WO2008018682A1 - composition de pâte pour couche diélectrique d'écran d'affichage plasma, écran d'affichage plasma utilisant la composition de pâte, et son procédé de fabrication - Google Patents
composition de pâte pour couche diélectrique d'écran d'affichage plasma, écran d'affichage plasma utilisant la composition de pâte, et son procédé de fabrication Download PDFInfo
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- WO2008018682A1 WO2008018682A1 PCT/KR2007/002817 KR2007002817W WO2008018682A1 WO 2008018682 A1 WO2008018682 A1 WO 2008018682A1 KR 2007002817 W KR2007002817 W KR 2007002817W WO 2008018682 A1 WO2008018682 A1 WO 2008018682A1
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- paste composition
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- 239000000203 mixture Substances 0.000 title claims abstract description 68
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- 239000000758 substrate Substances 0.000 claims abstract description 33
- 239000000178 monomer Substances 0.000 claims abstract description 28
- 239000011521 glass Substances 0.000 claims abstract description 23
- 239000003999 initiator Substances 0.000 claims abstract description 20
- 239000000843 powder Substances 0.000 claims abstract description 18
- 230000004888 barrier function Effects 0.000 claims abstract description 13
- 239000000945 filler Substances 0.000 claims abstract description 11
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 16
- -1 acryl Chemical group 0.000 claims description 14
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 8
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 8
- 150000002923 oximes Chemical class 0.000 claims description 8
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 8
- 239000011787 zinc oxide Substances 0.000 claims description 8
- 239000000395 magnesium oxide Substances 0.000 claims description 7
- NIXOWILDQLNWCW-UHFFFAOYSA-M acrylate group Chemical group C(C=C)(=O)[O-] NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 6
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 claims description 6
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 claims description 6
- 239000012965 benzophenone Substances 0.000 claims description 6
- 238000005245 sintering Methods 0.000 claims description 6
- 239000003795 chemical substances by application Substances 0.000 claims description 5
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 5
- INQDDHNZXOAFFD-UHFFFAOYSA-N 2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOC(=O)C=C INQDDHNZXOAFFD-UHFFFAOYSA-N 0.000 claims description 4
- KUDUQBURMYMBIJ-UHFFFAOYSA-N 2-prop-2-enoyloxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC(=O)C=C KUDUQBURMYMBIJ-UHFFFAOYSA-N 0.000 claims description 4
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 claims description 4
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 claims description 4
- GUUVPOWQJOLRAS-UHFFFAOYSA-N Diphenyl disulfide Chemical compound C=1C=CC=CC=1SSC1=CC=CC=C1 GUUVPOWQJOLRAS-UHFFFAOYSA-N 0.000 claims description 4
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 claims description 4
- SMWDFEZZVXVKRB-UHFFFAOYSA-N Quinoline Chemical compound N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 claims description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 4
- 229910000416 bismuth oxide Inorganic materials 0.000 claims description 4
- 229910052810 boron oxide Inorganic materials 0.000 claims description 4
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 claims description 4
- 239000000292 calcium oxide Substances 0.000 claims description 4
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims description 4
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 claims description 4
- 125000004386 diacrylate group Chemical group 0.000 claims description 4
- TYIXMATWDRGMPF-UHFFFAOYSA-N dibismuth;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Bi+3].[Bi+3] TYIXMATWDRGMPF-UHFFFAOYSA-N 0.000 claims description 4
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 claims description 4
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 claims description 4
- 229910000464 lead oxide Inorganic materials 0.000 claims description 4
- CERQOIWHTDAKMF-UHFFFAOYSA-M methacrylate group Chemical group C(C(=C)C)(=O)[O-] CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 claims description 4
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 4
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims description 4
- 239000000377 silicon dioxide Substances 0.000 claims description 4
- 235000012239 silicon dioxide Nutrition 0.000 claims description 4
- 150000003440 styrenes Chemical class 0.000 claims description 4
- HJUGFYREWKUQJT-UHFFFAOYSA-N tetrabromomethane Chemical compound BrC(Br)(Br)Br HJUGFYREWKUQJT-UHFFFAOYSA-N 0.000 claims description 4
- 229910001928 zirconium oxide Inorganic materials 0.000 claims description 4
- RZVINYQDSSQUKO-UHFFFAOYSA-N 2-phenoxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC1=CC=CC=C1 RZVINYQDSSQUKO-UHFFFAOYSA-N 0.000 claims description 3
- CNGTXGHYZBQUQS-UHFFFAOYSA-N ((1-(2-methoxyethoxy)ethoxy)methyl)benzene Chemical compound COCCOC(C)OCC1=CC=CC=C1 CNGTXGHYZBQUQS-UHFFFAOYSA-N 0.000 claims description 2
- LGPAKRMZNPYPMG-UHFFFAOYSA-N (3-hydroxy-2-prop-2-enoyloxypropyl) prop-2-enoate Chemical compound C=CC(=O)OC(CO)COC(=O)C=C LGPAKRMZNPYPMG-UHFFFAOYSA-N 0.000 claims description 2
- OKJAFMLILOEHQK-UHFFFAOYSA-N 1,1,1-tri(prop-2-enoyloxy)propan-2-yl prop-2-enoate Chemical compound C(C=C)(=O)OC(C(C)OC(C=C)=O)(OC(C=C)=O)OC(C=C)=O OKJAFMLILOEHQK-UHFFFAOYSA-N 0.000 claims description 2
- SCEFCWXRXJZWHE-UHFFFAOYSA-N 1,2,3-tribromo-4-(2,3,4-tribromophenyl)sulfonylbenzene Chemical compound BrC1=C(Br)C(Br)=CC=C1S(=O)(=O)C1=CC=C(Br)C(Br)=C1Br SCEFCWXRXJZWHE-UHFFFAOYSA-N 0.000 claims description 2
- NVZWEEGUWXZOKI-UHFFFAOYSA-N 1-ethenyl-2-methylbenzene Chemical compound CC1=CC=CC=C1C=C NVZWEEGUWXZOKI-UHFFFAOYSA-N 0.000 claims description 2
- JZHGRUMIRATHIU-UHFFFAOYSA-N 1-ethenyl-3-methylbenzene Chemical compound CC1=CC=CC(C=C)=C1 JZHGRUMIRATHIU-UHFFFAOYSA-N 0.000 claims description 2
- UVHXEHGUEKARKZ-UHFFFAOYSA-N 1-ethenylanthracene Chemical compound C1=CC=C2C=C3C(C=C)=CC=CC3=CC2=C1 UVHXEHGUEKARKZ-UHFFFAOYSA-N 0.000 claims description 2
- LMAUULKNZLEMGN-UHFFFAOYSA-N 1-ethyl-3,5-dimethylbenzene Chemical compound CCC1=CC(C)=CC(C)=C1 LMAUULKNZLEMGN-UHFFFAOYSA-N 0.000 claims description 2
- IGGDKDTUCAWDAN-UHFFFAOYSA-N 1-vinylnaphthalene Chemical compound C1=CC=C2C(C=C)=CC=CC2=C1 IGGDKDTUCAWDAN-UHFFFAOYSA-N 0.000 claims description 2
- SFSLTRCPISPSKB-UHFFFAOYSA-N 10-methylideneanthracen-9-one Chemical compound C1=CC=C2C(=C)C3=CC=CC=C3C(=O)C2=C1 SFSLTRCPISPSKB-UHFFFAOYSA-N 0.000 claims description 2
- VBHXIMACZBQHPX-UHFFFAOYSA-N 2,2,2-trifluoroethyl prop-2-enoate Chemical compound FC(F)(F)COC(=O)C=C VBHXIMACZBQHPX-UHFFFAOYSA-N 0.000 claims description 2
- PIZHFBODNLEQBL-UHFFFAOYSA-N 2,2-diethoxy-1-phenylethanone Chemical compound CCOC(OCC)C(=O)C1=CC=CC=C1 PIZHFBODNLEQBL-UHFFFAOYSA-N 0.000 claims description 2
- OWPUOLBODXJOKH-UHFFFAOYSA-N 2,3-dihydroxypropyl prop-2-enoate Chemical compound OCC(O)COC(=O)C=C OWPUOLBODXJOKH-UHFFFAOYSA-N 0.000 claims description 2
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 claims description 2
- UGIJCMNGQCUTPI-UHFFFAOYSA-N 2-aminoethyl prop-2-enoate Chemical compound NCCOC(=O)C=C UGIJCMNGQCUTPI-UHFFFAOYSA-N 0.000 claims description 2
- FGTYTUFKXYPTML-UHFFFAOYSA-N 2-benzoylbenzoic acid Chemical compound OC(=O)C1=CC=CC=C1C(=O)C1=CC=CC=C1 FGTYTUFKXYPTML-UHFFFAOYSA-N 0.000 claims description 2
- PTJDGKYFJYEAOK-UHFFFAOYSA-N 2-butoxyethyl prop-2-enoate Chemical compound CCCCOCCOC(=O)C=C PTJDGKYFJYEAOK-UHFFFAOYSA-N 0.000 claims description 2
- ZCDADJXRUCOCJE-UHFFFAOYSA-N 2-chlorothioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(Cl)=CC=C3SC2=C1 ZCDADJXRUCOCJE-UHFFFAOYSA-N 0.000 claims description 2
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 claims description 2
- 229940095095 2-hydroxyethyl acrylate Drugs 0.000 claims description 2
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 claims description 2
- GWZMWHWAWHPNHN-UHFFFAOYSA-N 2-hydroxypropyl prop-2-enoate Chemical compound CC(O)COC(=O)C=C GWZMWHWAWHPNHN-UHFFFAOYSA-N 0.000 claims description 2
- HFCUBKYHMMPGBY-UHFFFAOYSA-N 2-methoxyethyl prop-2-enoate Chemical compound COCCOC(=O)C=C HFCUBKYHMMPGBY-UHFFFAOYSA-N 0.000 claims description 2
- CFVWNXQPGQOHRJ-UHFFFAOYSA-N 2-methylpropyl prop-2-enoate Chemical compound CC(C)COC(=O)C=C CFVWNXQPGQOHRJ-UHFFFAOYSA-N 0.000 claims description 2
- MYISVPVWAQRUTL-UHFFFAOYSA-N 2-methylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC=C3SC2=C1 MYISVPVWAQRUTL-UHFFFAOYSA-N 0.000 claims description 2
- UMWZLYTVXQBTTE-UHFFFAOYSA-N 2-pentylanthracene-9,10-dione Chemical compound C1=CC=C2C(=O)C3=CC(CCCCC)=CC=C3C(=O)C2=C1 UMWZLYTVXQBTTE-UHFFFAOYSA-N 0.000 claims description 2
- VFZKVQVQOMDJEG-UHFFFAOYSA-N 2-prop-2-enoyloxypropyl prop-2-enoate Chemical compound C=CC(=O)OC(C)COC(=O)C=C VFZKVQVQOMDJEG-UHFFFAOYSA-N 0.000 claims description 2
- KTALPKYXQZGAEG-UHFFFAOYSA-N 2-propan-2-ylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C(C)C)=CC=C3SC2=C1 KTALPKYXQZGAEG-UHFFFAOYSA-N 0.000 claims description 2
- YTPSFXZMJKMUJE-UHFFFAOYSA-N 2-tert-butylanthracene-9,10-dione Chemical compound C1=CC=C2C(=O)C3=CC(C(C)(C)C)=CC=C3C(=O)C2=C1 YTPSFXZMJKMUJE-UHFFFAOYSA-N 0.000 claims description 2
- RBTBFTRPCNLSDE-UHFFFAOYSA-N 3,7-bis(dimethylamino)phenothiazin-5-ium Chemical compound C1=CC(N(C)C)=CC2=[S+]C3=CC(N(C)C)=CC=C3N=C21 RBTBFTRPCNLSDE-UHFFFAOYSA-N 0.000 claims description 2
- IWTYTFSSTWXZFU-UHFFFAOYSA-N 3-chloroprop-1-enylbenzene Chemical compound ClCC=CC1=CC=CC=C1 IWTYTFSSTWXZFU-UHFFFAOYSA-N 0.000 claims description 2
- FQMIAEWUVYWVNB-UHFFFAOYSA-N 3-prop-2-enoyloxybutyl prop-2-enoate Chemical compound C=CC(=O)OC(C)CCOC(=O)C=C FQMIAEWUVYWVNB-UHFFFAOYSA-N 0.000 claims description 2
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 claims description 2
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 claims description 2
- VNGLVZLEUDIDQH-UHFFFAOYSA-N 4-[2-(4-hydroxyphenyl)propan-2-yl]phenol;2-methyloxirane Chemical compound CC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 VNGLVZLEUDIDQH-UHFFFAOYSA-N 0.000 claims description 2
- VGVHNLRUAMRIEW-UHFFFAOYSA-N 4-methylcyclohexan-1-one Chemical compound CC1CCC(=O)CC1 VGVHNLRUAMRIEW-UHFFFAOYSA-N 0.000 claims description 2
- PSCXFXNEYIHJST-UHFFFAOYSA-N 4-phenylbut-3-enoic acid Chemical compound OC(=O)CC=CC1=CC=CC=C1 PSCXFXNEYIHJST-UHFFFAOYSA-N 0.000 claims description 2
- JHWGFJBTMHEZME-UHFFFAOYSA-N 4-prop-2-enoyloxybutyl prop-2-enoate Chemical compound C=CC(=O)OCCCCOC(=O)C=C JHWGFJBTMHEZME-UHFFFAOYSA-N 0.000 claims description 2
- JTHZUSWLNCPZLX-UHFFFAOYSA-N 6-fluoro-3-methyl-2h-indazole Chemical compound FC1=CC=C2C(C)=NNC2=C1 JTHZUSWLNCPZLX-UHFFFAOYSA-N 0.000 claims description 2
- DXPPIEDUBFUSEZ-UHFFFAOYSA-N 6-methylheptyl prop-2-enoate Chemical compound CC(C)CCCCCOC(=O)C=C DXPPIEDUBFUSEZ-UHFFFAOYSA-N 0.000 claims description 2
- HUKPVYBUJRAUAG-UHFFFAOYSA-N 7-benzo[a]phenalenone Chemical compound C1=CC(C(=O)C=2C3=CC=CC=2)=C2C3=CC=CC2=C1 HUKPVYBUJRAUAG-UHFFFAOYSA-N 0.000 claims description 2
- GBJVVSCPOBPEIT-UHFFFAOYSA-N AZT-1152 Chemical compound N=1C=NC2=CC(OCCCN(CC)CCOP(O)(O)=O)=CC=C2C=1NC(=NN1)C=C1CC(=O)NC1=CC=CC(F)=C1 GBJVVSCPOBPEIT-UHFFFAOYSA-N 0.000 claims description 2
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 claims description 2
- FIHZWZBEAXASKA-UHFFFAOYSA-N Anthron Natural products COc1cc2Cc3cc(C)cc(O)c3C(=O)c2c(O)c1C=CC(C)C FIHZWZBEAXASKA-UHFFFAOYSA-N 0.000 claims description 2
- 239000004342 Benzoyl peroxide Substances 0.000 claims description 2
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 claims description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 2
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 claims description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 claims description 2
- 239000002202 Polyethylene glycol Substances 0.000 claims description 2
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 2
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 claims description 2
- INXWLSDYDXPENO-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(CO)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C INXWLSDYDXPENO-UHFFFAOYSA-N 0.000 claims description 2
- PSSYEWWHQGPWGA-UHFFFAOYSA-N [2-hydroxy-3-[2-hydroxy-3-(2-hydroxy-3-prop-2-enoyloxypropoxy)propoxy]propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(O)COCC(O)COCC(O)COC(=O)C=C PSSYEWWHQGPWGA-UHFFFAOYSA-N 0.000 claims description 2
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 claims description 2
- FHLPGTXWCFQMIU-UHFFFAOYSA-N [4-[2-(4-prop-2-enoyloxyphenyl)propan-2-yl]phenyl] prop-2-enoate Chemical compound C=1C=C(OC(=O)C=C)C=CC=1C(C)(C)C1=CC=C(OC(=O)C=C)C=C1 FHLPGTXWCFQMIU-UHFFFAOYSA-N 0.000 claims description 2
- BTKXSYWWRGMQHR-UHFFFAOYSA-N [amino(diethoxy)silyl]oxyethane Chemical compound CCO[Si](N)(OCC)OCC BTKXSYWWRGMQHR-UHFFFAOYSA-N 0.000 claims description 2
- FXMBKAAULHJRKL-UHFFFAOYSA-N [amino(dimethoxy)silyl]oxymethane Chemical compound CO[Si](N)(OC)OC FXMBKAAULHJRKL-UHFFFAOYSA-N 0.000 claims description 2
- 229940117913 acrylamide Drugs 0.000 claims description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 2
- 125000005210 alkyl ammonium group Chemical group 0.000 claims description 2
- 150000008052 alkyl sulfonates Chemical class 0.000 claims description 2
- 125000003118 aryl group Chemical group 0.000 claims description 2
- 229940072107 ascorbate Drugs 0.000 claims description 2
- 235000010323 ascorbic acid Nutrition 0.000 claims description 2
- 239000011668 ascorbic acid Substances 0.000 claims description 2
- 229960002130 benzoin Drugs 0.000 claims description 2
- 235000019400 benzoyl peroxide Nutrition 0.000 claims description 2
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 claims description 2
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 claims description 2
- 239000003638 chemical reducing agent Substances 0.000 claims description 2
- 229910052801 chlorine Inorganic materials 0.000 claims description 2
- 239000000460 chlorine Substances 0.000 claims description 2
- OOCCDEMITAIZTP-UHFFFAOYSA-N cinnamyl alcohol Chemical compound OCC=CC1=CC=CC=C1 OOCCDEMITAIZTP-UHFFFAOYSA-N 0.000 claims description 2
- KBLWLMPSVYBVDK-UHFFFAOYSA-N cyclohexyl prop-2-enoate Chemical compound C=CC(=O)OC1CCCCC1 KBLWLMPSVYBVDK-UHFFFAOYSA-N 0.000 claims description 2
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 claims description 2
- YQGOJNYOYNNSMM-UHFFFAOYSA-N eosin Chemical compound [Na+].OC(=O)C1=CC=CC=C1C1=C2C=C(Br)C(=O)C(Br)=C2OC2=C(Br)C(O)=C(Br)C=C21 YQGOJNYOYNNSMM-UHFFFAOYSA-N 0.000 claims description 2
- 235000021323 fish oil Nutrition 0.000 claims description 2
- NWPWGNPPZVZAKO-UHFFFAOYSA-N fluoren-1-one Chemical compound C1=CC=C2C3=CC=CC(=O)C3=CC2=C1 NWPWGNPPZVZAKO-UHFFFAOYSA-N 0.000 claims description 2
- 125000001153 fluoro group Chemical group F* 0.000 claims description 2
- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical compound CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 claims description 2
- YDKNBNOOCSNPNS-UHFFFAOYSA-N methyl 1,3-benzoxazole-2-carboxylate Chemical compound C1=CC=C2OC(C(=O)OC)=NC2=C1 YDKNBNOOCSNPNS-UHFFFAOYSA-N 0.000 claims description 2
- XJRBAMWJDBPFIM-UHFFFAOYSA-N methyl vinyl ether Chemical group COC=C XJRBAMWJDBPFIM-UHFFFAOYSA-N 0.000 claims description 2
- LUCXVPAZUDVVBT-UHFFFAOYSA-N methyl-[3-(2-methylphenoxy)-3-phenylpropyl]azanium;chloride Chemical compound Cl.C=1C=CC=CC=1C(CCNC)OC1=CC=CC=C1C LUCXVPAZUDVVBT-UHFFFAOYSA-N 0.000 claims description 2
- 229960000907 methylthioninium chloride Drugs 0.000 claims description 2
- KKFHAJHLJHVUDM-UHFFFAOYSA-N n-vinylcarbazole Chemical compound C1=CC=C2N(C=C)C3=CC=CC=C3C2=C1 KKFHAJHLJHVUDM-UHFFFAOYSA-N 0.000 claims description 2
- SOEDHYUFNWMILE-UHFFFAOYSA-N naphthalen-1-yl prop-2-enoate Chemical compound C1=CC=C2C(OC(=O)C=C)=CC=CC2=C1 SOEDHYUFNWMILE-UHFFFAOYSA-N 0.000 claims description 2
- SLYCYWCVSGPDFR-UHFFFAOYSA-N octadecyltrimethoxysilane Chemical compound CCCCCCCCCCCCCCCCCC[Si](OC)(OC)OC SLYCYWCVSGPDFR-UHFFFAOYSA-N 0.000 claims description 2
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 claims description 2
- ULDDEWDFUNBUCM-UHFFFAOYSA-N pentyl prop-2-enoate Chemical compound CCCCCOC(=O)C=C ULDDEWDFUNBUCM-UHFFFAOYSA-N 0.000 claims description 2
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 claims description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 2
- WRAQQYDMVSCOTE-UHFFFAOYSA-N phenyl prop-2-enoate Chemical compound C=CC(=O)OC1=CC=CC=C1 WRAQQYDMVSCOTE-UHFFFAOYSA-N 0.000 claims description 2
- 229920005646 polycarboxylate Polymers 0.000 claims description 2
- 229920000728 polyester Polymers 0.000 claims description 2
- 229920001223 polyethylene glycol Polymers 0.000 claims description 2
- 229920000671 polyethylene glycol diacrylate Polymers 0.000 claims description 2
- 229920001451 polypropylene glycol Polymers 0.000 claims description 2
- QCTJRYGLPAFRMS-UHFFFAOYSA-N prop-2-enoic acid;1,3,5-triazine-2,4,6-triamine Chemical compound OC(=O)C=C.NC1=NC(N)=NC(N)=N1 QCTJRYGLPAFRMS-UHFFFAOYSA-N 0.000 claims description 2
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 claims description 2
- QTECDUFMBMSHKR-UHFFFAOYSA-N prop-2-enyl prop-2-enoate Chemical compound C=CCOC(=O)C=C QTECDUFMBMSHKR-UHFFFAOYSA-N 0.000 claims description 2
- LYBIZMNPXTXVMV-UHFFFAOYSA-N propan-2-yl prop-2-enoate Chemical compound CC(C)OC(=O)C=C LYBIZMNPXTXVMV-UHFFFAOYSA-N 0.000 claims description 2
- PNXMTCDJUBJHQJ-UHFFFAOYSA-N propyl prop-2-enoate Chemical compound CCCOC(=O)C=C PNXMTCDJUBJHQJ-UHFFFAOYSA-N 0.000 claims description 2
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 claims description 2
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 claims description 2
- FZMJEGJVKFTGMU-UHFFFAOYSA-N triethoxy(octadecyl)silane Chemical compound CCCCCCCCCCCCCCCCCC[Si](OCC)(OCC)OCC FZMJEGJVKFTGMU-UHFFFAOYSA-N 0.000 claims description 2
- 229940096522 trimethylolpropane triacrylate Drugs 0.000 claims description 2
- 229960004418 trolamine Drugs 0.000 claims description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 2
- 229920002554 vinyl polymer Polymers 0.000 claims description 2
- YEXPOXQUZXUXJW-UHFFFAOYSA-N oxolead Chemical compound [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 claims 3
- GJZFGDYLJLCGHT-UHFFFAOYSA-N 1,2-diethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=C(CC)C(CC)=CC=C3SC2=C1 GJZFGDYLJLCGHT-UHFFFAOYSA-N 0.000 claims 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims 1
- 229920005650 polypropylene glycol diacrylate Polymers 0.000 claims 1
- 238000012360 testing method Methods 0.000 description 13
- 230000000052 comparative effect Effects 0.000 description 8
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 7
- 239000002904 solvent Substances 0.000 description 6
- 239000007789 gas Substances 0.000 description 5
- 238000002310 reflectometry Methods 0.000 description 5
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 4
- 229910052753 mercury Inorganic materials 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- IAXXETNIOYFMLW-GYSYKLTISA-N [(1r,3r,4r)-4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl] 2-methylprop-2-enoate Chemical compound C1C[C@@]2(C)[C@H](OC(=O)C(=C)C)C[C@@H]1C2(C)C IAXXETNIOYFMLW-GYSYKLTISA-N 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 238000005286 illumination Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 206010034972 Photosensitivity reaction Diseases 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000003574 free electron Substances 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- HTUMBQDCCIXGCV-UHFFFAOYSA-N lead oxide Chemical compound [O-2].[Pb+2] HTUMBQDCCIXGCV-UHFFFAOYSA-N 0.000 description 2
- 230000036211 photosensitivity Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- WUOACPNHFRMFPN-SECBINFHSA-N (S)-(-)-alpha-terpineol Chemical compound CC1=CC[C@@H](C(C)(C)O)CC1 WUOACPNHFRMFPN-SECBINFHSA-N 0.000 description 1
- OVQQQQUJAGEBHH-UHFFFAOYSA-N 1,1,2,2,3,3,4,4,5,5,6,6,7,7,10,10,10-heptadecafluorodecyl prop-2-enoate Chemical compound FC(F)(F)CCC(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)OC(=O)C=C OVQQQQUJAGEBHH-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- OVKDFILSBMEKLT-UHFFFAOYSA-N alpha-Terpineol Natural products CC(=C)C1(O)CCC(C)=CC1 OVKDFILSBMEKLT-UHFFFAOYSA-N 0.000 description 1
- 229940088601 alpha-terpineol Drugs 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 1
- 150000004056 anthraquinones Chemical class 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 230000002070 germicidal effect Effects 0.000 description 1
- 230000005283 ground state Effects 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 230000004083 survival effect Effects 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/078—Glass compositions containing silica with 40% to 90% silica, by weight containing an oxide of a divalent metal, e.g. an oxide of zinc
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
- C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
- C03C3/091—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium
- C03C3/093—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium containing zinc or zirconium
Definitions
- the present invention relates to a photosensitive paste composition for a dielectric layer, a plasma display panel using the composition, and a method of manufacturing the panel. [10]
- Plasma display panel is a flat panel display device that can display images or information by using a light-emitting phenomenon from plasma discharge.
- PDP is generally divided into DC-type and AC-type according to panel structure and driving method.
- PDP generates plasma discharge in each cell separated by barrier ribs.
- PDP is a display device using the light emitting phenomenon of visible rays generated from the energy difference when ultraviolet rays generated by plasma discharge of a gas (such as He, Xe, etc.) provided in each cell returns to the ground state by exciting a phosphor in the cell.
- a gas such as He, Xe, etc.
- PDP has several advantages such as simple structure, easy manufacturing due to simple structure, high brightness, high luminous efficacy, high memory capacity, and a wide viewing angle over 160°. Also, PDP can be used for wide screens of 40 or more inches.
- PDP includes a front substrate and a rear substrate opposed to each other, and a barrier rib.
- the front substrate, the rear substrate and the barrier rib divide cells.
- a transparent electrode is disposed on the front substrate, and a bus electrode is disposed on the transparent electrode for decreasing resistance of the transparent electrode.
- An address electrode is disposed on the rear substrate.
- a phosphor material is applied inside of the cells divided by the barrier ribs.
- a front dielectric layer is formed to cover the transparent electrode and the bus electrode on the front substrate.
- a rear dielectric layer is disposed on the rear substrate to cover the address electrode.
- a protection layer is made of MgO, and disposed on the front dielectric layer.
- a general method of manufacturing the dielectric layer, especially the rear dielectric layer is as follows. [19] First, a paste composition having a glass powder, a solvent and a binder is printed on the rear substrate with the address electrode.
- the paste composition is dried at 150 0 C for 5 to 10 minutes.
- the dried paste composition is sintered to form the rear dielectric layer.
- Fig. 1 is a perspective view illustrating the PDP according to one embodiment of the present invention
- Figs. 2 - 5 are cross-sectional views illustrating the steps of forming the rear dielectric layer according to one embodiment of the present invention
- Fig. 6 is a view illustrating cross-sections of the rear dielectric layers formed by using each of the paste compositions in trial tests.
- One object of the present invention is to provide a paste composition for a dielectric layer formed by using a UV cured type of paste composition, whereby the process can be simplified, the manufacturing cost can be reduced, and the productivity can be improved; and a plasma display panel (PDP) using the paste composition; and a method of manufacturing the PDP.
- Another object of the present invention is to provide a PDP having an eco-friendly dielectric layer in the process of which the power consumption is low by using a paste composition not having a solvent, and a method of manufacturing the PDP.
- Fig. 1 is a perspective view illustrating the PDP according to one embodiment of the present invention.
- Fig. 1 the structure of PDP is divided into a front plate 200 and a rear plate 300.
- transparent electrodes 220, bus electrodes 230, a front dielectric layer 240, and a protection layer 250 are formed on a lower side of a glass substrate 210 (hereinafter, referred to as "front substrate”).
- the transparent electrodes 220 are formed with indium tin oxide (hereinafter, referred to as "ITO") to transmit a light from a discharging cell.
- ITO indium tin oxide
- the bus electrodes 230 are disposed on the transparent electrodes 220 to decrease line resistance of the transparent electrodes 220.
- the bus electrodes 230 are made of a material, like silver (Ag) paste, having high conductivity.
- the bus electrodes 230 can decrease the driving voltage of the transparent electrodes 220 having low conductivity because the bus electrodes 230 are made of a material having high conductivity.
- the front dielectric layer 240 directly contacts with the bus electrodes 230 made of metallic material, and may be made of PbO-based glass or non-Pb-based glass in order to avoid chemical reactions with the bus electrodes 230. This front dielectric layer 240 restricts discharge current to maintain glow discharge, and the electric charges generated at the time of plasma discharge are accumulated.
- the protection layer 250 prevents damage of the front dielectric layer 240 by sputtering at the time of plasma discharge, and increases the discharge efficiency of the secondary electrons as well.
- the protection layer 250 is made up of magnesium oxide
- address electrodes 320 In the rear plate 300 of PDP, address electrodes 320, a rear dielectric layer 330, barrier ribs 340, and a phosphor layer 350 are disposed on the upper surface of a glass substrate 310 (hereinafter, referred to as "rear substrate").
- the address electrodes 320 are positioned in the middle of each discharge cell.
- the address electrodes 320 may have a line width of about 70 to 80 D .
- the rear dielectric layer 330 is disposed on the entire surface of the rear substrate 310 and the address electrodes 320, and protects the address electrodes 320.
- the barrier ribs 340 are positioned on top of the rear dielectric layer 330, spaced by a predetermined distance from the address electrodes 320, and are formed longer in the perpendicular direction. [49]
- the barrier ribs 340 may have variety type, for example, a stripe type, a well type, a delta type or a honeycomb type.
- the barrier ribs 340 are needed to maintain a discharge distance, and prevent electrical and optical interference between adjacent discharge cells.
- the phosphor layer 350 is formed over both sides of the barrier ribs 340 and the upper surface of the rear dielectric layer 330.
- the phosphor layer 350 is excited by the ultraviolet rays generated at the time of plasma discharge, and generates a red (R), green (G) or blue (B) visible ray.
- the electrons to which the force is exerted obtain an energy (first ionization energy) enough to remove electrons in the outermost orbit, they ionize the gas, and thus generated ions and electrons are moved to both electrodes by the electromagnetic force. Particularly, secondary electrons are generated when the ions collide with the protection layer 250, and these secondary electrons help generation of plasma.
- the gas provided into the cells of PDP is generally an inert gas, such as Ne, Xe, He, etc.
- a red, green or blue visible ray is generated when an ultraviolet ray with a wavelength of between about 147 nm and 173 nm is applied to the phosphor layer 350.
- each discharge cell becomes a pixel representing each red, green, or blue color.
- each discharge cell is controlled by combination of RGB in each discharge cell.
- the color is controlled by controlling the time during which plasma is generated.
- Figs. 2 - 5 are cross-sectional views illustrating the steps of forming the rear dielectric layer according to one embodiment of the present invention.
- a paste composition 332 is applied onto the rear substrate
- a dielectric forming layer 334 is formed as shown in Fig. 3.
- the dielectric forming layer 334 becomes the rear dielectric layer 330 by sintering.
- the paste composition 332 comprises a glass powder, a photosensitive monomer, a photosensitive oligomer, a photo initiator, a dispenser and a thixotrophic agent.
- the paste composition 332 comprises about 50 to 70 parts by weight of the glass powder, about 10 to 30 parts by weight of the filler, about 10 to 30 parts by weight of the photosensitive monomer, about 1 to 10 parts by weight of the photosensitive oligomer, about 0.5 to 5 parts by weight of the photo initiator, and about 0.5 to 5 parts by weight of the dispenser.
- the glass powder is at least one selected from the group consisting of a silicon dioxide, a lead oxide, a zinc oxide, a bismuth oxide and a boron oxide, as main components.
- the glass powder can be functioned as supporter of the rear dielectric layer 330.
- the filler is at least one selected from the group consisting of a barium oxide, a calcium oxide, a magnesium oxide, a zinc oxide, a zirconium oxide, a titanium oxide and an aluminum oxide, in the amount of about 2 to 30 parts by weight.
- the filler plays a role to increase the reflectivity and strength of the rear dielectric layer 330.
- the photo initiator plays a role to increase photo-sensitivity in case the exposing process is conducted onto the paste composition 332.
- the photo initiator is at least one selected from a reducing agent group consisting of benzophenone, benzoyl benzoic acid methyl, 4,4-bis(dimethylamine)benzophenone, 4,4-bis(diethylamine)benzophenone, 4,4-dichlorobenzophnone, 4-benzoyl-4-methyldiphenylketone, dibenzilketone, fluorenon, 2,2-diethoxyacetophenone, 2,2-dimethoxy-2-phenyl-2-phenylacetophenone, 2-hydroxy-2-methylpropiophenone, p-t-buthyldichloroacetophenone, thioxanthone, 2-methylthioxanthone, 2-chlorothioxanthone, 2-isopropylthioxanthone, diethylth- ioxanthone, benzyl,
- the photo initiator can be used by about 0.5 to 5 parts by weight, preferably 0.5 to 2 parts by weight. If the amount of photo initiator is too little, the photo sensitivity is not good. If the amount of photo initiator is too much, the survival rate of exposing part may be too low.
- the dispenser plays a role to dispense the glass powder equally in the paste composition 332.
- the dispenser can be at least one selected from the group consisting of polyamineamide based compound, polycarboxylic acid based high molecular compound, fish oil, polyethyleneglycolether, alkylsulfonate, poly carboxy late, alky- lammonium, silicon, or acryl based dispenser; and can be used alone or in mixture of two or more.
- the silicon based dispenser can be amino triethoxy silane, amino trimethoxy silane, octadecyltriethoxy silane, octadecyltrimethoxy silane, etc.
- the acryl based dispenser is high or low molecular based acryl dispenser.
- the amount of dispenser in the present paste composition 332 is about 0.5 to 5 parts by weight, preferably about 0.5 to 2 parts by weight.
- the thixotrophic agent plays a role to increase viscosity of the paste composition
- the present paste composition 332 may not comprise a solvent, and so can form an eco-friendly dielectric layer.
- the photosensitive monomer is acrylic based monomer that is at least one selected from the group consisting of methylacrylate, ethylacrylate, n-propylacrylate, isopropy- lacrylate, n-butylacrylate, sec-butylacrylate, iso-butylacrylate, tert-butylacrylate, n- pentylacrylate, allylacrylate, benzilacrylate, butoxyethylacrylate, butoxytriethylenegly- colacrylate, cyclohexylacrylate, dicyclopentanylacrylate, dicyclopentenylacrylate, 2-ethylhexylacrylate, glycerolacrylate, glycidylacrylate, heptadecafluorodecylacrylate, 2-hydroxyethylacrylate, isobonylacrylate, 2-hydroxypropylacrylate, isothexylacrylate, isooctylacrylate, lau
- the photosensitive monomer is an aromatic monomer substituted with 1 to 5 chlorine or fluorine atoms.
- At least one acrylate can be substituted with methacrylate.
- the photosensitive monomer is isobonyl acrylate or isobonyl methacrylate.
- the photosensitive monomer is vinyl based monomer that is at least one selected from the group consisting of styrene, p-methylstyrene, o-methylstyrene, m- methylstyrene, chlorinated styrene, brominated styrene, alpha-methylstyrene, chlorinated alpha-methylstyrene, brominated alpha-methylstyrene, chloromethylstyrene, hydroxymethylstyrene, carboxymethylstyrene, vinylnaphthalene, vinylanthracene, vinylcarbazole and l-vinyl-2-pyrolidone.
- the photosensitive oligomer is at least one selected from the group consisting of melamine acrylate, epoxy acrylate, urethane acrylate, polyester acrylate, polyethylene glycol bisacrylate having the molecular weight of 500 to 3000, and polypropylene glycol bismethaacrylate having the molecular weight of 500 to 3000.
- the photosensitive oligomer is urethane acrylate.
- the dielectric forming layer 334 is exposed for a certain period of time, as shown in
- Exposure devices such as stepper exposer or proximity exposer may be used. For light exposure on a large area, the exposure is conducted by applying a paste or an electrode material over a glass or other substrate for return, whereby an exposer for small area can be used for large area.
- the active light sources that can be used at that time include visible light, near ultraviolet light, ultraviolet light, electron beam, X-ray, and laser beam, preferably ultraviolet light.
- the sources low-pressure mercury lamp, high-pressure mercury lamp, extra-high pressure mercury lamp, halogen lamp, and germicidal lamp can be used, but the extra-high pressure mercury lamp is preferred.
- the paste composition 332 is cured to form the dielectric forming layer 334.
- the cured dielectric forming layer 334 is sintered at a certain temperature for forming the rear dielectric layer 330, as shown in Fig. 5.
- the trial test results to the rear dielectric layer which is formed by using the paste composition for dielectric layer according to the above embodiment will be described.
- Comparative Example 1 formed a rear dielectric layer by using the paste composition comprising about 60 parts by weight of glass powder, 4 parts by weight of Al 2 O 3 , 11 parts by weight of TiO , 3 parts by weight of binder, and 22 parts by weight of solvent.
- binder EC STD 4 and EC STD 20 produced by Dow Chemical Co. were used by 1 and 2 parts by weight, respectively.
- solvent ⁇ -Terpineol was used by about 15 parts by weight, and BCA was used by about 7 parts by weight.
- Comparative Example 1 The past composition of Comparative Example 1 was applied on the rear substrate, dried, and sintered to form the rear dielectric layer. [95] In Examples 1 to 3, the photosensitive monomer was IBXA (Isobonyl Acrylaye),
- urethane based oligomer such as EB230 and EB9270 produced by SKCYTEC Co. was used.
- IR907, IR819 and TPO were used as the photo initiator; BYK180 of BYK Co. was used as the dispenser; and BYK410 of BYK Co. was used as the thixotrophic agent.
- the paste composition of Example 1 comprises about 60 parts by weight of glass powder, about 4 parts by weight of Al O , about 11 parts by weight of TiO , about 17 parts by weight of photosensitive monomer, about 6 parts by weight of photosensitive oligomer, about 1 part by weight of photo initiator, and about 1 part by weight of dispenser.
- EB9270 was used; and as the photo initiator, TPO was used.
- the paste composition of Example 2 comprises about 60 parts by weight of glass powder, about 4 parts by weight of Al O , about 11 parts by weight of TiO , about 20 parts by weight of photosensitive monomer, about 4 parts by weight of photosensitive oligomer, about 1 part by weight of photo initiator, about 0.9 part by weight of dispenser and about 0.01 part by weight of thixotrophic agent.
- photosensitive monomer IBXMA was used; as the photosensitive oligomer, about 1 part by weight of EB230 and about 3 parts by weight of EB 9270 were used; and as the photo initiator, about 0.6 part by weight of IR907 and about 0.4 part by weight of TPO were used.
- the paste composition of Example 3 comprises about 60 parts by weight of glass powder, about 4 parts by weight of Al O , about 11 parts by weight of TiO , about 20 parts by weight of photosensitive monomer, about 8 parts by weight of photosensitive oligomer, about 1 part by weight of photo initiator and about 1 part by weight of dispenser.
- photosensitive monomer about 10 parts by weight of IBXA, about 5 parts by weight of 4-HBA and about 5 parts by weight of IBXMA were used.
- photosensitive oligomer about 5 parts by weight of EB230 and about 3 parts by weight of EB9270 were used.
- photo initiator about 0.3 part by weight of IR819 and about 0.7 part by weight of TPO were used.
- the trial test according to the present invention first, evaluated the characteristics of viscosity and printing of the paste compositions of Comparative Example 1, and Examples 1 to 3. [105] Then, to the rear dielectric layer formed by each of the paste compositions, sintering intensity of surface illumination, reflectivity, and withstanding voltage were tested, and the test results are shown in Table 2 below.
- Fig. 6 is a view illustrating cross-sections of the rear dielectric layers formed by each of the paste compositions used in trial tests.
- the reflectivity is a rate of reflecting light incident to the rear dielectric layer. If the reflectivity is more than 50%, it is acceptable. In the trial tests, Comparative Example 1, and Examples 1 to 3 showed satisfactory levels of reflectivity.
- Comparative Example 1 manufactured by conventional method Examples 1 to 3 manufactured according to the present invention showed satisfying results compared with the characteristics of the prior rear dielectric layer as a whole, without the dry process in the art.
- the present invention has advantages that the power consumption is less compared with the prior art; the eco-friendly dielectric layer can be manufactured by using the paste composition not having a solvent; and the manufacturing time can be reduced since the curing can be done within a short period of time, with maintaining the normal characteristics in the art.
- An embodiment may be achieved in whole or in part by the paste composition for a dielectric layer comprising about 50 to 70 parts by weight of a glass powder, about 10 to 30 parts by weight of a filler, about 10 to 30 parts by weight of a photosensitive monomer, about 1 to 10 parts by weight of a photosensitive oligomer, about 0.5 to 5 parts by weight of a photo initiator and about 0.5 to 5 parts by weight of a dispenser.
- any reference in the present specification to "one embodiment,” “an embodiment,” “example embodiment,” etc. means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the invention.
- the appearances of such phrases in various places in the specification are not necessarily all referring to same embodiment.
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Abstract
La présente invention concerne une composition de pâte pour couche diélectrique, un écran d'affichage plasma utilisant la composition de pâte, et un procédé de fabrication dudit écran. L'écran d'affichage plasma comprend un substrat inférieur et un substrat supérieur opposés l'un à l'autre, des électrodes d'adresse formées sur le substrat inférieur, des électrodes de décharge formées sur le substrat supérieur, des couches diélectriques inférieure et supérieure disposées sur chacune des électrodes d'adresse et des électrodes de décharge, une nervure de protection disposée entre le substrat inférieur et le substrat supérieur et divisant une pluralité de cellules de décharge, et une couche de fluorescence formée dans les cellules de décharge divisée par une nervure de protection. La composition de pâte pour couche diélectrique comprend environ 50 à 70 parties en poids d'une poudre de verre, environ 10 à 30 parties en poids d'une matière de remplissage, environ 10 à 30 parties en poids d'un monomère photosensible, environ 1 à 10 parties en poids d'un oligomère photosensible, environ 0,5 à 5 parties en poids d'un photo-initiateur, et environ 0,5 à 5 parties en poids d'un distributeur. La composition de pâte et l'écran d'affichage plasma utilisant ladite composition selon la présente invention présente des avantages en ce sens que le processus de fabrication est plus simple, le coût de fabrication est moindre, et la productivité plus élevée, grâce à un type de vulcanisation UV de composition de pâte, par rapport à l'art antérieur.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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KR10-2006-0074601 | 2006-08-08 | ||
KR1020060074601A KR100800463B1 (ko) | 2006-08-08 | 2006-08-08 | 유전체층용 페이스트 조성물, 이를 이용한 플라즈마디스플레이 패널 및 그 제조방법 |
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WO2008018682A1 true WO2008018682A1 (fr) | 2008-02-14 |
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PCT/KR2007/002817 WO2008018682A1 (fr) | 2006-08-08 | 2007-06-12 | composition de pâte pour couche diélectrique d'écran d'affichage plasma, écran d'affichage plasma utilisant la composition de pâte, et son procédé de fabrication |
Country Status (2)
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KR (1) | KR100800463B1 (fr) |
WO (1) | WO2008018682A1 (fr) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010117702A (ja) * | 2008-10-17 | 2010-05-27 | Taiyo Ink Mfg Ltd | ソルダーレジスト組成物及びこれを用いて形成するプリント配線板 |
JP2010117703A (ja) * | 2008-10-17 | 2010-05-27 | Taiyo Ink Mfg Ltd | 硬化性樹脂組成物及び反射シート |
JP2012137769A (ja) * | 2012-02-06 | 2012-07-19 | Taiyo Holdings Co Ltd | ソルダーレジスト組成物およびプリント配線板 |
CN101962515B (zh) * | 2009-07-22 | 2012-08-08 | 东莞市贝特利新材料有限公司 | 硅橡胶与塑料粘接的紫外光固化胶粘剂 |
WO2023063654A1 (fr) * | 2021-10-12 | 2023-04-20 | 아이원스 주식회사 | Verre résistant au plasma, composant de chambre interne pour procédé de fabrication de semi-conducteur et leurs procédés de fabrication |
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KR100576208B1 (ko) * | 2003-11-24 | 2006-05-03 | 이비텍(주) | 플라즈마 디스플레이 패널용 감광성 유전체 페이스트 조성물 및 이를 이용한 유전체 패턴 형성 방법 |
KR20060086776A (ko) * | 2005-01-27 | 2006-08-01 | 엘지전자 주식회사 | 플라즈마 디스플레이 패널의 격벽 제조 방법 |
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US6043604A (en) * | 1996-07-10 | 2000-03-28 | Toray Industries, Inc. | Plasma display with barrier rib of specific construction |
JPH11335138A (ja) * | 1998-03-10 | 1999-12-07 | Toray Ind Inc | 感光性ペ―スト、プラズマディスプレイ、およびプラズマアドレス液晶ディスプレイならびにそれらの製造方法 |
JPH11323147A (ja) * | 1998-05-18 | 1999-11-26 | Toray Ind Inc | 誘電体ペーストおよびそれを用いたディスプレイ基板の製造方法 |
US20040198131A1 (en) * | 1999-03-25 | 2004-10-07 | 3M Innovative Properties Company | Method of producing substrate for plasma display panel and mold used in the method |
KR20060055638A (ko) * | 2004-11-18 | 2006-05-24 | 신유선 | 디스플레이 장치용 격벽 조성물 및 이를 이용한 격벽제조방법 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010117702A (ja) * | 2008-10-17 | 2010-05-27 | Taiyo Ink Mfg Ltd | ソルダーレジスト組成物及びこれを用いて形成するプリント配線板 |
JP2010117703A (ja) * | 2008-10-17 | 2010-05-27 | Taiyo Ink Mfg Ltd | 硬化性樹脂組成物及び反射シート |
JP2012128442A (ja) * | 2008-10-17 | 2012-07-05 | Taiyo Holdings Co Ltd | ソルダーレジスト組成物及びプリント配線板 |
CN101962515B (zh) * | 2009-07-22 | 2012-08-08 | 东莞市贝特利新材料有限公司 | 硅橡胶与塑料粘接的紫外光固化胶粘剂 |
JP2012137769A (ja) * | 2012-02-06 | 2012-07-19 | Taiyo Holdings Co Ltd | ソルダーレジスト組成物およびプリント配線板 |
WO2023063654A1 (fr) * | 2021-10-12 | 2023-04-20 | 아이원스 주식회사 | Verre résistant au plasma, composant de chambre interne pour procédé de fabrication de semi-conducteur et leurs procédés de fabrication |
Also Published As
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KR100800463B1 (ko) | 2008-02-04 |
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