WO2008077048A3 - Substrate processing apparatus and method - Google Patents

Substrate processing apparatus and method Download PDF

Info

Publication number
WO2008077048A3
WO2008077048A3 PCT/US2007/087953 US2007087953W WO2008077048A3 WO 2008077048 A3 WO2008077048 A3 WO 2008077048A3 US 2007087953 W US2007087953 W US 2007087953W WO 2008077048 A3 WO2008077048 A3 WO 2008077048A3
Authority
WO
WIPO (PCT)
Prior art keywords
stage
angular speed
substrate processing
respect
processing apparatus
Prior art date
Application number
PCT/US2007/087953
Other languages
French (fr)
Other versions
WO2008077048A2 (en
Inventor
Marek Zywno
Noah Bareket
Original Assignee
Kla Tencor Corp
Marek Zywno
Noah Bareket
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/670,896 external-priority patent/US7633070B2/en
Application filed by Kla Tencor Corp, Marek Zywno, Noah Bareket filed Critical Kla Tencor Corp
Priority to EP07869445A priority Critical patent/EP2097790A2/en
Priority to JP2009541643A priority patent/JP5453104B2/en
Publication of WO2008077048A2 publication Critical patent/WO2008077048A2/en
Priority to US12/170,361 priority patent/US8058628B2/en
Publication of WO2008077048A3 publication Critical patent/WO2008077048A3/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
    • F16C32/00—Bearings not otherwise provided for
    • F16C32/04—Bearings not otherwise provided for using magnetic or electric supporting means
    • F16C32/0406—Magnetic bearings
    • F16C32/044—Active magnetic bearings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
    • G03F7/704—Scanned exposure beam, e.g. raster-, rotary- and vector scanning
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70816—Bearings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate

Abstract

Substrate processing methods and apparatus are disclosed. In some embodiments a substrate processing apparatus may comprise a support structure and a moveable stage including first and second stages. The moveable stage has one or more maglev units attached to the first stage and/or second stage proximate an edge of the first stage. The first stage retains one or more substrates and moves with respect to a first axis that is substantially fixed with respect to the second stage. The second stage translates along a second axis with respect to the support structure. In other embodiments, a primary motor may maintain a rotary stage at an angular speed and/or accelerate or decelerate the stage from a first angular speed to a second angular speed. A secondary motor may accelerate the stage from rest to the first angular speed and/or decelerate the stage from a non-zero angular speed.
PCT/US2007/087953 2006-12-18 2007-12-18 Substrate processing apparatus and method WO2008077048A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP07869445A EP2097790A2 (en) 2006-12-18 2007-12-18 Substrate processing apparatus and method
JP2009541643A JP5453104B2 (en) 2006-12-18 2007-12-18 Substrate process equipment
US12/170,361 US8058628B2 (en) 2007-07-09 2008-07-09 Substrate processing apparatus and method

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US87052806P 2006-12-18 2006-12-18
US60/870,528 2006-12-18
US11/670,896 2007-02-02
US11/670,896 US7633070B2 (en) 2006-12-18 2007-02-02 Substrate processing apparatus and method
US94866707P 2007-07-09 2007-07-09
US60/948,667 2007-07-09

Publications (2)

Publication Number Publication Date
WO2008077048A2 WO2008077048A2 (en) 2008-06-26
WO2008077048A3 true WO2008077048A3 (en) 2008-12-04

Family

ID=39359425

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/087953 WO2008077048A2 (en) 2006-12-18 2007-12-18 Substrate processing apparatus and method

Country Status (3)

Country Link
EP (1) EP2097790A2 (en)
JP (3) JP5453104B2 (en)
WO (1) WO2008077048A2 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101847978B1 (en) * 2011-06-10 2018-04-12 엘지디스플레이 주식회사 Apparatus for manufacturing organic light emitting diodes
WO2013036615A1 (en) * 2011-09-06 2013-03-14 Kla-Tencor Corporation Linear stage for reflective electron beam lithography
JP5886084B2 (en) * 2012-03-05 2016-03-16 住友重機械工業株式会社 Stage equipment
KR102518220B1 (en) 2016-11-09 2023-04-04 티이엘 매뉴팩처링 앤드 엔지니어링 오브 아메리카, 인크. Magnetically levitated and rotated chucks for handling microelectronic substrates in process chambers
TWI765936B (en) 2016-11-29 2022-06-01 美商東京威力科創Ｆｓｉ股份有限公司 Translating and rotating chuck for processing microelectronic substrates in a process chamber
KR102493551B1 (en) 2017-01-27 2023-01-30 티이엘 매뉴팩처링 앤드 엔지니어링 오브 아메리카, 인크. Systems and methods for rotating and translating a substrate in a process chamber
DE102017002542A1 (en) * 2017-03-16 2018-09-20 Applied Materials, Inc. (N.D.Ges.D. Staates Delaware) Device for holding, positioning and / or moving an object
US11545387B2 (en) 2018-07-13 2023-01-03 Tel Manufacturing And Engineering Of America, Inc. Magnetic integrated lift pin system for a chemical processing chamber
CN112165277B (en) * 2020-10-14 2023-05-16 福建师范大学 Magnetic suspension rotating device for three-dimensional display and three-dimensional display system

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US5641960A (en) * 1994-01-13 1997-06-24 Fujitsu Limited Circuit pattern inspecting device and method and circuit pattern arrangement suitable for the method
US20020047542A1 (en) * 2000-09-07 2002-04-25 Pioneer Corporation Exposure system
US6515742B1 (en) * 2000-11-28 2003-02-04 Memc Electronic Materials, Inc. Defect classification using scattered light intensities
US20030230323A1 (en) * 2002-06-14 2003-12-18 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and method for improving scrubber cleaning
WO2006007167A2 (en) * 2004-06-17 2006-01-19 Nikon Corporation Magnetic levitation lithography apparatus and method
US20060054494A1 (en) * 2004-09-16 2006-03-16 Veeco Instruments Inc. Physical vapor deposition apparatus for depositing thin multilayer films and methods of depositing such films

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WO1997015978A1 (en) * 1995-10-26 1997-05-01 Satcon Technology Corporation Integrated magnetic levitation and rotation system
US20020047542A1 (en) * 2000-09-07 2002-04-25 Pioneer Corporation Exposure system
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US20060054494A1 (en) * 2004-09-16 2006-03-16 Veeco Instruments Inc. Physical vapor deposition apparatus for depositing thin multilayer films and methods of depositing such films

Also Published As

Publication number Publication date
JP5453104B2 (en) 2014-03-26
EP2097790A2 (en) 2009-09-09
JP2015111714A (en) 2015-06-18
JP2014042048A (en) 2014-03-06
JP2010514167A (en) 2010-04-30
WO2008077048A2 (en) 2008-06-26

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