WO2008087976A1 - Printed wiring board and method for manufacturing the same - Google Patents

Printed wiring board and method for manufacturing the same Download PDF

Info

Publication number
WO2008087976A1
WO2008087976A1 PCT/JP2008/050434 JP2008050434W WO2008087976A1 WO 2008087976 A1 WO2008087976 A1 WO 2008087976A1 JP 2008050434 W JP2008050434 W JP 2008050434W WO 2008087976 A1 WO2008087976 A1 WO 2008087976A1
Authority
WO
WIPO (PCT)
Prior art keywords
metal substrate
wiring board
printed wiring
insulating layer
manufacturing
Prior art date
Application number
PCT/JP2008/050434
Other languages
French (fr)
Japanese (ja)
Inventor
Yoshio Oka
Jinjoo Park
Kazuyuki Maeda
Narito Yagi
Tetsuya Shimomura
Junichiro Nishikawa
Original Assignee
Sumitomo Electric Industries, Ltd.
Sumitomo Electric Printed Circuits, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2007047609A external-priority patent/JP5214154B2/en
Application filed by Sumitomo Electric Industries, Ltd., Sumitomo Electric Printed Circuits, Inc. filed Critical Sumitomo Electric Industries, Ltd.
Priority to CN200880001426.1A priority Critical patent/CN101578927B/en
Priority to US12/518,398 priority patent/US8866027B2/en
Publication of WO2008087976A1 publication Critical patent/WO2008087976A1/en
Priority to HK10102067.2A priority patent/HK1135556A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09554—Via connected to metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates

Abstract

A printed wiring board (1) is provided with a metal substrate (2); an insulating layer (3) arranged on the surface of the metal substrate (2); and a conductive layer (4), which is arranged on the surface of the insulating layer (3) and electrically connected to the metal substrate (2). On the insulating layer (3) and the conductive layer (4), a bottomed via hole, which has a bottom surface on the metal substrate (2) and side walls on the insulating layer (3) and the conductive layer (4), or a through hole (6), which penetrates the insulating layer (3), the conductive layer (4) and the metal substrate (2). The bottomed via hole or the through hole (6) is filled with a conductive paste (7) for electrically connecting the metal substrate (2) and the conductive layer (4). The printed wiring board (1) is processed to permit a current to flow to an interface between the metal substrate (2) and the conductive paste (7).
PCT/JP2008/050434 2007-01-19 2008-01-16 Printed wiring board and method for manufacturing the same WO2008087976A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN200880001426.1A CN101578927B (en) 2007-01-19 2008-01-16 Printed wiring board and method for manufacturing the same
US12/518,398 US8866027B2 (en) 2007-01-19 2008-01-16 Printed wiring board and method for manufacturing the same
HK10102067.2A HK1135556A1 (en) 2007-01-19 2010-02-26 Printed wiring board and method for manufacturing the same

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007010416 2007-01-19
JP2007-010416 2007-01-19
JP2007047609A JP5214154B2 (en) 2007-01-19 2007-02-27 Printed wiring board and manufacturing method thereof
JP2007-047609 2007-02-27

Publications (1)

Publication Number Publication Date
WO2008087976A1 true WO2008087976A1 (en) 2008-07-24

Family

ID=39635982

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/050434 WO2008087976A1 (en) 2007-01-19 2008-01-16 Printed wiring board and method for manufacturing the same

Country Status (1)

Country Link
WO (1) WO2008087976A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102472966A (en) * 2009-07-27 2012-05-23 住友电气工业株式会社 Negative photosensitive resin composition, polyimide resin film using same, and flexible printed circuit board
JP2016009854A (en) * 2014-06-26 2016-01-18 住友電工プリントサーキット株式会社 Printed wiring board, electronic component, and method for manufacturing printed wiring board
CN112135441A (en) * 2020-10-09 2020-12-25 景旺电子科技(龙川)有限公司 Grounding metal-based circuit board and preparation method thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11251751A (en) * 1998-02-27 1999-09-17 Kyocera Corp Wiring board and its production
JP2006202359A (en) * 2005-01-18 2006-08-03 Dainippon Printing Co Ltd Magnetic head suspension
JP2006245122A (en) * 2005-03-01 2006-09-14 Dainippon Printing Co Ltd Wiring member and method of manufacturing wiring member

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11251751A (en) * 1998-02-27 1999-09-17 Kyocera Corp Wiring board and its production
JP2006202359A (en) * 2005-01-18 2006-08-03 Dainippon Printing Co Ltd Magnetic head suspension
JP2006245122A (en) * 2005-03-01 2006-09-14 Dainippon Printing Co Ltd Wiring member and method of manufacturing wiring member

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102472966A (en) * 2009-07-27 2012-05-23 住友电气工业株式会社 Negative photosensitive resin composition, polyimide resin film using same, and flexible printed circuit board
JP2016009854A (en) * 2014-06-26 2016-01-18 住友電工プリントサーキット株式会社 Printed wiring board, electronic component, and method for manufacturing printed wiring board
CN112135441A (en) * 2020-10-09 2020-12-25 景旺电子科技(龙川)有限公司 Grounding metal-based circuit board and preparation method thereof

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