WO2008083167A1 - Connecteur électrique présentant une pince de mise à la terre esd - Google Patents

Connecteur électrique présentant une pince de mise à la terre esd Download PDF

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Publication number
WO2008083167A1
WO2008083167A1 PCT/US2007/088838 US2007088838W WO2008083167A1 WO 2008083167 A1 WO2008083167 A1 WO 2008083167A1 US 2007088838 W US2007088838 W US 2007088838W WO 2008083167 A1 WO2008083167 A1 WO 2008083167A1
Authority
WO
WIPO (PCT)
Prior art keywords
grounding clip
ground pin
shroud
signal ground
signal
Prior art date
Application number
PCT/US2007/088838
Other languages
English (en)
Inventor
Steven Sprouse
Patricio Collantes
Dhaval Parikh
Original Assignee
Sandisk Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/618,292 external-priority patent/US7810235B2/en
Priority claimed from US11/618,280 external-priority patent/US7410370B2/en
Application filed by Sandisk Corporation filed Critical Sandisk Corporation
Publication of WO2008083167A1 publication Critical patent/WO2008083167A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2442—Contacts for co-operating by abutting resilient; resiliently-mounted with a single cantilevered beam
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/6485—Electrostatic discharge protection

Definitions

  • Embodiments of the present invention relate to a method of preventing electrostatic discharge during connection of a USB-type connector, and a USB- type connector formed thereby.
  • Non-volatile semiconductor memory devices such as flash memory storage cards
  • flash memory storage cards are becoming widely used to meet the ever-growing demands on digital information storage and exchange.
  • Their portability, versatility and rugged design, along with their high reliability and large storage capacity, have made such memory devices ideal for use in a wide variety of electronic devices, including for example digital cameras, digital music players, video game consoles, PDAs and cellular telephones.
  • USB universal serial bus
  • the USB interface is comprised of a male plug and female socket connectors. Plugs generally have one or more pins that are inserted into openings in the mating socket. While there are several types of USB connectors, the most commonly used is the type-A plug on which is a 4-pin connector, surrounded by a shield. A conventional type-A USB plug and socket are shown in cross-section in prior -2-
  • the conventional USB plug 20 shown in Fig. 1 may for example be attached to an electronic device and includes a base 22 on which is formed a signal power pin 24, a pair of signal pins 26, 28 and a signal ground pin 30. The base and pins are covered by a shroud 32.
  • the conventional USB socket 36 may be incorporated in a host device and includes a base 38 and four terminals 40 through 46 formed thereon. As seen in Fig. 3, the plug may be received within the socket with pins 24 through 30 mating with pins 40 through 46 to allow transfer of signals between the electronic and host devices.
  • the shroud is electrically coupled to the signal ground pin through an established circuit path in the electronic device.
  • the shroud may typically be soldered to a printed circuit board at a location coupled to the signal ground pin.
  • One of the functions of the electrical coupling of the shroud to ground is to prevent electrostatic discharge (ESD) between the shroud and portions of the circuit of the electronic device.
  • ESD electrostatic discharge
  • an electrostatic charge may jump from the shroud onto the electronic circuit, where the electrostatic charge may damage semiconductor components in the circuit.
  • the connector includes a split-level base block, a first level of which includes a plurality of signal pins, and a second level of which includes an ESD grounding clip.
  • the grounding clip may be provided within a recess formed at least partially down into the surface of the second level of the base block.
  • the grounding clip may have a proximal end affixed to a proximal end of a signal ground pin of the plurality of signal pins, though the grounding clip and signal ground pin may be coupled at other locations along their lengths.
  • the connector including the grounding clip may be affixed to a semiconductor device.
  • a shroud may be affixed around the connector and, possibly, around the semiconductor device.
  • a portion of the grounding clip is provided at a height above the surface of the base block such that, as the shroud is slid around the base block, the shroud engages and remains in contact with the grounding clip. Accordingly, any electrostatic discharge built up in the shroud travels from the shroud, through the ESD grounding clip, to the signal ground pin where it is harmlessly dissipated.
  • Figure 1 is a cross-sectional view of a conventional type-A USB plug.
  • Figure 2 is a cross-sectional view of a conventional type-A USB socket. -4-
  • Figure 3 is a cross-sectional view of a conventional type-A USB plug inserted within a type-A USB socket.
  • Figure 4 is a perspective view of a USB plug without a shroud according to an embodiment of the present invention.
  • Figure 5 is a top view of the embodiment shown in Fig. 4.
  • Figure 6 is an edge view of the embodiment shown in Fig. 4.
  • Figure 7 is an edge view of a USB plug without a shroud according to an alternative embodiment of the present invention.
  • Figure 8 is an edge view of a USB plug without a shroud according to a further embodiment of the present invention.
  • Figure 9 is an edge view of a USB plug without a shroud according to a further alternative embodiment of the present invention.
  • Figure 10 is a cross-sectional edge view of a USB plug according to an embodiment of the present invention.
  • Figure 11 is a top view of a USB semiconductor device without a shroud according to an embodiment of the present invention.
  • Figure 12 is a cross-sectional edge view of a USB semiconductor device according to an embodiment of the present invention.
  • Connector 100 includes a split-level base block 102 including a first level 104 and a second level 114 integrally formed or affixed to level 104.
  • First level 104 includes a plurality of signal pins 106-112, each having ends proximate to a distal end 118 of level 104.
  • Level 114 includes a distal end 120 and a proximal end 122.
  • Base block 102 may be formed of a material known for use in USB- type connectors, such as for example any of various plastics having dielectric properties.
  • Base block 102 may be molded as an integral unit including levels 104, 114 and signal pins 106-112. Alternatively, signal pins 106-112 may be -6-
  • level 104 affixed to level 104, and thereafter level 114 bonded to level 104 in an offset configuration as shown.
  • level 114 bonded to level 104 in an offset configuration as shown. While an embodiment of the present invention described herein includes a split level base block, it is understood that the ESD grounding clip described hereinafter may be used with other USB connector designs that do not include a split level base block.
  • Signal pins 106-112 may be conventional signal pins found in a type-A USB connector.
  • Pin 106 may be a signal power pin for supplying a voltage to a semiconductor device to which USB connector 100 is attached as explained hereinafter.
  • Signal pins 108 and 110 may transmit signals between the semiconductor device and a host device to which USB connector 100 is connected.
  • Pin 112 may be a signal ground pin providing the semiconductor device with a path to ground.
  • Each of pins 106-112 may be exposed on a surface of the first level 104 of the connector 100.
  • the signal pins 106-112 may be buried within a portion of connector 100 where levels 104 and 114 overlap, and the pins may be exposed at a bottom surface 124 of level 114.
  • a proximal end of each of the pins may extend past the proximal end 122 of level 114 as shown for signal ground pin 112 in Fig. 4 and for each of the pins in Fig. 5.
  • the proximal portions of pins 106-112 are used to solder the pins to a printed circuit board of the semiconductor device as explained hereinafter.
  • Base block 102 includes a recessed portion 130 formed in level 114.
  • recess 130 may be formed over the signal ground pin and along a length of the signal ground pin. However, recess 130 may be formed at other locations in level 114 in alternative embodiments explained hereinafter. As best seen in the edge view of Fig. 6, recess 130 may extend partially down through base block 102 a distance, d, so that no portion of the signal ground pin 112 beneath the recess 130 is exposed. As explained hereinafter, in alternative embodiments, recess 130 may extend down to a depth where portions of signal ground pin 112 are exposed within recess 130. In embodiments, recess 130 may be open to the proximal end 122 of level 114 but does not extend to the -7-
  • recess 130 may extend all the way to distal end 120 of layer 114. In a further alternative embodiment explained hereinafter, recess 130 may be omitted altogether.
  • ESD grounding clip 134 may be affixed within recess 130.
  • Grounding clip 134 may be formed of aluminum, copper, other metals and alloys thereof.
  • Clip 134 may or may not be plated.
  • ESD grounding clip 134 may include a proximal end 136 which is physically and electrically coupled to a proximal end of signal ground pin 112, such as for example by solder 138 (shown in Figs. 4 and 5). Other methods of electrically and physically coupling clip 134 to the proximal end of signal ground pin 112 are contemplated.
  • clip 134 may include a fulcrum point 140 (best seen in Fig.
  • Clip 134 may further include a portion 144 protruding outside of recess 130 as seen in Figs. 4 and 6. Portion 144 is provided to engage a shroud mounted around base block 102 as explained hereinafter.
  • Recess 130 and ESD grounding clip 134 are shown aligned over signal ground pin 112, and clip 134 is shown connected to ground pin 112 at a proximal end of pin 112.
  • clip 134 may be electrically coupled to signal ground pin 112 with the recess 130 and clip 134 positioned at other locations within level 114 of base block 102.
  • the recess 130 and clip 134 may be located over one or more of pins 106, 108 and 110.
  • Recess 130 and clip 134 may or may not be parallel to pins 106-112.
  • clip 134 is shown as a substantially straight length of metal (when viewed from the top of Fig. 5), it is understood that recess 130 and clip 134 may have curved or rounded edges when viewed from the top in further embodiments.
  • clip 134 may be physically and/or electrically coupled to signal ground pin 112 at locations other than the proximal end of pin 112.
  • recess 130 may extend all the way through level 114 to signal ground pin 112 so that signal ground pin 112 is exposed at the bottom of recess 130.
  • clip 134 may be physically and/or electrically coupled to a variety of positions along the length of signal ground pin 112 within level 114 of base block 102.
  • recess 130 may have first portions extending down through level 114 a first distance, dl, and a second portion extending all the way through level 114 a second distance, d2 (so that the signal ground pin 112 is exposed at the second portion of the recess).
  • clip 134 may be physically and electrically coupled to signal ground pin 112 where pin 112 is exposed within recess 130.
  • ESD grounding clip 134 may be directly affixed anywhere on the surface of level 114, and have a proximal end electrically coupled to the proximal end of signal ground pin 112 as described above. In such an embodiment, ESD grounding clip 134 may include a protruding portion 150 extending above the surface of level 114.
  • a shroud 156 may be affixed around base block 102 and ESD grounding clip 136.
  • Shroud 156 may be a protective metal cover as is known in the art, and base block 102 may be mounted within shroud 156 as is known in the art.
  • portion 146, 150 of clip 136 is provided at a height above the surface of base block 102 such that, as shroud 156 is slid around the base block, the shroud slightly compresses the portion 146, 150 downward.
  • Fig. 11 is a top view of connector 100 affixed to a semiconductor device 170.
  • pins 106, 108, 110 and 112 are affixed to semiconductor device 170 at their proximal ends, such as for example by soldering or other known electrical coupling methods.
  • semiconductor device 170 and connector 100 may both be enclosed within shroud 156.
  • semiconductor device 170 may be encased in molding compound and the encased semiconductor device then mounted within shroud 156. Where semiconductor device 170 is encased in molding compound, the shroud may only cover the connector 100.
  • the type and function of semiconductor device 170 is not critical to the present invention, but may in embodiments be a flash memory device including one or more flash memory die and one or more controller die such as an ASIC.

Landscapes

  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

La présente invention concerne un connecteur destiné à éviter les décharges électrostatiques au cours de la connexion d'un connecteur de type USB. Le connecteur comprend une pince de mise à la terre placée dans un retrait formé au moins partiellement vers le bas dans la surface du second niveau du bloc de base. La pince de mise à la terre peut présenter une extrémité proximale fixée à une extrémité proximale des nombreuses broches de terre de signalisation, la pince de mise à la terre et la broche de terre de signalisation pouvant cependant être couplées en d'autres emplacements sur leur longueur respective. Le connecteur comprenant une pince de mise à la terre peut être fixé à un dispositif à semi-conducteur. Une partie de la pince de mise à la terre est disposée à une hauteur supérieure à celle de la surface du bloc de base de sorte que, lorsqu'une gaine est glissée autour du connecteur, celle-ci se trouve couplée à la pince de mise à la terre et reste en contact avec elle. En conséquence, toute décharge électrostatique qui se forme dans la gaine, circule de la gaine, à travers la pince de mise à la terre ESD, jusqu'à la broche de terre de signalisation au niveau de laquelle elle se dissipe sans provoquer de dommage.
PCT/US2007/088838 2006-12-29 2007-12-26 Connecteur électrique présentant une pince de mise à la terre esd WO2008083167A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US11/618,292 US7810235B2 (en) 2006-12-29 2006-12-29 Method of making an electrical connector with ESD grounding clip
US11/618,292 2006-12-29
US11/618,280 2006-12-29
US11/618,280 US7410370B2 (en) 2006-12-29 2006-12-29 Electrical connector with ESD grounding clip

Publications (1)

Publication Number Publication Date
WO2008083167A1 true WO2008083167A1 (fr) 2008-07-10

Family

ID=39111805

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/088838 WO2008083167A1 (fr) 2006-12-29 2007-12-26 Connecteur électrique présentant une pince de mise à la terre esd

Country Status (2)

Country Link
TW (1) TWI343155B (fr)
WO (1) WO2008083167A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013107020A1 (fr) * 2012-01-19 2013-07-25 华硕科技（苏州）有限公司 Connecteur et système électronique l'utilisant
US9557791B2 (en) 2012-02-29 2017-01-31 Asus Technology (Suzhou) Co., Ltd. Computer device and method for converting working mode of universal serial bus connector of the computer device
DE102018116566A1 (de) 2018-07-09 2020-01-09 Te Connectivity Germany Gmbh Kontakteinrichtung und Kontaktsystem

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104466547B (zh) * 2013-09-25 2017-10-13 富士康(昆山)电脑接插件有限公司 电连接器
US20210296827A1 (en) * 2018-07-04 2021-09-23 Sakai Display Products Corporation First connector, second connector, and connector device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020048976A1 (en) * 2000-10-20 2002-04-25 Ziqiang Zhu Electrical connector with improved terminal arrangement and structure
US20030157836A1 (en) * 2002-02-21 2003-08-21 Yazaki Corporation USB connector
US6854984B1 (en) * 2003-09-11 2005-02-15 Super Talent Electronics, Inc. Slim USB connector with spring-engaging depressions, stabilizing dividers and wider end rails for flash-memory drive
US7108560B1 (en) * 2003-09-11 2006-09-19 Super Talent Electronics, Inc. Extended USB protocol plug and receptacle for implementing single-mode communication

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020048976A1 (en) * 2000-10-20 2002-04-25 Ziqiang Zhu Electrical connector with improved terminal arrangement and structure
US20030157836A1 (en) * 2002-02-21 2003-08-21 Yazaki Corporation USB connector
US6854984B1 (en) * 2003-09-11 2005-02-15 Super Talent Electronics, Inc. Slim USB connector with spring-engaging depressions, stabilizing dividers and wider end rails for flash-memory drive
US7108560B1 (en) * 2003-09-11 2006-09-19 Super Talent Electronics, Inc. Extended USB protocol plug and receptacle for implementing single-mode communication

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013107020A1 (fr) * 2012-01-19 2013-07-25 华硕科技（苏州）有限公司 Connecteur et système électronique l'utilisant
US9356397B2 (en) 2012-01-19 2016-05-31 Asustek Computer Inc. Connector and electronic system using the same
US9557791B2 (en) 2012-02-29 2017-01-31 Asus Technology (Suzhou) Co., Ltd. Computer device and method for converting working mode of universal serial bus connector of the computer device
DE102018116566A1 (de) 2018-07-09 2020-01-09 Te Connectivity Germany Gmbh Kontakteinrichtung und Kontaktsystem
EP3595100A1 (fr) 2018-07-09 2020-01-15 TE Connectivity Germany GmbH Dispositif de contact et système de contact
US10840630B2 (en) 2018-07-09 2020-11-17 Te Connectivity Germany Gmbh Contact device and contact system

Also Published As

Publication number Publication date
TWI343155B (en) 2011-06-01
TW200843246A (en) 2008-11-01

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