WO2008120458A1 - Pedestal leveling method and pedestal leveling device - Google Patents
Pedestal leveling method and pedestal leveling device Download PDFInfo
- Publication number
- WO2008120458A1 WO2008120458A1 PCT/JP2008/000626 JP2008000626W WO2008120458A1 WO 2008120458 A1 WO2008120458 A1 WO 2008120458A1 JP 2008000626 W JP2008000626 W JP 2008000626W WO 2008120458 A1 WO2008120458 A1 WO 2008120458A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- pedestal
- light beam
- substrate pedestal
- leveling
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Drying Of Semiconductors (AREA)
Abstract
A pedestal leveling method and device for leveling a substrate pedestal (4) so that the substrate (5) placed on the substrate pedestal (4) equipped in a semiconductor substrate processing system may be in a horizontal position. The device and method is characterized in that a light emitter (1) installed above the substrate pedestal (4) emits a light beam vertically downward, the light beam (2) is reflected from the substrate (5) placed on the substrate pedestal (4), and the inclination of the substrate pedestal (4) is adjusted so that the reflected light beam (3) may be aligned with the emitted light beam (2) to level the substrate pedestal. With this, when the substrate pedestal on which a semiconductor substrate is placed is leveled so that the semiconductor substrate may be in a horizontal position, the processing furnace of the semiconductor substrate processing system does not need to be opened, and any device for leveling the substrate pedestal does not need to be provided in the processing furnace. Thus, the substrate pedestal can be leveled simply and inexpensively.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-087269 | 2007-03-29 | ||
JP2007087269A JP4893414B2 (en) | 2007-03-29 | 2007-03-29 | Mounting table leveling method and mounting table leveling device |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008120458A1 true WO2008120458A1 (en) | 2008-10-09 |
Family
ID=39808044
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/000626 WO2008120458A1 (en) | 2007-03-29 | 2008-03-18 | Pedestal leveling method and pedestal leveling device |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP4893414B2 (en) |
WO (1) | WO2008120458A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104576436A (en) * | 2013-10-12 | 2015-04-29 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Film magazine position detecting device, transmitting system and semiconductor processing equipment |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60144606A (en) * | 1984-01-06 | 1985-07-31 | Toshiba Corp | Position measuring device |
JPH02187933A (en) * | 1989-01-13 | 1990-07-24 | Hitachi Maxell Ltd | Inclination angle measuring method |
JPH03220407A (en) * | 1990-01-25 | 1991-09-27 | Sumitomo Heavy Ind Ltd | Inclination detector |
JPH0587548A (en) * | 1991-05-01 | 1993-04-06 | Hitachi Electron Eng Co Ltd | Attitude angle detector |
JPH06265329A (en) * | 1993-03-11 | 1994-09-20 | Nikon Corp | Inclination detector for plane board |
JPH10221037A (en) * | 1997-02-05 | 1998-08-21 | Matsushita Electric Ind Co Ltd | Method and apparatus for inspecting disk shape |
-
2007
- 2007-03-29 JP JP2007087269A patent/JP4893414B2/en not_active Expired - Fee Related
-
2008
- 2008-03-18 WO PCT/JP2008/000626 patent/WO2008120458A1/en active Application Filing
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60144606A (en) * | 1984-01-06 | 1985-07-31 | Toshiba Corp | Position measuring device |
JPH02187933A (en) * | 1989-01-13 | 1990-07-24 | Hitachi Maxell Ltd | Inclination angle measuring method |
JPH03220407A (en) * | 1990-01-25 | 1991-09-27 | Sumitomo Heavy Ind Ltd | Inclination detector |
JPH0587548A (en) * | 1991-05-01 | 1993-04-06 | Hitachi Electron Eng Co Ltd | Attitude angle detector |
JPH06265329A (en) * | 1993-03-11 | 1994-09-20 | Nikon Corp | Inclination detector for plane board |
JPH10221037A (en) * | 1997-02-05 | 1998-08-21 | Matsushita Electric Ind Co Ltd | Method and apparatus for inspecting disk shape |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104576436A (en) * | 2013-10-12 | 2015-04-29 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Film magazine position detecting device, transmitting system and semiconductor processing equipment |
Also Published As
Publication number | Publication date |
---|---|
JP4893414B2 (en) | 2012-03-07 |
JP2008251577A (en) | 2008-10-16 |
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