WO2007094616A1 - Load-lock chamber for vacuum processing of substrate - Google Patents

Load-lock chamber for vacuum processing of substrate Download PDF

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Publication number
WO2007094616A1
WO2007094616A1 PCT/KR2007/000794 KR2007000794W WO2007094616A1 WO 2007094616 A1 WO2007094616 A1 WO 2007094616A1 KR 2007000794 W KR2007000794 W KR 2007000794W WO 2007094616 A1 WO2007094616 A1 WO 2007094616A1
Authority
WO
WIPO (PCT)
Prior art keywords
load
lock chamber
side wall
substrate
vacuum processing
Prior art date
Application number
PCT/KR2007/000794
Other languages
French (fr)
Inventor
Chang Su Kim
Tea Woo Rho
Original Assignee
Brooks Automation Asia Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Brooks Automation Asia Ltd. filed Critical Brooks Automation Asia Ltd.
Publication of WO2007094616A1 publication Critical patent/WO2007094616A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber

Definitions

  • the present invention relates to a load-lock chamber for vacuum processing of substrate, and more particularly, to a load-lock chamber for vacuum processing of substrate in which a side wall and bottom plate thereof have corresponding stepped adhesion portions respectively and are coupled to each other through a welding and bolting.
  • a flat panel display as a display element is in the limelight.
  • the flat panel display divides into a liquid crystal display, a plasma display panel, an organic light emitting diodes and so on.
  • the liquid crystal display is manufactured by an evaporation process for evaporating a dielectric material and so forth on the glass substrate in the form of a thin film, a photolithography process for exposing or covering up the selected areas of the thin film, and etching process for removing the selected areas in order to be patterned according to the intent, and a washing process for removing the residue.
  • evaporation process for evaporating a dielectric material and so forth on the glass substrate in the form of a thin film
  • a photolithography process for exposing or covering up the selected areas of the thin film
  • etching process for removing the selected areas in order to be patterned according to the intent
  • a washing process for removing the residue.
  • a vacuum processing device includes a processing chamber for conducting a plasma process and so on, a load-lock chamber, a transfer chamber and so forth.
  • the chamber for vacuum process can be arranged in process order or a plurality of chamber can be arranged around the transfer chamber in a cluster.
  • Korean patent publication No. 2005-0122090 discloses a separating type vacuum chamber of a panel fabrication device for flat panel display including a top plate located at the upper portion of the chamber, a bottom plate opposed to the top plate and located at the lower portion of the chamber, a wall plate having an internal airtight space and a protrusion protruded along the inner circumference of the chamber in order to form a stepped portion at an end portion connected to the bottom plate, a cover member for covering the bottom plate and the upper portion of the protrusion formed at the end of the wall plate connected to the bottom plate along the inner circumference of the chamber, and a sealing member for shielding the inside of the chamber interposed between the bottom plate and the upper portion of the protrusion and the cover member.
  • Korean patent publication No. 2005-0113574 discloses a vacuum chamber for vacuum process device capable of freely separating including a chamber body of a polygonal frame type having an opening, a polygonal side frame attached and deattached to at least one side of the chamber body and having an opening, each top plate bonded to the each top surface of the chamber body and the side frame having the opening, and each bottom plate bonded to the each bottom surface of the chamber body and the side frame having the opening.
  • Korean patent publication No. 2005-0086265 discloses a separating vacuum chamber for fabricating a liquid crystal display, in that a chamber structure having a wall surface of the vacuum chamber is divided into at least two pieces and the manufactured pieces are assembled with the inner parts.
  • Korean patent publication No. 2005-0071933 discloses a window for vacuum chamber having an outer circumference portion of a metal material and a transparent central portion including a doorframe, a sealing portion made of an elastic material attached to a sealing member path formed at a predetermined region of the inside of the outer circumference portion, a plurality of link supporters protruded at a predetermined region of one side of the doorframe and having a first link coupling groove, a chamber coupling portion coupled to a predetermined region of the vacuum chamber body and having a second link coupling groove, a first link portion having the first link coupling groove and a first link pin, a second link portion having the second link coupling groove and a second link pin, a link connection portion having a third link groove connected to the first link coupling groove and the first link pin, a fourth link groove connected to the second link coupling groove and the second link pin, and a connector, and a coupling portion having a plurality of coupling bolts, which are penetrated through a plurality of coupling
  • Korean patent publication No. 2005-0062190 discloses a vacuum chamber vessel including a top case, bottom case, a vacuum chamber touched with the top and bottom cases and having a part including an opening portion of a vacuum packing paper exposed to the inside thereof, a storage chamber for receiving the remainder of the vacuum packing paper touched with the top and bottom cases, an outer chamber touched with the top and bottom cases, and a vacuum valve for opening and closing the air passage passing through the outer chamber formed at any one side of the top case or bottom case, wherein the outer chamber surrounds the vacuum chamber and storage chamber and check valves are formed at the vacuum chamber and storage chamber so as to pass the internal air through the outer chamber.
  • Korean patent publication No. 2004-0060599 discloses a vacuum chamber including a first ingot having a bottom surface and a side surface, a second ingot having a side surface identical with that of the first ingot, and a bonding means for bonding ad sealing the first ingot and the second ingot.
  • Japanese patent publication No. 2006-137995 discloses a vacuum chamber including a polyhedral chamber body having a processing space, an opening passing through the processing space, a sealing means for covering the opening and maintaining the vacuum status of the processing space, wherein the chamber body includes a plurality of chamber pieces and flange portions are extended from at least one bonding surface of each chamber piece, so that the opposed flange portions are bonded to each other to complete the assemble of the chamber body.
  • Japanese patent publication No. 2004-363601 discloses a transfer chamber for cluster having process chambers for processing a processing object and connecting to each other and a transfer space for transferring the processing object to each processing chamber, wherein the transfer chamber includes a first body and a second body connected to the first body and having a space for transferring the processing object with the first body.
  • the conventional vacuum processing device of a cluster type includes a plurality of process chambers, the load-lock chamber connected to the process chambers around the transfer chamber, and a cassette for loading a plurality of substrates connected to one side surface of the load-lock chamber.
  • the load-lock chamber is repeatedly controlled in a vacuum and air pressure and the substrates are carried in and out the load-lock chamber.
  • the conventional load- lock chamber 100 for vacuum processing of substrate includes a body 110 and a cover 120 mounted on the top surface of the body 110.
  • the body 110 divides into a side wall 112 and a bottom plate 111 and then, the adherence surfaces between them are welded to complete the production thereof.
  • O-ring 130 is interposed between them.
  • a vacuum pressure is applied to the conventional load-lock chamber 100 for vacuum processing of substrate during manufacturing thereof.
  • the strength is concentrated on the welding surface 113. That is, since a high pressure is applied to an end portion of the top plate and an inner surface of the side wall, there is a problem in that they can be damaged owing to the high pressure.
  • an object of the present invention is to provide to a load-lock chamber for vacuum processing of substrate in which a side wall and bottom plate thereof have corresponding stepped adhesion portions respectively and are coupled to each other through a welding and bolting, so that a vacuum pressure is dispersed in the direction of the stepped thickness.
  • Another object of the present invention is to provide to a load- lock chamber for vacuum processing of substrate capable of preventing a body and top plate made of a metal such as aluminum or stainless from being contacted with each other as though the load- lock chamber is repeatedly controlled in a vacuum and air pressure.
  • a load-lock chamber for vacuum processing of substrate comprising: a bottom plate 11 having a stepped portion formed at an end portion thereof; a side wall 12 having anther stepped portion coupled and adhered to the stepped portion of the bottom plate 11 and an O- ring groove 15 formed at a top surface thereof; an O-ring inserted into the O-ring groove 15; and a cover 20 coupled to the top portion of the side wall 12 through the O- ring interposed between them.
  • the side wall 12 and the bottom plate 11 are coupled to each other by means of a welding and a bolting.
  • the load- lock chamber for vacuum processing of substrate further comprises a groove 13 for caving a head of the bolt 40 in the side wall 12.
  • the load-lock chamber for vacuum processing of substrate can be applied to a process chamber or a transfer chamber and so on.
  • the side wall and bottom plate thereof are coupled to each other through the welding and bolting, so that the coherence is more strengthened.
  • the load-lock chamber is repeatedly controlled in a vacuum and air pressure, it can prevent the body and top plate from being contacted with each other, so that the particle problem caused by the contact between the top plate and side wall and the abrasion phenomenon can be solved.
  • FIG. 1 is a sectional view illustrating a conventional load-lock chamber for vacuum processing of substrate
  • FIG. 2 is a sectional view illustrating a load- lock chamber for vacuum processing of substrate according to the present invention
  • FIG. 3 is a perspective view illustrating a load-lock chamber of FIG. 2;
  • FIG. 4 is a sectional view illustrating a load- lock chamber for vacuum processing of substrate according to another embodiment of the present invention.
  • FIG. 5 is a sectional view illustrating an abrasion phenomenon caused by a direct contact between a side wall and a top plate of the load-lock chamber
  • FIG. 6 and FIG. 7 are sectional views illustrating a load-lock chamber for vacuum processing of substrate according to further another embodiment of the present invention.
  • FIG. 8 and FIG. 9 are perspective views illustrating a load-lock chamber for vacuum processing of substrate according to further another embodiment of the present invention.
  • FIG. 1 is a sectional view illustrating a conventional load-lock chamber for vacuum processing of substrate
  • FIG. 2 is a sectional view illustrating a load-lock chamber for vacuum processing of substrate according to the present invention
  • FIG. 3 is a perspective view illustrating a load-lock chamber of FIG. 2
  • FIG. 4 is a sectional view illustrating a load-lock chamber for vacuum processing of substrate according to another embodiment of the present invention
  • FIG. 5 is a sectional view illustrating an abrasion phenomenon caused by a direct contact between a side wall and a top plate of the load-lock chamber
  • FIG. 6 and FIG. 7 are sectional views illustrating a load-lock chamber for vacuum processing of substrate according to further another embodiment of the present invention
  • FIG. 8 and FIG. 9 are perspective views illustrating a load-lock chamber for vacuum processing of substrate according to further another embodiment of the present invention.
  • the load-lock chamber 1 for vacuum processing of substrate includes a body 10, a bottom plate 11, a side wall 12, an inner side wall 12a, an outer side wall 12b, a groove 13, an O-ring 14, an O-ring groove 15, an adhesion portion 16, a top plate 20, welding surfaces 31 and 32, a bolt 40, a bolt head 40a, a fixing member 50, and a protrusion 60.
  • the load-lock chamber 1 for vacuum processing of substrate includes a bottom plate 11 having a stepped portion formed at an end portion thereof, a side wall 12 having anther stepped portion coupled and adhered to the stepped portion of the bottom plate 11 and an O- ring groove 15 formed at a top surface thereof, an O-ring inserted into the O-ring groove 15, and a top plate 20 as a cover coupled to the top portion of the side wall 12 through the O-ring 14 interposed between them.
  • the side wall 12 and the bottom plate 11 are coupled to each other by means of a welding and a bolting.
  • the load-lock chamber 1 for vacuum processing of substrate according to the present invention further includes a groove 13 for caving the head of the bolt 40 in the side wall 12 and a fixing member filled into the groove 13 so as to prevent the bolt 40 from being separated from the side wall owing to external surroundings.
  • the load- lock chamber 1 for vacuum processing of substrate the body 10 and the cover 20.
  • the body 10 includes the bottom plate 11 and the side wall 12 having stepped portions located at the adhered end portions thereof respectively.
  • the stepped portion of two stairs is formed at the end portion of the bottom plate 11 and another stepped portion of two stairs is formed at the end portion of the side wall 12 in order to stick the stepped portions of the bottom plate 11 and side wall 12 to each other. That is, the stepped end portion of the bottom plate 11 is adhered to the bottom end portion of the side wall 12 and then, the bolt 40 is successively penetrated through the side wall 12 and the bottom plate 11 to horizontally coupled to each other in the direction of an inside thereof.
  • the bolt can be coupled vertically or in two rows.
  • the cover 20 is coupled to the top portion of the side wall 12 through the O-ring 14 interposed between them to completely manufacture the load- lock chamber 1.
  • the stepped portion may be three or four stairs.
  • the vacuum pressure can be more dispersed.
  • the coherence is more strengthened owing to the bolting.
  • the fixing member 50 may be metal or synthetic resins and so on.
  • the adherence portion between the top plate 20 and side wall 12 can be discolored and abraded.
  • the load-lock chamber 1 includes the body having the
  • the top surface of the side wall is stepped in order that the top surface of the inner wall 12a of the side wall 12 is not contacted with the top plate 20.
  • the protrusion 60 of a nonmetal such as Teflon and so on is formed at the top surface of the outer wall 12b or the bottom surface of the top plate 20.
  • the material of the protrusion 60 is Teflon. Besides, it may be other nonmetal.
  • the top surface of the inner wall 12a of the side wall 12 is not contacted with the top plate 20.
  • the protrusion 60 made of Teflon material is interposed between the top surface of the outer wall 12b and the bottom surface of the top plate 20, so that the top surface of the inner wall 12a of the side wall 12 is not contacted with the top plate 20, thereby the adherence portion between the top plate 20 and side wall 12 is not discolored and abraded. Accordingly, it can prevent a particle problem caused by the contact between the top plate 20 and side wall 12 of metal material.
  • a plurality of protrusions 60 of a cylindrical type is attached to the top surface of outer wall 12b.
  • a protrusion 60' of a continuous band type is formed along the top surface of outer wall 12b.
  • the protrusions shown in FIG. 8 and FIG. 9 can be forcibly inserted into and coupled to an insertion groove (not shown) formed at the top surface of outer wall 12b.
  • a cutting portion is formed at the top surface of outer wall 12b and the protrusion higher than the cutting portion is adhered to the cutting portion and then, a bolt 40 is successively penetrated through the protrusion and side wall so as to be coupled to each other.
  • the present invention relates to a load-lock chamber for vacuum processing of substrate in which a side wall and bottom plate thereof have corresponding stepped adhesion portions respectively and are coupled to each other through a welding and bolting.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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  • Drying Of Semiconductors (AREA)

Abstract

The present invention relates to a load-lock chamber for vacuum processing of substrate including a bottom plate 11 having a stepped portion formed at an end portion thereof, a side wall 12 having anther stepped portion coupled and adhered to the stepped portion of the bottom plate 11 and an O-ring groove 15 formed at a top surface thereof, an O-ring inserted into the O- ring groove 15, and a top plate 20 as a cover coupled to the top portion of the side wall 12 through the O-ring 14 interposed between them. The side wall 12 and the bottom plate 11 are coupled to each other by means of a welding and a bolting.

Description

Description
LOAD-LOCK CHAMBER FOR VACUUM PROCESSING OF
SUBSTRATE
Technical Field
[1] The present invention relates to a load-lock chamber for vacuum processing of substrate, and more particularly, to a load-lock chamber for vacuum processing of substrate in which a side wall and bottom plate thereof have corresponding stepped adhesion portions respectively and are coupled to each other through a welding and bolting. Background Art
[2] Recently, according to a rapid progress and growth of market of a telecommunication technique, a flat panel display as a display element is in the limelight. The flat panel display divides into a liquid crystal display, a plasma display panel, an organic light emitting diodes and so on.
[3] Here, the liquid crystal display is manufactured by an evaporation process for evaporating a dielectric material and so forth on the glass substrate in the form of a thin film, a photolithography process for exposing or covering up the selected areas of the thin film, and etching process for removing the selected areas in order to be patterned according to the intent, and a washing process for removing the residue. Each process is performed in a chamber of the optimum surroundings.
[4] A vacuum processing device includes a processing chamber for conducting a plasma process and so on, a load-lock chamber, a transfer chamber and so forth. Here, the chamber for vacuum process can be arranged in process order or a plurality of chamber can be arranged around the transfer chamber in a cluster.
[5] As a representative prior art, Korean patent publication No. 2005-0122090 discloses a separating type vacuum chamber of a panel fabrication device for flat panel display including a top plate located at the upper portion of the chamber, a bottom plate opposed to the top plate and located at the lower portion of the chamber, a wall plate having an internal airtight space and a protrusion protruded along the inner circumference of the chamber in order to form a stepped portion at an end portion connected to the bottom plate, a cover member for covering the bottom plate and the upper portion of the protrusion formed at the end of the wall plate connected to the bottom plate along the inner circumference of the chamber, and a sealing member for shielding the inside of the chamber interposed between the bottom plate and the upper portion of the protrusion and the cover member.
[6] Korean patent publication No. 2005-0113574 discloses a vacuum chamber for vacuum process device capable of freely separating including a chamber body of a polygonal frame type having an opening, a polygonal side frame attached and deattached to at least one side of the chamber body and having an opening, each top plate bonded to the each top surface of the chamber body and the side frame having the opening, and each bottom plate bonded to the each bottom surface of the chamber body and the side frame having the opening.
[7] Korean patent publication No. 2005-0086265 discloses a separating vacuum chamber for fabricating a liquid crystal display, in that a chamber structure having a wall surface of the vacuum chamber is divided into at least two pieces and the manufactured pieces are assembled with the inner parts.
[8] Korean patent publication No. 2005-0071933 discloses a window for vacuum chamber having an outer circumference portion of a metal material and a transparent central portion including a doorframe, a sealing portion made of an elastic material attached to a sealing member path formed at a predetermined region of the inside of the outer circumference portion, a plurality of link supporters protruded at a predetermined region of one side of the doorframe and having a first link coupling groove, a chamber coupling portion coupled to a predetermined region of the vacuum chamber body and having a second link coupling groove, a first link portion having the first link coupling groove and a first link pin, a second link portion having the second link coupling groove and a second link pin, a link connection portion having a third link groove connected to the first link coupling groove and the first link pin, a fourth link groove connected to the second link coupling groove and the second link pin, and a connector, and a coupling portion having a plurality of coupling bolts, which are penetrated through a plurality of coupling grooves formed at a predetermined area of the outer circumference portion, coupled to the vacuum chamber in order to couple the doorframe to the vacuum chamber.
[9] Korean patent publication No. 2005-0062190 discloses a vacuum chamber vessel including a top case, bottom case, a vacuum chamber touched with the top and bottom cases and having a part including an opening portion of a vacuum packing paper exposed to the inside thereof, a storage chamber for receiving the remainder of the vacuum packing paper touched with the top and bottom cases, an outer chamber touched with the top and bottom cases, and a vacuum valve for opening and closing the air passage passing through the outer chamber formed at any one side of the top case or bottom case, wherein the outer chamber surrounds the vacuum chamber and storage chamber and check valves are formed at the vacuum chamber and storage chamber so as to pass the internal air through the outer chamber.
[10] Korean patent publication No. 2004-0060599 discloses a vacuum chamber including a first ingot having a bottom surface and a side surface, a second ingot having a side surface identical with that of the first ingot, and a bonding means for bonding ad sealing the first ingot and the second ingot.
[11] Japanese patent publication No. 2006-137995 discloses a vacuum chamber including a polyhedral chamber body having a processing space, an opening passing through the processing space, a sealing means for covering the opening and maintaining the vacuum status of the processing space, wherein the chamber body includes a plurality of chamber pieces and flange portions are extended from at least one bonding surface of each chamber piece, so that the opposed flange portions are bonded to each other to complete the assemble of the chamber body.
[12] Japanese patent publication No. 2004-363601 discloses a transfer chamber for cluster having process chambers for processing a processing object and connecting to each other and a transfer space for transferring the processing object to each processing chamber, wherein the transfer chamber includes a first body and a second body connected to the first body and having a space for transferring the processing object with the first body.
[13] In the meantime, the conventional vacuum processing device of a cluster type includes a plurality of process chambers, the load-lock chamber connected to the process chambers around the transfer chamber, and a cassette for loading a plurality of substrates connected to one side surface of the load-lock chamber. The load-lock chamber is repeatedly controlled in a vacuum and air pressure and the substrates are carried in and out the load-lock chamber.
[14] Referring to FIG. 1, the conventional load- lock chamber 100 for vacuum processing of substrate includes a body 110 and a cover 120 mounted on the top surface of the body 110. The body 110 divides into a side wall 112 and a bottom plate 111 and then, the adherence surfaces between them are welded to complete the production thereof.
[15] Also, in case that the cover 120 is coupled to the top surface of the side wall 112, an
O-ring 130 is interposed between them.
[16] Here, a vacuum pressure is applied to the conventional load-lock chamber 100 for vacuum processing of substrate during manufacturing thereof. In this case, the strength is concentrated on the welding surface 113. That is, since a high pressure is applied to an end portion of the top plate and an inner surface of the side wall, there is a problem in that they can be damaged owing to the high pressure.
[17] In order to solve the problem, the bead size of the welding surface becomes larger and a separated reinforcement material is required. Disclosure of Invention Technical Problem
[18] Accordingly, the present invention has been made to solve the above-mentioned problems occurring in the prior art, and an object of the present invention is to provide to a load-lock chamber for vacuum processing of substrate in which a side wall and bottom plate thereof have corresponding stepped adhesion portions respectively and are coupled to each other through a welding and bolting, so that a vacuum pressure is dispersed in the direction of the stepped thickness.
[19] Another object of the present invention is to provide to a load- lock chamber for vacuum processing of substrate capable of preventing a body and top plate made of a metal such as aluminum or stainless from being contacted with each other as though the load- lock chamber is repeatedly controlled in a vacuum and air pressure. Technical Solution
[20] To achieve the above object of the present invention, there is provided a load-lock chamber for vacuum processing of substrate comprising: a bottom plate 11 having a stepped portion formed at an end portion thereof; a side wall 12 having anther stepped portion coupled and adhered to the stepped portion of the bottom plate 11 and an O- ring groove 15 formed at a top surface thereof; an O-ring inserted into the O-ring groove 15; and a cover 20 coupled to the top portion of the side wall 12 through the O- ring interposed between them.
[21] Preferably, the side wall 12 and the bottom plate 11 are coupled to each other by means of a welding and a bolting.
[22] Preferably, the load- lock chamber for vacuum processing of substrate further comprises a groove 13 for caving a head of the bolt 40 in the side wall 12.
[23] The load-lock chamber for vacuum processing of substrate can be applied to a process chamber or a transfer chamber and so on.
Advantageous Effects
[24] As described above, according to the load- lock chamber for vacuum processing of substrate, a plurality of plates is assembled, so that the manufacturing process is simple and the side wall and bottom plate thereof have corresponding stepped adhesion portions respectively, so that the vacuum pressure applied to the side wall is dispersed.
[25] Also, the side wall and bottom plate thereof are coupled to each other through the welding and bolting, so that the coherence is more strengthened.
[26] Moreover, as though the load-lock chamber is repeatedly controlled in a vacuum and air pressure, it can prevent the body and top plate from being contacted with each other, so that the particle problem caused by the contact between the top plate and side wall and the abrasion phenomenon can be solved. Brief Description of the Drawings
[27] The above as well as the other objects, features and advantages of the present invention will be more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which:
[28] FIG. 1 is a sectional view illustrating a conventional load-lock chamber for vacuum processing of substrate;
[29] FIG. 2 is a sectional view illustrating a load- lock chamber for vacuum processing of substrate according to the present invention;
[30] FIG. 3 is a perspective view illustrating a load-lock chamber of FIG. 2;
[31] FIG. 4 is a sectional view illustrating a load- lock chamber for vacuum processing of substrate according to another embodiment of the present invention;
[32] FIG. 5 is a sectional view illustrating an abrasion phenomenon caused by a direct contact between a side wall and a top plate of the load-lock chamber;
[33] FIG. 6 and FIG. 7 are sectional views illustrating a load-lock chamber for vacuum processing of substrate according to further another embodiment of the present invention; and
[34] FIG. 8 and FIG. 9 are perspective views illustrating a load-lock chamber for vacuum processing of substrate according to further another embodiment of the present invention.
Best Mode for Carrying Out the Invention
[35] A preferred embodiment of the invention will be described in detail below with reference to the accompanying drawings.
[36] FIG. 1 is a sectional view illustrating a conventional load-lock chamber for vacuum processing of substrate, FIG. 2 is a sectional view illustrating a load-lock chamber for vacuum processing of substrate according to the present invention, FIG. 3 is a perspective view illustrating a load-lock chamber of FIG. 2, FIG. 4 is a sectional view illustrating a load-lock chamber for vacuum processing of substrate according to another embodiment of the present invention, FIG. 5 is a sectional view illustrating an abrasion phenomenon caused by a direct contact between a side wall and a top plate of the load-lock chamber, FIG. 6 and FIG. 7 are sectional views illustrating a load-lock chamber for vacuum processing of substrate according to further another embodiment of the present invention, and FIG. 8 and FIG. 9 are perspective views illustrating a load-lock chamber for vacuum processing of substrate according to further another embodiment of the present invention.
[37] As shown, the load-lock chamber 1 for vacuum processing of substrate according to the present invention includes a body 10, a bottom plate 11, a side wall 12, an inner side wall 12a, an outer side wall 12b, a groove 13, an O-ring 14, an O-ring groove 15, an adhesion portion 16, a top plate 20, welding surfaces 31 and 32, a bolt 40, a bolt head 40a, a fixing member 50, and a protrusion 60.
[38] As shown in FIG. 2 and FIG. 3, the load-lock chamber 1 for vacuum processing of substrate according to the present invention includes a bottom plate 11 having a stepped portion formed at an end portion thereof, a side wall 12 having anther stepped portion coupled and adhered to the stepped portion of the bottom plate 11 and an O- ring groove 15 formed at a top surface thereof, an O-ring inserted into the O-ring groove 15, and a top plate 20 as a cover coupled to the top portion of the side wall 12 through the O-ring 14 interposed between them.
[39] The side wall 12 and the bottom plate 11 are coupled to each other by means of a welding and a bolting.
[40] As shown in FIG. 4, the load-lock chamber 1 for vacuum processing of substrate according to the present invention further includes a groove 13 for caving the head of the bolt 40 in the side wall 12 and a fixing member filled into the groove 13 so as to prevent the bolt 40 from being separated from the side wall owing to external surroundings.
[41] As described above, the load- lock chamber 1 for vacuum processing of substrate according to the present invention the body 10 and the cover 20. Also, the body 10 includes the bottom plate 11 and the side wall 12 having stepped portions located at the adhered end portions thereof respectively.
[42] More concretely, the stepped portion of two stairs is formed at the end portion of the bottom plate 11 and another stepped portion of two stairs is formed at the end portion of the side wall 12 in order to stick the stepped portions of the bottom plate 11 and side wall 12 to each other. That is, the stepped end portion of the bottom plate 11 is adhered to the bottom end portion of the side wall 12 and then, the bolt 40 is successively penetrated through the side wall 12 and the bottom plate 11 to horizontally coupled to each other in the direction of an inside thereof. Here, the bolt can be coupled vertically or in two rows.
[43] In the meantime, the adhered portions of the side wall 12 and the bottom plate 11 are welded. In this embodiment of the present invention, two welding surfaces 31 and 32 are formed at inner and outer surfaces of the chamber respectively.
[44] After the body 10 is assembled as described above, the cover 20 is coupled to the top portion of the side wall 12 through the O-ring 14 interposed between them to completely manufacture the load- lock chamber 1.
[45] The operation of the load-lock chamber 1 for vacuum processing of substrate according to the present invention having the above structure will be described in detail below.
[46] Firstly, since the stepped portions are formed at the adhered portions of the bottom plate 11 and the side wall 12, the vacuum pressure is dispersed in the direction of the stepped thickness.
[47] Here, according to the condition thereof, the stepped portion may be three or four stairs. In this case, the vacuum pressure can be more dispersed. Also, the coherence is more strengthened owing to the bolting.
[48] Also, as shown in FIG. 4, since the groove 13 is formed at the side wall 12 of the chamber so as to cave the head 40a of the bolt 40 in the side wall 12 and the fixing member 50 is filled into the groove 13 in a state that the head 40a of the bolt 40 is received in the groove, it can prevent the bolt 40 from being arbitrary released, thereby more strengthening the coherence.
[49] The fixing member 50 may be metal or synthetic resins and so on.
[50] By means of the load- lock chamber 1 having the above construction, since the strength is applied in the direction of the inside of the chamber 1 through the vacuum pressure of the top plate 20, it can prevent the top plate 20 from being convexly bent downward.
[51] Here, as shown in FIG. 5, in the chamber 1, the adherence portion between the top plate 20 and side wall 12 can be discolored and abraded.
[52] Accordingly, in order to previously prevent the abrasion, the shape of the load-lock chamber 1 can be changed.
[53] That is, as shown in FIG. 6, the load-lock chamber 1 includes the body having the
O-ring groove 15 formed at the top surface of the side wall 12, the O-ring inserted into the O-ring groove 15, and the top plate 20 as a cover coupled to the top surface of the side wall 12.
[54] Here, the top surface of the side wall is stepped in order that the top surface of the inner wall 12a of the side wall 12 is not contacted with the top plate 20. Also, the protrusion 60 of a nonmetal such as Teflon and so on is formed at the top surface of the outer wall 12b or the bottom surface of the top plate 20.
[55] It is preferred that the material of the protrusion 60 is Teflon. Besides, it may be other nonmetal.
[56] As described above, since the inner wall 12a of the side wall 12 is stepped, as though the top plate 20 is convexly bent downward owing to the vacuum pressure, the top surface of the inner wall 12a of the side wall 12 is not contacted with the top plate 20. Also, the protrusion 60 made of Teflon material is interposed between the top surface of the outer wall 12b and the bottom surface of the top plate 20, so that the top surface of the inner wall 12a of the side wall 12 is not contacted with the top plate 20, thereby the adherence portion between the top plate 20 and side wall 12 is not discolored and abraded. Accordingly, it can prevent a particle problem caused by the contact between the top plate 20 and side wall 12 of metal material.
[57] As shown in FIG. 8 and FIG. 9, protrusions according another embodiment of the present invention are illustrated.
[58] That is, as shown in FIG. 8, a plurality of protrusions 60 of a cylindrical type is attached to the top surface of outer wall 12b. [59] Also, as shown in FIG. 9, a protrusion 60' of a continuous band type is formed along the top surface of outer wall 12b. [60] In the meantime, the protrusions shown in FIG. 8 and FIG. 9 can be forcibly inserted into and coupled to an insertion groove (not shown) formed at the top surface of outer wall 12b. [61] Also, a cutting portion is formed at the top surface of outer wall 12b and the protrusion higher than the cutting portion is adhered to the cutting portion and then, a bolt 40 is successively penetrated through the protrusion and side wall so as to be coupled to each other.
Industrial Applicability [62] The present invention relates to a load-lock chamber for vacuum processing of substrate in which a side wall and bottom plate thereof have corresponding stepped adhesion portions respectively and are coupled to each other through a welding and bolting. [63] While this invention has been described in connection with what are presently considered to be the most practical and preferred embodiments, it is to be understood that the invention is not limited to the disclosed embodiments and the drawings, but, on the contrary, it is intended to cover various modifications and variations within the spirit and scope of the appended claims.

Claims

Claims
[I] A load- lock chamber for vacuum processing of substrate comprising: a bottom plate 11 having a stepped portion formed at an end portion thereof; a side wall 12 having anther stepped portion coupled and adhered to the stepped portion of the bottom plate 11 and an O-ring groove 15 formed at a top surface thereof; an O-ring inserted into the O-ring groove 15; and a cover 20 coupled to the top portion of the side wall 12 through the O-ring interposed between them. [2] A load- lock chamber for vacuum processing of substrate as claimed in claim 1, wherein the side wall 12 and the bottom plate 11 are coupled to each other by means of a welding and a bolting. [3] A load- lock chamber for vacuum processing of substrate as claimed in claim 1, further comprising a groove 13 for caving a head of the bolt 40 in the side wall
12 and a fixing member filled into the groove 13 so as to prevent the bolt 40 from being separated from the side wall owing to external surroundings. [4] A load- lock chamber for vacuum processing of substrate as claimed in claim 1, wherein the load-lock chamber is a process chamber or a transfer chamber. [5] A load- lock chamber for vacuum processing of substrate as claimed in claim 1, wherein the side wall is stepped in order that a top surface of an inner wall 12a is not contacted with the top plate 20 based on an O-ring groove 15. [6] A load- lock chamber for vacuum processing of substrate as claimed in claim 1, wherein a protrusion 60 is formed at a top surface of the outer wall 12b or a bottom surface of the top plate 20. [7] A load-lock chamber for vacuum processing of substrate as claimed in claim 6, wherein the material of the protrusion is a Teflon. [8] A load-lock chamber for vacuum processing of substrate as claimed in claim 6, wherein the protrusion is more than two. [9] A load-lock chamber for vacuum processing of substrate as claimed in claim 6, wherein the protrusion is a continuous band type. [10] A load- lock chamber for vacuum processing of substrate as claimed in claim 6, wherein the protrusion is forcibly inserted into and coupled to an insertion groove formed at the top surface of an outer wall.
[I I] A load- lock chamber for vacuum processing of substrate as claimed in claim 6, wherein a cutting portion is formed at the top surface of outer wall and the protrusion higher than the cutting portion is adhered to the cutting portion and then, a bolt is successively penetrated through the protrusion and side wall so as to be coupled to each other.
PCT/KR2007/000794 2006-02-14 2007-02-14 Load-lock chamber for vacuum processing of substrate WO2007094616A1 (en)

Applications Claiming Priority (4)

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KR20060014052 2006-02-14
KR10-2006-0014052 2006-02-14
KR20060015236 2006-02-16
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KR101049087B1 (en) * 2008-06-18 2011-07-15 최만호 Joint structure of welding part of vacuum chamber
KR101645813B1 (en) * 2014-10-14 2016-08-05 (주)트리플코어스코리아 Plasma processing apparatus

Citations (4)

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JP2002164685A (en) * 2000-11-29 2002-06-07 Matsushita Electric Ind Co Ltd Vacuum processing system and electromagnetic shield unit and inclination coil spring
KR20040037288A (en) * 2002-10-28 2004-05-07 삼성전자주식회사 plasma treating equipment
JP2004292867A (en) * 2003-03-26 2004-10-21 Cyg Gijutsu Kenkyusho Kk Vacuum chamber assembly
US6960887B2 (en) * 2000-08-10 2005-11-01 Tokyo Electron Limited Method and apparatus for tuning a plasma reactor chamber

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US6960887B2 (en) * 2000-08-10 2005-11-01 Tokyo Electron Limited Method and apparatus for tuning a plasma reactor chamber
JP2002164685A (en) * 2000-11-29 2002-06-07 Matsushita Electric Ind Co Ltd Vacuum processing system and electromagnetic shield unit and inclination coil spring
KR20040037288A (en) * 2002-10-28 2004-05-07 삼성전자주식회사 plasma treating equipment
JP2004292867A (en) * 2003-03-26 2004-10-21 Cyg Gijutsu Kenkyusho Kk Vacuum chamber assembly

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