MX2009004284A - Thermal load locator. - Google Patents

Thermal load locator.

Info

Publication number
MX2009004284A
MX2009004284A MX2009004284A MX2009004284A MX2009004284A MX 2009004284 A MX2009004284 A MX 2009004284A MX 2009004284 A MX2009004284 A MX 2009004284A MX 2009004284 A MX2009004284 A MX 2009004284A MX 2009004284 A MX2009004284 A MX 2009004284A
Authority
MX
Mexico
Prior art keywords
cooling
coupled
unit
controller
units
Prior art date
Application number
MX2009004284A
Other languages
Spanish (es)
Inventor
James K Martin
Original Assignee
Liebert Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Liebert Corp filed Critical Liebert Corp
Publication of MX2009004284A publication Critical patent/MX2009004284A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/206—Cooling means comprising thermal management
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20836—Thermal management, e.g. server temperature control
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A centralized cooling system can selectively deliver individualized cooling to individual electrical load units. The system can provide direct cooling from a manifold of cooling outlets in a controlled manner based on the sensed electrical loads of particular load units. A branch monitoring system monitors the load on electrical feeds that are coupled to electrical load units. A controller is coupled to the branch monitoring system and provides output to control a cooling unit. At least one control valve is further coupled to the controller downstream of the cooling unit generally at each cooling outlet to control an amount of cooling fluid, such as air or liquid, directed to one or more of the units. If a load changes for a given unit, the controller can actuate a cooling valve coupled to a corresponding cooling outlet and alter the amount of cooling fluid flowing into or around the unit(s).
MX2009004284A 2006-10-23 2007-10-18 Thermal load locator. MX2009004284A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US86253806P 2006-10-23 2006-10-23
US11/670,208 US20080092577A1 (en) 2006-10-23 2007-02-01 Thermal load locator
PCT/US2007/081844 WO2008051809A2 (en) 2006-10-23 2007-10-18 Thermal load locator

Publications (1)

Publication Number Publication Date
MX2009004284A true MX2009004284A (en) 2009-05-05

Family

ID=39296072

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2009004284A MX2009004284A (en) 2006-10-23 2007-10-18 Thermal load locator.

Country Status (6)

Country Link
US (1) US20080092577A1 (en)
EP (1) EP2087780A2 (en)
BR (1) BRPI0717345A2 (en)
MX (1) MX2009004284A (en)
TW (1) TW200838412A (en)
WO (1) WO2008051809A2 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE533820C2 (en) * 2009-05-05 2011-01-25 Sitetel Sweden Ab Cabinet for cooling electronic equipment located in the cabinet
GB0922271D0 (en) * 2009-12-21 2010-02-03 Sir Robert Mcalpine Ltd Direct air cooling
DE102010005192B4 (en) * 2010-01-21 2014-12-04 Rittal Gmbh & Co. Kg Control method of a refrigeration system
TWI466628B (en) * 2011-07-07 2014-12-21 Hon Hai Prec Ind Co Ltd Container data center cooling system
US20130098593A1 (en) * 2011-10-19 2013-04-25 International Business Machines Corporation Independent computer system zone cooling responsive to zone power consumption
CN103429022B (en) * 2012-05-23 2016-09-07 华为技术有限公司 A kind of container data center
CN103729328A (en) * 2012-10-15 2014-04-16 深圳市腾讯计算机系统有限公司 Data center module and data center formed by micro-modules
US9148982B2 (en) 2012-11-08 2015-09-29 International Business Machines Corporation Separate control of coolant flow through coolant circuits
GB2514799A (en) * 2013-06-04 2014-12-10 Ibm Scalable panel cooling system
CN105283819B (en) * 2013-06-04 2019-09-03 施耐德电气It公司 Identify the method for being connected to the refrigerating module of refrigerant distribution unit in cooling system
WO2016069010A1 (en) * 2014-10-31 2016-05-06 Hewlett Packard Enterprise Development Lp Adaptive cooling assembly
AU2017348453B2 (en) * 2016-10-25 2020-09-03 NEXTDC Limited Data centre cooling regulation system and method

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2513040B2 (en) * 1989-10-03 1996-07-03 日本電気株式会社 Refrigerant supply device for liquid-cooled electronic devices
US6330516B1 (en) * 2000-03-27 2001-12-11 Power Distribution, Inc. Branch circuit monitor
US6415619B1 (en) * 2001-03-09 2002-07-09 Hewlett-Packard Company Multi-load refrigeration system with multiple parallel evaporators
US7024573B2 (en) * 2002-02-05 2006-04-04 Hewlett-Packard Development Company, L.P. Method and apparatus for cooling heat generating components
US20040020225A1 (en) * 2002-08-02 2004-02-05 Patel Chandrakant D. Cooling system
US6775997B2 (en) * 2002-10-03 2004-08-17 Hewlett-Packard Development Company, L.P. Cooling of data centers
US6829142B2 (en) * 2002-10-25 2004-12-07 Hewlett-Packard Development Company, L.P. Cell thermal connector
US6862179B2 (en) * 2002-11-26 2005-03-01 Hewlett-Packard Development Company, L.P. Partition for varying the supply of cooling fluid
US6868682B2 (en) * 2003-01-16 2005-03-22 Hewlett-Packard Development Company, L.P. Agent based control method and system for energy management
JP4199018B2 (en) * 2003-02-14 2008-12-17 株式会社日立製作所 Rack mount server system
US6747872B1 (en) * 2003-02-28 2004-06-08 Hewlett-Packard Development Company, L.P. Pressure control of cooling fluid within a plenum
US6987370B2 (en) * 2003-06-23 2006-01-17 Hewlett-Packard Development Company, L.P. Method and system for cooling electronic components
US7184267B2 (en) * 2003-12-12 2007-02-27 Hewlett-Packard Development Company, Lp. Longitudinally cooled electronic assembly
US7214131B2 (en) * 2004-01-15 2007-05-08 Hewlett-Packard Development Company, L.P. Airflow distribution control system for usage in a raised-floor data center
US7057506B2 (en) * 2004-01-16 2006-06-06 Hewlett-Packard Development Company, L.P. Cooling fluid provisioning with location aware sensors
US7203063B2 (en) * 2004-05-21 2007-04-10 Hewlett-Packard Development Company, L.P. Small form factor liquid loop cooling system
US8019477B2 (en) * 2004-05-26 2011-09-13 Hewlett-Packard Development Company, L.P. Energy efficient CRAC unit operation
US7010392B2 (en) * 2004-05-26 2006-03-07 Hewlett-Packard Development Company, L.P. Energy efficient CRAC unit operation using heat transfer levels
US7031870B2 (en) * 2004-05-28 2006-04-18 Hewlett-Packard Development Company, L.P. Data center evaluation using an air re-circulation index
DE102005013567A1 (en) * 2005-03-23 2006-09-28 Siemens Ag Component cooling arrangement for vehicle, has air suction element to draw cooling air away from component after cooling air flow through surface of component
US7596476B2 (en) * 2005-05-02 2009-09-29 American Power Conversion Corporation Methods and systems for managing facility power and cooling

Also Published As

Publication number Publication date
BRPI0717345A2 (en) 2013-10-15
WO2008051809A2 (en) 2008-05-02
TW200838412A (en) 2008-09-16
US20080092577A1 (en) 2008-04-24
WO2008051809A3 (en) 2008-07-03
EP2087780A2 (en) 2009-08-12

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