WO2008114350A1 - Connection module - Google Patents

Connection module Download PDF

Info

Publication number
WO2008114350A1
WO2008114350A1 PCT/JP2007/055401 JP2007055401W WO2008114350A1 WO 2008114350 A1 WO2008114350 A1 WO 2008114350A1 JP 2007055401 W JP2007055401 W JP 2007055401W WO 2008114350 A1 WO2008114350 A1 WO 2008114350A1
Authority
WO
WIPO (PCT)
Prior art keywords
package
substrate
electrode
supporting portion
package substrate
Prior art date
Application number
PCT/JP2007/055401
Other languages
French (fr)
Japanese (ja)
Inventor
Jun Matsui
Koji Terada
Hiroyuki Nobuhara
Original Assignee
Fujitsu Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Limited filed Critical Fujitsu Limited
Priority to JP2009504950A priority Critical patent/JP4823354B2/en
Priority to PCT/JP2007/055401 priority patent/WO2008114350A1/en
Publication of WO2008114350A1 publication Critical patent/WO2008114350A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1076—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by sliding
    • H05K7/1084—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by sliding pin grid array package carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Connecting Device With Holders (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

Mount/demount of a package substrate is simplified by eliminating a mechanism for securing by screwing. One end face of the conductive member (22) of an interconnection substrate (20) arranged in a socket frame (30) is connected with a mounting electrode, i.e., an electrode provided on a mounting substrate (40). Furthermore, a package supporting portion (12) is provided at the end of a package substrate (10), and a receiver opening (32) for receiving the package supporting portion (12) is provided in the socket frame (30). When the package supporting portion (12) and the receiver opening (32) are fitted with each other by inserting the package substrate (10) into a socket opening (31), a package electrode, i.e., an electrode provided on the package substrate (10) and the contact on the other end face of the conductive member (22) are connected and electrical connection is made.
PCT/JP2007/055401 2007-03-16 2007-03-16 Connection module WO2008114350A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009504950A JP4823354B2 (en) 2007-03-16 2007-03-16 Connection module
PCT/JP2007/055401 WO2008114350A1 (en) 2007-03-16 2007-03-16 Connection module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/055401 WO2008114350A1 (en) 2007-03-16 2007-03-16 Connection module

Publications (1)

Publication Number Publication Date
WO2008114350A1 true WO2008114350A1 (en) 2008-09-25

Family

ID=39765472

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/055401 WO2008114350A1 (en) 2007-03-16 2007-03-16 Connection module

Country Status (2)

Country Link
JP (1) JP4823354B2 (en)
WO (1) WO2008114350A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010075336A1 (en) * 2008-12-25 2010-07-01 Molex Incorporated Coaxial connector

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57111970A (en) * 1981-08-05 1982-07-12 Nippon Telegraph & Telephone Multipole connector
JP2002100424A (en) * 2000-09-25 2002-04-05 Shin Etsu Polymer Co Ltd Electrical connector and its manufacturing method
JP2004158761A (en) * 2002-11-08 2004-06-03 Renesas Technology Corp Stacked type bga package

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57111970A (en) * 1981-08-05 1982-07-12 Nippon Telegraph & Telephone Multipole connector
JP2002100424A (en) * 2000-09-25 2002-04-05 Shin Etsu Polymer Co Ltd Electrical connector and its manufacturing method
JP2004158761A (en) * 2002-11-08 2004-06-03 Renesas Technology Corp Stacked type bga package

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010075336A1 (en) * 2008-12-25 2010-07-01 Molex Incorporated Coaxial connector
CN102326303B (en) * 2008-12-25 2014-03-12 莫列斯公司 Coaxial connector

Also Published As

Publication number Publication date
JP4823354B2 (en) 2011-11-24
JPWO2008114350A1 (en) 2010-06-24

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