TWI803877B - Ultrasonic processing device - Google Patents
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Abstract
一種超音波加工裝置,包括壓電驅動器、刀具、變幅桿、填充材料以及拘束件,壓電驅動器供接收訊號以產生縱向超音波振動,變幅桿相對的兩端分別連接壓電驅動器及刀具,變幅桿具有圓錐段,圓錐段外壁設置有凹槽,拘束件設置於圓錐段以封閉凹槽之開口,藉此,變幅桿能將壓電驅動器提供之縱向超音波振動轉換為縱扭複合振動並傳遞至刀具;填充材料用以填充於凹槽中,透過填充於凹槽中之填充材料能減少變幅桿於高速旋轉下因氣流不穩定所引起的振動及高頻噪音,且拘束件能避免填充材料於變幅桿高速旋轉時脫離凹槽。An ultrasonic processing device, including a piezoelectric driver, a tool, a horn, a filling material, and a restraint, the piezoelectric driver is used to receive signals to generate longitudinal ultrasonic vibrations, and the opposite ends of the horn are respectively connected to the piezoelectric driver and the tool , the horn has a cone section, the outer wall of the cone section is provided with a groove, and the restraint is arranged on the cone section to close the opening of the groove, so that the horn can convert the longitudinal ultrasonic vibration provided by the piezoelectric driver into longitudinal torsion The composite vibration is transmitted to the tool; the filling material is used to fill the groove, and the filling material filled in the groove can reduce the vibration and high-frequency noise caused by the unstable air flow of the horn under high-speed rotation, and the restraint The parts can prevent the filling material from falling out of the groove when the horn rotates at high speed.
Description
本發明係與超音波加工裝置有關;特別是指一種縱扭複合之超音波加工裝置。The present invention is related to an ultrasonic processing device; in particular, it refers to a longitudinal-twisting composite ultrasonic processing device.
已知隨著現代科技和工業對材料要求的不斷提高,尤其是在半導體、光電、航太、醫療器材、能源、電動車、3C電子以及精密製造領域,時常採用具有例如輕量化、硬韌和耐高溫等性能的特殊材料。但是這些特殊材料往往具有高强度、高硬度、高脆性等特性。而傳統的加工裝置對於這些高强度、高硬度、高脆性等特殊材料的加工效果差、效率低,並無法滿足這類材料的加工精度要求。相較於傳統的加工裝置,超音波加工裝置具有降低切削力、減少刀具磨耗、提高工件表面精度、增加加工效率及延長刀具壽命等優點,而廣泛的應用於前述領域。It is known that with the continuous improvement of modern technology and industry requirements for materials, especially in the fields of semiconductors, optoelectronics, aerospace, medical equipment, energy, electric vehicles, 3C electronics and precision manufacturing, materials with properties such as lightweight, toughness and toughness are often used. Special materials with high temperature resistance and other properties. However, these special materials often have characteristics such as high strength, high hardness, and high brittleness. However, traditional processing devices have poor processing effects and low efficiency for these special materials such as high strength, high hardness, and high brittleness, and cannot meet the processing accuracy requirements of such materials. Compared with traditional processing devices, ultrasonic processing devices have the advantages of reducing cutting force, reducing tool wear, improving workpiece surface accuracy, increasing processing efficiency and prolonging tool life, and are widely used in the aforementioned fields.
一般超音波加工裝置包含壓電驅動器、變幅桿及刀具,變幅桿分別與壓電驅動器及刀具連接,壓電驅動器將電能轉化為機械振動能並產生振動,變幅桿用於將壓電驅動器產生的振動進行振幅放大處理後傳遞至刀具,其振動模式多是採用縱向振動模式,然而,單一的縱向振動,容易導致軸向衝擊力過大,不僅影響硬脆材料的表面加工效果,也使得刀具所採用的材料受到限制,通用性較差,因此,習用的超音波加工裝置仍有待改善之處。A general ultrasonic processing device includes a piezoelectric driver, a horn and a tool. The horn is connected to the piezoelectric driver and the tool respectively. The piezoelectric driver converts electrical energy into mechanical vibration energy and generates vibration. The vibration generated by the driver is amplified and then transmitted to the tool. The vibration mode is mostly longitudinal vibration mode. However, a single longitudinal vibration can easily lead to excessive axial impact force, which not only affects the surface processing effect of hard and brittle materials, but also makes the The materials used for the tool are limited and the versatility is poor. Therefore, the conventional ultrasonic processing device still needs to be improved.
有鑑於此,本發明之目的在於提供一種超音波加工裝置,能提供縱扭複合振動。In view of this, the object of the present invention is to provide an ultrasonic processing device capable of providing longitudinal-torsional compound vibration.
緣以達成上述目的,本發明提供的一種超音波加工裝置包括有一壓電驅動器、一刀具、一變幅桿以及一填充材料,該壓電驅動器供接收一訊號以產生縱向超音波振動,該變幅桿相對的兩端分別連接該壓電驅動器及該刀具,該變幅桿具有一圓錐段,該圓錐段外壁設置有至少一凹槽,藉此,該變幅桿能將該壓電驅動器提供之縱向超音波振動轉換為縱扭複合振動並傳遞至該刀具;該填充材料用以填充於該至少一凹槽中。In order to achieve the above object, an ultrasonic processing device provided by the present invention includes a piezoelectric driver, a cutter, a horn and a filling material. The piezoelectric driver is used to receive a signal to generate longitudinal ultrasonic vibration. The opposite ends of the horn are respectively connected to the piezoelectric driver and the tool, the horn has a conical section, the outer wall of the cone section is provided with at least one groove, whereby the horn can provide the piezoelectric driver The longitudinal ultrasonic vibration is converted into longitudinal-torsional composite vibration and transmitted to the tool; the filling material is used to fill in the at least one groove.
本發明之效果在於,透過在該變幅桿上設置至少一凹槽將部分縱向超音波振動轉為扭轉振動,如此一來,本發明之該超音波加工裝置能使刀具產生兼具縱向與扭轉之縱扭複合振動,以改善習用超音波加工裝置單一的縱向振動模式導致軸向衝擊力過大,影響硬脆材料表面加工效果,以及使得刀具所採用的材料受到限制的問題。除此之外,透過填充於該至少一凹槽中之該填充材料能減少該變幅桿於高速旋轉下因氣流不穩定所引起的振動及高頻噪音。The effect of the present invention is that part of the longitudinal ultrasonic vibration is converted into torsional vibration by providing at least one groove on the horn. In this way, the ultrasonic processing device of the present invention can make the tool produce both longitudinal and torsional vibrations. The longitudinal and torsional compound vibration is used to improve the problem that the single longitudinal vibration mode of the conventional ultrasonic processing device causes excessive axial impact force, affects the surface processing effect of hard and brittle materials, and limits the materials used for the tool. In addition, the vibration and high-frequency noise caused by the unstable air flow of the horn during high-speed rotation can be reduced by the filling material filled in the at least one groove.
為能更清楚地說明本發明,茲舉較佳實施例並配合圖式詳細說明如後。請參圖1至圖4所示,為本發明一較佳實施例之超音波加工裝置1,包含一刀桿10、一電能傳輸裝置20、一壓電驅動器30、一變幅桿40及一刀具50,該刀桿10用於連接BT、HSK或任意介面之主軸並連接該變幅桿40,該電能傳輸裝置20設置於該刀桿10上並與該壓電驅動器30電性連接,該電能傳輸裝置20可以是透過接觸式或是非接觸式的方式傳輸電能,該壓電驅動器30接收自該電能傳輸裝置20輸出之一訊號後將電能轉為振動機械能以產生縱向超音波振動,於本實施例中,該壓電驅動器30包含二壓電片32,該二壓電片32可受電能的驅動而產生高頻率振盪,該變幅桿40相對的兩端分別連接該壓電驅動器30及該刀具50,藉此,該變幅桿40能接收自壓電驅動器30之縱向超音波振動並將其放大後輸出至該刀具50。In order to illustrate the present invention more clearly, preferred embodiments are given and detailed descriptions are given below in conjunction with drawings. Please refer to Fig. 1 to Fig. 4, which is an ultrasonic processing device 1 of a preferred embodiment of the present invention, including a
請配合圖2至圖3,該變幅桿40具有一圓錐段401,該圓錐段401之外壁設置有複數個凹槽402,且該圓錐段401之外徑自遠離該刀具50之一端往靠近該刀具50之一端漸縮,如圖3所示,該圓錐段401具有相連接之一第一段401a及一第二段401b,該第一段401a相對該第二段401b設置於遠離該刀具50的位置,該第一段401a之壁厚大於該第二段401b之壁厚且該第一段401a具有該些凹槽402,該第二段401b連接一筒夾60,該筒夾60用以夾持該刀具50。藉此,該變幅桿40能透過該些凹槽402將該壓電驅動器30提供之縱向超音波振動部分轉換為扭轉振動並將縱扭複合振動傳遞至該刀具50。Please refer to FIG. 2 to FIG. 3, the
該超音波加工裝置19包含一填充材料G,用以填充於各該凹槽402中,其中該填充材料G可以是包含環氧樹脂(Epoxy)、乙烯基酯樹脂(vinyl ester resin)、紫外線硬化膠(UV膠)、聚氨脂(polyurethane)或丙烯酸樹脂(acrylic resin)之材料,實務上,該填充材料G能為一液態材料,該填充材料能填充於各該凹槽402並於各該凹槽402中固化後,再經加工製程使該填補於各該凹槽402中之該填充材料G之外表面S1如圖6所示與該圓錐段401之外壁S2齊平,如此一來,填充於各該凹槽402中之該填充材料G能減少該變幅桿40於高速旋轉下因氣流不穩定所引起的不必要振動及高頻噪音,以進一步提升加工品質並降低環境噪音。The ultrasonic processing device 19 includes a filling material G for filling in each of the
請配合圖3,該超音波加工裝置1包含一拘束件F,設置於該圓錐段401之外周壁,用以封閉各該凹槽402之開口,藉此,該填充材料G能穩固的設置於各該凹槽402中,以避免該填充材料G於該變幅桿40高速旋轉時受離心力影響而被甩離各該凹槽402。進一步說明的是,於本實施例中,該拘束件F為一帶狀碳纖維材料並透過纏繞的方式纏繞於該圓錐段401之外周壁而封閉各該凹槽402之開口以提升該拘束件F與該圓錐段401間的密合度,於其他實施例中,不排除該拘束件F以其他例如套設等其他方式設置於該圓錐段上,除此之外,於本實施例中,該拘束件F主要由碳纖維製成,實務上,該拘束件也可以是由複合材料、非導磁材料或其他例如玻璃、陶瓷、芳綸纖維、碳化矽纖維等材料製成,其中選用複合材料的好處在於,複合材料相較於金屬材料具有更高的結構强度以及良好的抗拉强度及高張力,同時複合材料還具備密度低、比重輕、質量輕等特性,進而能達到利於輕量化設計之效果。Please refer to FIG. 3 , the ultrasonic processing device 1 includes a binding member F, which is arranged on the outer peripheral wall of the
於本實施例中,各該凹槽402是以貫穿該圓錐段401並連通該圓錐段401內部之一容置空間的方式設置,藉此以提升該變幅桿40之扭轉振幅以及軸向與扭轉柔性並提升該刀具50尖端的縱向位移與扭轉位移,若貫穿該圓錐段401之各該凹槽402以直槽形式呈現,能有效提高變幅桿縱向柔性,若貫穿該圓錐段401之各該凹槽402以螺旋槽形式呈現,則能同時提高縱向柔性與扭轉柔性,除此之外,填充於各該凹槽中之填充材料還能有效避免用以移除切屑或是冷卻刀具之切削液體自該容置空間穿過該些凹槽402而洩漏;於其他實施例中,如圖7所示,凹槽也可以是以未貫穿該圓錐段的方式設置,所述凹槽分別自該圓錐段之外壁內凹形成,一樣能透過填充於各該凹槽中之填充材料減少該變幅桿於高速旋轉下因氣流不穩定所引起的不必要振動及高頻噪音。In this embodiment, each of the
如圖4所示,定義該圓錐段401外壁具有複數個力流傳遞路徑R,該些力流傳遞路徑R具有該變幅桿40自該壓電驅動器30傳遞振動至該刀具50的最小距離,其中位於各該力流傳遞路徑R上之凹槽的數量小於或等於一個,也就是說同一條力流傳遞路徑R上只會通過一個凹槽402或者完全沒有通過凹槽402,舉例來說,力流傳遞路徑R1於力流傳遞過程中並未通過任何凹槽,而力流傳遞路徑R2於力流傳遞過程中僅通過一個凹槽,更具體地說,力流傳遞路徑R2與凹槽402只會有一次的相交。如此一來,該變幅桿40不僅能將縱向超音波振動部分轉換為扭轉振動,還能達到將力流於該力流傳遞路徑上傳遞時之不連續性降到最低之效果。As shown in FIG. 4, it is defined that the outer wall of the
請配合圖5及圖6,該些凹槽402分別於該圓錐段401周向間隔設置,且該些凹槽402之數量為四個,於本實施例中,該些凹槽402之數量選用四個是為了使得該變幅桿40之應力均勻分布、扭轉振動更穩定,於其他實施例中,不排除該些凹槽之數量為兩個、三個或是四個以上。於本實施例中,透過選用該些凹槽402之螺旋角θ為30~100˚,螺距p為3~200mm以達成同一條力流傳遞路徑R上只會通過一個凹槽402或者完全沒有通過凹槽402之目的,其中,其中定義L為各該凹槽402之長度L,p為各該凹槽402之螺距p,θ為各該凹槽402之螺旋角θ,各該凹槽402之長度L滿足L=p(θ/360∘)之條件。Please cooperate with Fig. 5 and Fig. 6, these
進一步說明的是,於本實施例中,各該凹槽402之槽寬b為0.2mm~10mm,該圓錐段401於相對的兩端分別具有一最大外徑D及一最小外徑d,各該凹槽402之槽寬b滿足(D-d)/3~(D-d)/4之條件,該些凹槽402之槽深h為0.2mm~10mm,各該凹槽402之槽深h介於各該凹槽402之槽寬b的0.2至5倍之間,透過滿足前述條件,該變幅桿40能將該壓電驅動器30提供之縱向超音波振動部分轉換為扭轉振動,以實現扭轉複合加工之目的,同時又不會減弱該變幅桿40之強度。It is further explained that, in this embodiment, the groove width b of each of the
於本實施例中,該變幅桿40是以表面設置有複數個凹槽402為例說明,實務上,凹槽之數量也可以是一個或是一個以上,舉例來說,該變幅桿41也可以是圖7所示,設置有一個凹槽403,其中,該凹槽403滿足螺旋角θ1介於30~100˚、螺距介於3~20mm、槽寬b1介於0.2~5mm以及槽深h1介於0.2~10mm之條件,透過上述條件,能有效控制將部分縱向超音波振動轉為扭轉振動的比例,進而得到最佳縱扭振動轉換效益。除此之外,於前述實施例中,該些凹槽402以一固定之螺旋角θ、槽深h及槽寬b為例說明,實務上,並不以前述實施例凹槽之螺旋角、槽深及槽寬為一固定值為限,舉例來說,如圖8所示,該凹槽404之螺旋角θ2與相較於螺旋角θ2位於較接近該凹槽末端之螺旋角θ3的夾角角度並不相同,且該凹槽404之槽深h2及槽寬b2分別是以往該凹槽之末端方向逐漸縮小的方式設置。In this embodiment, the
綜上所述,本發明之超音波加工裝置1透過在該變幅桿40上設置凹槽402將部分縱向超音波振動轉為扭轉振動,如此一來,該超音波加工裝置1能使該刀具50產生兼具縱向與扭轉之縱扭複合振動,以改善習用超音波加工裝置單一的縱向振動模式導致軸向衝擊力過大,影響硬脆材料表面加工效果,以及使得刀具所採用的材料受到限制的問題。除此之外,本發明透過填充於凹槽402中之該填充材料G能大幅減少該變幅桿40於高速旋轉下因氣流不穩定所引起的振動及高頻噪音,以達到提升加工品質並降低環境噪音之效果。In summary, the ultrasonic processing device 1 of the present invention converts part of the longitudinal ultrasonic vibration into torsional vibration by providing the
以上所述僅為本發明較佳可行實施例而已,舉凡應用本發明說明書及申請專利範圍所為之等效變化,理應包含在本發明之專利範圍內。The above description is only a preferred feasible embodiment of the present invention, and all equivalent changes made by applying the description of the present invention and the scope of the patent application should be included in the scope of the patent of the present invention.
[本發明]
1:超音波加工裝置
10:刀桿
20:電能傳輸裝置
30:壓電驅動器
40,41,42:變幅桿
50:刀具
32:壓電片
401:圓錐段
402,403,404:凹槽
401a:第一段
401b:第二段
60:筒夾
R,R1,R2:力流傳遞路徑
θ,θ1,θ2,θ3:螺旋角
L:長度
p:螺距
b, b1, b2:槽寬
h, h1, h2:槽深
D:最大外徑
d:最小外徑
G:填充材料
S1:外表面
S2:外壁
F:拘束件
[this invention]
1: Ultrasonic processing device
10: Arbor
20: Power transmission device
30:
圖1本發明一較佳實施例之超音波加工裝置的立體圖。 圖2為本發明上述較佳實施例之超音波加工裝置的側視圖。 圖3為圖2之3-3方向剖視圖。 圖4為本發明上述較佳實施例之力流傳遞路徑的示意圖。 圖5為本發明上述較佳實施例之超音波加工裝置的側視圖。 圖6為圖2之6-6方向剖視圖。 圖7為另一較佳實施例之變幅桿的示意圖。 圖8為另一較佳實施例之變幅桿的示意圖。 Fig. 1 is a perspective view of an ultrasonic processing device in a preferred embodiment of the present invention. Fig. 2 is a side view of the ultrasonic processing device of the above-mentioned preferred embodiment of the present invention. Fig. 3 is a sectional view taken along line 3-3 in Fig. 2 . Fig. 4 is a schematic diagram of the force flow transmission path of the above-mentioned preferred embodiment of the present invention. Fig. 5 is a side view of the ultrasonic processing device of the above-mentioned preferred embodiment of the present invention. Fig. 6 is a sectional view along line 6-6 of Fig. 2 . Fig. 7 is a schematic diagram of another preferred embodiment of the horn. Fig. 8 is a schematic diagram of another preferred embodiment of the horn.
1:超音波加工裝置 1: Ultrasonic processing device
10:刀桿 10: Arbor
20:電能傳輸裝置 20: Power transmission device
40變幅桿 40 Horn
50:刀具 50: Knife
402:凹槽 402: Groove
60:筒夾 60: collet
Claims (17)
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200531750A (en) * | 2004-01-05 | 2005-10-01 | Univ Hong Kong Polytechnic | Driver for an ultrasonic transducer and an ultrasonic transducer |
TW200838063A (en) * | 2006-10-20 | 2008-09-16 | Hesse & Knipps Gmbh | Ultrasonic bonding device |
TW200916244A (en) * | 2007-06-15 | 2009-04-16 | Oerlikon Assembly Equipment Ag Steinhausen | Bond head for a wire bonder |
TW201639327A (en) * | 2015-04-10 | 2016-11-01 | 高通公司 | Method and apparatus for securing structured proximity service codes for restricted discovery |
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2021
- 2021-05-31 TW TW110119674A patent/TWI803877B/en active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200531750A (en) * | 2004-01-05 | 2005-10-01 | Univ Hong Kong Polytechnic | Driver for an ultrasonic transducer and an ultrasonic transducer |
TW200838063A (en) * | 2006-10-20 | 2008-09-16 | Hesse & Knipps Gmbh | Ultrasonic bonding device |
TW200916244A (en) * | 2007-06-15 | 2009-04-16 | Oerlikon Assembly Equipment Ag Steinhausen | Bond head for a wire bonder |
TW201639327A (en) * | 2015-04-10 | 2016-11-01 | 高通公司 | Method and apparatus for securing structured proximity service codes for restricted discovery |
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