WO2007104700A3 - A process for manufacturing a supporting element for an electronic circuit and the supporting element obtained thereby - Google Patents

A process for manufacturing a supporting element for an electronic circuit and the supporting element obtained thereby Download PDF

Info

Publication number
WO2007104700A3
WO2007104700A3 PCT/EP2007/052189 EP2007052189W WO2007104700A3 WO 2007104700 A3 WO2007104700 A3 WO 2007104700A3 EP 2007052189 W EP2007052189 W EP 2007052189W WO 2007104700 A3 WO2007104700 A3 WO 2007104700A3
Authority
WO
WIPO (PCT)
Prior art keywords
supporting element
electronic circuit
manufacturing
seats
element obtained
Prior art date
Application number
PCT/EP2007/052189
Other languages
French (fr)
Other versions
WO2007104700A2 (en
Inventor
Diego Bortot
Original Assignee
Elettrolab S R L
Diego Bortot
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Elettrolab S R L, Diego Bortot filed Critical Elettrolab S R L
Publication of WO2007104700A2 publication Critical patent/WO2007104700A2/en
Publication of WO2007104700A3 publication Critical patent/WO2007104700A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Details Of Resistors (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
  • Die Bonding (AREA)

Abstract

The invention refers to a manufacturing process of a supporting element (1) for an electronic circuit. The process according to the invention enables a plurality of electrically isolated seats (4) to be obtained in a metallic base (2). These seats are suitable for containing the leg wires (100) of electronic components (200) assembled on said supporting element.
PCT/EP2007/052189 2006-03-10 2007-03-08 A process for manufacturing a supporting element for an electronic circuit and the supporting element obtained thereby WO2007104700A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
ITTV20060031 ITTV20060031A1 (en) 2006-03-10 2006-03-10 PROCESS OF PROCESSING A SUPPORT ELEMENT FOR AN ELECTRONIC CIRCUIT AND SUPPORT ELEMENT SOON OBTAINED.
ITTV2006A000031 2006-03-10

Publications (2)

Publication Number Publication Date
WO2007104700A2 WO2007104700A2 (en) 2007-09-20
WO2007104700A3 true WO2007104700A3 (en) 2007-11-01

Family

ID=38134336

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2007/052189 WO2007104700A2 (en) 2006-03-10 2007-03-08 A process for manufacturing a supporting element for an electronic circuit and the supporting element obtained thereby

Country Status (2)

Country Link
IT (1) ITTV20060031A1 (en)
WO (1) WO2007104700A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2230891A1 (en) * 2009-03-20 2010-09-22 Eurocir, S.A. Procedure for manufacture of printed circuit boards with high thermal conductibility base materials suitable for insertion on non-superficial components

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2299456A (en) * 1995-03-30 1996-10-02 Marconi Gec Ltd Insulation of component leads
US6013588A (en) * 1996-09-30 2000-01-11 O.K. Print Corporation Printed circuit board and printed circuit board base material

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2299456A (en) * 1995-03-30 1996-10-02 Marconi Gec Ltd Insulation of component leads
US6013588A (en) * 1996-09-30 2000-01-11 O.K. Print Corporation Printed circuit board and printed circuit board base material

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
"METHOD FOR MANUFACTURING METAL CORE PRINTED WIRING BOARD", IBM TECHNICAL DISCLOSURE BULLETIN, IBM CORP. NEW YORK, US, vol. 33, no. 7, 1 December 1990 (1990-12-01), pages 38 - 40, XP000108403, ISSN: 0018-8689 *

Also Published As

Publication number Publication date
ITTV20060031A1 (en) 2007-09-11
WO2007104700A2 (en) 2007-09-20

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