WO2008097496A1 - Assemblages de diode électroluminescente pour illuminer des zones réfrigérées - Google Patents

Assemblages de diode électroluminescente pour illuminer des zones réfrigérées Download PDF

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Publication number
WO2008097496A1
WO2008097496A1 PCT/US2008/001430 US2008001430W WO2008097496A1 WO 2008097496 A1 WO2008097496 A1 WO 2008097496A1 US 2008001430 W US2008001430 W US 2008001430W WO 2008097496 A1 WO2008097496 A1 WO 2008097496A1
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WO
WIPO (PCT)
Prior art keywords
led
heat sink
led assembly
base
assembly
Prior art date
Application number
PCT/US2008/001430
Other languages
English (en)
Inventor
George K. Awai
Michael D. Ernst
Alain S. Corcos
Original Assignee
Illuminer, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/670,981 external-priority patent/US20080186732A1/en
Priority claimed from US11/693,605 external-priority patent/US20080186696A1/en
Priority claimed from US11/693,597 external-priority patent/US20080186695A1/en
Application filed by Illuminer, Inc. filed Critical Illuminer, Inc.
Publication of WO2008097496A1 publication Critical patent/WO2008097496A1/fr

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Classifications

    • A—HUMAN NECESSITIES
    • A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47F—SPECIAL FURNITURE, FITTINGS, OR ACCESSORIES FOR SHOPS, STOREHOUSES, BARS, RESTAURANTS OR THE LIKE; PAYING COUNTERS
    • A47F3/00—Show cases or show cabinets
    • A47F3/001—Devices for lighting, humidifying, heating, ventilation
    • A—HUMAN NECESSITIES
    • A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47F—SPECIAL FURNITURE, FITTINGS, OR ACCESSORIES FOR SHOPS, STOREHOUSES, BARS, RESTAURANTS OR THE LIKE; PAYING COUNTERS
    • A47F3/00—Show cases or show cabinets
    • A47F3/04—Show cases or show cabinets air-conditioned, refrigerated
    • A47F3/0482—Details common to both closed and open types
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/61—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using light guides
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/713—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0005—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being of the fibre type
    • G02B6/001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being of the fibre type the light being emitted along at least a portion of the lateral surface of the fibre
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2131/00—Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
    • F21W2131/30—Lighting for domestic or personal use
    • F21W2131/305—Lighting for domestic or personal use for refrigerators
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2131/00—Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
    • F21W2131/40—Lighting for industrial, commercial, recreational or military use
    • F21W2131/405—Lighting for industrial, commercial, recreational or military use for shop-windows or displays
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D27/00—Lighting arrangements
    • F25D27/005—Lighting arrangements combined with control means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0085—Means for removing heat created by the light source from the package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode

Definitions

  • This invention relates generally to illuminating panels. More particularly, this invention relates to light emitting diode (LED) assemblies for illuminating refrigerated areas.
  • LED light emitting diode
  • Refrigerated display areas such as supermarket freezers, make use of interior case lighting to illuminate products and to attract shoppers.
  • the lighting should generate minimal heat so as to reduce cooling requirements and avoid spoilage of the displayed food.
  • Fluorescent lighting are commonly used and are mounted vertically along the inside edge of the glass display doors of refrigerated areas. Although fluorescent lighting generate less heat and are more efficient than incandescent lighting, fluorescent lighting suffer from decreased light output and reduced lamp life when operated in cold temperature environments. Florescent lighting also produces diffused light patterns and hence do not illuminate the food products efficiently.
  • LEDs makes them suitable for compact edge lighting for illuminated display doors
  • LEDs especially high-powered LEDs, generate a substantial amount of heat which substantially increase cooling load of the refrigerated areas.
  • an LED assembly provides illumination for a refrigerated area, the LED assembly including a plurality of LED modules and a reflector base configured to reflect light generated by the plurality of LED modules into the refrigerated area.
  • the reflector base is further configured to conduct heat away from the plurality of LED modules and also includes a base cooling channel. Both the reflector base and the plurality of LED modules are located substantially within the refrigerated area.
  • the LED assembly also includes an external heat sink coupled to the reflector base, and configured to conduct heat away from the reflector base, wherein the external heat sink is further configured to be mounted substantially outside the refrigerated area.
  • the external heat sink can include an integral cooling channel.
  • the LED assembly can include a doom lens that forms a doom cooling channel substantially enclosing the reflector base.
  • An internal heat sink can also be mounted substantially within the refrigerated area thereby conducting heat from the reflector base to the external heat sink. This internal heat sink includes an internal sink cooling channel.
  • At least one of the plurality of LED modules includes an LED base, an LED located substantially within the LED base and configured to generate a light beam, an inner beam director, and an outer beam director.
  • the interface between the inner beam director and the outer beam director is shaped to refract and/or reflect the light beam along the interface, thereby narrowing a substantial portion of the light beam into the refrigerated area.
  • an LED assembly provides illumination for a refrigerated area, the LED assembly including a conductive base, a plurality of LED modules coupled to the conductive base, and a waveguide configured to direct light generated by the plurality of LED modules into the refrigerated area by reflecting and refracting light generated by the plurality of LED modules.
  • the waveguide is located substantially within the refrigerated area.
  • the LED assembly also includes an external heat sink coupled to the reflector base, and configured to conduct heat away from the conductive base.
  • the external heat sink is mounted substantially outside the refrigerated area.
  • the external heat sink can include an integral cooling channel.
  • the LED assembly can also include an external cooling doom configured to provide cooling for the external heat sink.
  • At least one of the plurality of LED modules includes an LED base, an LED located substantially within the LED base and configured to generate a light beam, an inner beam director, and an outer beam director.
  • the interface between the inner beam director and the outer beam director is shaped to refract and/or reflect the light beam along the interface, thereby narrowing a substantial portion of the light beam into the refrigerated area.
  • FIG. 1 is a front view showing three illuminated doors for a refrigerated space in accordance with the invention
  • FIGS. 2 A, 2B are a cross-sectional side view of one of the illuminated wall pillars for the refrigerated area of FIG. 1 and also shows display shelves;
  • FIGS. 3A-3D are cross-sectional views of several embodiments of
  • FIG. 4 illustrates a variant of the embodiment shown in FIG. 3B
  • FIGS. 5A-5C are cross-sectional views of additional embodiments of
  • FIG. 6 illustrates a variant of the embodiment shown in FIG. 5B
  • FIGS. 7 A, 7B and 7C are an isometric view, a cut-away view and a cross-sectional view, respectively, of an LED module 700 in accordance with an aspect of the present invention
  • FIGS. 7D, 7E are cross-sectional views of a substantially reflective module and a refractive/reflective module in accordance with the present invention.
  • FIGS. 8A- 1OE are cross-sectional views of additional embodiments of the LED modules of the present invention.
  • FIG. 11 is a cross-sectional view of another embodiment of LED assembly for the illuminated pillar of FIG. 2 A.
  • FIG. 1 is a front view showing an illuminated refrigerated display area 100 with a plurality of doors including doors 1 10, 120, 130.
  • Door 110 includes a transparent panel 112, a frame 114 and a door handle 1 16. For clarity, doors 120, 130 are shown partially cutaway to expose a support pillar 105 and a horizontal span 108.
  • FIG. 2 A is a cross sectional side view showing pillar 105 of FIG. 1 and also shows display shelves 210a, 210b ... 210k supported by corresponding brackets 215a, 215b ... 215k.
  • An LED assembly 240 (described in greater detail below) is attached to the refrigerated side of vertical pillar 105. LED assembly 240 can also be coupled to an external heat sink 245 via heat pipes 248a, 248b, 248c, 248d ...and 248m, thereby enabling LED assembly 240 to dissipate heat outside the refrigerated area.
  • FIGS. 3A-3D are cross sectional views of exemplary embodiments 300A, 300B, 300C, 300D for the LED assembly 240 of the present invention, and correspond to cross section line IA- IA of FIG. 1.
  • LED assembly 300A includes doom lens 310, reflector base 320a, LED boards 362, 364, internal heat sink 350a, conductors 342, 344, 346 and external heat sink 340a.
  • Doom lens 310 is located substantially within the refrigerated side of wall 330, while external heat sink 340a is located on the ambient side of wall 330.
  • Lens 310 can be made from a suitable transparent or translucent material such as glass or a suitable polymer, e.g., acrylic or polycarbonate. Depending on the specific implementation, lens 310 can be clear or frosty. In addition, lens 310 can have optical characteristics such as that of a Fresnel lens which can be incorporated onto the protected inner surface of lens 310.
  • a suitable transparent or translucent material such as glass or a suitable polymer, e.g., acrylic or polycarbonate.
  • lens 310 can be clear or frosty.
  • lens 310 can have optical characteristics such as that of a Fresnel lens which can be incorporated onto the protected inner surface of lens 310.
  • Each LED boards 362, 364 includes a row of LED modules and the circuitry for coupling the LED modules to a suitable power source (not shown). Suitable LED modules are commercially available from OSRAM Opto Semiconductors Inc. of Santa Clara, California, Nichia Corporation of Detroit, Michigan, Cree Inc. of Durham, North Carolina, or Philips Lumileds Lighting Company of San Jose, California. LED boards 362, 364 may also include some of the power circuitry components such as resistors and may also include sensors such as temperature sensors and/or illumination level sensors.
  • LED boards 362, 364 are mounted on reflector base 320a which focuses light rays 371a, 372a and rays 381a, 382a into rays 371b, 372b and rays 381b, 382b, respectively, onto the display area located in the refrigerated side of wall 330.
  • Reflector base 320a which is coupled to internal heat sink 350a.
  • Conductors 342, 344, 346 couple internal heat sink 350a to external heat sink 340a through wall 330.
  • the heat generated by LED boards 362, 364 can be conducted from reflector base 320a to internal heat sink 350a, and in turn to external heat sink 340a via conductors 342, 344, 346.
  • the heat dissipation capability of reflector base 320a and heat sinks 350a, 340a is further enhanced by lens cooling channel 315, base cooling channel 325a and heat sink cooling channel 355a.
  • cooling channels 315, 325a, 355a are oriented vertically and hence are capable of efficiently dissipating heat via air convection from ambient air drawn from outside the refrigerated space, thereby substantially reducing the amount of heat dissipated into the refrigerated space. Circulation of cooling air can also be from forced air cooling.
  • FIG. 3B shows a variant 300B of the LED assembly 240, in which the cooling surface area of heat sink cooling channel 355b is substantially increased by introducing ribs or groves into the internal surface of channel 355b thereby enhancing the heat dissipating capability of LED assembly 300B and substantially reducing the heat dissipated into the refrigerated space.
  • ribs or groves can also be incorporated onto the surface of external heat sink 340b to further increase the heat dissipation capability of external heat sink 340b into the ambient air.
  • LED assembly 300D can have three LED boards 362, 364, 368.
  • FIG. 4 is a cross sectional view of yet another embodiment 400 for the LED assembly 240 of the present invention, and corresponds to section line 1C- 1C of door frame 1 14.
  • External heat sink 440 is coupled to internal heat sink 350b via heat conducting connectors 442, 444.
  • external heat sink 440 also includes a ribbed cooling channel 448.
  • external heat sink 440 is shaped to also function as a door handle which is now warmer and more comfortable for a customer to use because external heat sink 440 is now dissipating heat generated by LED assembly 400.
  • LED assemblies 300A, 300B and 300C can also be modified to operate in a horizontal orientation along a top front span 108 of refrigerated area 100 corresponding to section line IE- IE, by for example eliminating one of the LED board and also using forced air cooling.
  • This horizontal variant of LED assemblies 300A, 300B and 300C can also be mounted along the top of door frame 114 corresponding to section line ID- ID.
  • FIGS. 5 A, 5B, 5C are additional cross sectional views of additional variants 500A, 500B, 500C for exemplary vertical LED assembly 240 and horizontal LED assemblies 242a, 242b ... 242k in accordance with the present invention.
  • LED assembly 500A includes an optical waveguide 510a, LED board 560, conductive base 545, thermal barrier 535, external heat sink 540a and external cooling doom 520.
  • Waveguide 510a is located substantially within the refrigerated side of wall 530, while the rest of assembly 500A, including cooling doom 520, is located substantially on the ambient air side of wall 530.
  • LED board 560 includes a row of LED modules and the circuitry for coupling the LED modules to a suitable power source (not shown). Suitable LED modules are commercially available from OSRAM Opto Semiconductors Inc. of Santa Clara, California, Nichia Corporation of Detroit, Michigan, Cree Inc. of Durham, North Carolina, or Philips Lumileds Lighting Company of San Jose, California. LED board 560 may also include some of the power circuitry components such as resistors and may also include sensors such as temperature sensors and/or illumination level sensors.
  • waveguide 510a By repeatedly reflecting and refracting light rays generated by LED board 560, waveguide 510a provides a pair of evenly-illuminated and focused light beams into the refrigerated area.
  • light ray 571a is internally reflected as light ray 571b, which is refracted outside waveguide as light ray 571c and also internally reflected as light ray 57 Id, and further refracted and reflected into light rays 571e, 571f, respectively.
  • Light ray 571f is then refracted as light ray 571g and reflected as light ray 57 Ih, which in turn is refracted and reflected into light rays 571k, 571m, respectively.
  • LED board 560 is mounted on conductive base 545 which in turn is coupled to external heat sink 450a. As a result, the heat generated by LED board 560 can be conducted by base 545 to external heat sink 540a, and then dissipated outside the refrigerated area.
  • cooling channel 525 formed by external cooling doom 520.
  • cooling channel 525 is oriented vertically and hence is capable of efficiently dissipating heat via air convection from ambient air drawn from outside the refrigerated space, thereby substantially reducing the amount of heat dissipated into the refrigerated space.
  • Circulation of cooling air can also be from forced air cooling. It is also possible to divert some of the chilled air from the refrigerated space into cooling channel 525.
  • FIG. 5B shows a variant 500B of the LED assembly 240, in which the cooling surface area of heat sink 540b is substantially increased by incorporating ribs or groves onto the surface of external heat sink 540b thereby enhancing the heat dissipating capability of LED assembly 300B and further reducing the heat dissipated into the refrigerated space by LED board 530 and waveguide 510a.
  • Other waveguide profiles are also possible and include straight, tapered, and curved shapes and combinations thereof. For example, as shown in FIG. 5 C, waveguide 510c has a straight body and a curved tip.
  • FIG. 6 is a cross sectional view of yet another embodiment 600 for the LED assembly 240 of the present invention, and corresponds to cross section line 1C- 1C of door frame 114.
  • external heat sink 640 also includes a cooling channel 648 and is shaped as a door handle which is now warmer and more comfortable for the customer's use because external heat sink 640 is now dissipating heat from LED board 560 via base 645.
  • FIGS. 7 A, 7B and 7C are an isometric view, a cut-away view and a cross-sectional view, respectively, of a highly efficient LED module 700 in accordance with another aspect of the present invention.
  • LED module 700 includes a base 710, an outer beam director 720, an inner beam director 730, and an LED 790.
  • Suitable materials for base 710 include high temperature acrylic copolymer and for beam directors 720, 730 include acrylic and optical grade silicone. Depending on the application, beam directors 720, 730 can be an optically clear material or slightly diffusive. LEDs suited for LED 790 include commercially available LEDs from OSRAM Opto Semiconductors Inc. of Santa Clara, California such as model numbers LW-E6SG, LW-G6SP and LW-541C.
  • LED 790 can be geometrically coated with a suitable phosphor layer, also known as conformal phosphor coating (not shown), known to one skilled in the art so as to produce a compact LED capable of generating a whiter light beam whose spectrum is better suited for illuminating display panels. This is possible because an even phosphor coating minimizes chromatic separation of the white light generated by LED 790. It is also possible to use LEDs that generate a whiter light spectrum without an additional phosphor layer.
  • a suitable phosphor layer also known as conformal phosphor coating (not shown)
  • LEDs have been used for illumination applications, most commercially available LED packages are designed to generate a fairly wide-angled and evenly-spread beam of light for applications such as area lighting. Hence, these off the shelf LED packages are not suitable for edge illumination of display panels because a wide-angled beam will generate a substantially higher level of illumination closer to the edge of the display panels resulting in uneven illumination.
  • light sources for edge illumination of the display panels should be capable of generating a substantially narrow beam of penetrating light so as to evenly illuminate the central portions of the display panels which can have a large display surface area.
  • the deep penetration needs are accomplished primarily by reliance on the refractive and/or reflective properties of the interface between outer beam director 720 and inner beam director 730.
  • the refractive and/or reflective properties can be controlled by selecting suitable interface profiles and N index values.
  • Suitable profiles for beam director interfaces include parabolic and elliptical curved shapes.
  • Suitable N values include for example, Nl being approximately 1.33 to 1.41 and N2 being approximately 1.49 to 1.6 for beam directors 720 and 730, respectively.
  • most of the light produced by LED module 700 is substantially concentrated within an approximately 40 degree beam angle.
  • exemplary light rays 760a, 770a produced by LED 790 are refracted by beam directors 720, 730 into rays 760b, 770b, respectively.
  • Light rays 760b, 770b are further refracted by the external surface of outer beam director 720 into rays 760c, 770c, and thereby enabling LED module 700 to generate a substantially narrower beam of light than that initially produced by LED 790.
  • FIG. 7D shows a modified LED module 700D in which a reflective layer 740 is added between outer beam director 720 and inner beam director 730 thereby enhancing the reflective properties of the interface between beam directors 720, 730.
  • Reflective layer 740 can be formed by techniques well known in the art including vapor and electrostatic deposition. Light rays 760a, 770a produced by LED 790 are reflected by layer 740 into rays 760b, 770b, respectively, enabling LED module 700D to produce a substantially narrow and penetrating beam of light including rays 760c, 770c.
  • a substantially wide-angled beam will better illuminate the surface of display panels closest to the light source, while a substantially narrow light beam is especially beneficial for deeper penetration of relatively large display panels.
  • both shallow and deep penetration needs can be accomplished by reliance on a suitable balance between the reflective and/or refractive properties of the interface between outer beam director 720 and inner beam director 730.
  • This delicate refractive/reflective balance can be controlled by selecting suitable materials with suitable relative N values for directors 720, 730, e.g. Nl being approximately 1.33 to 1.41 and N2 being approximately 1.49 to 1.6, respectively.
  • Nl being approximately 1.33 to 1.41
  • N2 being approximately 1.49 to 1.6
  • LED module 700 is now capable of producing a substantially narrow beam of light, e.g., rays 762c, 772c, for penetrating the display panel while still able to produce enough shorter range light rays, e.g., rays 764c, 774c to illuminate the closer surface of the display panel.
  • LED module 700 is capable of generating variable intensity ranges at various beam angles, e.g., 80% intensity at between 0 and 40 degrees, and 20% intensity between 40 to 80 degrees.
  • Several additions and modifications to LED module 700 are also possible as shown in the exemplary cross-sectional views of FIGS. 8 A through 1OE. Many other additions and modifications are also possible within the scope of the present invention.
  • FIGS. 8A and 8B show embodiments 800A, 800B with substantially straight interface profiles between outer beam directors 820a, 820b and inner beam directors 830a, 830b, respectively. Note the cone-shaped inner beam director 830a and cylindrical-shaped inner beam director 83Ob.
  • FIGS. 9A-9C illustrate additional embodiments with multiple refractive and/or reflective interfaces introduced by adding intermediate beam directors, i.e., directors 932 of module 900A, directors 934, 938 of module 900B, and director 932 of module 900C.
  • the multiple interfaces can have refractive and/or reflective properties defined by suitable interface profiles and N values.
  • light rays 960a, 970a produced by LED 790 are refracted by the interface between beam directors 930, 932 into rays 960b, 970b, respectively.
  • Light rays 960b, 970b are further refracted by the external surface of intermediate beam director 932 into rays 960c, 970c.
  • light rays 965a, 975a produced by LED 790 are refracted by the interface between beam directors 932, 930 into rays 965b, 975b, respectively, which are in turn further refracted by the interface between beam directors 920, 932 into rays 965c, 975c.
  • Light rays 965c, 975c are then refracted by the external surface of outer beam director 920 into rays 765d, 775d.
  • a focused beam of light including exemplary light rays 965d, 960c, 970c, 975d is formed, enabling LED module 900A to generate a substantially narrower and penetrating beam of light than that initially produced by LED 790.
  • beam directors 920, 932, 930 can be controlled by selecting suitable materials with suitable relative N values for directors 920, 932, 930.
  • beam directors 920, 932, 930 can be optically clear or slightly diffusive.
  • module IOOOA without an inner beam director
  • module IOOOB with a concave-topped inner beam director 1032
  • module IOOOC with a convex-topped inner beam director 1034
  • module IOOOD has an exposed LED 790 and a substantially reflective layer 1042 with a curved profile
  • module IOOOE has an exposed LED 790 and a substantially reflective layer 1044 with a cone-shaped profile.
  • FIG. 11 shows how the focused-beam LED modules described above, e.g., LED modules 700, 800A, 800B ... IOOOE can be incorporated into the LED assemblies 240 and 242a of the present invention.
  • LED boards 1162, 1164 each include at least one focused-beam LED module, and hence LED boards 1162, 1164 can be mounted onto base 1120 of LED assembly 1100 without the need for external reflectors.
  • LED assemblies 300A, 300B, 300C, 400, 500A, 500B, 600, 1100 can be dimmable by adding a variable current control circuitry.
  • An infrared red sensor can also be added to the control circuitry of assemblies 300A, 300B, 300C, 400, 500A, 500B, 600, 1100 so that the refrigerated area is illuminated when a potential customer enters the detection field thereby dimming or turning on and off in an appropriate manner.
  • Other modifications and variations are also possible. For example, it is also possible to sense the ambient light level of the surrounding and adjust the light output of the panels accordingly, thereby conserving power.
  • the present invention can also improve the quality and quantity of light transmitted by other non-point light sources such as neon and fluorescent light sources.
  • frame members of doors 110, 120 and the heat conducting components of LED assemblies 300A, 300B, 300C, 400, 500A, 500B, 600 can be manufactured from aluminum extrusions.
  • any other suitable rigid and heat-conducting framing materials including other metals, alloys, plastics and composites such as steel, bronze, wood, polycarbonate, carbon-fiber, and fiberglass is also possible.
  • the present invention provides improved LED assemblies for evenly illuminating refrigerated areas that is easy to manufacturer, easy to maintain, shock resistant, impact resistant, cost effective, and have long lamp-life.
  • the present invention has been described with reference to particular embodiments, it will be understood that the embodiments are illustrative and that the inventive scope is not so limited.
  • the various features of the present invention can be practiced alone or in combination.
  • Alternative embodiments of the present invention will also become apparent to those having ordinary skill in the art to which the present invention pertains. Such alternate embodiments are considered to be encompassed within the spirit and scope of the present invention. Accordingly, the scope of the present invention is described by the appended claims and is supported by the foregoing description.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)

Abstract

Un assemblage LED pour illuminer une zone réfrigérée comprend une pluralité de modules LED et une base de réflecteur configurée pour réfléchir la lumière générée par la pluralité de modules LED dans la zone réfrigérée. La base de réflecteur est configurée en outre pour conduire la chaleur hors de la pluralité de modules LED et comprend également un canal de refroidissement de la base. La base de réflecteur et la pluralité de modules LED sont tous les deux situés essentiellement dans la zone réfrigérée. Dans un autre mode de réalisation, un assemblage LED comprend une base conductrice, une pluralité de modules LED raccordés à la base conductrice, et un guide d'onde configuré pour diriger la lumière générée par la pluralité de modules LED dans la zone réfrigérée en réfléchissant et en réfractant la lumière générée par la pluralité de modules LED. Le guide d'onde est situé essentiellement dans la zone réfrigérée. L'assemblage LED comprend également une source de froid externe raccordée à la base du réflecteur, configurée pour conduire la chaleur hors de la base conductrice, et est monté essentiellement à l'extérieur de la zone réfrigérée.
PCT/US2008/001430 2007-02-03 2008-02-01 Assemblages de diode électroluminescente pour illuminer des zones réfrigérées WO2008097496A1 (fr)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US11/670,981 2007-02-03
US11/670,981 US20080186732A1 (en) 2007-02-03 2007-02-03 Light emitting diode modules for illuminated panels
US11/693,605 US20080186696A1 (en) 2007-02-03 2007-03-29 Light emitting diode waveguide assemblies for illuminating refrigerated areas
US11/693,597 2007-03-29
US11/693,605 2007-03-29
US11/693,597 US20080186695A1 (en) 2007-02-03 2007-03-29 Light emitting diode assemblies for illuminating refrigerated areas

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WO2008097496A1 true WO2008097496A1 (fr) 2008-08-14

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DE102008010585A1 (de) * 2008-02-22 2009-08-27 Albert Weiss Beleuchtungseinrichtung für Warenpräsentationsmöbel
WO2011116372A1 (fr) * 2010-03-19 2011-09-22 GE Lighting Solutions, LLC Vitrine éclairée ayant un éblouissement réduit
WO2012100391A1 (fr) * 2011-01-24 2012-08-02 宁波赛尔富电子有限公司 Lampe pour congélateur
AT12664U1 (de) * 2010-08-20 2012-09-15 Siteco Beleuchtungstech Gmbh Beleuchtungseinrichtung für ein kühlmöbel
EP2535642A2 (fr) * 2011-06-16 2012-12-19 Trilux GmbH & Co. KG Lampe avec élément de couplage thermique à base de plastique conducteur de chaleur
EP2685152A1 (fr) * 2012-07-09 2014-01-15 Kabushiki Kaisha Toshiba Dispositif d'éclairage
EP2392953A3 (fr) * 2010-06-01 2015-09-16 Young Lighting Technology Corporation Dispositif d'illumination
US20180209598A1 (en) * 2017-01-25 2018-07-26 Delta Electronics, Inc. Wide-angle linear led lighting device
EP3354974A1 (fr) * 2017-01-25 2018-08-01 Delta Electronics, Inc. Dispositif d'éclairage à del linéaire à grand angle

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US6005649A (en) * 1998-07-22 1999-12-21 Rainbow Displays, Inc. Tiled, flat-panel microdisplay array having visually imperceptible seams
US20030072147A1 (en) * 2001-10-12 2003-04-17 Pashley Michael D. LED illumination for cold storage compartments
US6824285B2 (en) * 2001-11-29 2004-11-30 Nec Corporation Light source and liquid crystal display device using this light source
US20050212397A1 (en) * 2003-10-28 2005-09-29 Nichia Corporation Fluorescent material and light-emitting device
US20050259424A1 (en) * 2004-05-18 2005-11-24 Zampini Thomas L Ii Collimating and controlling light produced by light emitting diodes

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008010585A1 (de) * 2008-02-22 2009-08-27 Albert Weiss Beleuchtungseinrichtung für Warenpräsentationsmöbel
WO2011116372A1 (fr) * 2010-03-19 2011-09-22 GE Lighting Solutions, LLC Vitrine éclairée ayant un éblouissement réduit
EP2392953A3 (fr) * 2010-06-01 2015-09-16 Young Lighting Technology Corporation Dispositif d'illumination
AT12664U1 (de) * 2010-08-20 2012-09-15 Siteco Beleuchtungstech Gmbh Beleuchtungseinrichtung für ein kühlmöbel
WO2012100391A1 (fr) * 2011-01-24 2012-08-02 宁波赛尔富电子有限公司 Lampe pour congélateur
EP2535642A2 (fr) * 2011-06-16 2012-12-19 Trilux GmbH & Co. KG Lampe avec élément de couplage thermique à base de plastique conducteur de chaleur
EP2535642A3 (fr) * 2011-06-16 2013-08-14 Trilux GmbH & Co. KG Lampe avec élément de couplage thermique à base de plastique conducteur de chaleur
EP2685152A1 (fr) * 2012-07-09 2014-01-15 Kabushiki Kaisha Toshiba Dispositif d'éclairage
US20180209598A1 (en) * 2017-01-25 2018-07-26 Delta Electronics, Inc. Wide-angle linear led lighting device
EP3354974A1 (fr) * 2017-01-25 2018-08-01 Delta Electronics, Inc. Dispositif d'éclairage à del linéaire à grand angle
US10473279B2 (en) 2017-01-25 2019-11-12 Delta Electronics, Inc. Wide-angle linear LED lighting device

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