WO2008043352A3 - Optoelektronisches modul und verfahren zur herstellung eines optoelektronischen moduls - Google Patents

Optoelektronisches modul und verfahren zur herstellung eines optoelektronischen moduls Download PDF

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Publication number
WO2008043352A3
WO2008043352A3 PCT/DE2007/001818 DE2007001818W WO2008043352A3 WO 2008043352 A3 WO2008043352 A3 WO 2008043352A3 DE 2007001818 W DE2007001818 W DE 2007001818W WO 2008043352 A3 WO2008043352 A3 WO 2008043352A3
Authority
WO
WIPO (PCT)
Prior art keywords
optoelectronic module
production
optoelectronic
disclosed
connecting support
Prior art date
Application number
PCT/DE2007/001818
Other languages
English (en)
French (fr)
Other versions
WO2008043352A2 (de
Inventor
Udo Custodis
Werner Schmidts
Gert Wemmer
Hubert Ott
Mario Wanninger
Original Assignee
Osram Gmbh
Udo Custodis
Werner Schmidts
Gert Wemmer
Hubert Ott
Mario Wanninger
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Gmbh, Udo Custodis, Werner Schmidts, Gert Wemmer, Hubert Ott, Mario Wanninger filed Critical Osram Gmbh
Publication of WO2008043352A2 publication Critical patent/WO2008043352A2/de
Publication of WO2008043352A3 publication Critical patent/WO2008043352A3/de

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Led Device Packages (AREA)

Abstract

Es wird ein optoelektronisches Modul (1) mit einer Strahlungsaustrittsfläche (10) angegeben, das einen Anschlussträger (3) mit einer Montagefläche (30) und eine Mehrzahl von optoelektronischen Komponenten (2) aufweist, wobei die optoelektronischen Komponenten (2) voneinander beabstandet auf der Montagefläche (30) befestigt sind und wobei die optoelektronischen Komponenten (2) mittels einer Umhüllung (4), die zumindest bereichsweise zwischen dem Anschlussträger (3) und der Strahlungsaustrittsfläche (10) ausgebildet ist, verkapselt sind. Weiterhin wird ein Verfahren zur Herstellung eines optoelektronischen Moduls (1) angegeben.
PCT/DE2007/001818 2006-10-13 2007-10-11 Optoelektronisches modul und verfahren zur herstellung eines optoelektronischen moduls WO2008043352A2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102006048592A DE102006048592A1 (de) 2006-10-13 2006-10-13 Optoelektronisches Modul und Verfahren zur Herstellung eines optoelektronischen Moduls
DE102006048592.0 2006-10-13

Publications (2)

Publication Number Publication Date
WO2008043352A2 WO2008043352A2 (de) 2008-04-17
WO2008043352A3 true WO2008043352A3 (de) 2008-12-04

Family

ID=39156342

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2007/001818 WO2008043352A2 (de) 2006-10-13 2007-10-11 Optoelektronisches modul und verfahren zur herstellung eines optoelektronischen moduls

Country Status (2)

Country Link
DE (1) DE102006048592A1 (de)
WO (1) WO2008043352A2 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008114657A1 (ja) * 2007-03-16 2008-09-25 Omron Corporation 光伝送路パッケージ、光伝送モジュール、電子機器、および、光伝送モジュールの製造方法
EP2190945B1 (de) 2007-09-28 2012-02-29 OSRAM Opto Semiconductors GmbH Organisches strahlungsemittierendes bauteil
DE102009039982A1 (de) * 2009-09-03 2011-03-10 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauelement und Verfahren zum Herstellen eines optoelektronischen Halbleiterbauelements
DE102011112710A1 (de) * 2011-09-07 2013-03-07 Osram Ag Beleuchtungsvorrichtung
DE102011085645B4 (de) 2011-11-03 2014-06-26 Osram Gmbh Leuchtdiodenmodul und Verfahren zum Betreiben eines Leuchtdiodenmoduls
DE102012107829B4 (de) 2012-08-24 2024-01-25 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronische Bauelemente und Verfahren zur Herstellung eines optoelektronischen Bauelements
DE102016104546A1 (de) * 2016-03-11 2017-09-14 Siteco Beleuchtungstechnik Gmbh LED-Modul mit Silikonlinse
DE102016125909A1 (de) * 2016-12-30 2018-07-05 Osram Opto Semiconductors Gmbh Bauteil und Anschlussträger

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0684648A2 (de) * 1994-05-24 1995-11-29 Sharp Kabushiki Kaisha Herstellungsverfahren für eine Halbleitervorrichtung
WO2005091387A1 (ja) * 2004-03-24 2005-09-29 Toshiba Lighting & Technology Corporation 発光装置および照明装置
WO2005093862A2 (en) * 2004-03-26 2005-10-06 Matsushita Electric Industrial Co., Ltd. Led mounting module, led module, manufacturing method of led mounting module, and manufacturing method of led module
US20050274973A1 (en) * 2004-02-26 2005-12-15 Matsushita Electric Industrial Co., Ltd. LED lamp
WO2006054616A1 (en) * 2004-11-22 2006-05-26 Matsushita Electric Industrial Co., Ltd. Light-emitting device, light-emitting module, display unit, lighting unit and method for manufacturing light-emitting device
CN2814677Y (zh) * 2005-06-03 2006-09-06 明达光电(厦门)有限公司 带凹槽式基板的发光二极管
EP1710846A1 (de) * 2005-04-08 2006-10-11 Sharp Kabushiki Kaisha Leuchtdiode
WO2007011068A1 (en) * 2005-07-22 2007-01-25 Showa Denko K.K. Light-emitting diode light source

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7659547B2 (en) * 2002-05-22 2010-02-09 Phoseon Technology, Inc. LED array
TWI220076B (en) * 2003-08-27 2004-08-01 Au Optronics Corp Light-emitting device
TWI255566B (en) * 2005-03-04 2006-05-21 Jemitek Electronics Corp Led
EP1861876A1 (de) * 2005-03-24 2007-12-05 Tir Systems Ltd. Halbleiter-beleuchtungseinrichtungs-gehäuse

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0684648A2 (de) * 1994-05-24 1995-11-29 Sharp Kabushiki Kaisha Herstellungsverfahren für eine Halbleitervorrichtung
US20050274973A1 (en) * 2004-02-26 2005-12-15 Matsushita Electric Industrial Co., Ltd. LED lamp
WO2005091387A1 (ja) * 2004-03-24 2005-09-29 Toshiba Lighting & Technology Corporation 発光装置および照明装置
EP1737050A1 (de) * 2004-03-24 2006-12-27 Toshiba Lighting & Technology Corporation Lichtquelle und beleuchtungseinrichtung
WO2005093862A2 (en) * 2004-03-26 2005-10-06 Matsushita Electric Industrial Co., Ltd. Led mounting module, led module, manufacturing method of led mounting module, and manufacturing method of led module
WO2006054616A1 (en) * 2004-11-22 2006-05-26 Matsushita Electric Industrial Co., Ltd. Light-emitting device, light-emitting module, display unit, lighting unit and method for manufacturing light-emitting device
EP1710846A1 (de) * 2005-04-08 2006-10-11 Sharp Kabushiki Kaisha Leuchtdiode
CN2814677Y (zh) * 2005-06-03 2006-09-06 明达光电(厦门)有限公司 带凹槽式基板的发光二极管
WO2006132795A2 (en) * 2005-06-03 2006-12-14 Intex Recreation Corp. A light-emitting device module with a substrate and methods of forming it
WO2007011068A1 (en) * 2005-07-22 2007-01-25 Showa Denko K.K. Light-emitting diode light source

Also Published As

Publication number Publication date
DE102006048592A1 (de) 2008-04-17
WO2008043352A2 (de) 2008-04-17

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