WO2007125511A3 - Wafer de-chucking - Google Patents

Wafer de-chucking Download PDF

Info

Publication number
WO2007125511A3
WO2007125511A3 PCT/IB2007/051599 IB2007051599W WO2007125511A3 WO 2007125511 A3 WO2007125511 A3 WO 2007125511A3 IB 2007051599 W IB2007051599 W IB 2007051599W WO 2007125511 A3 WO2007125511 A3 WO 2007125511A3
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
membrane
flow passage
tubes
fluid flow
Prior art date
Application number
PCT/IB2007/051599
Other languages
French (fr)
Other versions
WO2007125511A2 (en
Inventor
Srdjan Kordic
Original Assignee
Koninkl Philips Electronics Nv
Srdjan Kordic
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv, Srdjan Kordic filed Critical Koninkl Philips Electronics Nv
Priority to US12/299,302 priority Critical patent/US20090186560A1/en
Priority to EP07735709A priority patent/EP2024136A2/en
Priority to JP2009508596A priority patent/JP2009535836A/en
Publication of WO2007125511A2 publication Critical patent/WO2007125511A2/en
Publication of WO2007125511A3 publication Critical patent/WO2007125511A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

A carrier head (100) for a CMP tool, wherein the membrane (108) defining a chamber with a contact surface (102) of the carrier head (100) has a number of integral tubes (110) termining in openings coupled directly to the substrate (106), in addition to a main fluid flow passage (104) coupled to the chamber defined by the membrane (108). In use, during loading and polishing, a vacuum is applied to the main fluid flow passage (104) and the tubes (110) to hold the substrate (106) in flat engagement with the membrane (108) and contact surface (102). In order to unload the substrate (106), fluid pressure is applied to the substrate (106) via the tubes (110), whilst maintaining the application of the vacuum via the main fluid flow passage (104) so as to minimise bending and breakage of the substrate (106).
PCT/IB2007/051599 2006-05-02 2007-04-30 Wafer de-chucking WO2007125511A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US12/299,302 US20090186560A1 (en) 2006-05-02 2007-04-30 Wafer de-chucking
EP07735709A EP2024136A2 (en) 2006-05-02 2007-04-30 Wafer de-chucking
JP2009508596A JP2009535836A (en) 2006-05-02 2007-04-30 Wafer removal

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP06300423 2006-05-02
EP06300423.8 2006-05-02

Publications (2)

Publication Number Publication Date
WO2007125511A2 WO2007125511A2 (en) 2007-11-08
WO2007125511A3 true WO2007125511A3 (en) 2008-02-21

Family

ID=38655900

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2007/051599 WO2007125511A2 (en) 2006-05-02 2007-04-30 Wafer de-chucking

Country Status (5)

Country Link
US (1) US20090186560A1 (en)
EP (1) EP2024136A2 (en)
JP (1) JP2009535836A (en)
CN (1) CN101484277A (en)
WO (1) WO2007125511A2 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103252711B (en) * 2008-03-25 2016-06-29 应用材料公司 The carrier head thin film of improvement
JP5390807B2 (en) * 2008-08-21 2014-01-15 株式会社荏原製作所 Polishing method and apparatus
US10160093B2 (en) 2008-12-12 2018-12-25 Applied Materials, Inc. Carrier head membrane roughness to control polishing rate
KR102059524B1 (en) 2013-02-19 2019-12-27 삼성전자주식회사 Chemical mechanical polishing machine and polishing head assembly
EP3404699A1 (en) * 2013-05-29 2018-11-21 EV Group E. Thallner GmbH Method and device for bonding substrates
KR101575087B1 (en) 2014-09-02 2015-12-07 주식회사 케이씨텍 Membrane assembly in carrier head for chemical mechanical polishing apparatus and carrier head with the same
US10593603B2 (en) 2018-03-16 2020-03-17 Sandisk Technologies Llc Chemical mechanical polishing apparatus containing hydraulic multi-chamber bladder and method of using thereof
US11325223B2 (en) 2019-08-23 2022-05-10 Applied Materials, Inc. Carrier head with segmented substrate chuck
CN113118965B (en) * 2019-12-31 2022-09-30 清华大学 Substrate loading and unloading control method
CN111251177B (en) * 2020-03-10 2021-11-16 北京烁科精微电子装备有限公司 Bearing head and polishing device with same

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6036587A (en) * 1996-10-10 2000-03-14 Applied Materials, Inc. Carrier head with layer of conformable material for a chemical mechanical polishing system
US6080046A (en) * 1995-10-27 2000-06-27 Applied Materials, Inc. Underwater wafer storage and wafer picking for chemical mechanical polishing
US20020098780A1 (en) * 2000-11-23 2002-07-25 Samsung Electronics Co., Ltd. Apparatus for polishing a semiconductor wafer and method therefor
US20030236056A1 (en) * 2002-06-21 2003-12-25 Jae-Phil Boo Polishing station of a chemical mechanical polishing apparatus
US20040259476A1 (en) * 2000-03-31 2004-12-23 Korovin Nikolay N. Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece

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US4369605A (en) * 1980-07-11 1983-01-25 Monsanto Company Methods for preparing tube sheets for permeators having hollow fiber membranes
US5449316A (en) * 1994-01-05 1995-09-12 Strasbaugh; Alan Wafer carrier for film planarization
US6024630A (en) * 1995-06-09 2000-02-15 Applied Materials, Inc. Fluid-pressure regulated wafer polishing head
US5762539A (en) * 1996-02-27 1998-06-09 Ebara Corporation Apparatus for and method for polishing workpiece
USRE38854E1 (en) * 1996-02-27 2005-10-25 Ebara Corporation Apparatus for and method for polishing workpiece
JP3027551B2 (en) * 1997-07-03 2000-04-04 キヤノン株式会社 Substrate holding device, polishing method and polishing device using the substrate holding device
US6080050A (en) * 1997-12-31 2000-06-27 Applied Materials, Inc. Carrier head including a flexible membrane and a compliant backing member for a chemical mechanical polishing apparatus
JP2001024051A (en) * 1999-07-09 2001-01-26 Tokyo Seimitsu Co Ltd Wafer vacuum chuck pad
KR100780099B1 (en) * 2000-03-29 2007-11-29 신에쯔 한도타이 가부시키가이샤 Work holding panel for polishing, and device and method for polishing
US6527625B1 (en) * 2000-08-31 2003-03-04 Multi-Planar Technologies, Inc. Chemical mechanical polishing apparatus and method having a soft backed polishing head
JP3922887B2 (en) * 2001-03-16 2007-05-30 株式会社荏原製作所 Dresser and polishing device
TW587968B (en) * 2001-04-24 2004-05-21 United Microelectronics Corp Chemical mechanical polishing platform with pressure supression device and method for operating the same
KR20040023228A (en) * 2002-09-11 2004-03-18 삼성전자주식회사 Polishing head of a chemical mechanical polishing machine
US7001245B2 (en) * 2003-03-07 2006-02-21 Applied Materials Inc. Substrate carrier with a textured membrane
KR100653707B1 (en) * 2004-10-21 2006-12-04 삼성전자주식회사 Plasma processing method of plasma processing apparatus
US7048621B2 (en) * 2004-10-27 2006-05-23 Applied Materials Inc. Retaining ring deflection control
US7292428B2 (en) * 2005-04-26 2007-11-06 Applied Materials, Inc. Electrostatic chuck with smart lift-pin mechanism for a plasma reactor
US7074118B1 (en) * 2005-11-01 2006-07-11 Freescale Semiconductor, Inc. Polishing carrier head with a modified pressure profile
US7364496B2 (en) * 2006-03-03 2008-04-29 Inopla Inc. Polishing head for polishing semiconductor wafers

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6080046A (en) * 1995-10-27 2000-06-27 Applied Materials, Inc. Underwater wafer storage and wafer picking for chemical mechanical polishing
US6036587A (en) * 1996-10-10 2000-03-14 Applied Materials, Inc. Carrier head with layer of conformable material for a chemical mechanical polishing system
US20040259476A1 (en) * 2000-03-31 2004-12-23 Korovin Nikolay N. Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece
US20020098780A1 (en) * 2000-11-23 2002-07-25 Samsung Electronics Co., Ltd. Apparatus for polishing a semiconductor wafer and method therefor
US20030236056A1 (en) * 2002-06-21 2003-12-25 Jae-Phil Boo Polishing station of a chemical mechanical polishing apparatus

Also Published As

Publication number Publication date
CN101484277A (en) 2009-07-15
WO2007125511A2 (en) 2007-11-08
EP2024136A2 (en) 2009-02-18
US20090186560A1 (en) 2009-07-23
JP2009535836A (en) 2009-10-01

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