WO2007043884A2 - Method and device for laser cutting at an acute angle of carriers for electronic components - Google Patents

Method and device for laser cutting at an acute angle of carriers for electronic components Download PDF

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Publication number
WO2007043884A2
WO2007043884A2 PCT/NL2006/050253 NL2006050253W WO2007043884A2 WO 2007043884 A2 WO2007043884 A2 WO 2007043884A2 NL 2006050253 W NL2006050253 W NL 2006050253W WO 2007043884 A2 WO2007043884 A2 WO 2007043884A2
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WO
WIPO (PCT)
Prior art keywords
laser beam
carrier
laser
angle
cutting
Prior art date
Application number
PCT/NL2006/050253
Other languages
French (fr)
Other versions
WO2007043884A3 (en
Inventor
Joannes Leonardus Jurrian Zijl
Henri Joseph Van Egmond
Original Assignee
Fico B.V.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fico B.V. filed Critical Fico B.V.
Priority to EP06799542A priority Critical patent/EP1938675A2/en
Publication of WO2007043884A2 publication Critical patent/WO2007043884A2/en
Publication of WO2007043884A3 publication Critical patent/WO2007043884A3/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H35/00—Delivering articles from cutting or line-perforating machines; Article or web delivery apparatus incorporating cutting or line-perforating devices, e.g. adhesive tape dispensers
    • B65H35/04—Delivering articles from cutting or line-perforating machines; Article or web delivery apparatus incorporating cutting or line-perforating devices, e.g. adhesive tape dispensers from or with transverse cutters or perforators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1527—Obliquely held PCB

Definitions

  • the invention relates to a method for cutting a substantially flat carrier for electronic components with a laser beam by mutually displacing the laser beam and the carrier.
  • the invention also relates to a device for cutting a substantially flat carrier for electronic components with a laser beam, comprising: a holder for holding the flat carrier for electronic components to be cut with the laser beam, a laser source generating the laser beam, a frame connecting the holder and the laser source, and control means for mutually displacing the laser beam generated by the laser source and the holder.
  • the cutting of electronic carriers of electronic components with a laser beam is a known technique which is applied, among other reasons, in order to release segments from a larger carrier (also referred to as a board or lead frame).
  • Laser beam cutting is employed as alternative to the more traditional machining process techniques such as sawing and milling. Separating segments from the carrier with a laser provides a number of significant advantages, such as a great freedom in respect of the shape of the segments for releasing, and being able to perform a dry separating operation, this being particularly important in respect of the usually liquid-sensitive electronic components which may be present on the carrier segments to be released.
  • a further advantage of laser cutting is that it produces little waste compared to more traditional separation, among other reasons because of the relatively small width of the cut to be made.
  • the drawback of the existing method of laser cutting of substantially flat carriers for electronic components is that the form of the (laser) cut is not wholly controllable or is undesired.
  • the object of the present invention is to provide an improved method and device with which the drawbacks of prior art laser cutting, and in particular the consequences of the form of a laser cut being not controllable or being undesired, can be obviated. This objective is sought while retaining the advantages of prior art laser cutting.
  • the present invention provides for this purpose a method for cutting a substantially flat carrier for electronic components with a laser beam by mutually displacing the laser beam and the carrier, wherein during the cutting the laser beam encloses an acute angle V perpendicularly of the cutting direction with the side of the carrier directed toward the laser beam.
  • the angle V preferably lies here between 80 and 90°, more preferably between 81 and 85°, most preferably between 81 and 83°.
  • the advantage of such an angle V is related to the form a conventional cutting line usually has. On the side of the carrier toward the laser source the width of the cutting line is greater than at a distance from this side. In rough approximation the form of a cross-section through the cutting line is crater-shaped.
  • the side walls of this crater shape are generally at an angle of 78 to 81° to the surface of the carrier directed toward the laser source.
  • angle V acute angle
  • Such a choice of angle V is not obvious since the total cut depth hereby increases, with the consequence that a cut requires more energy and results in more contamination than a conventionally defined laser cut.
  • the skilled person in the field will therefore tend to resist a change in the conventional right angle V.
  • An angle V according to the present invention nevertheless results in advantages which, depending on the circumstances, can outweigh these evident disadvantages.
  • this advantage can already increase to more than 2%.
  • the relative gain in space in useful area of a carrier segment will be still greater in the case of thicker carriers.
  • the part separated from the carrier (the segment) is preferably provided with at least one electronic component, such as for instance an integrated circuit. Due to the freedom of choice in respect of the angle V, it is also possible under specific conditions to opt to make a cut edge which encloses with the side of the carrier directed toward the laser source an angle which is desired for the specific conditions.
  • a cut passing through the carrier can be made in multiple successive cutting operations.
  • the angle V can be constant during the successive cutting operations or the angle V can change during the successive cutting operations.
  • the focal length of the laser beam is adjustable subject to this angle, optionally also subject to other process conditions.
  • the focal length of the laser beam can be controlled in relatively simple manner by means of a lens displacement.
  • operation takes place at a focal length of at least 120 mm; such a greater focal length results in a longer distance for which the laser beam is still sufficiently compact.
  • the invention also provides a device of the type stated in the preamble for cutting with a laser beam a substantially flat carrier for electronic components, wherein the control means are adapted to adjust an angle V at which during cutting the laser beam is incident upon the side of the carrier directed toward the laser beam in a direction perpendicularly of the cutting direction.
  • the laser source is provided with an adjustable focal length, for instance in the form of an adjustable galvohead provided with a plurality of mutually displaceable lenses.
  • the distance between the laser source and the holder to be adjustable, i.e. a z-displacement is possible between the holder and the laser source.
  • the laser device is provided with automated control means; a cutting process can thus be automated and optimum process conditions can be accurately approximated.
  • the invention moreover also provides a carrier segment provided with at least one electronic component having at least an edge portion released by means of a laser beam, which edge portion released by the laser beam encloses an angle with a flat side of the carrier segment of between 80 and 90°, more preferably between 86 and 90°.
  • a carrier segment has a usable surface area which, at least for laser cutting, has a much better ratio to the largest outer dimension of the cut edge.
  • figure IA is a schematic view of the prior art cutting of a substantially flat carrier for electronic components using a laser beam
  • figure IB is a schematic view of the cutting of a substantially flat carrier for electronic components using a laser beam as according to the present invention
  • figure 2A shows a schematic view of the first cutting operation in the cutting of a carrier with a laser beam as according to the present invention
  • figure 2B is a schematic view of a second cutting operation in the cutting of the carrier shown in figure 2A with a laser beam as according to the present invention
  • figure 3 is a schematic view of a laser device according to the present invention.
  • Figure IA shows a carrier 1 for electronic components 2 in which a cut 4 of approximately crater-shaped cross-section is arranged using a laser beam 3.
  • a cut edge 5 of a segment 6 of carrier 1, which carries at least one electronic component 2, herein encloses an angle ⁇ of typically 78 to 81° with the surface 7 of carrier 1 directed toward laser beam 3.
  • Figure IB shows a carrier 10 for electronic components 11 in which according to the invention a cut 13 is arranged using a laser beam 12, wherein a cut edge 14 of a segment is approximately a right angle of 90° with the surface 16 of carrier 10 directed toward laser beam 12.
  • FIG 2A shows a laser beam 20 which according to the invention encloses an acute cutting angle Vi with a surface 21 of a carrier 22 for electronic components 23.
  • a cut 24 is made with a first cutting operation which does not pass completely through carrier 22.
  • a second cutting operation which is shown schematically in figure 2B, a cut 25 is continued further such that it now does pass completely through carrier 22.
  • cutting angle V 2 can differ from the first cutting angle Vi during this second cutting operation.
  • Vi can be larger or smaller than V 2 . It is also possible for Vi or V 2 to equal 90°.
  • FIG. 3 shows a laser device 30 with a laser source 31 connected via a frame 32 to a holder 33 for supporting a carrier 34 with electronic components 35.
  • a laser beam 36 is transmitted to carrier 34 by laser source 31.
  • Laser beam 36 herein encloses an angle ( with the vertical running through laser source 31. This angle ( is identical to the angle V which laser beam 36 encloses with the side 37 of carrier 4 directed toward laser source 31.
  • Laser source 31 is connected to an intelligent control unit 38 for control thereof.

Abstract

The invention relates to a method for cutting a substantially- flat carrier (22) for electronic components (23) with a laser beam(20) by mutually displacing the laser beam(20) and the carrier. The invention also relates to a device for cutting a substantially flat carrier (22) for electronic components (23) with a laser beam (20), comprising: a holder (33) for holding the flat carrier(22), a laser source(31), a frame(32) connecting the holder(33) and the laser source, and control means for mutually displacing the laser beam (20) and the holder (33).

Description

Method and device for laser cutting at an acute angle of carriers for electronic components
The invention relates to a method for cutting a substantially flat carrier for electronic components with a laser beam by mutually displacing the laser beam and the carrier. The invention also relates to a device for cutting a substantially flat carrier for electronic components with a laser beam, comprising: a holder for holding the flat carrier for electronic components to be cut with the laser beam, a laser source generating the laser beam, a frame connecting the holder and the laser source, and control means for mutually displacing the laser beam generated by the laser source and the holder.
The cutting of electronic carriers of electronic components with a laser beam is a known technique which is applied, among other reasons, in order to release segments from a larger carrier (also referred to as a board or lead frame). Laser beam cutting is employed as alternative to the more traditional machining process techniques such as sawing and milling. Separating segments from the carrier with a laser provides a number of significant advantages, such as a great freedom in respect of the shape of the segments for releasing, and being able to perform a dry separating operation, this being particularly important in respect of the usually liquid-sensitive electronic components which may be present on the carrier segments to be released. A further advantage of laser cutting is that it produces little waste compared to more traditional separation, among other reasons because of the relatively small width of the cut to be made. The drawback of the existing method of laser cutting of substantially flat carriers for electronic components is that the form of the (laser) cut is not wholly controllable or is undesired.
The object of the present invention is to provide an improved method and device with which the drawbacks of prior art laser cutting, and in particular the consequences of the form of a laser cut being not controllable or being undesired, can be obviated. This objective is sought while retaining the advantages of prior art laser cutting.
The present invention provides for this purpose a method for cutting a substantially flat carrier for electronic components with a laser beam by mutually displacing the laser beam and the carrier, wherein during the cutting the laser beam encloses an acute angle V perpendicularly of the cutting direction with the side of the carrier directed toward the laser beam. The angle V preferably lies here between 80 and 90°, more preferably between 81 and 85°, most preferably between 81 and 83°. The advantage of such an angle V is related to the form a conventional cutting line usually has. On the side of the carrier toward the laser source the width of the cutting line is greater than at a distance from this side. In rough approximation the form of a cross-section through the cutting line is crater-shaped. The side walls of this crater shape are generally at an angle of 78 to 81° to the surface of the carrier directed toward the laser source. However, by now changing the angle (acute angle V) which the laser beam encloses with the carrier during cutting it is possible to realize that one of the cut edges encloses a greater cut edge angle with the surface of the carrier directed toward the laser source. Such a choice of angle V is not obvious since the total cut depth hereby increases, with the consequence that a cut requires more energy and results in more contamination than a conventionally defined laser cut. The skilled person in the field will therefore tend to resist a change in the conventional right angle V. An angle V according to the present invention nevertheless results in advantages which, depending on the circumstances, can outweigh these evident disadvantages.
An important advantage of such a cut edge angle which approximates 90° more closely than the existing cut edge angles is that the surface of a segment separated from the carrier can hereby be optimized relative to the largest outer dimension of the separated segment. It is however then desirable for this purpose that the angle V is on the side opposite a cut to be made with the laser beam in a segment of the carrier to be separated from the carrier. The largest outer dimension of a separated segment does after all determine the assembly/placing options for the segment. Now that the difference between the largest outer dimension of a segment and the usable surface area of the segment can be reduced due to the present invention, a gain in space results under normal conditions of one to several per cent. At a carrier thickness of 0.5 mm and an outer dimension of 12 x 15 mm, this advantage can already increase to more than 2%. The relative gain in space in useful area of a carrier segment will be still greater in the case of thicker carriers. Envisage by way of illustration a SIM card in a mobile phone. With an identical outer dimension the useful surface area of the card can be enlarged by about 2%, this making it possible to provide the card with more functionality or, alternatively, to move toward a further miniaturization of components. It is also noted that the part separated from the carrier (the segment) is preferably provided with at least one electronic component, such as for instance an integrated circuit. Due to the freedom of choice in respect of the angle V, it is also possible under specific conditions to opt to make a cut edge which encloses with the side of the carrier directed toward the laser source an angle which is desired for the specific conditions.
Depending among other things on the thickness of the carrier, the material from which the carrier is manufactured, the quality of the laser beam, the desired accuracy of the cut and the maximum thermal load of the carrier, a cut passing through the carrier can be made in multiple successive cutting operations. Depending on the conditions and the desired cutting result, the angle V can be constant during the successive cutting operations or the angle V can change during the successive cutting operations.
As a result of the angle V, which is smaller than usual according to the prior art, it is also advantageous when the focal length of the laser beam is adjustable subject to this angle, optionally also subject to other process conditions. The focal length of the laser beam can be controlled in relatively simple manner by means of a lens displacement. Furthermore, it is also advantageous if operation takes place at a focal length of at least 120 mm; such a greater focal length results in a longer distance for which the laser beam is still sufficiently compact.
The invention also provides a device of the type stated in the preamble for cutting with a laser beam a substantially flat carrier for electronic components, wherein the control means are adapted to adjust an angle V at which during cutting the laser beam is incident upon the side of the carrier directed toward the laser beam in a direction perpendicularly of the cutting direction. In a preferred embodiment the laser source is provided with an adjustable focal length, for instance in the form of an adjustable galvohead provided with a plurality of mutually displaceable lenses. Conversely, it is also possible for the distance between the laser source and the holder to be adjustable, i.e. a z-displacement is possible between the holder and the laser source. For the advantages of such a laser device, which can be manufactured without substantial extra cost compared to the known laser equipment, reference is made to the above mentioned advantages in respect of the method according to the present invention.
It is also recommended that the laser device is provided with automated control means; a cutting process can thus be automated and optimum process conditions can be accurately approximated.
The invention moreover also provides a carrier segment provided with at least one electronic component having at least an edge portion released by means of a laser beam, which edge portion released by the laser beam encloses an angle with a flat side of the carrier segment of between 80 and 90°, more preferably between 86 and 90°. Such a carrier segment has a usable surface area which, at least for laser cutting, has a much better ratio to the largest outer dimension of the cut edge.
The present invention will be further elucidated on the basis of the non- limitative exemplary embodiments shown in the following figures. Herein: figure IA is a schematic view of the prior art cutting of a substantially flat carrier for electronic components using a laser beam, figure IB is a schematic view of the cutting of a substantially flat carrier for electronic components using a laser beam as according to the present invention, figure 2A shows a schematic view of the first cutting operation in the cutting of a carrier with a laser beam as according to the present invention, figure 2B is a schematic view of a second cutting operation in the cutting of the carrier shown in figure 2A with a laser beam as according to the present invention, and figure 3 is a schematic view of a laser device according to the present invention.
Figure IA shows a carrier 1 for electronic components 2 in which a cut 4 of approximately crater-shaped cross-section is arranged using a laser beam 3. A cut edge 5 of a segment 6 of carrier 1, which carries at least one electronic component 2, herein encloses an angle Ξ of typically 78 to 81° with the surface 7 of carrier 1 directed toward laser beam 3.
Figure IB shows a carrier 10 for electronic components 11 in which according to the invention a cut 13 is arranged using a laser beam 12, wherein a cut edge 14 of a segment is approximately a right angle of 90° with the surface 16 of carrier 10 directed toward laser beam 12.
Figure 2A shows a laser beam 20 which according to the invention encloses an acute cutting angle Vi with a surface 21 of a carrier 22 for electronic components 23. In the shown figure a cut 24 is made with a first cutting operation which does not pass completely through carrier 22. In a second cutting operation, which is shown schematically in figure 2B, a cut 25 is continued further such that it now does pass completely through carrier 22. It is possible here for cutting angle V2 to differ from the first cutting angle Vi during this second cutting operation. As desired, Vi can be larger or smaller than V2. It is also possible for Vi or V2 to equal 90°.
Figure 3 shows a laser device 30 with a laser source 31 connected via a frame 32 to a holder 33 for supporting a carrier 34 with electronic components 35. A laser beam 36 is transmitted to carrier 34 by laser source 31. Laser beam 36 herein encloses an angle ( with the vertical running through laser source 31. This angle ( is identical to the angle V which laser beam 36 encloses with the side 37 of carrier 4 directed toward laser source 31. Laser source 31 is connected to an intelligent control unit 38 for control thereof.

Claims

Claims
1. Method for cutting a substantially flat carrier for electronic components with a laser beam by mutually displacing the laser beam and the carrier, wherein during the cutting the laser beam encloses an acute angle V perpendicularly of the cutting direction with the side of the carrier directed toward the laser beam.
2. Method as claimed in claim 1, characterized in that the angle V is between 80 and 90°.
3. Method as claimed in claim 2, characterized in that the angle V is between 81 and 85°.
4. Method as claimed in any of the foregoing claims, characterized in that the angle V is on the side opposite a cut to be made with the laser beam in a segment of the carrier to be separated from the carrier.
5. Method as claimed in any of the foregoing claims, characterized in that a cut passing through the carrier is made in multiple successive cutting operations.
6. Method as claimed in claim 5, characterized in that the angle V is constant during the successive cutting operations.
7. Method as claimed in claim 5, characterized in that the angle V changes during the successive cutting operations.
8. Method as claimed in any of the foregoing claims, characterized in that the focal length of the laser beam is adjustable subject to the angle V.
9. Method as claimed in claim 8, characterized in that the focal length of the laser beam can be controlled by means of a lens displacement.
10. Method as claimed in any of the foregoing claims, characterized in that the effective focal length of the lens for the laser beam is at least 120 mm.
11. Device for cutting a substantially flat carrier for electronic components with a laser beam, comprising:
- a holder for holding the flat carrier for electronic components to be cut with the laser beam,
- a laser source generating the laser beam,
- a frame connecting the holder and the laser source, and - control means for mutually displacing the laser beam generated by the laser source and the holder, wherein the control means are adapted to adjust an angle V at which during cutting the laser beam is incident upon the side of the carrier directed toward the laser beam in a direction perpendicularly of the cutting direction.
12. Laser device as claimed in claim 11, characterized in that the laser source is provided with an adjustable focal length.
13. Laser device as claimed in claim 12, characterized in that the laser source is provided with an adjustable galvohead.
14. Laser device as claimed in any of the claims 11-13, characterized in that the distance between the laser source and the holder is adjustable.
15. Laser device as claimed in any of the claims 11-14, characterized in that the laser device is provided with automated control means.
16. Carrier segment provided with at least one electronic component having at least an edge portion released by means of a laser beam, which edge portion released by the laser beam encloses an angle with a flat side of the carrier segment of between 70 and 90°.
17. Carrier segment as claimed in claim 16, characterized in that the edge portion released by the laser beam encloses an angle with a flat side of the carrier segment of between 86 and 90°.
PCT/NL2006/050253 2005-10-14 2006-10-09 Method and device for laser cutting at an acute angle of carriers for electronic components WO2007043884A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP06799542A EP1938675A2 (en) 2005-10-14 2006-10-09 Method and device for laser cutting at an acute angle of carriers for electronic components

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL1030195 2005-10-14
NL1030195A NL1030195C2 (en) 2005-10-14 2005-10-14 Method and device for laser cutting carriers for electronic components at an acute angle.

Publications (2)

Publication Number Publication Date
WO2007043884A2 true WO2007043884A2 (en) 2007-04-19
WO2007043884A3 WO2007043884A3 (en) 2008-05-22

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PCT/NL2006/050253 WO2007043884A2 (en) 2005-10-14 2006-10-09 Method and device for laser cutting at an acute angle of carriers for electronic components

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EP (1) EP1938675A2 (en)
KR (1) KR20080070650A (en)
CN (1) CN101300910A (en)
NL (1) NL1030195C2 (en)
TW (1) TWI397357B (en)
WO (1) WO2007043884A2 (en)

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Publication number Priority date Publication date Assignee Title
US20090283508A1 (en) * 2008-03-28 2009-11-19 Siemens Aktiengesellschaft Method for producting a hole
US8835803B2 (en) 2009-12-29 2014-09-16 Samsung Display Co., Ltd. Laser cutting method and method of manufacturing organic light-emitting device

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Publication number Priority date Publication date Assignee Title
CN104427765B (en) * 2013-08-20 2017-06-27 深圳崇达多层线路板有限公司 The processing method of PTFE copper-clad plates

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Publication number Priority date Publication date Assignee Title
EP0437676A1 (en) * 1989-12-08 1991-07-24 Mitsubishi Denki Kabushiki Kaisha Laser cutting machine
JPH11197866A (en) * 1998-01-16 1999-07-27 Fuji Electric Co Ltd Device for laser beam machining and laser beam cutting method for work
US20020170891A1 (en) * 2001-03-22 2002-11-21 Adrian Boyle Laser machining system and method
US20040164060A1 (en) * 2003-02-17 2004-08-26 International Business Machines Corporation Hole drilling method and apparatus
US20050070075A1 (en) * 2003-09-26 2005-03-31 Yusuke Nagai Laser beam processing method and laser beam machine

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0437676A1 (en) * 1989-12-08 1991-07-24 Mitsubishi Denki Kabushiki Kaisha Laser cutting machine
JPH11197866A (en) * 1998-01-16 1999-07-27 Fuji Electric Co Ltd Device for laser beam machining and laser beam cutting method for work
US20020170891A1 (en) * 2001-03-22 2002-11-21 Adrian Boyle Laser machining system and method
US20040164060A1 (en) * 2003-02-17 2004-08-26 International Business Machines Corporation Hole drilling method and apparatus
US20050070075A1 (en) * 2003-09-26 2005-03-31 Yusuke Nagai Laser beam processing method and laser beam machine

Non-Patent Citations (1)

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Title
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 12, 29 October 1999 (1999-10-29) & JP 11 197866 A (FUJI ELECTRIC CO LTD), 27 July 1999 (1999-07-27) *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090283508A1 (en) * 2008-03-28 2009-11-19 Siemens Aktiengesellschaft Method for producting a hole
US9597751B2 (en) * 2008-03-28 2017-03-21 Siemens Aktiengesellschaft Method for producing a hole with side-delimiting flanks in a component
US8835803B2 (en) 2009-12-29 2014-09-16 Samsung Display Co., Ltd. Laser cutting method and method of manufacturing organic light-emitting device

Also Published As

Publication number Publication date
KR20080070650A (en) 2008-07-30
WO2007043884A3 (en) 2008-05-22
CN101300910A (en) 2008-11-05
EP1938675A2 (en) 2008-07-02
TW200731895A (en) 2007-08-16
NL1030195C2 (en) 2007-04-17
TWI397357B (en) 2013-05-21

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