WO2008102689A1 - Method of treating substrate and pre-wetting solvent for upper-film-forming material to be applied to surface of resist film - Google Patents

Method of treating substrate and pre-wetting solvent for upper-film-forming material to be applied to surface of resist film Download PDF

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Publication number
WO2008102689A1
WO2008102689A1 PCT/JP2008/052435 JP2008052435W WO2008102689A1 WO 2008102689 A1 WO2008102689 A1 WO 2008102689A1 JP 2008052435 W JP2008052435 W JP 2008052435W WO 2008102689 A1 WO2008102689 A1 WO 2008102689A1
Authority
WO
WIPO (PCT)
Prior art keywords
film
forming material
resist film
wetting solvent
treating substrate
Prior art date
Application number
PCT/JP2008/052435
Other languages
French (fr)
Japanese (ja)
Inventor
Kousuke Yoshihara
Tomohiro Iseki
Katsunori Ichino
Motoyuki Shima
Hiroki Nakagawa
Original Assignee
Tokyo Electron Limited
Jsr Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Limited, Jsr Corporation filed Critical Tokyo Electron Limited
Publication of WO2008102689A1 publication Critical patent/WO2008102689A1/en

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Materials For Photolithography (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

A pre-wetting solvent for an upper-film-forming material is applied to the surface of a resist film on a substrate before the upper-film-forming material is applied to the surface of the resist film by spin coating to form an upper-resist film. This pre-wetting solvent comprises at least one compound selected among mono- or di-hydric C1-10 alcohols, ethers having an optionally halogenated C1-8 alkyl, and C7-11 hydrocarbons. The pre-wetting solvent is effective in saving the upper-film-forming material.
PCT/JP2008/052435 2007-02-21 2008-02-14 Method of treating substrate and pre-wetting solvent for upper-film-forming material to be applied to surface of resist film WO2008102689A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-040986 2007-02-21
JP2007040986A JP4896765B2 (en) 2007-02-21 2007-02-21 Pre-wet solvent for upper layer coating agent applied to substrate processing method and resist film surface

Publications (1)

Publication Number Publication Date
WO2008102689A1 true WO2008102689A1 (en) 2008-08-28

Family

ID=39709966

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/052435 WO2008102689A1 (en) 2007-02-21 2008-02-14 Method of treating substrate and pre-wetting solvent for upper-film-forming material to be applied to surface of resist film

Country Status (3)

Country Link
JP (1) JP4896765B2 (en)
TW (1) TWI392977B (en)
WO (1) WO2008102689A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4733192B2 (en) * 2009-01-30 2011-07-27 東京エレクトロン株式会社 Coating processing method and coating processing apparatus
JP5159913B2 (en) * 2011-04-21 2013-03-13 東京エレクトロン株式会社 Substrate coating method
JP2014050803A (en) * 2012-09-07 2014-03-20 Toshiba Corp Rotary application equipment and rotary application method
JP6306855B2 (en) * 2013-10-31 2018-04-04 東京応化工業株式会社 Manufacturing method of solar cell
JP6374373B2 (en) * 2015-12-04 2018-08-15 東芝メモリ株式会社 Spin coater

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04151603A (en) * 1990-10-15 1992-05-25 Sanyo Chem Ind Ltd Surface protective material for color filter
JPH10123693A (en) * 1996-10-15 1998-05-15 Dainippon Printing Co Ltd Method of forming pattern of photosensitive organic film, and method of forming photomask pattern
JP2003086491A (en) * 2001-09-12 2003-03-20 Tokyo Electron Ltd Treatment method of substrate, and forming method of coating film
WO2006035790A1 (en) * 2004-09-30 2006-04-06 Jsr Corporation Copolymer and upper film-forming composition
JP2006337812A (en) * 2005-06-03 2006-12-14 Matsushita Electric Ind Co Ltd Method for forming pattern

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4488890B2 (en) * 2004-12-27 2010-06-23 株式会社東芝 Resist pattern forming method and semiconductor device manufacturing method
JP4594174B2 (en) * 2005-06-14 2010-12-08 パナソニック株式会社 Barrier film forming material and pattern forming method using the same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04151603A (en) * 1990-10-15 1992-05-25 Sanyo Chem Ind Ltd Surface protective material for color filter
JPH10123693A (en) * 1996-10-15 1998-05-15 Dainippon Printing Co Ltd Method of forming pattern of photosensitive organic film, and method of forming photomask pattern
JP2003086491A (en) * 2001-09-12 2003-03-20 Tokyo Electron Ltd Treatment method of substrate, and forming method of coating film
WO2006035790A1 (en) * 2004-09-30 2006-04-06 Jsr Corporation Copolymer and upper film-forming composition
JP2006337812A (en) * 2005-06-03 2006-12-14 Matsushita Electric Ind Co Ltd Method for forming pattern

Also Published As

Publication number Publication date
JP4896765B2 (en) 2012-03-14
TW200836023A (en) 2008-09-01
JP2008203638A (en) 2008-09-04
TWI392977B (en) 2013-04-11

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