WO2008035324A3 - Apparatus for fluid treatment - Google Patents

Apparatus for fluid treatment Download PDF

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Publication number
WO2008035324A3
WO2008035324A3 PCT/IL2006/001094 IL2006001094W WO2008035324A3 WO 2008035324 A3 WO2008035324 A3 WO 2008035324A3 IL 2006001094 W IL2006001094 W IL 2006001094W WO 2008035324 A3 WO2008035324 A3 WO 2008035324A3
Authority
WO
Grant status
Application
Patent type
Prior art keywords
fluid
plurality
pressure
contact
object
Prior art date
Application number
PCT/IL2006/001094
Other languages
French (fr)
Other versions
WO2008035324A2 (en )
Inventor
Yuval Yassour
Original Assignee
Coreflow Scient Solutions Ltd
Yuval Yassour
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04Cleaning involving contact with liquid
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B11/00Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
    • B08B11/02Devices for holding articles during cleaning
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67063Apparatus for fluid treatment for etching
    • H01L21/67075Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles

Abstract

A non-contact support apparatus for fluid treatment of a stationary or traveling object while supporting the object without contact by fluid- cushion induced forces. The apparatus comprises substantially opposite non-contact platforms having support surfaces, each support surface comprising a plurality of basic cells each cell having a plurality of pressure outlets and a plurality of fluid-evacuation channels. Each of the pressure outlets is fluidically connected through a flow restrictor to a high-pressure fluid supply, the pressure outlets providing pressurized fluid for generating pressure induced forces, maintaining a fluid-cushion between the object and the support surface of the platform The flow restrictor characteristically exhibits fluidic return spring behavior. Each of the plurality of fluid- evacuation channels has an inlet and outlet, for locally balancing mass flow for a plurality of basic cells.
PCT/IL2006/001094 2006-09-19 2006-09-19 Apparatus for fluid treatment WO2008035324A3 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/IL2006/001094 WO2008035324A3 (en) 2006-09-19 2006-09-19 Apparatus for fluid treatment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/IL2006/001094 WO2008035324A3 (en) 2006-09-19 2006-09-19 Apparatus for fluid treatment

Publications (2)

Publication Number Publication Date
WO2008035324A2 true WO2008035324A2 (en) 2008-03-27
WO2008035324A3 true true WO2008035324A3 (en) 2009-04-09

Family

ID=39200948

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IL2006/001094 WO2008035324A3 (en) 2006-09-19 2006-09-19 Apparatus for fluid treatment

Country Status (1)

Country Link
WO (1) WO2008035324A3 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010024263A1 (en) * 2010-06-18 2011-12-22 Festo Ag & Co. Kg Air storage facility

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3251139A (en) * 1965-03-10 1966-05-17 Us Dynamics Mfg Corp Dynamic insulating systems
US3599851A (en) * 1970-05-08 1971-08-17 Buckbee Mears Co Hydrodynamic turnover mechanisms
US5317778A (en) * 1991-07-31 1994-06-07 Shin-Etsu Handotai Co., Ltd. Automatic cleaning apparatus for wafers
US20010038783A1 (en) * 2000-04-17 2001-11-08 Hitachi Kokusai Electric Inc. Dual loading port semiconductor processing equipment
US20030102015A1 (en) * 1998-01-09 2003-06-05 Halbmaier David L. Wafer container washing apparatus
US20050126605A1 (en) * 2003-12-15 2005-06-16 Coreflow Scientific Solutions Ltd. Apparatus and method for cleaning surfaces
US20050195381A1 (en) * 2004-03-04 2005-09-08 Asml Netherlands B.V. Moveable object carrier, lithographic apparatus comprising the moveable object carrier and device manufacturing method
US20060050262A1 (en) * 2004-09-09 2006-03-09 Nikon Corporation Non-contact pneumatic transfer for stages with small motion
US20060054774A1 (en) * 2001-12-27 2006-03-16 Yuval Yassour High-performance non-contact support platforms

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3251139A (en) * 1965-03-10 1966-05-17 Us Dynamics Mfg Corp Dynamic insulating systems
US3599851A (en) * 1970-05-08 1971-08-17 Buckbee Mears Co Hydrodynamic turnover mechanisms
US5317778A (en) * 1991-07-31 1994-06-07 Shin-Etsu Handotai Co., Ltd. Automatic cleaning apparatus for wafers
US20030102015A1 (en) * 1998-01-09 2003-06-05 Halbmaier David L. Wafer container washing apparatus
US20010038783A1 (en) * 2000-04-17 2001-11-08 Hitachi Kokusai Electric Inc. Dual loading port semiconductor processing equipment
US20060054774A1 (en) * 2001-12-27 2006-03-16 Yuval Yassour High-performance non-contact support platforms
US20050126605A1 (en) * 2003-12-15 2005-06-16 Coreflow Scientific Solutions Ltd. Apparatus and method for cleaning surfaces
US20050195381A1 (en) * 2004-03-04 2005-09-08 Asml Netherlands B.V. Moveable object carrier, lithographic apparatus comprising the moveable object carrier and device manufacturing method
US20060050262A1 (en) * 2004-09-09 2006-03-09 Nikon Corporation Non-contact pneumatic transfer for stages with small motion

Also Published As

Publication number Publication date Type
WO2008035324A2 (en) 2008-03-27 application

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