WO2007124028A3 - Structure de support pour dispositifs de refroidissement planaires et procédés associés - Google Patents

Structure de support pour dispositifs de refroidissement planaires et procédés associés Download PDF

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Publication number
WO2007124028A3
WO2007124028A3 PCT/US2007/009619 US2007009619W WO2007124028A3 WO 2007124028 A3 WO2007124028 A3 WO 2007124028A3 US 2007009619 W US2007009619 W US 2007009619W WO 2007124028 A3 WO2007124028 A3 WO 2007124028A3
Authority
WO
WIPO (PCT)
Prior art keywords
support structure
cooling device
spacer
casing
cooling devices
Prior art date
Application number
PCT/US2007/009619
Other languages
English (en)
Other versions
WO2007124028A2 (fr
Inventor
George A Meyer Iv
Ki Bu Nam
Sung Sik Kwack
Jae Joon Chol
Original Assignee
Celsia Technologies Korea Inc
George A Meyer Iv
Ki Bu Nam
Sung Sik Kwack
Jae Joon Chol
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020060034917A external-priority patent/KR100775013B1/ko
Application filed by Celsia Technologies Korea Inc, George A Meyer Iv, Ki Bu Nam, Sung Sik Kwack, Jae Joon Chol filed Critical Celsia Technologies Korea Inc
Publication of WO2007124028A2 publication Critical patent/WO2007124028A2/fr
Publication of WO2007124028A3 publication Critical patent/WO2007124028A3/fr

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2240/00—Spacing means

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

L'invention concerne une structure de support pour un dispositif de refroidissement planaire compact. La structure de support de l'invention permet d'obtenir un dispositif de refroidissement présentant une structure plus simple par rapport aux dispositifs de refroidissement classiques. Le dispositif de refroidissement comprend un boîtier planaire, une couche de mèche, et la structure de support. La structure de support comprend une plaque plate possédant une partie découpée formant une ouverture et un élément d'espacement sur la plaque plate. L'élément d'espacement est formé par flexion ou pliage de la partie découpée de la plaque. L'élément d'espacement augmente la circulation de liquide frigorigène à l'intérieur du dispositif de refroidissement par poussée de la couche de mèche contre la surface intérieure du boîtier et par maintien d'une distance établie entre la structure de support et le boîtier pour permettre un libre passage du liquide frigorigène. Le dispositif de refroidissement peut être produit de manière économique sans nuire à l'efficacité du transfert de chaleur.
PCT/US2007/009619 2006-04-18 2007-04-18 Structure de support pour dispositifs de refroidissement planaires et procédés associés WO2007124028A2 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2006-0034917 2006-04-18
KR1020060034917A KR100775013B1 (ko) 2006-04-18 2006-04-18 판형 열전달 장치
US11/410,772 US20070240860A1 (en) 2006-04-18 2006-04-24 Support structure for a planar cooling device
US11/410,772 2006-04-24

Publications (2)

Publication Number Publication Date
WO2007124028A2 WO2007124028A2 (fr) 2007-11-01
WO2007124028A3 true WO2007124028A3 (fr) 2008-10-23

Family

ID=38625603

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/009619 WO2007124028A2 (fr) 2006-04-18 2007-04-18 Structure de support pour dispositifs de refroidissement planaires et procédés associés

Country Status (1)

Country Link
WO (1) WO2007124028A2 (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2930465B1 (fr) * 2008-04-28 2010-09-24 Air Liquide Procede de fabrication d'un echangeur de chaleur a plaques utilisant un ensemble de cales
US9163883B2 (en) 2009-03-06 2015-10-20 Kevlin Thermal Technologies, Inc. Flexible thermal ground plane and manufacturing the same
CN106794562B (zh) * 2014-09-17 2019-07-23 科罗拉多州立大学董事会法人团体 启用微柱的热接地平面
US11988453B2 (en) 2014-09-17 2024-05-21 Kelvin Thermal Technologies, Inc. Thermal management planes
US11598594B2 (en) 2014-09-17 2023-03-07 The Regents Of The University Of Colorado Micropillar-enabled thermal ground plane
CN106403674B (zh) * 2015-07-27 2019-01-04 极致科技股份有限公司 板状均温装置
CN110715346A (zh) * 2019-09-09 2020-01-21 靳宏杰 一种塑料金属复合联箱管及应用该复合联箱管的暖气片
US11930621B2 (en) 2020-06-19 2024-03-12 Kelvin Thermal Technologies, Inc. Folding thermal ground plane

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3266567A (en) * 1962-12-20 1966-08-16 Borg Warner Heat exchanger
US5029389A (en) * 1987-12-14 1991-07-09 Hughes Aircraft Company Method of making a heat pipe with improved end cap
US6293332B2 (en) * 1999-03-31 2001-09-25 Jia Hao Li Structure of a super-thin heat plate
US20010047859A1 (en) * 1997-12-08 2001-12-06 Yoshio Ishida Heat pipe and method for processing the same
US20020020518A1 (en) * 2000-05-22 2002-02-21 Li Jia Hao Supportive wick structure of planar heat pipe
US20020021556A1 (en) * 1999-07-15 2002-02-21 Dibene Joseph T. Vapor chamber with integrated pin array
US6397935B1 (en) * 1995-12-21 2002-06-04 The Furukawa Electric Co. Ltd. Flat type heat pipe

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3266567A (en) * 1962-12-20 1966-08-16 Borg Warner Heat exchanger
US5029389A (en) * 1987-12-14 1991-07-09 Hughes Aircraft Company Method of making a heat pipe with improved end cap
US6397935B1 (en) * 1995-12-21 2002-06-04 The Furukawa Electric Co. Ltd. Flat type heat pipe
US20010047859A1 (en) * 1997-12-08 2001-12-06 Yoshio Ishida Heat pipe and method for processing the same
US6293332B2 (en) * 1999-03-31 2001-09-25 Jia Hao Li Structure of a super-thin heat plate
US20020021556A1 (en) * 1999-07-15 2002-02-21 Dibene Joseph T. Vapor chamber with integrated pin array
US20020020518A1 (en) * 2000-05-22 2002-02-21 Li Jia Hao Supportive wick structure of planar heat pipe

Also Published As

Publication number Publication date
WO2007124028A2 (fr) 2007-11-01

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