WO2007101697A1 - Dispositif de serrage pour un ensemble de corps de refroidissement - Google Patents

Dispositif de serrage pour un ensemble de corps de refroidissement Download PDF

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Publication number
WO2007101697A1
WO2007101697A1 PCT/EP2007/002040 EP2007002040W WO2007101697A1 WO 2007101697 A1 WO2007101697 A1 WO 2007101697A1 EP 2007002040 W EP2007002040 W EP 2007002040W WO 2007101697 A1 WO2007101697 A1 WO 2007101697A1
Authority
WO
WIPO (PCT)
Prior art keywords
clamping
evaporator
heat sink
refrigerant
heat
Prior art date
Application number
PCT/EP2007/002040
Other languages
German (de)
English (en)
Inventor
Steffen GRÖZINGER
Horst ROTENHÖFER
Henry Madsen
Henrik Olsen
Original Assignee
Behr Industry Gmbh & Co. Kg
Noise Limit Aps
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Behr Industry Gmbh & Co. Kg, Noise Limit Aps filed Critical Behr Industry Gmbh & Co. Kg
Priority to EP07723127A priority Critical patent/EP1999787A1/fr
Publication of WO2007101697A1 publication Critical patent/WO2007101697A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention relates to a clamping device according to the preamble of claim 1, a heat sink assembly according to the preamble of claim 12 and a device for cooling according to the preamble of claim 13.
  • Such a cooling device is known from WO 2005/055319 A2.
  • the known system has an evaporator for receiving heat of an electronic component and a capacitor for delivering the heat to the environment. From an outlet of the evaporator extends a riser, which opens into the condenser. In the riser, bubbles of vaporized refrigerant rise from the evaporator into the condenser, thus causing circulation of the refrigerant in the system.
  • the basic idea of the invention is to use a heat sink in the clamping direction in a receptacle of the clamping device, so that on one side of the heat sink against the clamping direction, such as top, no space for the clamping device and / or the clamping operation is needed.
  • Retaining elements for transmitting a clamping force in the clamping direction on the heat sink are no longer necessarily arranged on the upper side of the heat sink, but can cooperate with corresponding counter elements of the heat sink next to the heat sink.
  • the heat sink can be inserted into the clamping device to form a heat sink assembly, after which the heat sink assembly is clamped to a heat-emitting component.
  • 1 is a perspective view of a device for cooling electronic components
  • 2 is an exploded view of a device for cooling electronic components
  • FIG. 3 shows a side view of a device for cooling electronic components
  • FIG. 6 shows a plan view of a device for cooling electronic components
  • FIG. 7 shows a longitudinal section of a distribution container of a gas cooler
  • Fig. 8 is a side view of a device for cooling of electronic
  • FIG. 9 is a perspective view of a clamping device for pressing a heat sink to a heat-emitting component
  • Fig. 10 six side views of a clamping device for pressing a heat sink to a heat-emitting component.
  • the cooling device 110 has an evaporator 120, a condenser 130, a first refrigerant line 140 and a second refrigerant line hidden in FIG. 1.
  • the first refrigerant line 140 connects an evaporator outlet 150 with a concealed condenser inlet
  • the second refrigerant line connects a concealed condenser outlet with a likewise concealed evaporator inlet.
  • the evaporator 120 is inserted into a tensioning device 160, with which the cooling device 110 is stretched onto the heat-emitting component.
  • the capacitor 130 has a filling device 165, which is soldered to a tubular distribution container of the capacitor 130.
  • the capacitor 130 is sandwiched between a substantially rectangular cover 170 having a recess 180 and an axial fan 190.
  • the existing from the evaporator 120, the condenser 130 and the first and second refrigerant line refrigerant circuit is first evacuated before use via the filling device 165 and then filled with refrigerant, preferably using the known from the art refrigerant R134a is used.
  • the evaporator 120 transfers heat from the exothermic component to the refrigerant therein, which at least partially vaporizes and enters the condenser 130 via the first refrigerant line 140.
  • the condenser 130 transfers heat from the refrigerant in it to air flowing convectively or driven by the axial fan 190 through a tube-fin block of the condenser 130 and through the recess 180.
  • the refrigerant in the condenser 130 is cooled and optionally at least partially condensed. Subsequently, the refrigerant flows from the condenser 130 via the second refrigerant line back into the evaporator.
  • FIG. 2 shows an exploded view of a cooling device 210, which essentially corresponds to the cooling device 110 in FIG. 1.
  • the cooling device 210 has an evaporator 220, a condenser 230, a first refrigerant line 240 and a second cold line 245.
  • the first refrigerant line 240 connects an evaporator exit 250 to a concealed condenser entrance
  • the second refrigerant line 245 connects a concealed condenser exit to a concealed evaporator entrance.
  • the evaporator 220 is inserted into a tensioning device 260, with which the cooling device 210 in FIG. 2 is tensioned downward onto the heat-emitting component.
  • the tensioning device 260 has a first tension element 262 and a second tension element 263 as well as a tension web 264 arranged between the first and the second tension element.
  • first tension member 262 mounted in a nose on the heat-emitting component or a frame part connected to her counterpart and then also trained as eyelet and downwardly facing second tension element 263 pressed down and also hooked into a counterpart, whereby on the tensioning web 264 a clamping force on the inserted into a receptacle 266 of the clamping web 264 evaporator 220 acts, which presses the evaporator to the heat-emitting component down ,
  • the clamping direction is thus in Figs. 1 and 2 down.
  • the condenser 230 has a filling device 265, which is soldered to a tubular distribution container 232 of the capacitor 230.
  • the capacitor 230 is enclosed between on the one hand a substantially rectangular cover 270 with a frame 275 enclosing the capacitor 230 and a recess 280 and on the other hand an axial fan 290.
  • the evaporator 220 transfers heat from the exothermic component to the refrigerant therein in a protective sheath 222 and a cooling plate 224 which at least partially vaporizes.
  • the cooling plate preferably has cooling elements, such as ribs, knobs or pins, which project into the evaporator to be flowed around by refrigerant.
  • a lid 226 closes the evaporator 220 and optionally receives the cooling elements in it.
  • the refrigerant passes into the condenser 230 via the first refrigerant line 240.
  • the condenser 230 transfers heat from the refrigerant Air convectionally or driven by the axial fan 290 flows through a tube-and-fin interface 234 of the condenser 230 and through the recess 280 of the cover 270.
  • the axial fan 290 has a fan wheel with a hub 292, fan blades 294 and an outer ring 296, which circulates in a fan housing 298, driven by an electric fan motor concealed by the hub.
  • the refrigerant flows through a hidden condenser inlet into the distribution container 232 of the condenser 230 and is distributed to the flat tubes 236 of the tube-and-fin block 232, which in turn are soldered into tube openings of the distribution container 232.
  • the cooled and optionally condensed refrigerant is collected in the collecting container 238 and then flows back into the evaporator 220 via a condenser outlet via the second refrigerant line 245.
  • the condenser 230 and preferably also the evaporator 230 and the first and second refrigerant lines are made of a metal, preferably aluminum, or an alloy, preferably aluminum alloy, and soldered.
  • the cover 270, the individual parts of the axial fan 290 with the exception of the fan motor and / or the clamping device 260 are preferably made of plastic, preferably by an injection molding process.
  • the cooling device 310 has an evaporator 320, a condenser 330, a first refrigerant line 340 and a second refrigerant line 345.
  • the first refrigerant line 340 connects an evaporator exit 350 to a condenser inlet concealed by a cover 370
  • the second refrigerant line 345 connects a concealed condenser exit to an evaporator entrance 352.
  • An axial fan 390 connects to the condenser 330 and is located near the evaporator 320. so that between the axial fan 390 and the evaporator 320 no space for the application of a tensioning device remains.
  • the evaporator 320 transfers heat from a heat-emitting component via a cooling plate 324 to refrigerant therein, which at least partially vaporizes.
  • a lid 326 closes the evaporator 320 and receives any existing cooling elements in it.
  • the refrigerant passes into the condenser 330 via the first refrigerant line 340.
  • the condenser 330 transfers heat from the refrigerant to air, which flows convectionally or driven by the axial fan 390 through the condenser 330.
  • the cooled and possibly condensed refrigerant flows via a condenser outlet into the second refrigerant line 345 and from there back into the evaporator 320.
  • the circulation of the refrigerant is indicated in FIG. 3 by arrows.
  • the evaporator outlet 350 is arranged geodetically higher than the evaporator inlet 352. Since vapor bubbles in the refrigerant in the evaporator optionally rise, a transfer of the vapor bubbles via the evaporator outlet 350 into the first refrigerant line 340 is thus supported, but a passage of the vapor bubbles via the evaporator inlet 352 into the second refrigerant line 345 is hindered.
  • the circulation of the refrigerant is assisted in that the first refrigerant passage 340 has a diameter preferably larger by about one quarter than the second refrigerant passage 345.
  • FIG. 4 shows a cooling device 410 in a longitudinal section.
  • the cooling device 410 has an evaporator 420, a condenser 430, a first refrigerant line 440, and a second refrigerant line 445.
  • the first refrigerant line 440 connects an evaporator outlet 450 to a condenser inlet 455, and the second refrigerant line 445 connects a condenser outlet 458 to an evaporator inlet located in front of the drawing plane and therefore invisible.
  • a refrigerant shown in black passes from the evaporator 420 via the evaporator outlet 450, the first refrigerant line 440 and the condenser inlet 455 into a substantially cylindrical distribution container 432 of the condenser 430.
  • the condenser 430 transfers heat from the refrigerant Air flowing through the tube-rib block 434 of the condenser 430. After a transfer of heat to the air, the cooled and optionally condensed refrigerant is collected in a collecting container 438 and flows via the condenser outlet 458 into the second refrigerant line 445 and from there back into the evaporator 420.
  • the evaporator outlet 450 is arranged geodetically higher than the evaporator inlet. Moreover, the circulation of the refrigerant is assisted in that the first refrigerant pipe 440 has a diameter that is preferably larger than the second refrigerant pipe 445 by about one quarter.
  • a diameter of 10 mm for the first refrigerant pipe 440 and a diameter of 8 mm for the second refrigerant line are advantageous for the circulation of the refrigerant.
  • a simple construction may be provided by the provision of an outwardly projecting collar 451 on the evaporator exit 450 and / or an outwardly projecting collar 459 on the condenser outlet 458.
  • the collar 451 and the collar 459 each have a similar or larger internal diameter than the first or Second refrigerant line, so that no bottleneck for the refrigerant is formed.
  • the first and the second refrigerant line then have for attaching a first flared pipe end 441 and a second flared pipe end 446 with internal dimensions corresponding to the outer Shen dimensions of the collar 451 and the collar 459, on.
  • FIG. 5 shows a cooling device 510 in a cross section, which essentially corresponds to the cooling device 410 in FIG. 4.
  • the cooling device 510 has an evaporator 520, a condenser 530, a first refrigerant line not arranged in the drawing plane, and a second refrigerant line 545.
  • the second refrigerant line 545 connects a condenser outlet 558 with an evaporator inlet 552 and leaves the drawing plane in sections and is therefore not completely shown.
  • tube openings 531 are provided, into which flat tubes 536 are inserted and soldered.
  • the flat tubes 536 are divided by longitudinal dividing walls 539 into flow channels 535, wherein the flow channels 535 during a condensation of the Refrigerants are partially filled with refrigerant and in which condensed
  • Refrigerant also y gcenkuüih lilti w WiiIrUr 4 .
  • a simple construction may be provided by the provision of an outwardly projecting collar 559 at the condenser exit 558.
  • the collar 459 has a similar or larger internal diameter than the second refrigerant conduit 545 so that no constriction is created for the refrigerant.
  • the second refrigerant line 545 has a second flared pipe end 546 with inner dimensions corresponding to the outer dimensions of the collar 459 for attachment.
  • the cooling device 610 shows a cooling device 610, which is provided for cooling a heat-emitting component, not shown, preferably a processor of a calculating machine.
  • the cooling device 610 has an evaporator 620, a condenser 630, a first refrigerant line 640, and a second refrigerant line 645.
  • the evaporator 620 is inserted into a tensioning device 660, with which the cooling device 610 is tensioned onto the heat-emitting component.
  • the condenser 630 has a filling device 665, which is soldered to a tubular distribution container 632 of the capacitor 630.
  • the capacitor 630 is enclosed between a cover, not shown, and an axial fan 690.
  • the existing from the evaporator 620, the condenser 630 and the first and second refrigerant line refrigerant circuit is first evacuated before use via the filling device 665 and then filled with refrigerant.
  • FIG. 6 shows the distribution container 632 has a capacitor input 655 for insertion and soldering of the first refrigerant line 640 and a filling opening 656 for soldering the filling device 665.
  • the substantially cylindrical filling device 665 is arranged as a nozzle on the longitudinal side of the tubular distribution container 632.
  • a third refrigerant line is connected to a valve housing 666 of the filling device 665 designed as a valve by screwing a coupling element arranged at the end of the third refrigerant line onto the valve housing 666.
  • the coupling element displaces a valve insert 668 in a channel 669 in Fig. 7 to the left in a filling position, wherein a spring element not shown within the valve core 668, which is supported via a stop element 667 at the filling opening 656 of the distribution container 632 or on the valve housing 666 , is tense.
  • the cooling device 610 is first evacuated via the channel 669 and the third refrigerant line released through the valve insert 668 in the filling position, and then filled with refrigerant via the third refrigerant line and the channel 669. Subsequently, the coupling element is unscrewed again from the filling device, wherein the spring element in the valve insert 668, possibly supported by an overpressure of the refrigerant in the cooling device 610, the valve insert 668 moves in Fig. 7 to the right in a closed position in which the valve core 668th the channel 669 blocked and seals by means of at least one sealing ring.
  • FIG. 8 shows the cooling device 610 from FIG. 6 in a side view.
  • the tube-ribbed network 634 is arranged between the cylindrical distribution container 632 and a likewise cylindrical collecting container 638 of the condenser 630.
  • the filling device is arranged at right angles to the tube-rib network on the distribution container.
  • FIG. 9 shows a tensioning device 910, which is provided for pressing a cooling body on to a heat-emitting component, for example to a processor of a calculating machine, in a perspective view.
  • the tensioning device 910 has a first tension element 920 and a second tension element 930 as well as a tension web 940 arranged therebetween.
  • the chuck 940 has a receptacle 950 for a heat sink and a concealed first retaining element 960 and a second retaining element 970.
  • the heat sink in Fig. 9 is first inserted from above into the receptacle.
  • a lateral first projection of the heat sink is thereby pushed under the holding element 960 formed as a shoulder, after which a first projection opposite the second projection of the heat sink is pressed under the second holding element 970.
  • This is made possible by an elastic receding of the rear part web 945 of the clamping web 940 and facilitated by an inclined ramp 975 of the second holding element 970.
  • a supernatant of the cooling plate relative to the lid of the evaporator serves as a projection.
  • the heat sink has a stop for the clamping device 910 upwards, so that the clamping device 910 is fixed after insertion of the heat sink into the receptacle 950 on the heat sink.
  • the first and / or second refrigerant line fixedly connected to the evaporator and used as a stop serves as a stop.
  • the heat sink assembly obtained in this way is finally tensioned onto the heat-emitting component or a frame connected to it, for example an electronic circuit board.
  • a frame connected to it for example an electronic circuit board.
  • first designed as a downwardly facing eyelet first pulling element 920 mounted in a nose on the frame and then the second tension member 930 depressed and also hooked into a nose.
  • the clamping device 910 has a receptacle 980 for a tool, such as a screwdriver, in the region of the second pulling element 930.
  • FIG. 10 shows six side views of a clamping device 1010, the
  • Clamping device 910 in Fig. 9 substantially corresponds, from six different sides.
  • the tensioning device 1010 has a first pulling element 1020 and a second tension member 1030 and a clamping web 1040 arranged therebetween.
  • the clamping web 1040 has a receptacle 1050 for a heat sink and a first holding element 1060 and a second holding element 1070.
  • the heat sink For pressing the heat sink to the heat-emitting component, the heat sink is first inserted in the clamping direction in the recording. A lateral first projection of the heat sink is thereby pushed under the holding element 1060 formed as a step, after which a first projection opposite the second projection of the heat sink is pressed under the second holding element 1070. This is made possible by an elastic retraction of the rear part web 1045 of the clamping web 1040 and facilitated by an inclined ramp 1075 of the second holding element 1070.
  • the heat sink assembly obtained in this way is finally tensioned onto the heat-emitting component or a frame connected to it, for example an electronic circuit board.
  • a frame connected to it for example an electronic circuit board.
  • the clamping device 1010 has a receptacle 1080 for a tool, such as a screwdriver, in the region of the second pulling element 1030.
  • the second pulling element 1030 is designed as a bow which can be pivoted outwards, preferably a metal bow, and has a projection 1035 as an assembly aid.
  • the second traction element 1030 can thus be swung in the depressed state easily into the counterpart intended for this purpose, for example in a nose, and then released via the projection 1035.
  • the clamping web 1040 is then stretched and generates a clamping force which is transmitted via the tension elements as a tensile force and the heat sink as a compressive force on the heat-emitting component, so that a sufficient heat transfer from the heat-emitting component is ensured on the heat sink.
  • the invention has been described by way of example with reference to a cooling device for an electronic component, but is not limited to the described embodiments. It should be noted that the present invention is otherwise applicable. All described objects can be combined with each other. Likewise, all features of each item described are arbitrarily combinable or replaceable with all the features of the other items.

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

L'invention concerne un dispositif de serrage destiné à presser un corps froid dans un sens de serrage sur un composant dégageant de la chaleur.
PCT/EP2007/002040 2006-03-09 2007-03-08 Dispositif de serrage pour un ensemble de corps de refroidissement WO2007101697A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP07723127A EP1999787A1 (fr) 2006-03-09 2007-03-08 Dispositif de serrage pour un ensemble de corps de refroidissement

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102006011332.2 2006-03-09
DE200610011332 DE102006011332A1 (de) 2006-03-09 2006-03-09 Spannvorrichtung, Kühlkörperanordnung und Vorrichtung zur Kühlung

Publications (1)

Publication Number Publication Date
WO2007101697A1 true WO2007101697A1 (fr) 2007-09-13

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ID=38283237

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2007/002040 WO2007101697A1 (fr) 2006-03-09 2007-03-08 Dispositif de serrage pour un ensemble de corps de refroidissement

Country Status (3)

Country Link
EP (1) EP1999787A1 (fr)
DE (1) DE102006011332A1 (fr)
WO (1) WO2007101697A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008155883A1 (fr) 2007-06-15 2008-12-24 Nikon Corporation Dispositif de microscope confocal

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE20112851U1 (de) * 2001-07-06 2001-10-04 Chen Char Her Kühlaggregat für Zentraleinheit
DE20303845U1 (de) * 2003-03-03 2003-05-15 Woehr Richard Gmbh Kühlvorrichtung mit lüfterlosem Flüssigkeitskühler für einen auf einer Grundplatte getragenen Prozessor
US6646880B1 (en) * 2002-07-10 2003-11-11 Hon Hai Precision Ind. Co., Ltd. Heat sink clip
US6648664B1 (en) * 2002-08-13 2003-11-18 Hon Hai Precision Ind. Co., Ltd. Foldable retention device for pressing a heat sink to an electronic package mounted on a socket connector
US20040114332A1 (en) * 2002-12-13 2004-06-17 Lee Hsieh Kun Heat sink clip assembly with cammed clip handles
US20040125567A1 (en) * 2002-12-31 2004-07-01 Lee Hsieh Kun Heat sink clip with pivoting locking portions
US20040170001A1 (en) * 2003-02-27 2004-09-02 Lee Hsieh Kun Heat sink mounting assembly
US20060042787A1 (en) * 2004-08-25 2006-03-02 Foxconn Technology Co., Ltd. Heat dissipation device having cap for protecting thermal interface material thereon

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE20112851U1 (de) * 2001-07-06 2001-10-04 Chen Char Her Kühlaggregat für Zentraleinheit
US6646880B1 (en) * 2002-07-10 2003-11-11 Hon Hai Precision Ind. Co., Ltd. Heat sink clip
US6648664B1 (en) * 2002-08-13 2003-11-18 Hon Hai Precision Ind. Co., Ltd. Foldable retention device for pressing a heat sink to an electronic package mounted on a socket connector
US20040114332A1 (en) * 2002-12-13 2004-06-17 Lee Hsieh Kun Heat sink clip assembly with cammed clip handles
US20040125567A1 (en) * 2002-12-31 2004-07-01 Lee Hsieh Kun Heat sink clip with pivoting locking portions
US20040170001A1 (en) * 2003-02-27 2004-09-02 Lee Hsieh Kun Heat sink mounting assembly
DE20303845U1 (de) * 2003-03-03 2003-05-15 Woehr Richard Gmbh Kühlvorrichtung mit lüfterlosem Flüssigkeitskühler für einen auf einer Grundplatte getragenen Prozessor
US20060042787A1 (en) * 2004-08-25 2006-03-02 Foxconn Technology Co., Ltd. Heat dissipation device having cap for protecting thermal interface material thereon

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008155883A1 (fr) 2007-06-15 2008-12-24 Nikon Corporation Dispositif de microscope confocal

Also Published As

Publication number Publication date
DE102006011332A1 (de) 2007-09-20
EP1999787A1 (fr) 2008-12-10

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