WO2008096714A1 - Resin-sealed light emitting element, planar light source, methods for manufacturing the resin-sealed light emitting element and the planar light source, and liquid crystal display device - Google Patents

Resin-sealed light emitting element, planar light source, methods for manufacturing the resin-sealed light emitting element and the planar light source, and liquid crystal display device Download PDF

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Publication number
WO2008096714A1
WO2008096714A1 PCT/JP2008/051781 JP2008051781W WO2008096714A1 WO 2008096714 A1 WO2008096714 A1 WO 2008096714A1 JP 2008051781 W JP2008051781 W JP 2008051781W WO 2008096714 A1 WO2008096714 A1 WO 2008096714A1
Authority
WO
WIPO (PCT)
Prior art keywords
emitting element
light emitting
resin
light source
sealed
Prior art date
Application number
PCT/JP2008/051781
Other languages
French (fr)
Japanese (ja)
Inventor
Shunji Watanabe
Masayuki Shijo
Kaori Ezura
Yoshinobu Ezura
Original Assignee
Nikon Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corporation filed Critical Nikon Corporation
Priority to JP2008557105A priority Critical patent/JPWO2008096714A1/en
Publication of WO2008096714A1 publication Critical patent/WO2008096714A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Planar Illumination Modules (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

Provided is a method for manufacturing a resin-sealed light emitting element. In the method, a light emitting element and a luminous flux control member, which is formed in a shape capable of controlling a luminous flux emitted from the light emitting element and is composed of a thermoplastic resin, are bonded by curing the thermoplastic resin, in a status where the thermoplastic resin is arranged between the light outgoing surface of the light emitting element and the light incoming surface of the luminous flux control member.
PCT/JP2008/051781 2007-02-05 2008-02-04 Resin-sealed light emitting element, planar light source, methods for manufacturing the resin-sealed light emitting element and the planar light source, and liquid crystal display device WO2008096714A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008557105A JPWO2008096714A1 (en) 2007-02-05 2008-02-04 Resin-sealed light emitting device, planar light source, method for producing the same, and liquid crystal display device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007024972 2007-02-05
JP2007-024972 2007-02-05

Publications (1)

Publication Number Publication Date
WO2008096714A1 true WO2008096714A1 (en) 2008-08-14

Family

ID=39681623

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/051781 WO2008096714A1 (en) 2007-02-05 2008-02-04 Resin-sealed light emitting element, planar light source, methods for manufacturing the resin-sealed light emitting element and the planar light source, and liquid crystal display device

Country Status (2)

Country Link
JP (1) JPWO2008096714A1 (en)
WO (1) WO2008096714A1 (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011016269A1 (en) * 2009-08-07 2011-02-10 シャープ株式会社 Lens, light-emitting module, light-emitting element package, illumination device, display device, and television receiver
WO2012033180A1 (en) * 2010-09-08 2012-03-15 三菱化学株式会社 Light emitting apparatus, lighting apparatus, and lens
JP2012234947A (en) * 2011-04-28 2012-11-29 Mitsubishi Chemicals Corp Resin package for semiconductor light-emitting device, semiconductor light-emitting device having the resin package and method for manufacturing the same
KR20150092597A (en) * 2014-02-05 2015-08-13 엘지이노텍 주식회사 Light emitting device package and lighting apparatus including the same
KR20150092596A (en) * 2014-02-05 2015-08-13 엘지이노텍 주식회사 Light emitting device package and lighting apparatus including the same
KR20150092598A (en) * 2014-02-05 2015-08-13 엘지이노텍 주식회사 Light emitting device package and lighting apparatus including the same
JP2015195407A (en) * 2009-07-22 2015-11-05 フィリップス ルミレッズ ライティング カンパニー リミテッド ライアビリティ カンパニー Light-emitting diode packages and manufacturing methods thereof
JP2016206633A (en) * 2015-04-21 2016-12-08 隆達電子股▲ふん▼有限公司 Light emitting device and its lens structure

Citations (10)

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JPS5092665U (en) * 1973-12-27 1975-08-05
JPH05291627A (en) * 1992-04-10 1993-11-05 Iwasaki Electric Co Ltd Light emitting diode
JPH0653554A (en) * 1992-07-28 1994-02-25 Rohm Co Ltd Optical semiconductor device
JPH098357A (en) * 1995-06-16 1997-01-10 Rohm Co Ltd Light emitting device and production thereof
JP2001279585A (en) * 2000-03-29 2001-10-10 Asahi Lite Optical Co Ltd Method for producing colored plastic lens having high refractive index
JP3101037U (en) * 2002-11-26 2004-06-03 玄基光電半導體股▲ふん▼有限公司 Surface mount type light emitting diode
WO2005025831A1 (en) * 2003-09-09 2005-03-24 Cree, Inc. Transmissive optical elements including transparent plastic shell having a phosphor dispersed therein, and methods of fabricating same
JP2006310710A (en) * 2005-05-02 2006-11-09 Sony Corp Semiconductor light-emitting element
JP2006525682A (en) * 2003-04-30 2006-11-09 クリー　インコーポレイテッド High power solid state light emitting device package
JP2006319149A (en) * 2005-05-13 2006-11-24 Sony Corp Light source, manufacturing method thereof, and display unit using the same

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0563343A (en) * 1991-08-30 1993-03-12 Techno Sunstar Kk Electronic parts packaging method
JP2000282442A (en) * 1999-03-30 2000-10-10 Ube Nitto Kasei Co Ltd Partition panel made of fiber reinforced resin

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5092665U (en) * 1973-12-27 1975-08-05
JPH05291627A (en) * 1992-04-10 1993-11-05 Iwasaki Electric Co Ltd Light emitting diode
JPH0653554A (en) * 1992-07-28 1994-02-25 Rohm Co Ltd Optical semiconductor device
JPH098357A (en) * 1995-06-16 1997-01-10 Rohm Co Ltd Light emitting device and production thereof
JP2001279585A (en) * 2000-03-29 2001-10-10 Asahi Lite Optical Co Ltd Method for producing colored plastic lens having high refractive index
JP3101037U (en) * 2002-11-26 2004-06-03 玄基光電半導體股▲ふん▼有限公司 Surface mount type light emitting diode
JP2006525682A (en) * 2003-04-30 2006-11-09 クリー　インコーポレイテッド High power solid state light emitting device package
WO2005025831A1 (en) * 2003-09-09 2005-03-24 Cree, Inc. Transmissive optical elements including transparent plastic shell having a phosphor dispersed therein, and methods of fabricating same
JP2006310710A (en) * 2005-05-02 2006-11-09 Sony Corp Semiconductor light-emitting element
JP2006319149A (en) * 2005-05-13 2006-11-24 Sony Corp Light source, manufacturing method thereof, and display unit using the same

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015195407A (en) * 2009-07-22 2015-11-05 フィリップス ルミレッズ ライティング カンパニー リミテッド ライアビリティ カンパニー Light-emitting diode packages and manufacturing methods thereof
WO2011016269A1 (en) * 2009-08-07 2011-02-10 シャープ株式会社 Lens, light-emitting module, light-emitting element package, illumination device, display device, and television receiver
WO2012033180A1 (en) * 2010-09-08 2012-03-15 三菱化学株式会社 Light emitting apparatus, lighting apparatus, and lens
JP2012109532A (en) * 2010-09-08 2012-06-07 Mitsubishi Chemicals Corp Light emitting apparatus, lighting apparatus, and lens
US8814385B2 (en) 2010-09-08 2014-08-26 Mitsubishi Chemical Corporation Light-emitting apparatus, lighting apparatus and lens
JP2012234947A (en) * 2011-04-28 2012-11-29 Mitsubishi Chemicals Corp Resin package for semiconductor light-emitting device, semiconductor light-emitting device having the resin package and method for manufacturing the same
KR20150092596A (en) * 2014-02-05 2015-08-13 엘지이노텍 주식회사 Light emitting device package and lighting apparatus including the same
KR20150092598A (en) * 2014-02-05 2015-08-13 엘지이노텍 주식회사 Light emitting device package and lighting apparatus including the same
KR20150092597A (en) * 2014-02-05 2015-08-13 엘지이노텍 주식회사 Light emitting device package and lighting apparatus including the same
KR102131771B1 (en) * 2014-02-05 2020-07-08 엘지이노텍 주식회사 Light emitting device package and lighting apparatus including the same
KR102140226B1 (en) * 2014-02-05 2020-07-31 엘지이노텍 주식회사 Light emitting device package and lighting apparatus including the same
KR102154061B1 (en) * 2014-02-05 2020-09-09 엘지이노텍 주식회사 Light emitting device package and lighting apparatus including the same
JP2016206633A (en) * 2015-04-21 2016-12-08 隆達電子股▲ふん▼有限公司 Light emitting device and its lens structure
US9903559B2 (en) 2015-04-21 2018-02-27 Lextar Electronics Corporation Lighting apparatus and lens structure thereof

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Publication number Publication date
JPWO2008096714A1 (en) 2010-05-20

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