WO2008081705A1 - Pressure wave generator and heat dissipation method thereof - Google Patents

Pressure wave generator and heat dissipation method thereof Download PDF

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Publication number
WO2008081705A1
WO2008081705A1 PCT/JP2007/074247 JP2007074247W WO2008081705A1 WO 2008081705 A1 WO2008081705 A1 WO 2008081705A1 JP 2007074247 W JP2007074247 W JP 2007074247W WO 2008081705 A1 WO2008081705 A1 WO 2008081705A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
wave generator
pressure wave
heat
insulating layer
Prior art date
Application number
PCT/JP2007/074247
Other languages
French (fr)
Japanese (ja)
Inventor
Masato Hayashi
Original Assignee
Tokyo Electron Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Limited filed Critical Tokyo Electron Limited
Publication of WO2008081705A1 publication Critical patent/WO2008081705A1/en

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Classifications

    • G—PHYSICS
    • G10—MUSICAL INSTRUMENTS; ACOUSTICS
    • G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
    • G10K15/00—Acoustics not otherwise provided for
    • G10K15/04—Sound-producing devices

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Multimedia (AREA)
  • Apparatuses For Generation Of Mechanical Vibrations (AREA)
  • Motor Or Generator Cooling System (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

Disclosed is a pressure wave generator (1) comprising a thermally conductive substrate (2), a heat insulating layer (3) formed on one major surface of the substrate (2), a heat generating body (4) formed on the heat insulating layer (3) and generating heat when a current containing an alternating component is applied thereto, and a heatsink (5) arranged in contact with the other major surface of the substrate (2) and diffusing heat of the substrate (2) to the outside of the substrate (2). The pressure wave generator (1) may further comprise a cooling means for forcibly cooling the heatsink (5). Preferably, the heat insulating layer (3) is composed of a nanocrystalline silicon. The heat generating body (4) may contain gold or tungsten.
PCT/JP2007/074247 2006-12-28 2007-12-17 Pressure wave generator and heat dissipation method thereof WO2008081705A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006-355677 2006-12-28
JP2006355677A JP2008161820A (en) 2006-12-28 2006-12-28 Pressure wave producing apparatus

Publications (1)

Publication Number Publication Date
WO2008081705A1 true WO2008081705A1 (en) 2008-07-10

Family

ID=39588389

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/074247 WO2008081705A1 (en) 2006-12-28 2007-12-17 Pressure wave generator and heat dissipation method thereof

Country Status (3)

Country Link
JP (1) JP2008161820A (en)
TW (1) TW200841940A (en)
WO (1) WO2008081705A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019245418A1 (en) * 2018-06-21 2019-12-26 Mats Olsson Method and system for cooling hot objects

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010220313A (en) * 2009-03-13 2010-09-30 Tokyo Electron Ltd Sample injection device
CN103999014B (en) * 2011-11-15 2019-03-12 汉高知识产权控股有限责任公司 The electronic equipment assembled using thermal insulation layer
TWI657132B (en) 2013-12-19 2019-04-21 德商漢高智慧財產控股公司 Compositions having a matrix and encapsulated phase change materials dispersed therein, and electronic devices assembled therewith

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002134975A (en) * 2000-10-23 2002-05-10 Nippon Keiki Works Ltd Cooling fan
JP2005269745A (en) * 2004-03-17 2005-09-29 Nokodai Tlo Kk Ultrasonic sound source and ultrasonic sensor
JP2006307030A (en) * 2005-04-28 2006-11-09 Fujikura Rubber Ltd Heat-radiating greasy composition

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002134975A (en) * 2000-10-23 2002-05-10 Nippon Keiki Works Ltd Cooling fan
JP2005269745A (en) * 2004-03-17 2005-09-29 Nokodai Tlo Kk Ultrasonic sound source and ultrasonic sensor
JP2006307030A (en) * 2005-04-28 2006-11-09 Fujikura Rubber Ltd Heat-radiating greasy composition

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019245418A1 (en) * 2018-06-21 2019-12-26 Mats Olsson Method and system for cooling hot objects

Also Published As

Publication number Publication date
TW200841940A (en) 2008-11-01
JP2008161820A (en) 2008-07-17

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