WO2008051809A3 - Thermal load locator - Google Patents
Thermal load locator Download PDFInfo
- Publication number
- WO2008051809A3 WO2008051809A3 PCT/US2007/081844 US2007081844W WO2008051809A3 WO 2008051809 A3 WO2008051809 A3 WO 2008051809A3 US 2007081844 W US2007081844 W US 2007081844W WO 2008051809 A3 WO2008051809 A3 WO 2008051809A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- cooling
- coupled
- unit
- controller
- units
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/206—Cooling means comprising thermal management
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20836—Thermal management, e.g. server temperature control
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
MX2009004284A MX2009004284A (en) | 2006-10-23 | 2007-10-18 | Thermal load locator. |
BRPI0717345-8A2A BRPI0717345A2 (en) | 2006-10-23 | 2007-10-18 | THERMAL LOAD LOCATOR |
EP07844416A EP2087780A2 (en) | 2006-10-23 | 2007-10-18 | Thermal load locator |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US86253806P | 2006-10-23 | 2006-10-23 | |
US60/862,538 | 2006-10-23 | ||
US11/670,208 US20080092577A1 (en) | 2006-10-23 | 2007-02-01 | Thermal load locator |
US11/670,208 | 2007-02-01 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2008051809A2 WO2008051809A2 (en) | 2008-05-02 |
WO2008051809A3 true WO2008051809A3 (en) | 2008-07-03 |
Family
ID=39296072
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2007/081844 WO2008051809A2 (en) | 2006-10-23 | 2007-10-18 | Thermal load locator |
Country Status (6)
Country | Link |
---|---|
US (1) | US20080092577A1 (en) |
EP (1) | EP2087780A2 (en) |
BR (1) | BRPI0717345A2 (en) |
MX (1) | MX2009004284A (en) |
TW (1) | TW200838412A (en) |
WO (1) | WO2008051809A2 (en) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SE533820C2 (en) * | 2009-05-05 | 2011-01-25 | Sitetel Sweden Ab | Cabinet for cooling electronic equipment located in the cabinet |
GB0922271D0 (en) * | 2009-12-21 | 2010-02-03 | Sir Robert Mcalpine Ltd | Direct air cooling |
DE102010005192B4 (en) * | 2010-01-21 | 2014-12-04 | Rittal Gmbh & Co. Kg | Control method of a refrigeration system |
TWI466628B (en) * | 2011-07-07 | 2014-12-21 | Hon Hai Prec Ind Co Ltd | Container data center cooling system |
US20130098593A1 (en) * | 2011-10-19 | 2013-04-25 | International Business Machines Corporation | Independent computer system zone cooling responsive to zone power consumption |
CN103429022B (en) * | 2012-05-23 | 2016-09-07 | 华为技术有限公司 | A kind of container data center |
CN103729328A (en) * | 2012-10-15 | 2014-04-16 | 深圳市腾讯计算机系统有限公司 | Data center module and data center formed by micro-modules |
US9148982B2 (en) | 2012-11-08 | 2015-09-29 | International Business Machines Corporation | Separate control of coolant flow through coolant circuits |
GB2514799A (en) * | 2013-06-04 | 2014-12-10 | Ibm | Scalable panel cooling system |
US10156875B2 (en) | 2013-06-04 | 2018-12-18 | Schneider Electric It Corporation | Method to identify cooling modules attached to a refrigerant distribution unit in a cooling system |
US10356957B2 (en) * | 2014-10-31 | 2019-07-16 | Hewlett Packard Enterprise Development Lp | Adaptive cooling assembly |
SG11201903461WA (en) * | 2016-10-25 | 2019-05-30 | Nextdc Ltd | Data centre cooling regulation system and method |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0421743A2 (en) * | 1989-10-03 | 1991-04-10 | Nec Corporation | Coolant supply apparatus for liquid-cooled electronic device |
US6415619B1 (en) * | 2001-03-09 | 2002-07-09 | Hewlett-Packard Company | Multi-load refrigeration system with multiple parallel evaporators |
US20030147214A1 (en) * | 2002-02-05 | 2003-08-07 | Patel Chandrakant D. | Method and apparatus for cooling heat generating components |
EP1448040A2 (en) * | 2003-02-14 | 2004-08-18 | Hitachi, Ltd. | Liquid cooling system for a rack-mount server system |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6330516B1 (en) * | 2000-03-27 | 2001-12-11 | Power Distribution, Inc. | Branch circuit monitor |
US20040020225A1 (en) * | 2002-08-02 | 2004-02-05 | Patel Chandrakant D. | Cooling system |
US6775997B2 (en) * | 2002-10-03 | 2004-08-17 | Hewlett-Packard Development Company, L.P. | Cooling of data centers |
US6829142B2 (en) * | 2002-10-25 | 2004-12-07 | Hewlett-Packard Development Company, L.P. | Cell thermal connector |
US6862179B2 (en) * | 2002-11-26 | 2005-03-01 | Hewlett-Packard Development Company, L.P. | Partition for varying the supply of cooling fluid |
US6868682B2 (en) * | 2003-01-16 | 2005-03-22 | Hewlett-Packard Development Company, L.P. | Agent based control method and system for energy management |
US6747872B1 (en) * | 2003-02-28 | 2004-06-08 | Hewlett-Packard Development Company, L.P. | Pressure control of cooling fluid within a plenum |
US6987370B2 (en) * | 2003-06-23 | 2006-01-17 | Hewlett-Packard Development Company, L.P. | Method and system for cooling electronic components |
US7184267B2 (en) * | 2003-12-12 | 2007-02-27 | Hewlett-Packard Development Company, Lp. | Longitudinally cooled electronic assembly |
US7214131B2 (en) * | 2004-01-15 | 2007-05-08 | Hewlett-Packard Development Company, L.P. | Airflow distribution control system for usage in a raised-floor data center |
US7057506B2 (en) * | 2004-01-16 | 2006-06-06 | Hewlett-Packard Development Company, L.P. | Cooling fluid provisioning with location aware sensors |
US7203063B2 (en) * | 2004-05-21 | 2007-04-10 | Hewlett-Packard Development Company, L.P. | Small form factor liquid loop cooling system |
US8019477B2 (en) * | 2004-05-26 | 2011-09-13 | Hewlett-Packard Development Company, L.P. | Energy efficient CRAC unit operation |
US7010392B2 (en) * | 2004-05-26 | 2006-03-07 | Hewlett-Packard Development Company, L.P. | Energy efficient CRAC unit operation using heat transfer levels |
US7031870B2 (en) * | 2004-05-28 | 2006-04-18 | Hewlett-Packard Development Company, L.P. | Data center evaluation using an air re-circulation index |
DE102005013567A1 (en) * | 2005-03-23 | 2006-09-28 | Siemens Ag | Component cooling arrangement for vehicle, has air suction element to draw cooling air away from component after cooling air flow through surface of component |
US7596476B2 (en) * | 2005-05-02 | 2009-09-29 | American Power Conversion Corporation | Methods and systems for managing facility power and cooling |
-
2007
- 2007-02-01 US US11/670,208 patent/US20080092577A1/en not_active Abandoned
- 2007-10-18 EP EP07844416A patent/EP2087780A2/en not_active Withdrawn
- 2007-10-18 WO PCT/US2007/081844 patent/WO2008051809A2/en active Application Filing
- 2007-10-18 MX MX2009004284A patent/MX2009004284A/en unknown
- 2007-10-18 BR BRPI0717345-8A2A patent/BRPI0717345A2/en not_active Application Discontinuation
- 2007-10-23 TW TW096139716A patent/TW200838412A/en unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0421743A2 (en) * | 1989-10-03 | 1991-04-10 | Nec Corporation | Coolant supply apparatus for liquid-cooled electronic device |
US6415619B1 (en) * | 2001-03-09 | 2002-07-09 | Hewlett-Packard Company | Multi-load refrigeration system with multiple parallel evaporators |
US20030147214A1 (en) * | 2002-02-05 | 2003-08-07 | Patel Chandrakant D. | Method and apparatus for cooling heat generating components |
EP1448040A2 (en) * | 2003-02-14 | 2004-08-18 | Hitachi, Ltd. | Liquid cooling system for a rack-mount server system |
Also Published As
Publication number | Publication date |
---|---|
EP2087780A2 (en) | 2009-08-12 |
BRPI0717345A2 (en) | 2013-10-15 |
TW200838412A (en) | 2008-09-16 |
WO2008051809A2 (en) | 2008-05-02 |
US20080092577A1 (en) | 2008-04-24 |
MX2009004284A (en) | 2009-05-05 |
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