WO2008111205A1 - Process for producing semiconductor device, wafer and wafer cleaning apparatus - Google Patents
Process for producing semiconductor device, wafer and wafer cleaning apparatus Download PDFInfo
- Publication number
- WO2008111205A1 WO2008111205A1 PCT/JP2007/055194 JP2007055194W WO2008111205A1 WO 2008111205 A1 WO2008111205 A1 WO 2008111205A1 JP 2007055194 W JP2007055194 W JP 2007055194W WO 2008111205 A1 WO2008111205 A1 WO 2008111205A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- wafer
- cleaning
- semiconductor device
- cutting out
- zone
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
[PROBLEMS] To provide a process for producing a semiconductor device, in which the occurrence of defective goods by static buildup at the cleaning of wafer surface can be suppressed; a relevant method of wafer cleaning and cleaning apparatus; and a wafer suitable therefor. [MEANS FOR SOLVING PROBLEMS] The process for producing a semiconductor device comprises the pattern forming step of forming circuit patterns on a wafer in its partitioned areas; the cleaning step of cleaning the wafer surface by applying a jet of cleaning liquid thereto while rotating the wafer provided with the circuit patterns; the cutting out step of cutting out waferpieces by partitions; and the separation step of, defining as a static buildup countermeasure zone a zone containing a region within a given radius from the center of rotation where charges occurring on the wafer at the cleaning step are likely to accumulate, cutting out the static buildup countermeasure zone and removing the same from semiconductor chips as a product.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2007/055194 WO2008111205A1 (en) | 2007-03-15 | 2007-03-15 | Process for producing semiconductor device, wafer and wafer cleaning apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2007/055194 WO2008111205A1 (en) | 2007-03-15 | 2007-03-15 | Process for producing semiconductor device, wafer and wafer cleaning apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008111205A1 true WO2008111205A1 (en) | 2008-09-18 |
Family
ID=39759156
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2007/055194 WO2008111205A1 (en) | 2007-03-15 | 2007-03-15 | Process for producing semiconductor device, wafer and wafer cleaning apparatus |
Country Status (1)
Country | Link |
---|---|
WO (1) | WO2008111205A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2011135979A1 (en) * | 2010-04-28 | 2013-07-18 | コニカミノルタ株式会社 | Method for manufacturing imaging lens |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04114425A (en) * | 1990-09-04 | 1992-04-15 | Fujitsu Ltd | Manufacture of semiconductor device |
JPH08330594A (en) * | 1995-05-31 | 1996-12-13 | Sony Corp | Manufacture of insulator substrate and manufacture of semiconductor device |
JPH10308374A (en) * | 1997-03-06 | 1998-11-17 | Ebara Corp | Method and equipment for cleaning |
JP2002100750A (en) * | 2000-09-25 | 2002-04-05 | Mitsubishi Materials Silicon Corp | Soi substrate and its manufacturing method |
-
2007
- 2007-03-15 WO PCT/JP2007/055194 patent/WO2008111205A1/en active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04114425A (en) * | 1990-09-04 | 1992-04-15 | Fujitsu Ltd | Manufacture of semiconductor device |
JPH08330594A (en) * | 1995-05-31 | 1996-12-13 | Sony Corp | Manufacture of insulator substrate and manufacture of semiconductor device |
JPH10308374A (en) * | 1997-03-06 | 1998-11-17 | Ebara Corp | Method and equipment for cleaning |
JP2002100750A (en) * | 2000-09-25 | 2002-04-05 | Mitsubishi Materials Silicon Corp | Soi substrate and its manufacturing method |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2011135979A1 (en) * | 2010-04-28 | 2013-07-18 | コニカミノルタ株式会社 | Method for manufacturing imaging lens |
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