WO2007136832A3 - Procédé d'évacuation d'un gaz se trouvant entre un substrat et un moule - Google Patents
Procédé d'évacuation d'un gaz se trouvant entre un substrat et un moule Download PDFInfo
- Publication number
- WO2007136832A3 WO2007136832A3 PCT/US2007/012071 US2007012071W WO2007136832A3 WO 2007136832 A3 WO2007136832 A3 WO 2007136832A3 US 2007012071 W US2007012071 W US 2007012071W WO 2007136832 A3 WO2007136832 A3 WO 2007136832A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- mold
- gas positioned
- expelling gas
- expelling
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/10—Moulds or cores; Details thereof or accessories therefor with incorporated venting means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/56—Compression moulding under special conditions, e.g. vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/58—Measuring, controlling or regulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
- B29C2043/023—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface having a plurality of grooves
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/56—Compression moulding under special conditions, e.g. vacuum
- B29C2043/566—Compression moulding under special conditions, e.g. vacuum in a specific gas atmosphere, with or without pressure
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Nanotechnology (AREA)
- Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
Abstract
L'invention concerne un procédé d'évacuation d'un gaz se trouvant entre un substrat et un moule, un liquide étant par ailleurs présent entre le substrat et le moule.
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US80126506P | 2006-05-18 | 2006-05-18 | |
US60/801,265 | 2006-05-18 | ||
US82712806P | 2006-09-27 | 2006-09-27 | |
US60/827,128 | 2006-09-27 | ||
US11/565,393 | 2006-11-30 | ||
US11/565,393 US7691313B2 (en) | 2002-11-13 | 2006-11-30 | Method for expelling gas positioned between a substrate and a mold |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2007136832A2 WO2007136832A2 (fr) | 2007-11-29 |
WO2007136832A3 true WO2007136832A3 (fr) | 2008-09-25 |
Family
ID=38723896
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2007/012071 WO2007136832A2 (fr) | 2006-05-18 | 2007-05-18 | Procédé d'évacuation d'un gaz se trouvant entre un substrat et un moule |
Country Status (1)
Country | Link |
---|---|
WO (1) | WO2007136832A2 (fr) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8215946B2 (en) * | 2006-05-18 | 2012-07-10 | Molecular Imprints, Inc. | Imprint lithography system and method |
US8187515B2 (en) * | 2008-04-01 | 2012-05-29 | Molecular Imprints, Inc. | Large area roll-to-roll imprint lithography |
US8652393B2 (en) | 2008-10-24 | 2014-02-18 | Molecular Imprints, Inc. | Strain and kinetics control during separation phase of imprint process |
US8309008B2 (en) * | 2008-10-30 | 2012-11-13 | Molecular Imprints, Inc. | Separation in an imprint lithography process |
JP5416420B2 (ja) * | 2009-01-22 | 2014-02-12 | 株式会社日立ハイテクノロジーズ | 微細構造転写装置 |
US9164375B2 (en) * | 2009-06-19 | 2015-10-20 | Canon Nanotechnologies, Inc. | Dual zone template chuck |
KR102394754B1 (ko) | 2014-04-22 | 2022-05-04 | 에베 그룹 에. 탈너 게엠베하 | 나노구조를 엠보싱하기 위한 방법 및 장치 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5427599A (en) * | 1987-06-09 | 1995-06-27 | International Business Machines Corporation | System for stamping an optical storage disk |
US5550654A (en) * | 1993-07-19 | 1996-08-27 | Lucent Technologies Inc. | Method for forming, in optical media, refractive index perturbations having reduced birefringence |
US5947027A (en) * | 1998-09-08 | 1999-09-07 | Motorola, Inc. | Printing apparatus with inflatable means for advancing a substrate towards the stamping surface |
US6137562A (en) * | 1996-12-05 | 2000-10-24 | Nikon Corporation | Substrate adjuster, substrate holder and substrate holding method |
US20030189273A1 (en) * | 2002-04-04 | 2003-10-09 | Lennart Olsson | Imprint method and device |
-
2007
- 2007-05-18 WO PCT/US2007/012071 patent/WO2007136832A2/fr active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5427599A (en) * | 1987-06-09 | 1995-06-27 | International Business Machines Corporation | System for stamping an optical storage disk |
US5550654A (en) * | 1993-07-19 | 1996-08-27 | Lucent Technologies Inc. | Method for forming, in optical media, refractive index perturbations having reduced birefringence |
US6137562A (en) * | 1996-12-05 | 2000-10-24 | Nikon Corporation | Substrate adjuster, substrate holder and substrate holding method |
US5947027A (en) * | 1998-09-08 | 1999-09-07 | Motorola, Inc. | Printing apparatus with inflatable means for advancing a substrate towards the stamping surface |
US20030189273A1 (en) * | 2002-04-04 | 2003-10-09 | Lennart Olsson | Imprint method and device |
Also Published As
Publication number | Publication date |
---|---|
WO2007136832A2 (fr) | 2007-11-29 |
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