WO2008023288A3 - An apparatus for and method of polishing a semiconductor wafer using chemical mechanical planarization - Google Patents

An apparatus for and method of polishing a semiconductor wafer using chemical mechanical planarization Download PDF

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Publication number
WO2008023288A3
WO2008023288A3 PCT/IB2007/051402 IB2007051402W WO2008023288A3 WO 2008023288 A3 WO2008023288 A3 WO 2008023288A3 IB 2007051402 W IB2007051402 W IB 2007051402W WO 2008023288 A3 WO2008023288 A3 WO 2008023288A3
Authority
WO
WIPO (PCT)
Prior art keywords
polishing
semiconductor wafer
conical body
chemical mechanical
mechanical planarization
Prior art date
Application number
PCT/IB2007/051402
Other languages
French (fr)
Other versions
WO2008023288A8 (en
WO2008023288A2 (en
Inventor
Eoin O'dea
Original Assignee
Eoin O'dea
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from IES20060298 external-priority patent/IES20060298A2/en
Application filed by Eoin O'dea filed Critical Eoin O'dea
Publication of WO2008023288A2 publication Critical patent/WO2008023288A2/en
Publication of WO2008023288A8 publication Critical patent/WO2008023288A8/en
Publication of WO2008023288A3 publication Critical patent/WO2008023288A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/12—Lapping plates for working plane surfaces
    • B24B37/16—Lapping plates for working plane surfaces characterised by the shape of the lapping plate surface, e.g. grooved

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

An apparatus (40) for polishing a substrate surface such as a semiconductor wafer or the like by Chemical Mechanical Planarization (CMP) comprises a rotatable wafer platen (41) which is held against a conical body (43) having a polishing pad (42) which contacts the wafer along tangential length of the curved surface of the conical body (43 ). The polishing pad(42) is optionally a belt tensioned over the conical body (43) or a conical pad (42) securely mounted to the conical body (43). The apparatus includes a housing or process vessel (50) to encapsulate substantially the process interface region, particulary where a chemical slurry is used in the polishing media. A method of polishing a substrate, such as a semiconductor wafer, is also disclosed. The method optionally includes immersion of the process interface in polishing media. a
PCT/IB2007/051402 2006-04-18 2007-04-19 An apparatus for and method of polishing a semiconductor wafer using chemical mechanical planarization WO2008023288A2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
IES2006/0298 2006-04-18
IES20060298 IES20060298A2 (en) 2006-04-18 2006-04-18 An apparatus for and method of polishing a semiconductor wafer using chemical mechanical planarization
GB0606088.0 2006-05-04
GB0608800A GB2437264A (en) 2006-04-18 2006-05-04 Polishing a substrate surface

Publications (3)

Publication Number Publication Date
WO2008023288A2 WO2008023288A2 (en) 2008-02-28
WO2008023288A8 WO2008023288A8 (en) 2008-11-27
WO2008023288A3 true WO2008023288A3 (en) 2009-06-18

Family

ID=39110408

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2007/051402 WO2008023288A2 (en) 2006-04-18 2007-04-19 An apparatus for and method of polishing a semiconductor wafer using chemical mechanical planarization

Country Status (1)

Country Link
WO (1) WO2008023288A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105563296A (en) * 2016-02-26 2016-05-11 四川德恩精工科技股份有限公司 Metal hand wheel polishing device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5688360A (en) * 1995-05-17 1997-11-18 National Semiconductor Corporation Method and apparatus for polishing a semiconductor substrate wafer
JPH1015810A (en) * 1996-07-04 1998-01-20 Canon Inc Chemical-mechanical polishing method and its device
JP2003173992A (en) * 2001-12-05 2003-06-20 Hitachi Ltd Chemical mechanical polisher

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5688360A (en) * 1995-05-17 1997-11-18 National Semiconductor Corporation Method and apparatus for polishing a semiconductor substrate wafer
JPH1015810A (en) * 1996-07-04 1998-01-20 Canon Inc Chemical-mechanical polishing method and its device
JP2003173992A (en) * 2001-12-05 2003-06-20 Hitachi Ltd Chemical mechanical polisher

Also Published As

Publication number Publication date
WO2008023288A8 (en) 2008-11-27
WO2008023288A2 (en) 2008-02-28

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