WO2008062598A1

WO2008062598A1 - Vacuum pump

Info

Publication number: WO2008062598A1
Application number: PCT/JP2007/068069
Authority: WO
Inventors: Takashi Kabasawa
Original assignee: Edwards Japan Limited
Priority date: 2006-11-22
Filing date: 2007-09-18
Publication date: 2008-05-29
Also published as: JPWO2008062598A1; JP5156640B2

Abstract

A vacuum pump having a pump body and a controller integrated together, in which the inside of the controller is appropriately cooled. In a control board on which an element producing a large amount of heat is mounted and that is in contact with a partition plate, the produced heat is directly transmitted from the control board to the partition plate and then transmitted to a cooling jacket through a sidewall. On the other hand, in a control board not in contact with the partition plate, heat produced by an element mounted on the control board is transmitted from the control board to air passing between stacked control boards. Consequently,air passing between the stacked control boards is heated. When the heated air passes through heat exchange fins cooled by cooling effect of the cooling jacket, the heat is transmitted to the heat exchange fins and the cooled air is fed again to the control board. Thus, heat produced by the control board is discharged to the outside not only through the partition plate but also through the air circulating in the controller.

Description

Specification

Vacuum pump

Technical field

The present invention relates to a vacuum pump, for example, a vacuum pump that performs exhaust processing of a vacuum vessel.

Background art

[0002] Vacuum pumps such as turbo molecular pumps and thread groove pumps are widely used in, for example, vacuum vessels that require high vacuum, such as exhaust of semiconductor manufacturing equipment and electron microscopes.

A vacuum pump that realizes this high vacuum environment includes a casing that forms an exterior body having an intake port and an exhaust port. And inside the casing, there is housed a structure that allows the vacuum pump to exert its exhaust function! A structure that exhibits this exhaust function is roughly composed of a rotating part (rotor part) rotatably supported by a shaft and a fixed part (stator part) fixed to the casing.

[0003] The rotating unit includes a rotating shaft and a rotating body fixed to the rotating shaft, and the rotating body is provided with rotor blades arranged radially and in multiple stages. In addition, the fixed part has a plurality of stator blades arranged in multiple stages with respect to the rotor blades.

The turbo molecular pump is provided with a motor for rotating the rotating shaft at a high speed. When the rotating shaft rotates at a high speed by the function of this motor, gas is sucked from the intake port by the action of the rotor blade and the stator blade. And exhausted from the exhaust port.

The pump body configured as described above is controlled in various operations by a control device (control unit).

[0004] The pump body and the control device as described above are connected via a dedicated cable. Since this dedicated cable is a thick bundle of many signal wires and power supply wires, the cable could not be routed easily.

Also, in an environment where the pump body and the control unit are located far away from each other! /, The length of the dedicated cable is inevitably longer, so the signal may be attenuated while passing through the cable. was there. Conventionally, in order to eliminate such problems caused by the dedicated cable, the technology for connecting the pump body and the control device without using the dedicated cable, that is, the technology for integrating the pump body and the control device is described in the following patent document. Proposed to 1!

[0005] In addition, the vacuum pump kept the pump body at a high temperature (about 60 to 80 ° C) in order to suppress product accumulation in the gas transfer path. For this reason, in a vacuum pump in which the pump body and the control device are integrated, if the control device is cooled to prevent overheating, condensation may occur inside.

Therefore, in a vacuum pump in which the pump main body and the control device are integrated, a technique for achieving heat dissipation within the control device without suppressing condensation is proposed in Patent Document 2 below.

Patent Document 1: Japanese Patent Laid-Open No. 11 173293

Patent Document 2: JP-A-2006-90251

Disclosure of the invention

Problems to be solved by the invention

[0006] By the way, in the vacuum pump proposed in Patent Document 2, the heat generating element is disposed so as to be in contact with the casing, and thereby heat is radiated to the outside through the casing.

For this reason, it has been difficult to cool the control circuit disposed in the region not in contact with the casing.

Therefore, it is an object of the present invention to provide a vacuum pump capable of improving the cooling efficiency of a control circuit in a vacuum pump control device in which a pump body and a control device are integrated.

Means for solving the problem

[0007] The invention of claim 1 includes a pump body including a gas transfer mechanism that transfers gas from an intake port to an exhaust port, and a control circuit that is mounted on the pump body and controls the pump body. And a control device having a housing sealed inside, the control device comprising forced convection generating means for forcibly generating a flow in the fluid in the housing. The object is achieved.

The invention according to claim 2 is the vacuum pump according to claim 1, wherein the control circuit has a heating element that is heated by self-loss, and the control device is generated in the control circuit. And a cooling means for cooling the heat exchange mechanism.

A third aspect of the present invention is the vacuum pump according to the first or second aspect, wherein the heat exchange mechanism constitutes a fluid flow path in the casing.

According to a fourth aspect of the present invention, in the vacuum pump according to the first, second, or third aspect, the control device includes the control circuit and constitutes a fluid flow path in the casing. And the heat exchange mechanism absorbs heat of the control board.

According to a fifth aspect of the present invention, in the vacuum pump according to the fourth aspect, the control boards are stacked via a gap, and the adjacent control boards constitute a fluid flow path in the casing. Features.

The invention according to claim 6 is the vacuum pump according to any one of claims 1 to 5, wherein the housing of the control device communicates with a fluid flow path in the housing on a side surface. A first housing part including the control circuit, and a second housing part disposed so as to cover the circulation hole, the second housing part Is provided so as to be detachable from the first casing.

The invention according to claim 7 is the vacuum pump according to claim 6, wherein the cooling means is provided in the second casing.

The invention according to claim 8 is the vacuum pump according to any one of claims 1 to 7, wherein the control device is attached to the pump body via a heat insulating means. Features.

The invention's effect

[0008] According to the present invention, the cooling efficiency of the control circuit can be improved by forcibly generating a flow in the fluid in the casing of the control device.

Brief Description of Drawings

FIG. 1 is a diagram showing a schematic configuration of a turbo molecular pump according to the present embodiment.

FIG. 2 is a perspective view showing a schematic configuration of a control device according to the present embodiment.

FIG. 3 is a diagram showing the air flow inside the control device when the first cooling method is used. 4] A diagram showing the air flow inside the control device when the second cooling method is used.

1 Turbo molecular pump

2 Casing

3 base

4 Rotor part

5 Inlet

6 Exhaust vent

7 Shaft

8 rotor blades

9 Cylindrical member

10 volts

11 Motor section

12- ^ 14 Magnetic bearing

15 ～ 17 Displacement sensor

18 Stator blade

19 Thread groove spacer

20 Spacer

21 Stator column

22 tricks

23 Connector section

24 Control unit

25 Baking heater

26 Cooling pipe

30 housing

31a-d sidewall 31e! Bulkhead plate

32 Exhaust hole

33 Air intake holes

34 Through hole

40 fans

50 Cooling jar

51 Cooling pipe

52 Communication path

60 heat exchanger

70 Control board

71 Spacer

81 G

82 Crafts

90 Thermal insulation

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to FIGS.

In this embodiment, a turbo molecular pump is used as an example of a vacuum pump. FIG. 1 is a diagram showing a schematic configuration of a turbo molecular pump 1 according to the present embodiment. FIG. 1 shows a cross-sectional view of the turbo molecular pump 1 in the axial direction.

In the present embodiment, as an example of a turbo molecular pump, a so-called composite wing type molecular pump including a turbo molecular pump part T and a thread groove type pump part S will be described as an example.

The turbo molecular pump 1 is a vacuum pump that exhibits an exhaust function by the exhaust action of the rotor portion that rotates at a high speed and the fixed stator portion. There are pumps that have both of these structures.

The casing 2 forming the exterior body of the turbo molecular pump 1 has a cylindrical shape, and constitutes the exterior body of the turbo molecular pump 1 together with the base 3 provided at the bottom of the casing 2. A structure that allows the turbo molecular pump 1 to perform an exhaust function, that is, a gas transfer mechanism, is housed inside the exterior of the turbo molecular pump 1. These structures that exhibit the exhaust function are roughly composed of a rotor portion 4 that is rotatably supported and a stator portion that is fixed to the casing 2.

In addition, the intake port 5 side is composed of a turbo-molecular pump part T, and the exhaust port 6 side is composed of a thread groove type pump part S! /.

[0013] In the rotor section 4, a rotor blade 8 composed of blades inclined at a predetermined angle from a plane perpendicular to the axis of the shaft 7 and extending radially from the shaft 7 is provided on the intake port 5 side (turbo molecular pump section T ). The rotor portion 4 is made of a metal such as stainless steel or aluminum alloy.

Further, the rotor part 4 is provided with a cylindrical member 9 made of a member having a cylindrical outer peripheral surface on the exhaust port 6 side (screw groove type pump part S).

The turbo molecular pump 1 has a plurality of rotor blades 8 formed in the axial direction.

The shaft 7 is a rotating shaft (rotor shaft) of the cylindrical member. A rotor portion 4 is attached to the upper end of the shaft 7 by a plurality of bolts 10.

In the middle of the axial direction of the shaft 7, a motor part 11 for rotating the shaft 7 is arranged! / In addition, the shaft 7 is arranged in the radial direction on the intake port 5 side and the exhaust port 6 side of the motor unit 11. A magnetic bearing portion 12 and a magnetic bearing portion 13 for supporting the shaft are provided.

Furthermore, a magnetic bearing portion 14 for supporting the shaft 7 in the axial direction (thrust direction) is provided at the lower end of the shaft 7.

The shaft 7 is supported in a non-contact manner by a 5-axis control type magnetic bearing composed of magnetic bearing portions 12, 13, and 14.

Displacement sensors 15 and 16 are formed in the vicinity of the magnetic bearing portions 12 and 13, respectively, so that the radial displacement of the shaft 7 can be detected. Further, a displacement sensor 17 is formed at the lower end of the shaft 7 so that the axial displacement of the shaft 7 can be detected.

A stator portion is formed on the inner peripheral side of the casing 2. This stator part consists of a stator blade 18 provided on the intake port 5 side (turbo molecular pump part T) and a thread groove spacer 19 provided on the exhaust port 6 side (screw groove type pump part S). Has been. The stator blade 18 is composed of a blade that is inclined by a predetermined angle from a plane perpendicular to the axis of the shaft 7 and extends from the inner peripheral surface of the casing 2 toward the shaft 7. In the turbo molecular pump section T, the stator blades 18 are formed in a plurality of stages alternately with the rotor blades 8 in the axial direction. The stator blades 18 of each stage are separated from each other by a cylindrical spacer 20.

[0016] The thread groove spacer 19 is a cylindrical member in which a spiral groove is formed on the inner peripheral surface. The inner peripheral surface of the thread groove spacer 19 faces the outer peripheral surface of the cylindrical member 9 with a predetermined clearance (gap) therebetween. The direction of the spiral groove formed in the thread groove spacer 19 is the direction toward the exhaust port 6 when the gas is transported through the spiral groove in the rotational direction of the rotor portion 4. The depth of the spiral groove becomes shallower as it approaches the exhaust port 6. The gas transported through the spiral groove is compressed as it approaches the exhaust port 6.

These stator parts are made of metal such as stainless steel or aluminum alloy. The base 3 together with the casing 2 constitutes the outer package of the turbo molecular pump 1. At the center of the base 3 in the radial direction, a stator column 21 having a cylindrical shape is attached concentrically with the rotation axis of the rotor.

A back cover 22 is attached to the bottom of the base 3 (opening of the stator column 21). Back cover

22 is provided with a connector portion 23 for drawing out the internal wiring of the turbo molecular pump 1 and connecting it to a control device 24 described later.

The region (part) in which the casing 2, the base 3 and the back cover 22 are used as the exterior body, that is, the part where the gas transfer mechanism is configured is the pump body.

In the turbo molecular pump 1 according to the present embodiment, a control device 24 for controlling the pump body is mounted on the pump body. That is, the pump body and the control device 24 are integrated.

The control device 24 is disposed at the bottom of the base 3 (the opening of the stator column 21), that is, in the region facing the back cover 22.

A baking heater 25 is attached to the outer peripheral portion of the thread groove type pump portion S so as to surround the base 3 in the circumferential direction. The baking heater 25 is constituted by an electric heating member such as a nichrome wire, and is supplied with electric power by a temperature controller. The baking heater 25 generates heat when electric power is supplied, and heats the thread groove type pump section S.

Since the gas sucked from the intake port 5 is cooled while the turbo molecular pump unit T is transferred, the temperature of the gas is lowered when transferred to the thread groove type pump unit S. On the other hand, when the gas pressure is transferred to the thread groove type pump section S, it is high. That is, the gas transferred to the thread groove type pump section S is in a low temperature and high pressure state. Therefore, the thread groove type pump section S is in a state where the solid product due to the transferred gas is likely to precipitate.

Therefore, in order to suppress the precipitation of the solid product due to the gas transferred by the thread groove spacer 19, the thread groove pump section S is kept at a high temperature by using a baking heater 25.

During the operation of the turbo molecular pump 1, the rotor unit 4 rotates at a high speed, and the blades of the rotor blades 8 and the stator blades 18 receive a process gas that has become a high temperature due to compression heat or the like. In response to the compression heat and the like, the blade temperature of the rotor blades 8 and the stator blades 18 rises.

Further, the turbo molecular pump 1 is heated by heat generated from the motor unit 11 and becomes a high temperature state.

Thus, the pump body is in a high temperature state due to collision heat (compression heat) of gas molecules, heat generation from the motor unit 11, heating by the baking heater 25, and the like.

[0020] If high-temperature heat in the pump body as described above is conducted to the control device 24, there is a possibility that a circuit (control circuit) inside the control device 24 may be defective. That is, the internal circuit of the control device 24 may be affected by heat and cause malfunction.

Therefore, a cooling pipe 26 is embedded in the base 3 in order to reduce the influence of the heat of the pump body that the control device 24 receives.

The cooling pipe 26 is made of a tubular (tubular) member. The cooling pipe 26 is a member that cools the periphery of the cooling pipe 26 by flowing a cooling medium, which is a heat medium, into the cooling pipe 26 so that the cooling medium absorbs heat. By flowing the coolant through the cooling pipe 26, the base 3 is forcibly cooled. This cooling effect can reduce (suppress) the heat conducted from the pump body to the control device 24.

[0021] The cooling pipe 26 described above is made of a member having low thermal resistance, that is, a member having high thermal conductivity, such as copper or stainless steel.

Further, the coolant flowing through the cooling pipe 26, that is, the fluid for cooling the object may be a liquid or a gas. As the liquid coolant, for example, water, a calcium chloride aqueous solution, an ethylene glycol aqueous solution, or the like can be used. For example, ammonia, methane, ethane, halogen, helium gas, carbon dioxide gas, air, etc. can be used as the gas coolant.

In the present embodiment, the position of the force cooling pipe 26 in which the cooling pipe 26 is disposed on the base 3 is not limited to this. For example, it may be provided so as to be directly embedded in the stator column 21 and the back cover 22.

Next, the structure of the control device 24 attached to the pump body having the above-described configuration will be described.

FIG. 2 is a perspective view showing a schematic configuration of the control device 24 according to the present embodiment. In FIG. 2, the components constituting the control device 24 are shown separated.

The control device 24 includes a housing 30, a fan (blower) 40, a cooling jacket 50, a heat exchange fin 60, a control board 70, an upper lid 81 and a lower lid 82.

The housing 30 includes four side walls 31a to 31d constituting a frame, and a partition plate 31e that divides the inside of the housing (frame) 30 into a first region and a second region.

The first region is the upper part of the partition plate 31e, that is, the region between the partition plate 31e and the upper lid 81, and the second region is the lower part of the partition plate 31e, that is, the partition plate 31e and the lower lid 82. Indicates the area between.

The partition plate 31e is formed integrally with the side walls 31a to 31d, and is configured such that the heat of the partition plate 31e is quickly transferred to the side walls 31a to 31d.

The casing 30 is made of a member having high thermal conductivity such as aluminum, copper, or aluminum alloy. The partition plate 31 e is provided in a direction orthogonal to the inner side surfaces of the side walls 31 a to 31 d, that is, in a horizontal direction on the drawing.

The partition plate 31 e is formed with a rectangular through-hole 34 penetrating in the thickness direction in the vicinity of the end thereof, specifically in the vicinity of the side wall 31 a.

The fan 40 is attached such that the air blowing port closes the through hole 34. Note that the air outlet refers to an outlet for air blown from the fan 40. The fan 40 functions as a means for generating forced convection.

A side wall 31 d constituting the housing 30 is provided with an exhaust hole 32 communicating with the first region inside the housing 30 and an intake hole 33 communicating with the second region inside the housing 30.

The heat exchange fin 60 has a plurality of fins for increasing the surface area, and is fixed to the partition plate 31 e in the first region inside the housing 30. The heat exchange fin 60 functions as a heat exchange mechanism.

The heat exchange fin 60 and the partition plate 31 e are fixed (joined) so as to be in surface contact with each other in order to improve the thermal conductivity between them, that is, to increase the heat transfer speed.

Note that the heat exchange fin 60 and the partition plate 31 e may be integrally formed. In addition, it is desirable to apply silicon grease to the contact surface between the heat exchange fin 60 and the partition plate 31 e or to dispose a silicon sheet. In this way, by using a member having high thermal conductivity for the contact surface between the heat exchange fin 60 and the partition plate 31e, the thermal conductivity between the two can be further improved.

The upper lid 81 is joined to the housing 30 so as to seal the opening end of the upper part (pump main body side) of the frame.

[0025] The control board 70 is a board on which a control circuit is mounted. In the present embodiment, a plurality of control boards 70 are fixed to the partition plate 31e in the second region inside the housing 30.

In the present embodiment, a plurality of control boards 70 are stacked via spacers 71. Of the laminated control boards 70, the control board 70 closest to the partition board 31e is joined (fixed) to the partition board 31e so as to come into surface contact.

Note that the arrangement interval of the control boards 70 can be set to an arbitrary value by adjusting the height of the spacer 71. Here, the control circuit mounted on the control board 70 will be described.

The control circuit is provided with a drive circuit, a power circuit, and the like for the motor unit 11 and the magnetic bearing units 12 to 14. Further, a circuit for controlling these drive circuits and a storage element storing various information used for controlling the turbo molecular pump 1 are mounted.

The storage element stores information (data) such as pump operation time, error history, temperature control set temperature, and the like as pump information.

In general, electrical components (elements) used in electronic circuits have an environmental temperature that takes reliability into consideration. For example, the environmental temperature of the memory elements mentioned above is about 60 ° C. Such an element having low heat resistance is expressed as a low heat resistance element.

[0027] Each electrical component must be used within the set range of the ambient temperature when the turbo molecular pump 1 is in operation.

In addition to the low heat resistance element described above, many circuits (power elements) that generate heat due to internal loss (internal loss) are used in the circuit provided in the control device 24. For example, a transistor element constituting an inverter circuit that is a drive circuit of the motor unit 11 corresponds to this.

The environmental temperature is also set in such an element that increases the amount of self-heating. Therefore, in the present embodiment, such an element with a large amount of heat generation is mounted on the control board 70 closest to the partition plate 31e so that heat is easily discharged (discharged).

The lower lid 82 is joined to the housing 30 so as to seal the lower open end of the frame.

Note that the structure formed by the casing 30, the upper lid 81, and the lower lid 82 functions as a first casing portion.

[0028] The cooling jacket 50 is fixed to the formation surface of the side wall 3Id in the casing 30 by a fastening member such as a bolt. The cooling jacket 50 functions as a second housing part. In the present embodiment, the cooling jacket 50 is configured to be easily detached from the housing 30 by removing the fastening member, that is, detachable.

A cooling pipe 51 for water cooling similar to the cooling pipe 26 described above is embedded in the cooling jacket 50. The cooling jacket 50 is cooled by flowing a coolant through the cooling pipe 51, and the casing 30 in contact with the cooling jacket 50 is forcibly cooled.

As shown in FIG. 1, the cooling jacket 50 is formed with a concave communication passage 52 between the side wall 31d of the housing 30 and connecting the exhaust hole 32 and the intake hole 33.

The cooling jacket 50 is mounted so as to cover the exhaust hole 32 and the intake hole 33 of the side wall 31d of the casing 30, that is, the casing 30 is configured to be sealed by the cooling jacket 50.

In the present embodiment, the cooling pipe 26 is disposed on the base 3 of the pump body in order to efficiently reduce the heat transmitted from the pump body to the control device 24.

However, when partial forced cooling is performed using the cooling pipe 26 as in the present embodiment, condensation may occur at the cooling location.

This condensation is a phenomenon in which water droplets appear on the cooling surface (cooling surface) below the dew point (temperature at which relative humidity becomes 100%).

When such condensation occurs in the controller 24, there fear force ^s cause defective control circuit.

Therefore, in the present embodiment, in order to suppress dew condensation in the control device 24, the control device 24 is screwed and fixed to the pump body via a washer-like heat insulating member 90. That is, a heat insulating member 90 is disposed between the pump body and the control device 24.

The heat insulating member 90 is disposed in a region (region) that comes into contact with the pump body when the control device 24 is attached to the pump body.

The heat insulating member 90 is made of a material having high heat resistance such as rubber, plastic, foam material, ceramic, etc., that is, a material having a low thermal conductivity!

Further, the control device 24 may be fixed through a gap (specifically, a spacer 20) without closely contacting the pump body. In this case, the gap between the pump body and the control device 24 functions (acts) as the heat insulating member 90.

[0031] By disposing the heat insulating member 90 in this manner, it is possible to thermally insulate (separate) the pump body and the control device 24 from each other. That is, by providing the heat insulating member 90, it is possible to suppress (reduce) the influence of cooling by the cooling pipe 26 that the control device 24 receives. As a result, a sudden temperature difference between the pump body and the control device 24 can be buffered, so that it is possible to prevent the inside of the control device 24 from being cooled to the dew point or less. 24 It is possible to appropriately suppress the occurrence of condensation inside. It should be noted that the thermally insulated pump body and the control device 24 perform temperature management independently (individually).

Specifically, in the pump body, temperature control is performed by adjusting the refrigerant flowing through the cooling pipe 26 or adjusting the set temperature of the baking heater 25.

On the other hand, in the control device 24, temperature management is performed by adjusting the refrigerant flowing through the cooling pipe 51 in the cooling jacket 50 or adjusting the position of the element disposed (arranged) inside.

Next, a method for cooling the inside of the control device 24 in the turbo molecular pump 1 according to the present embodiment will be described.

The control device 24 in the turbo molecular pump 1 according to the present embodiment is provided with the detachable cooling jacket 50 as described above.

Therefore, the internal cooling method in the control device 24 includes two types of cooling methods, the first cooling method when the cooling jacket 50 is attached and the second cooling method when the cooling jacket 50 is removed. They can be used according to the specifications of the molecular pump 1 and the usage environment.

First, a cooling method of the control device 24 by the first cooling method with the cooling jacket 50 attached will be described.

FIG. 3 is a diagram showing the air flow inside the control device 24 when the first cooling method is used.

As shown in FIG. 3, when the fan 40 starts operating (air blowing) with the cooling jacket 50 mounted, the air in the control device 24 passes through the heat exchange fins 60 and reaches the side wall 31d of the housing 30. It is sent to the communication passage 52 of the cooling jacket 50 through the provided exhaust hole 32.

Thereafter, the air in the control device 24 is sent from the communication path 52 to the second region inside the housing 30 through the intake holes 33 provided in the side wall 31d of the housing 30. The air in the control device 24 passes between the stacked control boards 70 or between the control board 70 and the lower lid 82, and then is sent to the fan 40 again to circulate inside the control equipment 24. That is, the space between the fins in the heat exchange fin 60, the communication path 52, the stacked control boards 70, and the control board 70 and the lower lid 82 are circulated inside the control device 24. Functions as a gas flow path.

Next, a heat dissipation method of the control board 70 when using the first cooling method, that is, a heat transfer path of the control board 70 will be described.

In the control board 70 that is in contact with the partition plate 31e on which an element that generates a large amount of heat is mounted, the heat generated from the mounted element is directly transferred from the control board 70 to the partition plate 31e, and then the partition board 31e. On the control board 70 that is transmitted from the plate 31e to the cooling jacket 50, i.e., the cooling pipe 51, through the side walls 31a to 31d, but is not in contact with the partition plate 31e, the heat generated from the mounted elements is controlled. The air is transmitted from the board 70 to the air passing between the stacked control boards 70 and between the control board 70 and the lower lid 82.

As a result, the air passing between the stacked control boards 70 or between the control boards 70 and the lower lid 82 is heated.

When the heated air passes through the heat exchange fins 60 cooled by the cooling action of the cooling jacket 50 (cooling pipe 51), the heat is transferred to the heat exchange fins 60 and cooled. Then, the air cooled by the heat exchange fins 60 is sent to the control board 70 again.

Specifically, the temperature of the control board 70 is heated to 70 to 80 ° C. by the heat generated by the mounted elements.

The air circulating inside the control device 24 is heated to about 60 ° C. by absorbing heat from the control board 70 when passing through the arrangement area of the control board 70.

When the heated air passes through the heat exchange fins 60 cooled to about 30 ° C. by the action of the cooling jacket 50 (cooling pipe 51) cooled to about 20 ° C., about 40 ° C. And is sent to the control board 70 again.

Here, an example of the temperature of each part is shown, and the temperature state changes depending on the use conditions. [0036] Thus, according to the first cooling method, the cooling jacket 50 (cooling pipe 51) is passed through the air circulating in the control device 24 that removes the heat generated in the control board 70 only by the partition plate 31e. That is, it can be discharged to the outside of the control device 24.

According to the first cooling method, the air in the control device 24 is forced to circulate, thereby suppressing the occurrence of a region in which the humidity and temperature are significantly increased inside the control device 24). Can do. As a result, overheating and condensation inside the control device 24 can be prevented appropriately.

According to the first cooling method, the heat dissipation process can be appropriately performed even with the laminated control board 70, and therefore the control device 24 can be easily downsized.

By using the first cooling method, the inside of the housing 30 is sealed by the cooling jacket 50, so the turbo molecular pump 1 must be installed even in an environment where condensation that does not allow contact with outside air is likely to occur. Can do.

In the first cooling method, heat is released to the outside through the cooling pipe 51, so that it is possible to prevent the periphery of the turbo molecular pump 1 from becoming a heat spot. The heat spot is a place (spot) where the temperature is locally increased in the room where the turbo molecular pump 1 is installed.

[0037] By using the first cooling method, the inside of the housing 30 is sealed by the cooling jacket 50. Therefore, it is easy to take measures for waterproofing the inside of the control device 24, specifically, the control board 70 (control circuit). I'll do it.

In the above-described embodiment, the power casing 30, the partition plate, which uses the cooling jacket 50 provided with the cooling pipe 51 to cool the casing 30, the partition plate 31 e and the heat exchange fins 60. The cooling method of 31 e and the heat exchange fin 60 is not limited to this.

For example, the casing 30, the partition plate 31e, and the heat exchange fins 60 may be cooled by bringing the cooling jacket 50 into contact with a low-temperature structure without providing the cooling pipe 51.

[0038] Next, a cooling method of the control device 24 by the second cooling method with the cooling jacket 50 removed will be described.

FIG. 4 is a diagram showing the flow of air inside the control device 24 when the second cooling method is used. As shown in FIG. 4, when the operation (air blowing) of the fan 40 is started with the cooling jacket 50 removed, the air is supplied to the control device 24 through the intake hole 33 provided in the side wall 31d of the housing 30. It is taken from the outside into the second area inside the housing 30.

The air sucked from the outside passes between the stacked control boards 70 or between the control boards 70 and the lower lid 82 and is sent to the fan 40.

Thereafter, the air in the control device 24 passes through the heat exchange fins 60 and is exhausted (exhausted) to the outside of the control device 24 through the exhaust holes 32 provided in the side wall 31 d of the housing 30.

That is, between the fins in the heat exchange fin 60, between the stacked control boards 70, and between the control board 70 and the lower lid 82 are air flow paths circulating inside the control device 24. Function.

Next, a heat dissipation method of the control board 70 when using the second cooling method, that is, a heat transfer path of the control board 70 will be described.

In the control board 70 that is in contact with the partition plate 31 e on which the element that generates a large amount of heat is mounted, the heat generated from the mounted element is directly transmitted from the control board 70 to the partition plate 31 e. Is transmitted from the partition plate 31 e to the heat exchange fin 60.

The heat transferred to the heat exchange fin 60 is transferred to the air passing through the heat exchange fin 60. Then, the heated air is exhausted (exhausted) from the exhaust hole 32 to the outside of the control device 24, whereby heat generated inside the control device 24 is released to the outside.

On the other hand, in the control board 70 that is not in contact with the partition plate 31 e, the heat generated from the mounted elements is transferred from the control board 70 to the laminated control board 70 or between the control board 70 and the lower lid 82. It is transmitted to the air passing between.

The heated air passes through the heat exchange fins 60 and is then exhausted (exhausted) from the exhaust hole 32 to the outside of the control device 24, whereby the heat generated inside the control device 24 is released to the outside.

Specifically, the temperature of the control board 70 is heated to 70 to 80 ° C. due to heat generation of the mounted element. The air taken into the control device 24 at about 30 ° C. is heated to about 40 ° C. by absorbing heat from the control substrate 70 when passing through the arrangement area of the control substrate 70. The heated air passes through the heat exchange fin 60 heated to about 60 ° C. by the heat from the control board 70 in contact with the partition plate 31e, and is further heated to about 50 ° C. It is discharged outside the control device 24.

Here, an example of the temperature of each part is shown, and the temperature state changes depending on the use conditions.

Thus, according to the second cooling method, the heat generated in the control board 70 and the heat transferred from the control board 70 to the partition plate 31e are circulated through the circulating air taken into the control device 24. And can be discharged to the outside of the control device 24.

In the second cooling method, even if the control board 70 is laminated by using the above-described forced air cooling method, the heat dissipation process can be performed appropriately, and therefore the control device 24 can be easily downsized. .

According to the second cooling method, since the inside of the control device 24 can be cooled without providing the cooling jacket 50 (cooling pipe 51), the cooling system can be constructed at low cost. Further, according to the second cooling method, the inside of the control device 24 can be cooled without providing the cooling jacket 50 (cooling pipe 51), that is, no cooling water supply facility is required, so that the turbo molecule It is possible to reduce restrictions on the installation location of the pump 1.

[0042] As described above, according to the present embodiment, the first cooling method and the second cooling method can be easily switched by switching the attachment / detachment of the cooling jacket 50.

Since one turbo molecular pump 1 can switch the cooling system of the control device 24 in this way, the cooling method of the control device 24 depends on the usage environment and specification conditions even after delivery of the product. Can be easily switched. This can reduce the cost of changing the cooling method.

For example, in an environment where it is difficult to use the water cooling facility, the cooling jacket 50 is removed and the control device 24 is cooled by the second cooling method, that is, only air cooling is performed. Also, for example, in a use environment where there is a concern about malfunctions due to heat spots, the cooling jacket 50 is attached, and the cooling of the control device 24 by the first cooling method, that is, water cooling and air cooling are used in combination. Make sure to cool.

In the above-described embodiment, the force described using air as an example of the fluid in the control device 24 and the fluid in the control device 24 are not limited to this.

For example, when the inside of the control device 24 is sealed as in the first cooling method, a liquid cooling method using a liquid insulator may be used as the fluid in the control device 24. . However, in this case, a circulation pump is installed instead of the fan 40 to circulate the fluid.

Claims

The scope of the claims

[1] A pump body including a gas transfer mechanism that transfers gas from an intake port to an exhaust port, and a casing that is attached to the pump body and includes a control circuit that controls the pump body and is sealed inside. A control device comprising:

A vacuum pump comprising:

The vacuum pump according to claim 1, wherein the control device includes forced convection generating means for forcibly generating a flow in the fluid in the casing.

[2] The control circuit has a heating element that is heated by self-loss,

The controller is

A heat exchange mechanism for absorbing heat generated in the control circuit;

Cooling means for cooling the heat exchange mechanism;

The vacuum pump according to claim 1, further comprising:

[3] The heat exchange mechanism forms a fluid flow path in the casing.

The vacuum pump according to claim 1 or claim 2.

[4] The control device includes a control board on which the control circuit is mounted and which forms a fluid flow path in the housing.

The vacuum pump according to claim 1, claim 2, or claim 3, wherein the heat exchange mechanism absorbs heat of the control board.

[5] The control board is laminated through a gap,

5. The vacuum pump according to claim 4, wherein the adjacent control board constitutes a fluid flow path in the casing.

[6] The casing of the control device is:

A first housing portion having a flow hole communicating with a fluid flow path in the housing on a side surface and containing the control circuit;

A second housing part disposed so as to cover the flow hole;

With

The vacuum according to any one of claims 1 to 5, wherein the second casing is detachably attached to the first casing. pump. The vacuum pump according to claim 6, wherein the cooling means is provided in the second casing.

The vacuum pump according to any one of claims 1 to 7, wherein the control device is attached to the pump main body via heat insulating means.