WO2008117436A1 - Cooling system - Google Patents

Cooling system Download PDF

Info

Publication number
WO2008117436A1
WO2008117436A1 PCT/JP2007/056392 JP2007056392W WO2008117436A1 WO 2008117436 A1 WO2008117436 A1 WO 2008117436A1 JP 2007056392 W JP2007056392 W JP 2007056392W WO 2008117436 A1 WO2008117436 A1 WO 2008117436A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic device
upstream side
cooling system
cooling
side tank
Prior art date
Application number
PCT/JP2007/056392
Other languages
French (fr)
Japanese (ja)
Inventor
Junichi Ishimine
Original Assignee
Fujitsu Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Limited filed Critical Fujitsu Limited
Priority to PCT/JP2007/056392 priority Critical patent/WO2008117436A1/en
Publication of WO2008117436A1 publication Critical patent/WO2008117436A1/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A cooling system for cooling a heating element in an electronic device (2) comprises an upstream side tank (4) disposed above the electronic device (2) and so constituted that the tank can store a liquid refrigerant, a supply pipe (6) for connecting the upstream side tank (4) and the electronic device (2) to each other, and a discharge pipe (8) having one end connected to the electronic device (2) and the other end disposed below the electronic device (2). The liquid refrigerant in the upstream side tank (4) is supplied to the electronic device (2) through the supply pipe (6), and after cooling the heating elements in the electronic device (2), the liquid is discharged through the discharge pipe (8).
PCT/JP2007/056392 2007-03-27 2007-03-27 Cooling system WO2008117436A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/056392 WO2008117436A1 (en) 2007-03-27 2007-03-27 Cooling system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/056392 WO2008117436A1 (en) 2007-03-27 2007-03-27 Cooling system

Publications (1)

Publication Number Publication Date
WO2008117436A1 true WO2008117436A1 (en) 2008-10-02

Family

ID=39788179

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/056392 WO2008117436A1 (en) 2007-03-27 2007-03-27 Cooling system

Country Status (1)

Country Link
WO (1) WO2008117436A1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011257976A (en) * 2010-06-09 2011-12-22 Kawamura Electric Inc Cooling system for server rack
JP5634581B1 (en) * 2013-09-20 2014-12-03 東芝Ｉｔサービス株式会社 Container type data center
JP2019519847A (en) * 2017-01-20 2019-07-11 広東合一新材料研究院有限公司Ｇｕａｎｇｄｏｎｇ Ｈｉ−１ Ｎｅｗ Ｍａｔｅｒｉａｌｓ Ｔｅｃｈｎｏｌｏｇｙ Ｒｅｓｅａｒｃｈ Ｉｎｓｔｉｔｕｔｅ Ｃｏ．， Ｌｔｄ． Data center cabinet and its gravity spray system
JP7501257B2 (en) 2020-09-09 2024-06-18 富士通株式会社 Cooling device, electronic device, and cooling method

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57100710A (en) * 1980-12-16 1982-06-23 Toshiba Corp Evaporation cooling type induction device
JPS59103359A (en) * 1982-12-03 1984-06-14 Mitsubishi Electric Corp Cooling device for heating element
JPS59217348A (en) * 1983-05-25 1984-12-07 Kansai Electric Power Co Inc:The Electric apparatus
JPS63293481A (en) * 1987-05-27 1988-11-30 Hitachi Ltd Cooling method for semiconductor device
JPH0244346U (en) * 1988-09-20 1990-03-27
JPH02129999A (en) * 1988-11-09 1990-05-18 Fujikura Ltd Cooling device for electronic elemnt
JPH03235359A (en) * 1990-02-13 1991-10-21 Hitachi Ltd Cooling method for semiconductor
JP2003509874A (en) * 1999-09-13 2003-03-11 ヒューレット・パッカード・カンパニー Spray cooling system
JP2005203528A (en) * 2004-01-15 2005-07-28 Mitsubishi Electric Corp Cooling member and electronic apparatus

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57100710A (en) * 1980-12-16 1982-06-23 Toshiba Corp Evaporation cooling type induction device
JPS59103359A (en) * 1982-12-03 1984-06-14 Mitsubishi Electric Corp Cooling device for heating element
JPS59217348A (en) * 1983-05-25 1984-12-07 Kansai Electric Power Co Inc:The Electric apparatus
JPS63293481A (en) * 1987-05-27 1988-11-30 Hitachi Ltd Cooling method for semiconductor device
JPH0244346U (en) * 1988-09-20 1990-03-27
JPH02129999A (en) * 1988-11-09 1990-05-18 Fujikura Ltd Cooling device for electronic elemnt
JPH03235359A (en) * 1990-02-13 1991-10-21 Hitachi Ltd Cooling method for semiconductor
JP2003509874A (en) * 1999-09-13 2003-03-11 ヒューレット・パッカード・カンパニー Spray cooling system
JP2005203528A (en) * 2004-01-15 2005-07-28 Mitsubishi Electric Corp Cooling member and electronic apparatus

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011257976A (en) * 2010-06-09 2011-12-22 Kawamura Electric Inc Cooling system for server rack
JP5634581B1 (en) * 2013-09-20 2014-12-03 東芝Ｉｔサービス株式会社 Container type data center
JP2019519847A (en) * 2017-01-20 2019-07-11 広東合一新材料研究院有限公司Ｇｕａｎｇｄｏｎｇ Ｈｉ−１ Ｎｅｗ Ｍａｔｅｒｉａｌｓ Ｔｅｃｈｎｏｌｏｇｙ Ｒｅｓｅａｒｃｈ Ｉｎｓｔｉｔｕｔｅ Ｃｏ．， Ｌｔｄ． Data center cabinet and its gravity spray system
JP7501257B2 (en) 2020-09-09 2024-06-18 富士通株式会社 Cooling device, electronic device, and cooling method

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