WO2008046396A1 - Dispositif de soudage par ultrasons - Google Patents

Dispositif de soudage par ultrasons Download PDF

Info

Publication number
WO2008046396A1
WO2008046396A1 PCT/DE2007/001831 DE2007001831W WO2008046396A1 WO 2008046396 A1 WO2008046396 A1 WO 2008046396A1 DE 2007001831 W DE2007001831 W DE 2007001831W WO 2008046396 A1 WO2008046396 A1 WO 2008046396A1
Authority
WO
WIPO (PCT)
Prior art keywords
transducer
wire
bond
test
force
Prior art date
Application number
PCT/DE2007/001831
Other languages
German (de)
English (en)
Inventor
Hans-Jürgen HESSE
Frank Walther
Original Assignee
Hesse & Knipps Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hesse & Knipps Gmbh filed Critical Hesse & Knipps Gmbh
Publication of WO2008046396A1 publication Critical patent/WO2008046396A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B23K20/106—Features related to sonotrodes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
    • B23K31/12—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to investigating the properties, e.g. the weldability, of materials
    • B23K31/125—Weld quality monitoring
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/02—Details not specific for a particular testing method
    • G01N2203/026—Specifications of the specimen
    • G01N2203/0296—Welds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]

Definitions

  • the present invention relates to an ultrasonic bonder for producing a Drahtbonditati between a wire and a substrate with a bonding head with a bonding tool, which is excitable by a transducer attached thereto to ultrasonic vibrations, and a movable by means of a drive main support means, mounted on the bonding head is, by movement of the main support means and thus of the bonding head transversely to the wire direction in the bonding plane with standing on the welded wire of a manufactured bond bond wedge (wedge) by applying a shearing force a shear test with the compound prepared is performed.
  • Such an ultrasonic bonder is known from EP 1 464 433 A1.
  • the test force is applied to the wire, while the groove in the tip of the ultrasonic tool engages over the wire and / or the bond connection.
  • This has the particular advantage that, after the bond has been established, the ultrasound Sound tool must not first be lifted off the bond and placed next to this again. Also, immediately after making the bond, there is an optimum fit between the ultrasonic tool and the wire or bond.
  • a force can be applied directly orthogonal to the bonding direction in the bonding plane for checking the bond connection.
  • the transducer (transducer) and / or the bonding head are moved transversely to the wire direction.
  • the spring rigidity of the ultrasonic tool automatically results in a force extending transversely to the wire direction, which loads the bond connection and can therefore be used to check the quality.
  • the present invention is therefore based on the object, an ultrasonic bonder of the type described above to create, with which the bond produced hereby can be checked in a particularly precise manner.
  • an ultrasonic bonder of the type specified in that the transducer of the bond head is mounted so as to be vertically movable in a bearing unit, which is connected to the main mounting device via at least one bending zone, that the bending zone is provided with a strain gauge, which measures the actual displacement of the wedge tip and therewith the actual shearing force, and that the ultrasonic bonder has an evaluation device for comparing the measured shearing force with a shearing force characteristic of the strength of the wire bond connection.
  • the converter guide provided according to the invention it is achieved that during the execution of the shear test no rotation of the transducer can occur and the vertical force which occurs is kept substantially constant, so that the test results are not falsified and by the lateral process of the main support means the actual displacement the tool tip and thus the actual shearing force (unaffected by the above-mentioned side effects) can be measured.
  • the measurement is made by detecting the deformation of the bearing unit caused by the lateral movement of the main mounting device, namely at at least one bending zone thereof, wherein the bending zone is provided with at least one strain measuring device.
  • the strain gauge preferably strain gauges, the deformation and from this the shear force is measured.
  • C tot is determined in a separate calibration route.
  • the measured shearing force is compared with a shearing force characteristic of the strength of the wire bond.
  • the bond is ideally fixed, i. there is no shearing happening.
  • the wire is sheared off completely, with the strain gauge outputting a voltage signal of 0 V.
  • the bondhead is then free of forces again and offset by the distance .DELTA.x in the direction of movement.
  • the bearing unit for the converter is preferably connected to the main mounting device via two bending zones, wherein the deformation measurement (strain measurement) takes place at both bending zones.
  • the torsion-free vertically movably guided bearing of the transducer of the bonding head in the bearing unit is preferably realized via a suspension system.
  • This is in particular a double suspension system, which is structurally realized, for example, so that the converter is mounted by means of lower and upper wishbones articulated to two longitudinal struts, which in turn via upper and lower wishbones are hinged to the storage unit.
  • a torsionally stiff suspension is achieved, which compensates for torsion effects, so that the shear test can be carried out without side effects, which lead to a falsification of the results.
  • the ultrasonic bonder is provided with means for performing a pull test.
  • the ultrasonic bonder has both means for performing a shear test and
  • Means for performing a pull test In the pull test, the wire of the bond is subjected to a tensile force to check the strength of the joint in this way.
  • the means for carrying out the pull test include a wire clamping device, a device for pulling the bonding head with wire clamping device upwards and a device for measuring the relative movement between the main holding device and the bonding head attachment.
  • a preset force is applied through the puller after the wire is clamped.
  • the effect of the applied tensile force is measured by the measuring device, by determining the relative movement between the bonding head attachment and the main support means.
  • the pulling device is expediently formed by the Z-axis drive of the main mounting device.
  • the device for measuring the relative movement preferably has a measuring element arranged on the transducer, whose relative movement to the bearing unit of the transducer is measured.
  • FIG. 1 shows a schematic vertical section through the mounting of a transducer of an ultrasonic baffle without transverse force application
  • Figure 2 is a vertical section corresponding to Figure 1 after application of a transverse force to perform a shear test
  • FIG. 3 shows a schematic vertical section through the suspension of the transducer of Figures 1 and 2.
  • the invention relates to an ultrasonic bonder, as described and illustrated, for example, in DE 40 16 720 B4.
  • an ultrasonic bonder as described and illustrated, for example, in DE 40 16 720 B4.
  • the general characteristics of such an ultrasonic bonder are not explained in detail. These are familiar to the person skilled in the art, for example, from the publication mentioned above.
  • Figure 1 shows schematically the main support means 1 of the ultrasonic bonder, can be carried out by means of the movements in the x, y, z and in the direction of rotation.
  • Main mounting device 1 has a box-shaped bearing unit 2 for the transducer 5 of the bonding head, said bearing unit 2 is connected via two bending zones 3 with the remaining part of the main support means 1.
  • the transducer 5 (transducer) of the bonding head is mounted torsion-free guided vertically movable.
  • the vertical guide 18 is indicated only schematically. An example of this is shown in detail in FIG.
  • the bonding tool 7 is arranged on the wire 8 to be wound on a substrate 10 and, due to the wedge shape, is guided through the wire 8 after the bond connection has been established. prevented from moving transversely to the wire direction in the bonding plane.
  • FIG. 1 shows a measuring element 11 fastened to the transducer 5, which extends through the bearing unit 2 and serves for measuring the relative movement between the transducer 5 and the bearing unit 2 or the main mounting device 1 during a pull test. This will be discussed later.
  • Figure 2 shows the arrangement of Figure 1 after the implementation of the main support means 1 in the transverse direction over the distance .DELTA.x. While in FIG. 1 the wedge 9 of the bonding tool is perpendicular to the welded wire 8, since no force is exerted in the horizontal direction, in a lateral movement of the main support device 1, as shown by the arrow shown in FIG shown arrangement, since the bonding tool 7 can not move freely due to the support on the wire 8.
  • the illustrated guide 18 of the transducer 5 tilt-free vertical guide
  • no rotation of the transducer 5 is allowed, also kept the vertical force constant. In this way the above mentioned, the measurement result falsifying side effects are turned off.
  • FIG 3 shows schematically a double suspension system of the converter 5 for realizing the above-mentioned converter guide.
  • the bearing unit 2 for the converter is shown here only schematically. It can be seen that the transducer 5 is articulated to two vertical struts 12 via two upper links 13 and two lower links 14, which in turn are articulated to the bearing unit 2 via two upper links 15 and two lower links 16.
  • the rotational movements of the transducer 5 caused by the transverse forces acting on it are compensated, so that during a transverse movement of the main mounting device exactly the reaction force exerted by the wire 8 on the bonding tool 7 is detected.
  • the ultrasonic bonder described and illustrated herein is further provided with means for performing a pull test so that both a shear test as described above and a pull test may be performed to detect all possible defect images of the bond.
  • the means for performing the pull test include a wire clamp, means for pulling up the bond head with wire clamp up, and means for measuring the relative movement between the main support and the bond head fixture.
  • Figures 1 and 2 show that the transducer 5 of the bonding head is provided with a measuring element 11 which extends laterally of the bearing unit 2 out. The shift This measuring element 11 relative to the bearing unit, as indicated at 17, is measured, wherein the measured displacement is evaluated as a measure of the quality of the bond.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Quality & Reliability (AREA)
  • Wire Bonding (AREA)
  • Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
  • Force Measurement Appropriate To Specific Purposes (AREA)

Abstract

L'invention concerne un dispositif de soudage par ultrasons. L'objectif de cette invention est de réaliser un essai de cisaillement, si possible sans générer d'effets indésirables, sur une soudure crééé au moyen du dispositif de soudage par ultrasons. A cet effet, le transducteur (5) de la tête de soudage peut être déplacé verticalement sans torsion. Ladite tête de soudage est montée dans une unité de palier (2) qui est reliée à un dispositif de maintien principal (1) du dispositif de soudage par ultrasons par l'intermédiaire d'au moins une zone de flexion (3). Lorsqu'une force de vérification (force transversale) est appliquée, la déformation de la zone de flexion est mesurée par un dispositif de mesure d'allongement (4). La force de cisaillement mesurée est comparée avec une force de cisaillement qui est caractéristique de la stabilité de la soudure du fil, en vue de déterminer la qualité de cette soudure. Le dispositif de soudage par ultrasons selon l'invention peut en outre comporter des moyens servant à effectuer un essai de traction.
PCT/DE2007/001831 2006-10-20 2007-10-16 Dispositif de soudage par ultrasons WO2008046396A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102006049624.8 2006-10-20
DE102006049624.8A DE102006049624B4 (de) 2006-10-20 2006-10-20 Ultraschallbonder

Publications (1)

Publication Number Publication Date
WO2008046396A1 true WO2008046396A1 (fr) 2008-04-24

Family

ID=38983563

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2007/001831 WO2008046396A1 (fr) 2006-10-20 2007-10-16 Dispositif de soudage par ultrasons

Country Status (3)

Country Link
DE (1) DE102006049624B4 (fr)
TW (1) TWI377749B (fr)
WO (1) WO2008046396A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8129220B2 (en) 2009-08-24 2012-03-06 Hong Kong Polytechnic University Method and system for bonding electrical devices using an electrically conductive adhesive

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103730390A (zh) * 2012-10-15 2014-04-16 飞思卡尔半导体公司 引线接合机以及测试引线接合连接的方法
DE102016102164A1 (de) 2016-02-08 2017-08-10 Ms Ultraschall Technologie Gmbh Ultraschall-Bearbeitungsmaschine
DE102016214227B3 (de) * 2016-08-02 2017-12-07 Schunk Sonosystems Gmbh Vorrichtung und Verfahren zur Herstellung einer geprüften Schweißverbindung
CN115356205B (zh) * 2022-07-27 2024-04-09 苏州信息职业技术学院 半导体芯片的打线质量测试系统与测试方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3890831A (en) * 1973-01-19 1975-06-24 Us Navy Ultrasonic bond monitor
EP0275877A2 (fr) * 1987-01-21 1988-07-27 Siemens Aktiengesellschaft Contrôle des paramètres de jonction pendant la fixation des fils de connexion
US5591920A (en) * 1995-11-17 1997-01-07 Kulicke And Soffa Investments, Inc. Diagnostic wire bond pull tester
US6341530B1 (en) * 1999-05-06 2002-01-29 D{Dot Over (A)}Ge Precision Industries, Ltd. Apparatus and method for shear testing bonds of electrical connections
US6564115B1 (en) * 2000-02-01 2003-05-13 Texas Instruments Incorporated Combined system, method and apparatus for wire bonding and testing
EP1333263A1 (fr) * 2002-02-01 2003-08-06 F & K Delvotec Bondtechnik GmbH Dispositif d'essais en tirage de connections
EP1464433A1 (fr) * 2003-04-04 2004-10-06 Hesse & Knipps GmbH Procédé et dispositif de test pour des connexions de fils
US20040256438A1 (en) * 2003-06-18 2004-12-23 Esec Trading Sa Method for checking the quality of a wedge bond

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3890831A (en) * 1973-01-19 1975-06-24 Us Navy Ultrasonic bond monitor
EP0275877A2 (fr) * 1987-01-21 1988-07-27 Siemens Aktiengesellschaft Contrôle des paramètres de jonction pendant la fixation des fils de connexion
US5591920A (en) * 1995-11-17 1997-01-07 Kulicke And Soffa Investments, Inc. Diagnostic wire bond pull tester
US6341530B1 (en) * 1999-05-06 2002-01-29 D{Dot Over (A)}Ge Precision Industries, Ltd. Apparatus and method for shear testing bonds of electrical connections
US6564115B1 (en) * 2000-02-01 2003-05-13 Texas Instruments Incorporated Combined system, method and apparatus for wire bonding and testing
EP1333263A1 (fr) * 2002-02-01 2003-08-06 F & K Delvotec Bondtechnik GmbH Dispositif d'essais en tirage de connections
EP1464433A1 (fr) * 2003-04-04 2004-10-06 Hesse & Knipps GmbH Procédé et dispositif de test pour des connexions de fils
US20040256438A1 (en) * 2003-06-18 2004-12-23 Esec Trading Sa Method for checking the quality of a wedge bond

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8129220B2 (en) 2009-08-24 2012-03-06 Hong Kong Polytechnic University Method and system for bonding electrical devices using an electrically conductive adhesive
US8833418B2 (en) 2009-08-24 2014-09-16 The Hong Kong Polytechnic University Method and system for bonding electrical devices using an electrically conductive adhesive

Also Published As

Publication number Publication date
DE102006049624B4 (de) 2016-07-14
DE102006049624A1 (de) 2008-04-24
TWI377749B (en) 2012-11-21
TW200838062A (en) 2008-09-16

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