WO2008096756A1 - Aqueous adhesive composition - Google Patents

Aqueous adhesive composition Download PDF

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Publication number
WO2008096756A1
WO2008096756A1 PCT/JP2008/051866 JP2008051866W WO2008096756A1 WO 2008096756 A1 WO2008096756 A1 WO 2008096756A1 JP 2008051866 W JP2008051866 W JP 2008051866W WO 2008096756 A1 WO2008096756 A1 WO 2008096756A1
Authority
WO
WIPO (PCT)
Prior art keywords
aqueous
carboxyl group
epoxy compound
adhesive composition
molecule
Prior art date
Application number
PCT/JP2008/051866
Other languages
French (fr)
Japanese (ja)
Inventor
Susumu Harashima
Masaharu Iwasaki
Hiroyasu Morinaga
Original Assignee
Oshika Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oshika Corporation filed Critical Oshika Corporation
Publication of WO2008096756A1 publication Critical patent/WO2008096756A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
    • C08G59/184—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4246—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof polymers with carboxylic terminal groups
    • C08G59/4253—Rubbers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/44—Amides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Veneer Processing And Manufacture Of Plywood (AREA)

Abstract

Disclosed is an aqueous adhesive composition exhibiting excellent adhesive performance from the viewpoints of water resistance, heat resistance and durability. The aqueous adhesive composition contains a base material containing at least one aqueous polymer having a carboxyl group, a curing agent containing a polyamide epoxy compound, and a tetrafunctional epoxy compound having a tertiary amino nitrogen atom. The aqueous polymer is at least one member selected from the group consisting of aqueous polymers containing a carboxyl group in a molecule, aqueous solutions of such aqueous polymers, aqueous latexes containing a carboxyl group in a molecule and aqueous emulsions containing a carboxyl group in a molecule. The polyamide epoxy compound is a compound obtained by reacting an epihalohydrin with a polyamine or a polyamide. The tetrafunctional epoxy compound having a tertiary amino nitrogen atom is a compound containing an N,N-glycidylamino group.
PCT/JP2008/051866 2007-02-06 2008-02-05 Aqueous adhesive composition WO2008096756A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007026899A JP2008189839A (en) 2007-02-06 2007-02-06 Aqueous adhesive composition
JP2007-026899 2007-02-06

Publications (1)

Publication Number Publication Date
WO2008096756A1 true WO2008096756A1 (en) 2008-08-14

Family

ID=39681664

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/051866 WO2008096756A1 (en) 2007-02-06 2008-02-05 Aqueous adhesive composition

Country Status (2)

Country Link
JP (1) JP2008189839A (en)
WO (1) WO2008096756A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5490403B2 (en) * 2008-12-25 2014-05-14 光洋産業株式会社 Two-component fractional application adhesive and bonding method using the adhesive
JP5501994B2 (en) * 2011-03-02 2014-05-28 株式会社オーシカ One-part adhesive composition
CN104845549B (en) 2014-02-18 2019-07-12 财团法人工业技术研究院 Wood adhesive, wood adhesion method using same and wood joint structure
TWI564356B (en) 2015-09-18 2017-01-01 財團法人工業技術研究院 Wood adhesive
WO2019221065A1 (en) * 2018-05-18 2019-11-21 積水化学工業株式会社 Adhesive tape and method for manufacturing electronic component

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001003022A (en) * 1999-06-24 2001-01-09 Oshika Shinko Co Ltd Adhesive composition for wood
JP2004277724A (en) * 2003-02-25 2004-10-07 Oshika:Kk Water-proof adhesive composition for wood
JP2005089704A (en) * 2003-09-19 2005-04-07 Oshika:Kk Waterproof adhesive composition for woody material
WO2007007578A1 (en) * 2005-07-13 2007-01-18 Kuraray Co., Ltd Aqueous liquid dispersion, method for producing same, composition, adhesive, and coating material

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000239646A (en) * 1999-02-18 2000-09-05 Shoei Kagaku Kogyo Kk Adhesive composition for decorative convex plate
JP2005089703A (en) * 2003-09-19 2005-04-07 Oshika:Kk Waterproof adhesive composition for woody material

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001003022A (en) * 1999-06-24 2001-01-09 Oshika Shinko Co Ltd Adhesive composition for wood
JP2004277724A (en) * 2003-02-25 2004-10-07 Oshika:Kk Water-proof adhesive composition for wood
JP2005089704A (en) * 2003-09-19 2005-04-07 Oshika:Kk Waterproof adhesive composition for woody material
WO2007007578A1 (en) * 2005-07-13 2007-01-18 Kuraray Co., Ltd Aqueous liquid dispersion, method for producing same, composition, adhesive, and coating material

Also Published As

Publication number Publication date
JP2008189839A (en) 2008-08-21

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