-08 Mercotrust Aktiengesellschaft Apparatus for projection copying from masks onto a substrate
AT393763B (en) * 1989-03-21 1991-12-10 Tabarelli Werner DEVICE FOR CONSISTENCY THE AIR WAVELENGTH OF LASER LIGHT
JPH03252507A (en) * 1990-03-02 1991-11-11 Hitachi Ltd Laser interference length measuring instrument and positioning method using same
JP3365571B2 (en) * 1993-11-10 2003-01-14 株式会社ニコン Optical measuring device and exposure device
JP3825921B2 (en) * 1998-07-23 2006-09-27 キヤノン株式会社 Scanning exposure apparatus and device manufacturing method
EP1098226A3 (en) * 1999-11-05 2002-01-09 Asm Lithography B.V. Lithographic apparatus with gas flushing system
DE102007017630B4 (en) * 2006-05-16 2009-08-20 Vistec Semiconductor Systems Gmbh A method of increasing measurement accuracy in determining the coordinates of structures on a substrate

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0498499A1 (en) * 1991-02-07 1992-08-12 ASM Lithography B.V. Method of and device for repetitively imaging a mask pattern on a substrate
DE19628969C1 (en) * 1996-07-18 1997-10-02 Leica Mikroskopie & Syst Coordinate position measuring device using dual-beam interferometer
EP0838728A2 (en) * 1996-10-24 1998-04-29 Nikon Corporation Precision stage interferometer system with air duct
US20040022694A1 (en) * 1998-02-25 2004-02-05 Canon Kabushiki Kaisha Processing apparatus, measuring apparatus, and device manufacturing method
US20040156026A1 (en) * 2000-12-27 2004-08-12 Nikon Corporation Exposure apparatus and exposure method
US20060055899A1 (en) * 2004-09-10 2006-03-16 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US20060279743A1 (en) * 2005-05-13 2006-12-14 Vistec Semiconductor Systems Gmbh Measuring device and method for determining relative positions of a positioning stage configured to be moveable in at least one direction
DE102005052758A1 (en) * 2005-11-04 2007-05-16 Leica Microsystems Substrate holding device for use in a position measuring device
DE102005052757A1 (en) * 2005-11-04 2007-05-31 Vistec Semiconductor Systems Gmbh Device for measuring the position of an object with a laser interferometer system

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
ADAM DIETER ET AL: "First measurement data obtained on the new Vistec LMS IPRO4", SPIE PROCEEDINGS, vol. 6533, 3 May 2007 (2007-05-03), XP002489484 *
EMLC 2007: 23RD EUROPEAN MASK AND LITHOGRAPHY CONFERENCE 2007, METROLOGY I, 22 January 2007 (2007-01-22) - 25 January 2007 (2007-01-25), Grenoble, France *

Also Published As

Publication number Publication date
TW200907289A (en) 2009-02-16
DE102007034942A1 (en) 2008-10-16
WO2008122335A2 (en) 2008-10-16

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