WO2008117343A1 - Contact d'examen de substrat - Google Patents

Contact d'examen de substrat Download PDF

Info

Publication number
WO2008117343A1
WO2008117343A1 PCT/JP2007/053353 JP2007053353W WO2008117343A1 WO 2008117343 A1 WO2008117343 A1 WO 2008117343A1 JP 2007053353 W JP2007053353 W JP 2007053353W WO 2008117343 A1 WO2008117343 A1 WO 2008117343A1
Authority
WO
WIPO (PCT)
Prior art keywords
contact
conductive portion
substrate inspection
substrate
inspection
Prior art date
Application number
PCT/JP2007/053353
Other languages
English (en)
Japanese (ja)
Inventor
Kiyoshi Numata
Minoru Kato
Masami Yamamoto
Original Assignee
Nidec-Read Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nidec-Read Corporation filed Critical Nidec-Read Corporation
Priority to PCT/JP2007/053353 priority Critical patent/WO2008117343A1/fr
Priority to TW097102971A priority patent/TW200905203A/zh
Publication of WO2008117343A1 publication Critical patent/WO2008117343A1/fr

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06772—High frequency probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams

Landscapes

  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

L'invention vise à proposer un contact d'examen de substrat pour quatre mesures de borne. Ledit contact peut être fabriqué à un coût faible de par sa structure simple et comporte deux bornes qui peuvent être facilement entrées en contact avec un minuscule point à examiner sans conduire d'électricité entre les deux bornes. À cet effet, le contact d'examen de substrat est muni de première et seconde parties conductrices entrant en contact par pression avec un point à examiner prédéterminé et disposé sur le motif de câblage d'un substrat à examiner, de telle sorte qu'une partie conductrice est utilisée pour une mesure de tension et l'autre est utilisée pour l'application d'un courant. La première partie conductrice est allongée, souple et conductrice ; la seconde partie conductrice est formée d'un élément tubulaire souple et conducteur et renferme la première partie conductrice. En utilisation, les première et seconde parties conductrices du contacteur d'examen de substrat sont mises en contact avec le point à examiner.
PCT/JP2007/053353 2007-02-23 2007-02-23 Contact d'examen de substrat WO2008117343A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/JP2007/053353 WO2008117343A1 (fr) 2007-02-23 2007-02-23 Contact d'examen de substrat
TW097102971A TW200905203A (en) 2007-02-23 2008-01-25 Substrate inspection contact

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/053353 WO2008117343A1 (fr) 2007-02-23 2007-02-23 Contact d'examen de substrat

Publications (1)

Publication Number Publication Date
WO2008117343A1 true WO2008117343A1 (fr) 2008-10-02

Family

ID=39788088

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/053353 WO2008117343A1 (fr) 2007-02-23 2007-02-23 Contact d'examen de substrat

Country Status (2)

Country Link
TW (1) TW200905203A (fr)
WO (1) WO2008117343A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI638165B (zh) * 2017-09-01 2018-10-11 中華精測科技股份有限公司 探針組件及其探針結構

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102110150B1 (ko) * 2019-01-08 2020-06-08 (주)티에스이 신호 전송 커넥터용 도전부 보호부재 및 그 제조방법과, 이를 갖는 신호 전송 커넥터 및 그 제조방법

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0829475A (ja) * 1994-07-12 1996-02-02 Fuji Photo Film Co Ltd 実装基板検査装置のコンタクトプローブ
JP2002228682A (ja) * 2001-02-02 2002-08-14 Tokyo Electron Ltd プローブ

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0829475A (ja) * 1994-07-12 1996-02-02 Fuji Photo Film Co Ltd 実装基板検査装置のコンタクトプローブ
JP2002228682A (ja) * 2001-02-02 2002-08-14 Tokyo Electron Ltd プローブ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI638165B (zh) * 2017-09-01 2018-10-11 中華精測科技股份有限公司 探針組件及其探針結構

Also Published As

Publication number Publication date
TWI372251B (fr) 2012-09-11
TW200905203A (en) 2009-02-01

Similar Documents

Publication Publication Date Title
TW200720665A (en) Jig for inspecting substrate, and inspection probe
TW200728723A (en) Anisotropic conductive connector device and circuit device inspection device
TW200730831A (en) Double-ended contact probe
WO2008076590A3 (fr) Structures électriques de garde pour protéger une piste de signal d'interférences électriques
WO2013049147A3 (fr) Sonde ayant une poutre en porte-à-faux ayant des sections creuse et pleine
WO2013003638A3 (fr) Conducteurs transparents incorporant des additifs et procédés de fabrication associés
WO2010062512A3 (fr) Structure de plafond spécifique et grille de plafond fonctionnelle
WO2008048678A3 (fr) Prises pour structure de plafond électrifiée
TW200746512A (en) Eliminating incorrect battery installation
MY167319A (en) Touch panel and display device with touch panel
MY166609A (en) Connector assembly and method of manufacture
SG195107A1 (en) An electrical interconnect assembly
TWM373022U (en) Electrical contact
WO2009078370A1 (fr) Détecteur de gaz
FR2930849B3 (fr) Prise electrique multiple de securite.
WO2009085445A3 (fr) Connecteur de jonction de fil électrique
ATE518283T1 (de) Elektrische anschlussvorrichtung
CA2895641C (fr) Connecteur electrique pour substrat presentant des pistes conductrices
WO2013043730A3 (fr) Contacts électriques avec des zones nanostructurées
WO2013048759A3 (fr) Interconnexion de cellule photovoltaïque
FI20065247A (fi) Sähköinen liitos ja sähkökomponentti
TW200730845A (en) Substrate inspection apparatus and method thereof
WO2011107497A3 (fr) Dispositif de connexion destiné à un module solaire
TW200708745A (en) Connector for measuring electrical resistance, and apparatus and method for measuring electrical resistance of circuit board
TW200729373A (en) Test module for wafer

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 07714824

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 07714824

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: JP