WO2007136832A3 - Procédé d'évacuation d'un gaz se trouvant entre un substrat et un moule - Google Patents

Procédé d'évacuation d'un gaz se trouvant entre un substrat et un moule Download PDF

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Publication number
WO2007136832A3
WO2007136832A3 PCT/US2007/012071 US2007012071W WO2007136832A3 WO 2007136832 A3 WO2007136832 A3 WO 2007136832A3 US 2007012071 W US2007012071 W US 2007012071W WO 2007136832 A3 WO2007136832 A3 WO 2007136832A3
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
mold
gas positioned
expelling gas
expelling
Prior art date
Application number
PCT/US2007/012071
Other languages
English (en)
Other versions
WO2007136832A2 (fr
Inventor
Byung-Jin Choi
Mahadevan Ganapathisubramanian
Yeoung-Jun Choi
Mario J Meissl
Original Assignee
Molecular Imprints Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/565,393 external-priority patent/US7691313B2/en
Application filed by Molecular Imprints Inc filed Critical Molecular Imprints Inc
Publication of WO2007136832A2 publication Critical patent/WO2007136832A2/fr
Publication of WO2007136832A3 publication Critical patent/WO2007136832A3/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/10—Moulds or cores; Details thereof or accessories therefor with incorporated venting means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/56—Compression moulding under special conditions, e.g. vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
    • B29C2043/023—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface having a plurality of grooves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/56—Compression moulding under special conditions, e.g. vacuum
    • B29C2043/566—Compression moulding under special conditions, e.g. vacuum in a specific gas atmosphere, with or without pressure

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)

Abstract

L'invention concerne un procédé d'évacuation d'un gaz se trouvant entre un substrat et un moule, un liquide étant par ailleurs présent entre le substrat et le moule.
PCT/US2007/012071 2006-05-18 2007-05-18 Procédé d'évacuation d'un gaz se trouvant entre un substrat et un moule WO2007136832A2 (fr)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US80126506P 2006-05-18 2006-05-18
US60/801,265 2006-05-18
US82712806P 2006-09-27 2006-09-27
US60/827,128 2006-09-27
US11/565,393 2006-11-30
US11/565,393 US7691313B2 (en) 2002-11-13 2006-11-30 Method for expelling gas positioned between a substrate and a mold

Publications (2)

Publication Number Publication Date
WO2007136832A2 WO2007136832A2 (fr) 2007-11-29
WO2007136832A3 true WO2007136832A3 (fr) 2008-09-25

Family

ID=38723896

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/012071 WO2007136832A2 (fr) 2006-05-18 2007-05-18 Procédé d'évacuation d'un gaz se trouvant entre un substrat et un moule

Country Status (1)

Country Link
WO (1) WO2007136832A2 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8215946B2 (en) * 2006-05-18 2012-07-10 Molecular Imprints, Inc. Imprint lithography system and method
US8187515B2 (en) * 2008-04-01 2012-05-29 Molecular Imprints, Inc. Large area roll-to-roll imprint lithography
US8652393B2 (en) 2008-10-24 2014-02-18 Molecular Imprints, Inc. Strain and kinetics control during separation phase of imprint process
US8309008B2 (en) * 2008-10-30 2012-11-13 Molecular Imprints, Inc. Separation in an imprint lithography process
JP5416420B2 (ja) * 2009-01-22 2014-02-12 株式会社日立ハイテクノロジーズ 微細構造転写装置
US9164375B2 (en) * 2009-06-19 2015-10-20 Canon Nanotechnologies, Inc. Dual zone template chuck
KR102394754B1 (ko) 2014-04-22 2022-05-04 에베 그룹 에. 탈너 게엠베하 나노구조를 엠보싱하기 위한 방법 및 장치

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5427599A (en) * 1987-06-09 1995-06-27 International Business Machines Corporation System for stamping an optical storage disk
US5550654A (en) * 1993-07-19 1996-08-27 Lucent Technologies Inc. Method for forming, in optical media, refractive index perturbations having reduced birefringence
US5947027A (en) * 1998-09-08 1999-09-07 Motorola, Inc. Printing apparatus with inflatable means for advancing a substrate towards the stamping surface
US6137562A (en) * 1996-12-05 2000-10-24 Nikon Corporation Substrate adjuster, substrate holder and substrate holding method
US20030189273A1 (en) * 2002-04-04 2003-10-09 Lennart Olsson Imprint method and device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5427599A (en) * 1987-06-09 1995-06-27 International Business Machines Corporation System for stamping an optical storage disk
US5550654A (en) * 1993-07-19 1996-08-27 Lucent Technologies Inc. Method for forming, in optical media, refractive index perturbations having reduced birefringence
US6137562A (en) * 1996-12-05 2000-10-24 Nikon Corporation Substrate adjuster, substrate holder and substrate holding method
US5947027A (en) * 1998-09-08 1999-09-07 Motorola, Inc. Printing apparatus with inflatable means for advancing a substrate towards the stamping surface
US20030189273A1 (en) * 2002-04-04 2003-10-09 Lennart Olsson Imprint method and device

Also Published As

Publication number Publication date
WO2007136832A2 (fr) 2007-11-29

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