WO2007048274A1 - Structure de source electroluminescente a del integree - Google Patents
Structure de source electroluminescente a del integree Download PDFInfo
- Publication number
- WO2007048274A1 WO2007048274A1 PCT/CN2005/001774 CN2005001774W WO2007048274A1 WO 2007048274 A1 WO2007048274 A1 WO 2007048274A1 CN 2005001774 W CN2005001774 W CN 2005001774W WO 2007048274 A1 WO2007048274 A1 WO 2007048274A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- light
- source structure
- curved
- illumination source
- led
- Prior art date
Links
- 238000005286 illumination Methods 0.000 claims description 23
- 239000011347 resin Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 4
- 239000007787 solid Substances 0.000 claims description 3
- 238000010276 construction Methods 0.000 claims description 2
- 239000000843 powder Substances 0.000 claims description 2
- 239000000084 colloidal system Substances 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 239000012141 concentrate Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 230000005693 optoelectronics Effects 0.000 description 2
- 230000002441 reversible effect Effects 0.000 description 2
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 235000013339 cereals Nutrition 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000010903 husk Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 235000015096 spirit Nutrition 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Definitions
- the LED light source structure of the present invention is applied to a light-emitting component of a light-emitting semiconductor article, which is used to concentrate light and is more in a pseudo-parallel light state, thereby reducing light loss and reducing light-emitting material.
- the use of light allows the light to be effectively and fully utilized. Background technique
- the development goal of LED has been pursuing how to be brighter and more diverse, and great progress has been made.
- the electric-optical-electrical conversion is not only visible light that can be seen by the eye, but also its application range is extended to infrared LEDs and semiconductor lasers, etc., using light to achieve the purpose of transmitting electrical signals.
- a radio or video machine such as a radio, TV, VCR, mobile phone, computer LCD screen, etc. Use red, green, yellow, etc. LEDs as indicator lights or illuminant structures on the LCD screen.
- Air conditioners, rice cookers, etc. use digital display LEDs to display the time and temperature of home appliances.
- a display device that uses high-brightness LEDs for use as a traffic sign or traffic sign.
- the illuminant 50 includes two electrodes, and the two electrodes are divided into an anode 52 and a cathode 53, and a cathode 53 is provided on the cathode 53.
- a disk 54 having a reverse effect is formed.
- the disk 54 is provided with an LED die 55.
- the disk 54 is provided with phosphor powder, thereby generating light by the LED die 55 and generating different colors via the fluorescent light.
- a wedge-shaped wire 56 is disposed between the LED die 55 and the anode 52 for connecting the two, and a lead wire 57 is connected under the anode 52 and the cathode 53 for connecting the power source to cause the illuminant 50 to emit light, and the illuminant is connected by
- the transparent resin is coated with a lens resin 51 to adjust the range of light and also to direct the light to the pseudo-parallel light, and the lens resin 51 can be set to various shapes for changing the directivity, and many are made. Convex or square, its common applications are car brake lights, traffic lights, flashlights and more.
- the illuminant 60 includes a two-electrode cathode 62 and an anode 63.
- an LED dies 64 are mounted on the anode 63, and the anode 63 and the LED dies are mounted on the anode 63.
- 64 has a wedge-shaped wire 66 for connecting the two, except that a body casing 61 is mounted on the illuminant 60.
- the body casing 61 is provided with a positive reflection parabolic curved surface 65, and the positive reflection parabolic curved surface 65 is directly opposite.
- the light emitting surface of the LED die 64 is such that the light guide emitted from the LED die 64 is emitted as pseudo-parallel light. Summary of the invention
- An LED light source structure of the present invention is for solving the above-mentioned conventional LED light source structure,
- the illuminant shown in Fig. 5 in order to increase the light energy design and make the light more concentrated, it is necessary to widen the lens resin and to lengthen the distance between the illuminating source and the lens resin.
- the effective guiding of the light is concentrated in the state of emission, so that the material and cost required for the loss are increased, and the illuminant shown in Fig. 6 is used to reduce the loss of light and to concentrate the light.
- the parabolic surface must use a larger paraboloid design, so the material and cost required for the loss will increase, and the two of them
- the design cannot match the design of the light guide plate with a narrow entrance surface.
- the LED light source structure of the present invention is characterized in that the light-emitting diode die is arranged by a conventional horizontal arrangement and the light is emitted as a horizontal plane, and is changed to a vertical installation, so that the light-emitting surface is changed to a vertical surface light, and the vertical light-emitting design is adopted.
- the light-emitting opening is designed to reduce the opening surface of the parabolic curved surface by half, and the light-emitting opening surface is a light guiding front surface adjusted to match the light-incident surface of the light guiding plate, so that The light source is unchanged and the light is more concentrated and guided.
- the light-emitting surface of the light guide plate is adjusted to adjust the light-emitting opening of the LED light source structure, and the light-emitting opening range of the LED light source structure is adjusted.
- the light guide plate enters the light surface. The range is such that the light is concentrated on the light guide surface of the light guide plate, and the light is sent to the light guide plate in a state of pseudo-parallel light, so that the light is more effectively utilized and the light is reduced.
- the product makes the product more elegant and spectacular, and its reduced LED illumination source structure can be applied to the medical gastroscope.
- the reduced LED illumination source structure can alleviate the pain of patients who use the gastroscope to swallow the gastroscope, and the reduction
- the LED light source structure can also be applied to all existing lamps or light sources, and multiple reduced LED light source configurations can be used at the same time to make the original lamps more bright.
- FIG. 1A is a schematic view showing an opening structure of an LED light source structure according to the present invention.
- FIG. 1B is a schematic view showing the structure of the opening of the LED light source of the present invention
- FIG. 1C is a schematic diagram of light guiding of the LED light source structure of the present invention
- FIG. 2 is a view showing a first embodiment of the LED light source structure of the present invention
- 3 is a view showing a second embodiment of the LED light source structure of the present invention
- FIG. 4 is a view showing a third embodiment of the LED light source structure of the present invention.
- FIG. 5 is a schematic view showing the structure of a conventional lens resin LED light source
- Figure 6 is a schematic diagram showing the structure of a conventional parabolic curved LED illumination source.
- the structure of the sealed LED light source of the present invention is as shown in FIG. 1A.
- the structure of the body 10 is a one-half parabolic curved surface shape, and is a solid structure, which can make the light source structure easier to manufacture.
- the shape can be divided into three faces, the bottom surface is the position of the light-emitting secondary body die 11, that is, the bottom surface is a plane regular reflection surface 13 (light-emitting surface), and the left side of the bottom surface is a curved surface, the left side of the arc It is a curved reflector 12 (reflecting surface), and there is a curved surface on the right side of the bottom surface, the right curved surface is a light opening surface, and the right and left curved surfaces are connected to the bottom surface, and the right side And the two sides of the arc on the left side are connected to form a one-half parabolic curved surface, wherein the light-emitting opening surface (right curved surface) is adjusted to be a light guide surface 14 in cooperation with the
- the source structure is such that the body 10 is actually a curved solid structure, and the reflective surface of both the curved regular reflection plate 12 and the planar regular reflection surface 13 can be attached with a reverse film on the outside or an external dip coated reflective film.
- a recessed surface on which the LED die 11 is mounted is immersed in the front reflector of the open recess of the sealed body 10, so that the LED die 11 can be mounted on the planar reflection of the opening 10 of the body casing.
- the design of the one-half parabolic surface is obviously more than double the concentration of the concentrated light energy of the conventional reflector of the parabolic curved surface, and the light-emitting opening surface is a light guide adjusted to match the light-incident surface of the light guide plate.
- the curved surface 14 adjusts the light to collimate light toward the incident surface, and further illuminates the light under the design of the present invention.
- FIG. 1B there are two more reflecting surfaces than FIG. 1A, and two reflecting surfaces are formed by the curved front reflecting plate 12 and the light guiding front surface 14 and the planar regular reflecting surface 13 respectively.
- the surface structure is used to make the light more efficient and achieve the effect of sufficient refraction.
- Fig. 1C the use of the two small reflecting surfaces can be completely revealed, that is, the light is effectively utilized to make the light more dense and concentrated.
- the curved positive reflector 12 of the open recess of the body 10 of FIG. 1A is modified as a beveled retroreflective sheet 20 , and the LED die 11 is also mounted on the planar positive reflector 13 .
- the light exit opening is still shown as a one-half parabolic curved opening width as shown in FIG. 1A, which is designed to concentrate light more.
- one side of the open groove of the body 10 is a curved regular reflection plate 12 (which can also be designed as a beveled regular reflection plate 20), and the other side is
- the first planar regular reflection plate 30 is further provided with a second inclined positive reflection plate 31 after the first planar regular reflection plate 30, and the LED die 11 is mounted on the first plane of the opening groove of the casing 10 of the body
- the opening between the second beveled regular reflection plate 31 and the curved regular reflection plate 12 is matched with the light incident surface opening of the light guide plate, and the light incident surface of the light guide plate is opened by the second inclined positive reflection plate.
- the angle of inclination of 31 determines the angle of the light opening. This design can be combined with the light-incident surface of the light guide plate to emit light and make the light more concentrated.
- the method shown in FIG. 3 can also be designed in the following manner, wherein one side of the open groove of the body 10 is a curved regular reflection plate 12 ( It can also be designed as a beveled reflector 20), and the other side is a first planar positive reflector 30. A second curved reflector 41 is attached to the first planar reflector 30, and the LED die 11 is mounted.
- the opening between the front reflecting plate 41 and the curved front reflecting plate 12 is matched with the light incident surface opening of the light guide plate, and the light incident surface opening of the light guide plate is determined by the curved curvature of the second curved front reflecting plate 41 to determine the light opening.
- the curved surface design of the second curved surface reflection plate 41 can reduce the energy loss of light in the reflection, which is a better design method.
- the design can be combined with the light entrance surface of the light guide plate to open the light and make the light more light. Concentrated injection, and its reduced LED illumination source structure can be applied to medical gastroscopes.
- the reduced LED illumination source structure can alleviate the pain of patients who use gastroscopes to swallow the gastroscope, and the reduced LED illumination source structure can also be It can be applied to all existing lamps or illuminating sources, and can simultaneously use multiple reduced LED illuminating source structures to make the original luminaires brighter. Therefore, it is suitable for practical and progressive requirements, so patent application is filed according to law.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
L'invention concerne une structure à source électroluminescente à DEL intégrée comprenant un corps (10) et une puce DEL (11), le corps (10) adoptant une courbe mi-parabolique et comportant une plaque plate réfléchissante (13) placée au fond, une plaque arquée réfléchissante (12) placée sur la gauche et une surface courbée de transmission de lumière (14) placée sur la droite. Les côtés supérieurs de la plaque arquée réfléchissante (12) et de la surface courbée de transmission de lumière (14) sont assemblés et leurs côtés inférieurs le sont avec la plaque plate réfléchissante (13). La puce DEL (11) est montée sur la gauche de la plaque plate réfléchissante (13). La lumière émise par la puce DEL (11) est réfléchie à travers la plaque arquée réfléchissante (12) et la plaque plate réfléchissante (13) afin de se diffuser depuis la surface courbée de transmission de lumière (14).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/CN2005/001774 WO2007048274A1 (fr) | 2005-10-27 | 2005-10-27 | Structure de source electroluminescente a del integree |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/CN2005/001774 WO2007048274A1 (fr) | 2005-10-27 | 2005-10-27 | Structure de source electroluminescente a del integree |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2007048274A1 true WO2007048274A1 (fr) | 2007-05-03 |
Family
ID=37967389
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/CN2005/001774 WO2007048274A1 (fr) | 2005-10-27 | 2005-10-27 | Structure de source electroluminescente a del integree |
Country Status (1)
Country | Link |
---|---|
WO (1) | WO2007048274A1 (fr) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6217721A (ja) * | 1985-07-16 | 1987-01-26 | Ricoh Co Ltd | 投光装置 |
EP1026032A2 (fr) * | 1999-02-03 | 2000-08-09 | Autopal S.R.O. | Lampe plate à LED pour automobile |
CN1637340A (zh) * | 2003-12-24 | 2005-07-13 | 株式会社小糸制作所 | 车辆用灯具单元 |
-
2005
- 2005-10-27 WO PCT/CN2005/001774 patent/WO2007048274A1/fr active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6217721A (ja) * | 1985-07-16 | 1987-01-26 | Ricoh Co Ltd | 投光装置 |
EP1026032A2 (fr) * | 1999-02-03 | 2000-08-09 | Autopal S.R.O. | Lampe plate à LED pour automobile |
CN1637340A (zh) * | 2003-12-24 | 2005-07-13 | 株式会社小糸制作所 | 车辆用灯具单元 |
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