WO2008046397A1 - Ultrasonic bonding device - Google Patents

Ultrasonic bonding device Download PDF

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Publication number
WO2008046397A1
WO2008046397A1 PCT/DE2007/001832 DE2007001832W WO2008046397A1 WO 2008046397 A1 WO2008046397 A1 WO 2008046397A1 DE 2007001832 W DE2007001832 W DE 2007001832W WO 2008046397 A1 WO2008046397 A1 WO 2008046397A1
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WO
WIPO (PCT)
Prior art keywords
cutting device
ultrasonic bonder
bonder according
wire
separate drive
Prior art date
Application number
PCT/DE2007/001832
Other languages
German (de)
French (fr)
Inventor
Hans-Jürgen HESSE
Frank Walther
Original Assignee
Hesse & Knipps Gmbh
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Filing date
Publication date
Application filed by Hesse & Knipps Gmbh filed Critical Hesse & Knipps Gmbh
Publication of WO2008046397A1 publication Critical patent/WO2008046397A1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/26—Auxiliary equipment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67138—Apparatus for wiring semiconductor or solid state device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01052—Tellurium [Te]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19042—Component type being an inductor

Definitions

  • the present invention relates to an ultrasonic bonder having a bonding tool, a wire feed device and a cutting device, wherein the bonding tool, the wire feed device and the cutting device are mounted on a Z-axis direction movable main support means and the bonding tool, the wire feed device and the cutting device by a Z Axis drive the main support means are lowered together in the Z-axis direction in the direction of a substrate.
  • Such an ultrasonic bonder is known for example from DE 40 16 720 B4.
  • the ultrasonic device is used for attaching connecting wires to semiconductor devices, wherein, for example, an aluminum wire is pulled from a first bonding connection to a second bonding connection.
  • the wire is pressed against the semiconductor surface with the aid of a bonding tool.
  • the end of the tool is set in ultrasonic vibrations.
  • the combination of static pressure on the bond Tool and vibrations of the tool end parallel to the semiconductor surface (substrate surface) leads to a plastic deformation of the wire. In this way, a bond connection in the form of a cold-welded connection is created.
  • the ultrasonic bonder disclosed in the above-mentioned publication has a so-called "passive" knife, ie a cutting device, which is connected to the main holding device in such a way that it directly follows its movements in the direction of the Z-axis, and with its aid in one Therefore, in the known ultrasonic bonder, the movement of the cutter until disconnection of the wire takes place solely by the corresponding downward movement of the main support device, in other words, there are no separate or additional devices provided which drive the cutting device to perform their respective downward and upward movement.
  • the present invention has for its object to provide an ultrasonic bonder of the type described above, with a particularly precise movement of the
  • Cutting device for cutting the wire can be performed.
  • Cutting device by lowering the main holder means is lowered by means of the Z-axis drive only to an intermediate position in which the cutting device is arranged at a distance from the wire to be bonderden, and that the ultrasonic bonder has a separate Antriebseinrich- device (actuator) for the cutting device, which independently the cutting device from the movement of the main support means and the intermediate position in a Abtrenngna further lowers to at least partially separate the wire.
  • actuator Antriebseinrich- device
  • the start position of the cutting process is started using the Z axis. In order to save time, this position corresponds approximately to the position which the bonding head already occupies during the bonding process. After the bonding process then only a very small distance with the prime mover (Z-axis) must be moved together until the "cutter has a well-defined distance from the gebon- Deten wire or the tool tip. From this 1
  • the cutting device is then further lowered by means of the separate drive means (of the actuator) in the Abtrenngna, said additional movement takes place independently of the Z-axis drive of the Hauptstalt ceremoniess- device.
  • the separate drive means can be controlled precisely and the associated movement distance of the cutting device can be determined exactly from the intermediate position to the severing position, a particularly precise movement of the cutting device and thus a precise running separation process of the wire is achieved.
  • the intermediate position of the cutting device corresponds to the position of the main holder, in which the bonding tool and the wire contacting the substrate ren. Different high substrates result in different intermediate positions of the cutting device, but the distance from the intermediate position to the separation position always remains the same.
  • the separate drive means for the cutter can operate with constant lift.
  • the separate drive means is mounted obliquely relative to the Z-axis direction and the cutting device hereby connected at an angle, so that it occupies a position parallel to the Z axis and upon actuation of the separate drive means for separating the wire in Z -Axis direction down and simultaneously moved in the transverse direction to the bonding tool.
  • this inclination of the separate drive device relative to the Z axis it is achieved that the cutting device for separating the wire is not moved downwards parallel to the Z axis but obliquely downwards toward the bonding tool, so that the cutting process of the wire is also moved via an oblique movement.
  • the pushers used in the prior art can be omitted, the bonding head can be made more compact and is more suitable for bonding in tight housings due to more favorable collision properties.
  • the separate drive device for the cutting device is expediently connected via an articulated connection.
  • the articulated connection preferably has a fixedly arranged on the main support means side and a thereto flexibly mounted arm which carries the cutting device. The arm can thus perform the desired up and down movement or oblique movement due to the flexible storage.
  • the articulated connection is expediently designed as a four-bar linkage which shifts parallelogram-shaped upon actuation of the drive device.
  • the drive device itself comprises an electromagnet whose stationary part is fixedly arranged on the main support device and whose movable part carries the cutting device.
  • the electromagnet preferably comprises a submersible magnet arranged on the flexibly mounted arm of the articulated connection and one on the fixed side of the articulated connection. Binding arranged coil.
  • the ultrasonic bonder embodied according to the invention preferably has a device which calculates this distance (digitally) and controls the separate drive device accordingly. This has the advantage that limit switches, which determine the end of movement, can be omitted and nevertheless a particularly precise execution of the movement is achieved.
  • the separate drive device is preferably designed as a voice coil actuator, with which good results are achieved.
  • the separate drive device may be a single or double-acting drive device.
  • the drive means acts on one side, i. in the lowering direction of the cutting device, and a suitable elastic device in the opposite direction, i. upwards.
  • the active cutting device used according to the invention operates particularly fast and is crash-proof, since the blade can escape when the magnetic force is exceeded. As already mentioned, eliminates a pusher.
  • FIG. 1 shows a schematic representation of an ultrasound sound bonder, in which the bonding tool, the wire feeding device and the cutting device are in the starting position;
  • Figure 2 is a view corresponding to Figure 1, in which the bonding tool and the wire feeding device are lowered so far that they contact the substrate, and the cutting device is in the intermediate position.
  • FIG 3 is a schematic detail view of the ultrasonic baffle of Figures 1 and 2, wherein the cutting device is shown with the drive means in greater detail.
  • FIG. 1 shows very schematically the parts of an ultrasonic bonder which play a part in the present invention.
  • a schematically illustrated main retaining device 1 of the ultrasonic bonder on which a bonding tool 13 and a wire feed device 21 are flexibly mounted.
  • a cutting device 22 is mounted on the main support device 1 via a drive device 20.
  • Denoted by 25 is a substrate on which a bonder process is to be performed.
  • the bonding tool 13, the wire feed device 21 and the cutting device 22 are in the starting position. It is understood that these parts are not shown to scale. Other parts of the ultrasonic bonder have been omitted for clarity.
  • FIG. 2 shows a position in which the bonding tool 13 and the wire feeder 21 have been lowered from the Z-axis drive of the main holder 1 so far as to contact the substrate 25. In this position, therefore, the bonding tool 13 perform the corresponding Bonder process.
  • the cutting device 22 takes a so-called intermediate position 23 a.
  • This intermediate position 23 represents the end position in which the cutting device 22 has been lowered by the main holder 1.
  • the further downward movement of the cutting device 22 out of this intermediate position 23 into the disconnecting position is carried out by a drive device 20 independently of the movement of the main holder device 1.
  • This drive means 20 causes an oblique movement of the cutting device 22 in its disconnection position shown at 24.
  • the cutting device 22 has approximated the bonding tool 13 in order to carry out the separation process can. Details about the sequence of this movement will be explained in connection with FIG.
  • FIG. 3 shows that the drive device 20 for the cutting device 22 is arranged at an angle to the Z-axis extending through the bonding tool 13.
  • This separate drive device 20 for the cutting device 22 is articulated to the main mounting device 1 via a four-bar linkage or the four-bar linkage forms a Part of this drive device 20.
  • the four-bar linkage has a fixed side or plate 2, which is firmly connected to the main bracket 1. At this fixed side or plate 2, an upper arm 4 and a lower arm 5 are hinged.
  • the angle connected to the arm 3 cutting device 22, which has a suitable angled blade 11 is moved in this way down and across in the direction of the bonding tool 13 in the cut-off position shown in dashed lines 12, in which a suitable wire 14 is at least partially separated.
  • the upward movement of the cutting device 22 after the successful separation process takes place automatically due to the elastic mounting of the submersible magnet 8.
  • the drive device 20 shown here is shown only schematically.
  • a suitable voice coil actuator is preferably used for this, with which the corresponding movement frequencies can be achieved.
  • Such devices are known in the art.

Abstract

The invention relates to an ultrasonic bonding device comprising a bonding tool (13), a wire feed unit (21) and a cutting unit (22). In order to separate a bonded wire with the aid of the cutting unit (22), said unit (22) is lowered by means of a combined displacement, the lowering of the cutting unit (22) taking place in an intermediate position by means of a Z-axis drive, together with the bonding tool and the wire feed unit, whereas the displacement from the intermediate position into the separation position is assumed by a separate drive unit (actuator) (20). This permits the precise, rapid lowering and separation displacement of the cutting unit.

Description

Ultraschallbonder ultrasonic Bonder
Die vorliegende Erfindung betrifft einen Ultraschallbonder mit einem Bondwerkzeug, einer Drahtzuführeinrichtung und einer Schneidvorrichtung, wobei das Bondwerkzeug, die Drahtzuführeinrichtung und die Schneidvorrichtung an einer in Z-Achsen-Richtung bewegbaren Haupthalterungseinrichtung gelagert sind und das Bondwerkzeug, die Drahtzuführeinrichtung und die Schneidvorrichtung durch einen Z-Achsen- Antrieb der Haupthalterungseinrichtung gemeinsam in Z- Achsen-Richtung in Richtung auf ein Substrat absenkbar sind.The present invention relates to an ultrasonic bonder having a bonding tool, a wire feed device and a cutting device, wherein the bonding tool, the wire feed device and the cutting device are mounted on a Z-axis direction movable main support means and the bonding tool, the wire feed device and the cutting device by a Z Axis drive the main support means are lowered together in the Z-axis direction in the direction of a substrate.
Ein derartiger Ultraschallbonder ist beispielsweise aus der DE 40 16 720 B4 bekannt. Das Ultraschallbondern dient zum Anbringen von Verbindungsdrähten an Halbleiterbauelementen, wobei beispielsweise ein Aluminiumdraht von einer ersten Bondverbindung zu einer zweiten Bondverbindung gezogen wird. Beim Bonden wird der Draht mit Hilfe eines Bondwerkzeuges gegen die Halbleiteroberfläche gedrückt. Das Ende des Werkzeuges wird dabei in Ultraschallschwingungen versetzt. Die Kombination von statischem Druck auf das Bond- Werkzeug und von Vibrationen des Werkzeugendes parallel zur Halbleiteroberfläche (Substratoberfläche) führt zu einer plastischen Verformung des Drahtes. Auf diese Weise wird eine Bondverbindung in Form einer Kaltschweißverbindung ge- schaffen.Such an ultrasonic bonder is known for example from DE 40 16 720 B4. The ultrasonic device is used for attaching connecting wires to semiconductor devices, wherein, for example, an aluminum wire is pulled from a first bonding connection to a second bonding connection. During bonding, the wire is pressed against the semiconductor surface with the aid of a bonding tool. The end of the tool is set in ultrasonic vibrations. The combination of static pressure on the bond Tool and vibrations of the tool end parallel to the semiconductor surface (substrate surface) leads to a plastic deformation of the wire. In this way, a bond connection in the form of a cold-welded connection is created.
Der aus der vorstehend genannten Veröffentlichung bekannte Ultraschallbonder besitzt ein sogenanntes „passives" Messer, d.h. eine Schneidvorrichtung, die mit der Haupthalte- rungsvorrichtung derart verbunden ist, dass sie deren Bewegungen in Richtung der Z-Achse direkt folgt, und mit deren Hilfe in einem durch eine Bondverbindung festgelegten Draht ein Schnitt zum Abtrennen des Drahtes herstellbar ist. Bei dem bekannten Ultraschallbonder findet daher die Bewegung der Schneidvorrichtung bis zum Abtrennen des Drahtes ausschließlich durch die entsprechende Abwärtsbewegung der Haupthalterungsvorrichtung statt. Mit anderen Worten, es sind keine hiervon getrennten bzw. zusätzlichen Einrichtungen vorgesehen, die die Schneidvorrichtung zur Durchführung ihrer entsprechenden Abwärts- und Aufwärtsbewegung antreiben.The ultrasonic bonder disclosed in the above-mentioned publication has a so-called "passive" knife, ie a cutting device, which is connected to the main holding device in such a way that it directly follows its movements in the direction of the Z-axis, and with its aid in one Therefore, in the known ultrasonic bonder, the movement of the cutter until disconnection of the wire takes place solely by the corresponding downward movement of the main support device, in other words, there are no separate or additional devices provided which drive the cutting device to perform their respective downward and upward movement.
Der vorliegenden Erfindung liegt die Aufgabe zugrunde, einen Ultraschallbonder der eingangs beschriebenen Art zu schaffen, mit dem eine besonders präzise Bewegung derThe present invention has for its object to provide an ultrasonic bonder of the type described above, with a particularly precise movement of the
Schneidvorrichtung zur Durchtrennung des Drahtes durchgeführt werden kann.Cutting device for cutting the wire can be performed.
Diese Aufgabe wird erfindungsgemäß bei einem Ultraschall- bonder der angegebenen Art dadurch gelöst, dass dieThis object is achieved in an ultrasonic bonder of the type specified by the fact that the
Schneidvorrichtung durch das Absenken der Haupthalterungs- einrichtung mittels des Z-Achsen-Antriebes nur bis in eine Zwischenstellung abgesenkt wird, in der die Schneidvorrichtung im Abstand vom zu bondernden Draht angeordnet ist, und dass der Ultraschallbonder eine gesonderte Antriebseinrich- tung (Aktor) für die Schneidvorrichtung aufweist, die die Schneidvorrichtung unabhängig von der Bewegung der Haupt- halterungseinrichtung und der Zwischenstellung in eine Abtrennstellung weiter absenkt, um den Draht zumindest teilweise abzutrennen.Cutting device by lowering the main holder means is lowered by means of the Z-axis drive only to an intermediate position in which the cutting device is arranged at a distance from the wire to be bonderden, and that the ultrasonic bonder has a separate Antriebseinrich- device (actuator) for the cutting device, which independently the cutting device from the movement of the main support means and the intermediate position in a Abtrennstellung further lowers to at least partially separate the wire.
Bei der erfindungsgemäßen Lösung findet daher eine kombinierte Bewegung der Schneidvorrichtung statt. Die Startposition des Schneidvorgangs wird unter Verwendung der Z- Achse angefahren. Diese Position entspricht - um Zeit zu sparen - in etwa der Position, die der Bondkopf sowieso schon beim Bondvorgang einnimmt. Nach dem Bondvorgang muss dann nur noch ein sehr kleiner Weg mit der Hauptbewegungseinrichtung (Z-Achse) gemeinsam verfahren werden, bis die" Schneideinrichtung einen wohldefinierten Abstand vom gebon- deten Draht bzw. der Werkzeugspitze besitzt. Aus dieser1 In the solution according to the invention therefore takes place a combined movement of the cutting device. The start position of the cutting process is started using the Z axis. In order to save time, this position corresponds approximately to the position which the bonding head already occupies during the bonding process. After the bonding process then only a very small distance with the prime mover (Z-axis) must be moved together until the "cutter has a well-defined distance from the gebon- Deten wire or the tool tip. From this 1
Zwischenstellung wird die Schneidvorrichtung dann mit Hilfe der gesonderten Antriebseinrichtung (des Aktors) in die Abtrennstellung weiter abgesenkt, wobei diese zusätzliche Bewegung unabhängig vom Z-Achsen-Antrieb der Haupthalterungs- einrichtung erfolgt. Da sich die gesonderte Antriebseinrichtung exakt steuern lässt und die zugehörige Bewegungsstrecke der Schneidvorrichtung aus der Zwischenstellung bis zur Abtrennstellung exakt ermitteln lässt, wird ein besonders präziser Bewegungsablauf der Schneidvorrichtung und damit ein präzise ablaufender Abtrennvorgang des Drahtes erreicht. Vorzugsweise entspricht die Zwischenstellung der Schneidvorrichtung der Stellung der Haupthalterungseinrichtung, in der das Bondwerkzeug und der Draht das Substrat kontaktie- ren. Bei verschieden hohen Substraten ergeben sich dabei unterschiedliche Zwischenstellungen der Schneidvorrichtung, wobei jedoch die Strecke von der Zwischenstellung bis zur Abtrennstellung immer gleich bleibt. Somit kann die gesonderte Antriebseinrichtung für die Schneidvorrichtung mit konstantem Hub arbeiten.Intermediate position, the cutting device is then further lowered by means of the separate drive means (of the actuator) in the Abtrennstellung, said additional movement takes place independently of the Z-axis drive of the Hauptstalterungs- device. Since the separate drive means can be controlled precisely and the associated movement distance of the cutting device can be determined exactly from the intermediate position to the severing position, a particularly precise movement of the cutting device and thus a precise running separation process of the wire is achieved. Preferably, the intermediate position of the cutting device corresponds to the position of the main holder, in which the bonding tool and the wire contacting the substrate ren. Different high substrates result in different intermediate positions of the cutting device, but the distance from the intermediate position to the separation position always remains the same. Thus, the separate drive means for the cutter can operate with constant lift.
In Weiterbildung der Erfindung ist die gesonderte Antriebseinrichtung relativ zur Z-Achsen-Richtung schräg gelagert und die Schneidvorrichtung hiermit winklig verbun- den, so dass diese eine Lage parallel zur Z-Achse einnimmt und sich bei Betätigung der gesonderten Antriebseinrichtung zum Abtrennen des Drahtes in Z-Achsen-Richtung nach unten und gleichzeitig in Querrichtung auf das Bondwerkzeug zu bewegt. Durch diese Schrägstellung der gesonderten An- triebseinrichtung relativ zur Z-Achse wird erreicht, dass die Schneidvorrichtung zum Abtrennen des Drahtes nicht parallel zur Z-Achse nach unten, sondern schräg nach unten auf das Bondwerkzeug zu bewegt wird, so dass auch der Abtrennvorgang des Drahtes über eine Schrägbewegung erfolgt. Auf diese Weise können die beim Stand der Technik verwendeten Pusher entfallen, der Bondkopf kann kompakter aufgebaut werden und ist aufgrund günstigerer Kollisionseigenschaften für das Bonden in engen Gehäusen besser geeignet.In a further development of the invention, the separate drive means is mounted obliquely relative to the Z-axis direction and the cutting device hereby connected at an angle, so that it occupies a position parallel to the Z axis and upon actuation of the separate drive means for separating the wire in Z -Axis direction down and simultaneously moved in the transverse direction to the bonding tool. As a result of this inclination of the separate drive device relative to the Z axis, it is achieved that the cutting device for separating the wire is not moved downwards parallel to the Z axis but obliquely downwards toward the bonding tool, so that the cutting process of the wire is also moved via an oblique movement. In this way, the pushers used in the prior art can be omitted, the bonding head can be made more compact and is more suitable for bonding in tight housings due to more favorable collision properties.
Zweckmäßigerweise ist die gesonderte Antriebseinrichtung für die Schneidvorrichtung über eine Gelenkverbindung fle- xibel an der Haupthalterungseinrichtung gelagert. Dabei besitzt die Gelenkverbindung vorzugsweise eine fest an der Haupthalterungseinrichtung angeordnete Seite und einen hieran flexibel gelagerten Arm, der die Schneidvorrichtung trägt. Der Arm kann somit aufgrund der flexiblen Lagerung die gewünschte Auf- und Abwärtsbewegung bzw. Schrägbewegung durchführen.The separate drive device for the cutting device is expediently connected via an articulated connection. xibel stored on the main support device. In this case, the articulated connection preferably has a fixedly arranged on the main support means side and a thereto flexibly mounted arm which carries the cutting device. The arm can thus perform the desired up and down movement or oblique movement due to the flexible storage.
Die Gelenkverbindung ist zweckmäßigerweise als Gelenkvier- eck ausgebildet, das sich bei Betätigung der Antriebseinrichtung parallelogrammförmig verschiebt.The articulated connection is expediently designed as a four-bar linkage which shifts parallelogram-shaped upon actuation of the drive device.
In Weiterbildung der Erfindung umfasst die Antriebseinrichtung (Aktor) selbst einen Elektromagneten, dessen stationä- rer Teil fest an der Haupthalterungseinrichtung angeordnet und dessen beweglicher Teil die Schneidvorrichtung trägt. Der Elektromagnet umfasst dabei vorzugsweise einen am flexibel gelagerten Arm der Gelenkverbindung angeordneten Tauchmagneten und eine an der festen Seite der Gelenkver- . bindung angeordnete Spule. Bei Stromdurchfluss durch die Spule wird der Tauchmagnet in die Spule hineingezogen, wodurch der Arm der Gelenkverbindung (des Gelenkviereckes) , mit dem der Tauchmagnet verbunden ist, abwärts bzw. schräg abwärts bewegt wird, so dass die damit verbundene Schneid- Vorrichtung den Abtrennvorgang durchführen kann. Da der Arm bei der Ausgestaltung als Gelenkviereck im oberen und unteren Bereich gelenkig über Verbindungsglieder mit der festen Seite der Gelenkverbindung bzw. des Gelenkviereckes (der Haupthalterungseinrichtung) verbunden ist, kann die ge- wünschte Bewegung präzise und behinderungsfrei erfolgen. Was die Strecke der von der gesonderten Antriebseinrichtung bewirkten Abwärtsbewegung der Schneidvorrichtung von der Zwischenstellung bis zur Abtrennstellung betrifft, so weist der erfindungsgemäß ausgebildete Ultraschallbonder vorzugs- weise eine Einrichtung auf, die diese Strecke (digital) berechnet und die gesonderte Antriebseinrichtung entsprechend steuert. Dies hat den Vorteil, dass Endschalter, die das Bewegungsende festlegen, entfallen können und trotzdem eine besonders präzise Durchführung der Bewegung erreicht wird.In a development of the invention, the drive device (actuator) itself comprises an electromagnet whose stationary part is fixedly arranged on the main support device and whose movable part carries the cutting device. The electromagnet preferably comprises a submersible magnet arranged on the flexibly mounted arm of the articulated connection and one on the fixed side of the articulated connection. Binding arranged coil. When current flows through the coil of the solenoid is pulled into the coil, whereby the arm of the articulation (the four-bar linkage), with which the solenoid is connected, is moved downwards or obliquely downward, so that the associated cutting device can perform the separation process , Since the arm in the embodiment as a four-bar linkage in the upper and lower region is pivotally connected via connecting links to the fixed side of the articulated joint or the four-bar linkage (the main mounting device), the desired movement can be precise and without hindrance. As regards the distance of the downward movement of the cutting device caused by the separate drive device from the intermediate position to the disconnected position, the ultrasonic bonder embodied according to the invention preferably has a device which calculates this distance (digitally) and controls the separate drive device accordingly. This has the advantage that limit switches, which determine the end of movement, can be omitted and nevertheless a particularly precise execution of the movement is achieved.
Die gesonderte Antriebseinrichtung ist vorzugsweise als Voice-coil-Aktor ausgebildet, womit gute Ergebnisse erzielt werden.The separate drive device is preferably designed as a voice coil actuator, with which good results are achieved.
Bei der gesonderten Antriebseinrichtung kann es sich um eine einfach oder doppelt wirkende Antriebseinrichtung handeln. Vorzugsweise wirkt die Antriebseinrichtung einseitig, d.h. in Absenkrichtung der Schneidvorrichtung, und eine ge- eignete elastische Einrichtung in der entgegengesetzten Richtung, d.h. aufwärts.The separate drive device may be a single or double-acting drive device. Preferably, the drive means acts on one side, i. in the lowering direction of the cutting device, and a suitable elastic device in the opposite direction, i. upwards.
Die erfindungsgemäß verwendete aktive Schneideinrichtung arbeitet besonders schnell und ist crashsicher, da das Messer bei Überschreiten der Magnetkraft ausweichen kann. Wie bereits erwähnt, entfällt ein Pusher.The active cutting device used according to the invention operates particularly fast and is crash-proof, since the blade can escape when the magnetic force is exceeded. As already mentioned, eliminates a pusher.
Die Erfindung wird nachfolgend anhand eines Ausführungsbeispieles in Verbindung mit der Zeichnung im einzelnen erläutert. Es zeigen:The invention will now be explained in detail with reference to an embodiment in conjunction with the drawings. Show it:
Figur 1 eine schematische Darstellung eines Ultra- schallbonders, bei der sich das Bondwerkzeug, die Drahtzuführeinrichtung und die Schneidvorrichtung in der Ausgangsstellung befinden;FIG. 1 shows a schematic representation of an ultrasound sound bonder, in which the bonding tool, the wire feeding device and the cutting device are in the starting position;
Figur 2 eine Darstellung entsprechend Figur 1, bei der das Bondwerkzeug und die Drahtzuführeinrichtung so weit abgesenkt sind, dass sie das Substrat kontaktieren, und sich die Schneidvorrichtung in der Zwischenstellung befindet; undFigure 2 is a view corresponding to Figure 1, in which the bonding tool and the wire feeding device are lowered so far that they contact the substrate, and the cutting device is in the intermediate position. and
Figur 3 eine schematische Detailansicht des Ultra- schallbonders der Figuren 1 und 2, wobei die Schneidvorrichtung mit der Antriebseinrichtung in größeren Einzelheiten dargestellt ist .Figure 3 is a schematic detail view of the ultrasonic baffle of Figures 1 and 2, wherein the cutting device is shown with the drive means in greater detail.
Figur 1 zeigt ganz schematisch die Teile eines Ultraschall- bonders, die für die vorliegende Erfindung eine Rolle spielen. Man erkennt eine schematisch dargestellte Haupthalte- rungseinrichtung 1 des ültraschallbonders, an der ein Bondwerkzeug 13 und eine Drahtzuführeinrichtung 21 flexibel gelagert sind. Ferner ist an der Haupthalterungseinrichtung 1 eine Schneidvorrichtung 22 über eine Antriebseinrichtung 20 gelagert. Mit 25 ist ein Substrat bezeichnet, auf dem ein Bondervorgang durchgeführt werden soll.FIG. 1 shows very schematically the parts of an ultrasonic bonder which play a part in the present invention. One recognizes a schematically illustrated main retaining device 1 of the ultrasonic bonder, on which a bonding tool 13 and a wire feed device 21 are flexibly mounted. Furthermore, a cutting device 22 is mounted on the main support device 1 via a drive device 20. Denoted by 25 is a substrate on which a bonder process is to be performed.
In der Darstellung der Figur 1 befinden sich das Bondwerk- zeug 13, die Drahtzuführeinrichtung 21 und die Schneidvorrichtung 22 in der Ausgangsstellung. Es versteht sich, dass diese Teile nicht maßstäblich gezeigt sind. Weitere Teile des Ultraschallbonders sind aus Klarheitsgründen weggelassen worden.In the representation of FIG. 1, the bonding tool 13, the wire feed device 21 and the cutting device 22 are in the starting position. It is understood that these parts are not shown to scale. Other parts of the ultrasonic bonder have been omitted for clarity.
Figur 2 zeigt eine Stellung, in der das Bondwerkzeug 13 und die Drahtzuführeinrichtung 21 vom Z-Achsen-Antrieb der Haupthalterungseinrichtung 1 so weit abgesenkt worden sind, dass sie das Substrat 25 kontaktieren. In dieser Stellung kann daher das Bondwerkzeug 13 den entsprechenden Bonder- Vorgang durchführen. In dieser Stellung nimmt die Schneidvorrichtung 22 eine sogenannte Zwischenstellung 23 ein. Diese Zwischenstellung 23 stellt die Endstellung dar, in die die Schneidvorrichtung 22 von der Haupthalterungseinrichtung 1 abgesenkt worden ist. Die weitere Abwärtsbewe- gung der Schneidvorrichtung 22 aus dieser Zwischenstellung 23 in die Abtrennstellung wird unabhängig von der Bewegung der Haupthalterungseinrichtung 1 von einer Antriebseinrichtung 20 durchgeführt. Diese Antriebseinrichtung 20 bewirkt eine Schrägbewegung der Schneidvorrichtung 22 in ihre bei 24 gezeigte Abtrennstellung. In dieser Abtrennstellung 24 hat sich die Schneidvorrichtung 22 dem Bondwerkzeug 13 entsprechend angenähert, um den Abtrennvorgang durchführen zu können. Einzelheiten über den Ablauf dieser Bewegung werden in Verbindung mit Figur 3 erläutert.FIG. 2 shows a position in which the bonding tool 13 and the wire feeder 21 have been lowered from the Z-axis drive of the main holder 1 so far as to contact the substrate 25. In this position, therefore, the bonding tool 13 perform the corresponding Bonder process. In this position, the cutting device 22 takes a so-called intermediate position 23 a. This intermediate position 23 represents the end position in which the cutting device 22 has been lowered by the main holder 1. The further downward movement of the cutting device 22 out of this intermediate position 23 into the disconnecting position is carried out by a drive device 20 independently of the movement of the main holder device 1. This drive means 20 causes an oblique movement of the cutting device 22 in its disconnection position shown at 24. In this separation position 24, the cutting device 22 has approximated the bonding tool 13 in order to carry out the separation process can. Details about the sequence of this movement will be explained in connection with FIG.
Figur 3 zeigt, dass die Antriebseinrichtung 20 für die Schneidvorrichtung 22 schräg zur sich durch das Bondwerkzeug 13 erstreckenden Z-Achse angeordnet ist. Diese gesonderte Antriebseinrichtung 20 für die Schneidvorrichtung 22 ist über ein Gelenkviereck gelenkig an der Haupthalterungseinrichtung 1 gelagert bzw. das Gelenkviereck bildet einen Teil dieser Antriebseinrichtung 20. Das Gelenkviereck weist eine feste Seite bzw. Platte 2 auf, die fest mit der Haupt- halterungseinrichtung 1 verbunden ist. An diese feste Seite bzw. Platte 2 sind ein oberer Lenker 4 und ein unterer Len- ker 5 gelenkig befestigt. Die entsprechenden Gelenke 6FIG. 3 shows that the drive device 20 for the cutting device 22 is arranged at an angle to the Z-axis extending through the bonding tool 13. This separate drive device 20 for the cutting device 22 is articulated to the main mounting device 1 via a four-bar linkage or the four-bar linkage forms a Part of this drive device 20. The four-bar linkage has a fixed side or plate 2, which is firmly connected to the main bracket 1. At this fixed side or plate 2, an upper arm 4 and a lower arm 5 are hinged. The corresponding joints 6
(verdünnte Abschnitte der Lenker) an den Enden der Lenker 4, 5 sind dargestellt. Mit den freien Enden der Lenker 4, 5 ist ein etwa parallel zur Seite bzw. Platte 2 verlaufender Arm 3 bezeichnet, der über die benachbarten Gelenke (ver- dünnten Abschnitte) 6 mit den beiden Lenkern 4, 5 verbunden ist. Mit dem Arm 3 fest verbunden ist ein Träger 9, der einen Tauchmagneten 8 trägt. Ein mit der Seite bzw. Platte 2 fest verbundener Träger 10 trägt eine Spule 7. Wenn die Spule 7 von Strom durchflössen wird, wird der Tauchmagnet 8 in die Spule hineingezogen, so dass der Arm 3 unter entsprechender Verbiegung der Lenker 4, 5 schräg abwärts bewegt wird. Die winklig mit dem Arm 3 verbundene Schneidvorrichtung 22, die ein geeignetes abgewinkeltes Messer 11 aufweist, wird auf diese Weise abwärts und quer in Richtung auf das Bondwerkzeug 13 in die gestrichelt dargestellte Abtrennstellung 12 bewegt, in der ein geeigneter Draht 14 zumindest teilweise abgetrennt wird. Die Aufwärtsbewegung der Schneidvorrichtung 22 nach dem erfolgten Trennvorgang erfolgt aufgrund der elastischen Lagerung des Tauchmagneten 8 automatisch.(Thinner portions of the links) at the ends of the links 4, 5 are shown. With the free ends of the links 4, 5 an approximately parallel to the side or plate 2 extending arm 3 is designated, which is connected via the adjacent joints (thinned sections) 6 with the two arms 4, 5. Securely connected to the arm 3 is a support 9 which carries a submersible magnet 8. When the coil 7 is traversed by current, the solenoid 8 is drawn into the coil, so that the arm 3 with a corresponding deflection of the links 4, 5 obliquely downward is moved. The angle connected to the arm 3 cutting device 22, which has a suitable angled blade 11 is moved in this way down and across in the direction of the bonding tool 13 in the cut-off position shown in dashed lines 12, in which a suitable wire 14 is at least partially separated. The upward movement of the cutting device 22 after the successful separation process takes place automatically due to the elastic mounting of the submersible magnet 8.
Die hier gezeigte Antriebseinrichtung 20 ist nur schematisch dargestellt. Es findet vorzugsweise hierfür ein geeigneter Voice-coil-Aktor Verwendung, mit dem die entspre- chenden Bewegungsfrequenzen erzielt werden können. Derartige Einrichtungen sind dem Fachmann bekannt. The drive device 20 shown here is shown only schematically. A suitable voice coil actuator is preferably used for this, with which the corresponding movement frequencies can be achieved. Such devices are known in the art.

Claims

Patentansprüche claims
1. Ultraschallbonder mit einem Bondwerkzeug, einer Drahtzuführeinrichtung und einer Schneidvorrichtung, wobei das Bondwerkzeug, die Drahtzuführein- richtung und die Schneidvorrichtung an einer in Z- Achsen-Richtung bewegbaren Haupthalterungseinrich- tung gelagert sind und das Bondwerkzeug, die Drahtzuführeinrichtung und die Schneidvorrichtung durch einen Z-Achsen-Antrieb der Haupthalterungseinrich- tung in Richtung auf ein Substrat absenkbar sind, dadurch gekennzeichnet, dass die Schneidvorrichtung (22) durch das Absenken der Haupthalterungseinrich- tung (1) mittels des Z-Achsen-Antriebes nur bis in eine Zwischenstellung (23) abgesenkt wird, in der die Schneidvorrichtung (22) im Abstand vom zu bon- dernden Draht angeordnet ist, und dass der Ultraschallbonder eine gesonderte Antriebseinrichtung (Aktor) (20) für die Schneidvorrichtung (22) aufweist, die die Schneidvorrichtung (22) unabhängig von der Bewegung der Haupthalterungseinrichtung (1) von der Zwischenstellung (23) in eine Abtrennstel- lung (24) weiter absenkt, um den Draht zumindest teilweise abzutrennen.An ultrasonic bonder comprising a bonding tool, a wire feeder, and a cutter, wherein the bonding tool, the wire feeder, and the cutter are mounted on a main support means movable in the Z axis direction, and the bonding tool, the wire feeder, and the cutter are separated by a Z Axes drive of the main mounting device can be lowered in the direction of a substrate, characterized in that the cutting device (22) by lowering the Haupthalterungseinrich- device (1) by means of the Z-axis drive only in an intermediate position (23) in which the cutting device (22) is arranged at a distance from the wire to be bonded, and that the ultrasonic bonder has a separate drive device (actuator) (20) for the cutting device (22) which controls the cutting device (22) independently of the movement of the main support means (1) from the intermediate position (23) in an Ab trennstel- ment (24) further lowered to at least partially separate the wire.
2. Ultraschallbonder nach Anspruch 1, dadurch gekenn- zeichnet, dass die Zwischenstellung (23) der2. Ultrasonic bonder according to claim 1, characterized in that the intermediate position (23) of
Schneidvorrichtung (22) der Stellung der Haupthal- terungseinrichtung (1) entspricht, in der das Bondwerkzeug (13) und der Draht das Substrat (25) kontaktieren.Cutting device (22) corresponds to the position of the Haupth- lerungseinrichtung (1), in which the bonding tool (13) and the wire contact the substrate (25).
3. Ultraschallbonder nach Anspruch 1 oder 2, dadurch gekennzeichnet, dass die gesonderte Antriebseinrichtung (20) relativ zur Z-Achsen-Richtung schräg gelagert ist und die Schneidvorrichtung (22) hier- mit winklig verbunden ist, so dass diese eine Lage parallel zur Z-Achse einnimmt und sich bei Betätigung der gesonderten Antriebseinrichtung (20) zum Abtrennen des Drahtes in Z-Achsen-Richtung nach unten und gleichzeitig in Querrichtung (Bondrichtung) auf das Bondwerkzeug (13) zubewegt.3. ultrasonic bonder according to claim 1 or 2, characterized in that the separate drive means (20) is mounted obliquely relative to the Z-axis direction and the cutting device (22) is connected at an angle, so that it is a position parallel to the Z -Axis takes and moves upon actuation of the separate drive means (20) for separating the wire in the Z-axis direction down and at the same time in the transverse direction (bonding direction) on the bonding tool (13).
4. Ultraschallbonder nach einem der vorangehenden Ansprüche, dadurch gekennzeichnet, dass die gesonderte Antriebseinrichtung (20) über eine Gelenkverbin- düng flexibel an der Haupthalterungseinrichtung (1) gelagert ist.4. ultrasonic bonder according to any one of the preceding claims, characterized in that the separate drive means (20) via a Gelenkverbin- düng flexibly to the main support means (1) is mounted.
5. Ultraschallbonder nach Anspruch 4, dadurch gekennzeichnet, dass die Gelenkverbindung eine fest an der Haupthalterungseinrichtung (1) angeordnete Sei- te (2) und einen hieran flexibel gelagerten Arm (3] aufweist, der die Schneidvorrichtung (22) trägt.5. ultrasonic bonder according to claim 4, characterized in that the articulated connection a fixed to the main support means (1) arranged sei- te (2) and a thereto flexibly mounted arm (3], which carries the cutting device (22).
6. Ultraschallbonder nach Anspruch 4 oder 5, dadurch gekennzeichnet, dass die Gelenkverbindung als Gelenkviereck ausgebildet ist.6. ultrasonic bonder according to claim 4 or 5, characterized in that the articulated connection is designed as a four-bar linkage.
7. Ultraschallbonder nach einem der vorangehenden Ansprüche, dadurch gekennzeichnet, dass die Gelenk- Verbindung als Festkörpergelenk ausgebildet ist.7. Ultrasonic bonder according to one of the preceding claims, characterized in that the joint connection is designed as a solid-body joint.
8. Ultraschallbonder nach einem der vorangehenden Ansprüche, dadurch gekennzeichnet, dass die Antriebseinrichtung (Aktor) (20) einen Elektromagne- ten umfasst, dessen stationärer Teil fest an der Haupthalterungseinrichtung angeordnet und dessen beweglicher Teil die Schneidvorrichtung (22) trägt.8. Ultrasonic bonder according to one of the preceding claims, characterized in that the drive device (actuator) (20) comprises an electric ten whose stationary part fixed to the main support means and whose movable part carries the cutting device (22).
9. Ultraschallbonder nach Anspruch 7, dadurch gekenn- zeichnet, dass der Elektromagnet einen am flexibel gelagerten Arm (3) der Gelenkverbindung angeordneten Tauchmagneten (8) und eine an der festen Seite (2) der Gelenkverbindung angeordnete Spule (7) aufweist .9. The ultrasonic bonder according to claim 7, characterized in that the electromagnet has a flexible arm (3) of the articulated connection arranged submersible magnets (8) and one on the fixed side (2) of the articulated connection arranged coil (7).
10. Ultraschallbonder nach einem der vorangehenden Ansprüche, dadurch gekennzeichnet, dass er eine Einrichtung aufweist, die die Strecke der von der gesonderten Antriebseinrichtung (20) bewirkten Ab- wärtsbewegung der Schneidvorrichtung (22) von der Zwischenstellung (23) bis zur Abtrennstellung (24) berechnet und die gesonderte Antriebseinrichtung (20) entsprechend steuert.10. Ultrasonic bonder according to one of the preceding claims, characterized in that it comprises a device which determines the distance of the separate drive device (20) effected downward movement of the cutting device (22) from the intermediate position (23) to the separation position (24). calculated and the separate drive means (20) controls accordingly.
11. Ultraschallbonder nach einem der vorangehenden An- sprüche, dadurch gekennzeichnet, dass die gesonderte Antriebseinrichtung (20) als Voice-coil-Aktor ausgebildet ist.11. Ultrasonic bonder according to one of the preceding claims, characterized in that the separate drive device (20) is designed as a voice coil actuator.
12. Ultraschallbonder nach einem der vorangehenden An- sprüche, dadurch gekennzeichnet, dass die gesonderte Antriebseinrichtung (20) als Piezo-Antrieb ausgebildet ist. 12. Ultrasonic bonder according to one of the preceding claims, characterized in that the separate drive device (20) is designed as a piezo drive.
PCT/DE2007/001832 2006-10-20 2007-10-16 Ultrasonic bonding device WO2008046397A1 (en)

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WO2009080471A1 (en) * 2007-12-21 2009-07-02 Hesse & Knipps Gmbh Bonding device and method for producing electrically conductive connections
CN101740427B (en) * 2008-11-21 2011-07-20 先进自动器材有限公司 Bond head for heavy wire bonder
US8129220B2 (en) 2009-08-24 2012-03-06 Hong Kong Polytechnic University Method and system for bonding electrical devices using an electrically conductive adhesive
US8833418B2 (en) 2009-08-24 2014-09-16 The Hong Kong Polytechnic University Method and system for bonding electrical devices using an electrically conductive adhesive

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TW200838063A (en) 2008-09-16
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