WO2008120458A1 - Pedestal leveling method and pedestal leveling device - Google Patents

Pedestal leveling method and pedestal leveling device Download PDF

Info

Publication number
WO2008120458A1
WO2008120458A1 PCT/JP2008/000626 JP2008000626W WO2008120458A1 WO 2008120458 A1 WO2008120458 A1 WO 2008120458A1 JP 2008000626 W JP2008000626 W JP 2008000626W WO 2008120458 A1 WO2008120458 A1 WO 2008120458A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
pedestal
light beam
substrate pedestal
leveling
Prior art date
Application number
PCT/JP2008/000626
Other languages
French (fr)
Japanese (ja)
Inventor
Toru Yamada
Original Assignee
Shin-Etsu Handotai Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin-Etsu Handotai Co., Ltd. filed Critical Shin-Etsu Handotai Co., Ltd.
Publication of WO2008120458A1 publication Critical patent/WO2008120458A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means

Abstract

A pedestal leveling method and device for leveling a substrate pedestal (4) so that the substrate (5) placed on the substrate pedestal (4) equipped in a semiconductor substrate processing system may be in a horizontal position. The device and method is characterized in that a light emitter (1) installed above the substrate pedestal (4) emits a light beam vertically downward, the light beam (2) is reflected from the substrate (5) placed on the substrate pedestal (4), and the inclination of the substrate pedestal (4) is adjusted so that the reflected light beam (3) may be aligned with the emitted light beam (2) to level the substrate pedestal. With this, when the substrate pedestal on which a semiconductor substrate is placed is leveled so that the semiconductor substrate may be in a horizontal position, the processing furnace of the semiconductor substrate processing system does not need to be opened, and any device for leveling the substrate pedestal does not need to be provided in the processing furnace. Thus, the substrate pedestal can be leveled simply and inexpensively.
PCT/JP2008/000626 2007-03-29 2008-03-18 Pedestal leveling method and pedestal leveling device WO2008120458A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-087269 2007-03-29
JP2007087269A JP4893414B2 (en) 2007-03-29 2007-03-29 Mounting table leveling method and mounting table leveling device

Publications (1)

Publication Number Publication Date
WO2008120458A1 true WO2008120458A1 (en) 2008-10-09

Family

ID=39808044

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/000626 WO2008120458A1 (en) 2007-03-29 2008-03-18 Pedestal leveling method and pedestal leveling device

Country Status (2)

Country Link
JP (1) JP4893414B2 (en)
WO (1) WO2008120458A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104576436A (en) * 2013-10-12 2015-04-29 北京北方微电子基地设备工艺研究中心有限责任公司 Film magazine position detecting device, transmitting system and semiconductor processing equipment

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60144606A (en) * 1984-01-06 1985-07-31 Toshiba Corp Position measuring device
JPH02187933A (en) * 1989-01-13 1990-07-24 Hitachi Maxell Ltd Inclination angle measuring method
JPH03220407A (en) * 1990-01-25 1991-09-27 Sumitomo Heavy Ind Ltd Inclination detector
JPH0587548A (en) * 1991-05-01 1993-04-06 Hitachi Electron Eng Co Ltd Attitude angle detector
JPH06265329A (en) * 1993-03-11 1994-09-20 Nikon Corp Inclination detector for plane board
JPH10221037A (en) * 1997-02-05 1998-08-21 Matsushita Electric Ind Co Ltd Method and apparatus for inspecting disk shape

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60144606A (en) * 1984-01-06 1985-07-31 Toshiba Corp Position measuring device
JPH02187933A (en) * 1989-01-13 1990-07-24 Hitachi Maxell Ltd Inclination angle measuring method
JPH03220407A (en) * 1990-01-25 1991-09-27 Sumitomo Heavy Ind Ltd Inclination detector
JPH0587548A (en) * 1991-05-01 1993-04-06 Hitachi Electron Eng Co Ltd Attitude angle detector
JPH06265329A (en) * 1993-03-11 1994-09-20 Nikon Corp Inclination detector for plane board
JPH10221037A (en) * 1997-02-05 1998-08-21 Matsushita Electric Ind Co Ltd Method and apparatus for inspecting disk shape

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104576436A (en) * 2013-10-12 2015-04-29 北京北方微电子基地设备工艺研究中心有限责任公司 Film magazine position detecting device, transmitting system and semiconductor processing equipment

Also Published As

Publication number Publication date
JP2008251577A (en) 2008-10-16
JP4893414B2 (en) 2012-03-07

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