WO2007075599A3 - Multi-fluid coolant system - Google Patents

Multi-fluid coolant system Download PDF

Info

Publication number
WO2007075599A3
WO2007075599A3 PCT/US2006/048291 US2006048291W WO2007075599A3 WO 2007075599 A3 WO2007075599 A3 WO 2007075599A3 US 2006048291 W US2006048291 W US 2006048291W WO 2007075599 A3 WO2007075599 A3 WO 2007075599A3
Authority
WO
WIPO (PCT)
Prior art keywords
fluid coolant
coolant system
fluid
channels
boiling point
Prior art date
Application number
PCT/US2006/048291
Other languages
French (fr)
Other versions
WO2007075599A2 (en
Inventor
Chumbo Zhang
Yuandong Gu
Francis A Kulacki
Martin Kristoffersen
Original Assignee
Honeywell Int Inc
Chumbo Zhang
Yuandong Gu
Francis A Kulacki
Martin Kristoffersen
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell Int Inc, Chumbo Zhang, Yuandong Gu, Francis A Kulacki, Martin Kristoffersen filed Critical Honeywell Int Inc
Priority to JP2008547408A priority Critical patent/JP2009520178A/en
Priority to EP06847762A priority patent/EP1964172A2/en
Publication of WO2007075599A2 publication Critical patent/WO2007075599A2/en
Publication of WO2007075599A3 publication Critical patent/WO2007075599A3/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/02—Materials undergoing a change of physical state when used
    • C09K5/04—Materials undergoing a change of physical state when used the change of state being from liquid to vapour or vice versa
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/003—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by using permeable mass, perforated or porous materials
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Human Computer Interaction (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Sustainable Development (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Combustion & Propulsion (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A system using a multi-fluid coolant. Immiscible or miscible fluids may be put through one or more channels. A device to be cooled may be thermally coupled to the channels. The boiling point of one fluid may be greater than an operating temperature that is to be maintained in the device. The boiling point of another fluid should be less than the operating temperature of the device.
PCT/US2006/048291 2005-12-19 2006-12-18 Multi-fluid coolant system WO2007075599A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2008547408A JP2009520178A (en) 2005-12-19 2006-12-18 Multi-fluid refrigerant system
EP06847762A EP1964172A2 (en) 2005-12-19 2006-12-18 Multi-fluid coolant system

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US75150605P 2005-12-19 2005-12-19
US60/751,506 2005-12-19
US11/612,241 US20070153480A1 (en) 2005-12-19 2006-12-18 Multi-fluid coolant system
US11/612,241 2006-12-18

Publications (2)

Publication Number Publication Date
WO2007075599A2 WO2007075599A2 (en) 2007-07-05
WO2007075599A3 true WO2007075599A3 (en) 2007-08-16

Family

ID=38134889

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2006/048291 WO2007075599A2 (en) 2005-12-19 2006-12-18 Multi-fluid coolant system

Country Status (4)

Country Link
US (1) US20070153480A1 (en)
EP (1) EP1964172A2 (en)
JP (1) JP2009520178A (en)
WO (1) WO2007075599A2 (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7787248B2 (en) * 2006-06-26 2010-08-31 International Business Machines Corporation Multi-fluid cooling system, cooled electronics module, and methods of fabrication thereof
US7841385B2 (en) * 2006-06-26 2010-11-30 International Business Machines Corporation Dual-chamber fluid pump for a multi-fluid electronics cooling system and method
US20080047688A1 (en) * 2006-08-28 2008-02-28 Airbus Deutschland Gmbh Cooling System And Cooling Method For Cooling Components Of A Power Electronics
US8082978B2 (en) * 2007-08-07 2011-12-27 Georgia Tech Research Corporation Fluid-to-fluid spot-to-spreader heat management devices and systems and methods of managing heat
US8165855B2 (en) * 2009-05-27 2012-04-24 King Fahd University Of Petroleum & Minerals Method for modeling fluid flow over porous blocks
US10656109B1 (en) * 2009-06-12 2020-05-19 United States Of America As Represented By The Administrator Of Nasa Cup cryostat thermal conductivity analyzer
US8619425B2 (en) * 2011-10-26 2013-12-31 International Business Machines Corporation Multi-fluid, two-phase immersion-cooling of electronic component(s)
WO2014007354A1 (en) * 2012-07-06 2014-01-09 国立大学法人九州大学 Ebullient cooling device
DE102012217874A1 (en) * 2012-09-28 2014-04-17 Behr Gmbh & Co. Kg Device for guiding a fluid
EP3054479B1 (en) * 2013-10-02 2023-12-27 Nissan Motor Co., Ltd. Heat-radiating system
CN105451503B (en) * 2014-07-21 2019-03-08 联想(北京)有限公司 A kind of electronic equipment
CN212341825U (en) * 2020-06-29 2021-01-12 建准电机工业股份有限公司 Immersion cooling system and electronic device with same
US11800683B2 (en) * 2021-02-17 2023-10-24 Sunonwealth Electric Machine Industry Co., Ltd. Immersion cooling system
CN114945260B (en) * 2021-02-17 2024-07-12 建准电机工业股份有限公司 Submerged cooling system
US20230209773A1 (en) * 2021-12-29 2023-06-29 Microsoft Technology Licensing, Llc Systems and methods for mixing immersion fluids in immersion-cooled datacenters

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59125643A (en) * 1982-12-22 1984-07-20 Fujitsu Ltd Liquid-cooled electronic device
US5038571A (en) * 1988-11-18 1991-08-13 Fujitsu Limited Production and use of coolant in cryogenic devices
US5349499A (en) * 1990-05-11 1994-09-20 Fujitsu Limited Immersion cooling coolant and electronic device using this coolant
US20040112585A1 (en) * 2002-11-01 2004-06-17 Cooligy Inc. Method and apparatus for achieving temperature uniformity and hot spot cooling in a heat producing device

Family Cites Families (12)

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Publication number Priority date Publication date Assignee Title
US2440930A (en) * 1945-04-02 1948-05-04 Gen Electric Cooling system
US3258933A (en) * 1964-10-08 1966-07-05 Carrier Corp Refrigeration
US3406244A (en) * 1966-06-07 1968-10-15 Ibm Multi-liquid heat transfer
US3417814A (en) * 1967-06-26 1968-12-24 Ibm Air cooled multiliquid heat transfer unit
US4641349A (en) * 1985-02-20 1987-02-03 Leonard Flom Iris recognition system
US4914921A (en) * 1988-08-16 1990-04-10 Cbi Research Corporation Refrigeration method and apparatus using aqueous liquid sealed compressor
US5291560A (en) * 1991-07-15 1994-03-01 Iri Scan Incorporated Biometric personal identification system based on iris analysis
US5427174A (en) * 1993-04-30 1995-06-27 Heat Transfer Devices, Inc. Method and apparatus for a self contained heat exchanger
US5485671A (en) * 1993-09-10 1996-01-23 Aavid Laboratories, Inc. Method of making a two-phase thermal bag component cooler
US6223810B1 (en) * 1998-03-31 2001-05-01 International Business Machines Extended air cooling with heat loop for dense or compact configurations of electronic components
US6983790B2 (en) * 2003-03-27 2006-01-10 Mitsubishi Denki Kabushiki Kaisha Heat transport device, semiconductor apparatus using the heat transport device and extra-atmospheric mobile unit using the heat transport device
US7284389B2 (en) * 2005-01-21 2007-10-23 Hewlett-Packard Development Company, L.P. Two-fluid spray cooling system

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59125643A (en) * 1982-12-22 1984-07-20 Fujitsu Ltd Liquid-cooled electronic device
US5038571A (en) * 1988-11-18 1991-08-13 Fujitsu Limited Production and use of coolant in cryogenic devices
US5349499A (en) * 1990-05-11 1994-09-20 Fujitsu Limited Immersion cooling coolant and electronic device using this coolant
US20040112585A1 (en) * 2002-11-01 2004-06-17 Cooligy Inc. Method and apparatus for achieving temperature uniformity and hot spot cooling in a heat producing device

Also Published As

Publication number Publication date
EP1964172A2 (en) 2008-09-03
WO2007075599A2 (en) 2007-07-05
US20070153480A1 (en) 2007-07-05
JP2009520178A (en) 2009-05-21

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