WO2007029425A1 - Nonlead glass composition - Google Patents

Nonlead glass composition Download PDF

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Publication number
WO2007029425A1
WO2007029425A1 PCT/JP2006/314761 JP2006314761W WO2007029425A1 WO 2007029425 A1 WO2007029425 A1 WO 2007029425A1 JP 2006314761 W JP2006314761 W JP 2006314761W WO 2007029425 A1 WO2007029425 A1 WO 2007029425A1
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WIPO (PCT)
Prior art keywords
glass
weight
lead
acid resistance
glass composition
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PCT/JP2006/314761
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French (fr)
Japanese (ja)
Inventor
Yoshitaka Mayumi
Original Assignee
Nihon Yamamura Glass Co., Ltd.
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Publication date
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Publication of WO2007029425A1 publication Critical patent/WO2007029425A1/en

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    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00Glass compositions
    • C03C3/04Glass compositions containing silica
    • C03C3/062Glass compositions containing silica with less than 40% silica by weight
    • C03C3/07Glass compositions containing silica with less than 40% silica by weight containing lead
    • C03C3/072Glass compositions containing silica with less than 40% silica by weight containing lead containing boron
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00Glass compositions
    • C03C3/04Glass compositions containing silica
    • C03C3/062Glass compositions containing silica with less than 40% silica by weight
    • C03C3/064Glass compositions containing silica with less than 40% silica by weight containing boron
    • C03C3/066Glass compositions containing silica with less than 40% silica by weight containing boron containing zinc
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C4/00Compositions for glass with special properties
    • C03C4/20Compositions for glass with special properties for chemical resistant glass
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2211/00Plasma display panels with alternate current induction of the discharge, e.g. AC-PDPs
    • H01J2211/20Constructional details
    • H01J2211/22Electrodes
    • H01J2211/225Material of electrodes

Definitions

  • the present invention relates to a lead-free glass composition. More specifically, the present invention relates to a lead-free glass composition used for the formation, adhesion, coating or sealing of electronic components that require acid resistance. More specifically, lead-free glass added to conductor wiring parts such as Ag conductors that require acid resistance over plasma display panels, or lead-free glass used to protect surfaces that require acid resistance of electronic components and elements. Relates to a glass composition.
  • a conductor used for wiring is formed by mixing Ag powder with glass powder and sintering the glass, and protecting the surface of the element with glass. It has been usefully used. Conventionally, lead glass has been mainly used as these glasses, but in recent years, products containing lead have a tendency to be avoided from an environmental point of view.
  • Low melting glass that does not contain lead includes P O ZnO, P O—SnO, and Bi O
  • Patent Document 1 JP 2002-270035 A
  • Patent Document 2 JP 2000-67750 A
  • Patent Document 3 Japanese Patent Laid-Open No. 10-231141
  • the above-mentioned BiO glass has the same glass soft spot as that of conventional lead glass.
  • a conductor wiring is formed on a glass substrate by sintering using a metal powder and the BiO glass powder, and further forming a wiring.
  • the partition When forming a partition from a layer laminated on a glass substrate, the partition is formed.
  • etching is performed using an acid, there has been a problem that the conductor containing the glass is corroded by the etching using the acid.
  • Patent Document 1 discloses the use of vitreous powder mainly composed of bismuth zinc borosilicate glass
  • Patent Document 2 discloses non-crystalline glass or bismuth composed mainly of zinc oxide. It is disclosed to use an amorphous glass mainly composed of a system, and both Patent Documents 1 and 2 aim at improving the stability of the glass and adjusting the glass softening point. However, neither Patent Document 1 or 2 improves the acid resistance of the glass itself.
  • the bismuth borosilicate glass contains ZnO and AlO.
  • the present invention solves the above-mentioned problems in the conventional BiO-based glass and has been used in the past.
  • the lead-free glass composition of the present invention is, in terms of oxide, Bi 2 O: 55 to 75% by weight, B
  • composition %, ZrO: 0.1 to 5% by weight of the composition is the first feature.
  • the lead-free glass composition of the present invention is, in terms of oxide, Bi O: 65 to 72% by weight, B 2 O
  • the second feature is that the composition contains ZrO: 0.5 to 3% by weight.
  • the lead-free glass composition of the present invention precipitates garnite (ZnAl 2 O 3) or zircon (ZrSiO 2) crystals when fired at 600 ° C. or lower. Is the third feature.
  • the lead-free glass composition of the present invention is added to the metal powder as a conductor that requires acid resistance in addition to any of the first to third features described above, and is sintered together.
  • the fourth feature is that it is a glass powder as an agent.
  • the lead-free glass composition of the present invention is, in addition to any of the first to fourth features described above, a glass powder for adding a metal electrode formed on a glass substrate of a plasma display panel.
  • the lead-free glass composition of the present invention has a sixth feature that it is used as a glass for coating an electronic component surface in addition to any of the first to third features.
  • the glass composition is converted into an oxide, Bi
  • the metal powder is formed to form a conductor that requires acid resistance.
  • the sintered conductor of the metal powder mixed with the lead-free glass composition of the present invention can exhibit preferable acid corrosion resistance as a part of the apparatus, member, and component.
  • the metal electrode configured on the glass substrate of the plasma display panel in consideration of the effect of the configuration according to any one of claims 1 to 4.
  • the metal electrode formed by adding this glass powder is adapted to the glass substrate, and at the time of manufacturing the plasma display panel in the manufacturing process, etching using an acidic solution is performed during the manufacturing process. However, it is possible to prevent the metal electrode from being easily damaged by corrosion.
  • the lead-free glass composition according to claim 6 in addition to the effect of the structure according to any one of claims 1 to 3, the lead-free glass composition is acidic by being used as a glass for coating an electronic component surface. In the atmosphere, it is possible to exert a durable component protecting effect.
  • the lead-free glass composition of the present invention constitutes electrodes and electric wires laminated on a glass substrate of a plasma display panel, other glass substrates, and ceramic substrates. Mainly used as added glass powder. In addition, it can be used as glass for coating the surface of an electronic component that covers the surface of an electronic component that requires acid resistance, other glass members, glass components, and glass devices.
  • substantially free of Pb means that no raw material containing lead such as PbO is used, and the raw materials of each component constituting the glass, the inorganic filler, etc. It does not exclude the case where lead as an impurity contained in is mixed.
  • Bi 2 O is an essential component for forming a glass network and melting the glass.
  • the component range is 55 to 75% by weight. Less than 55% by weight of glass has low melting On the other hand, when it exceeds 75% by weight, the acid resistance of the glass is lowered and becomes insufficient.
  • BiO is preferably 65 to 72% by weight.
  • Acid resistance can be improved without increasing the soft spot of the glass.
  • Bi O is more preferably 66 to 69% by weight.
  • B 2 O forms a glass network and improves stability when the glass melts
  • the component range is 5 to 15% by weight. If it is less than 5% by weight, the glass becomes unstable. On the other hand, if it exceeds 15% by weight, the acid resistance of the glass decreases, which is not preferable.
  • B 2 O is preferably 10 to 15% by weight.
  • the acid resistance can be improved without increasing the soft saddle point of the lath.
  • B 2 O is more preferably 10 to 13% by weight.
  • SiO forms a glass network to improve the acid resistance and stability of the glass when melted.
  • the component range is 4 to 12% by weight. If it is less than 4% by weight, the acid resistance of the glass and the stability at the time of melting are lowered and become insufficient. On the other hand, if it exceeds 12% by weight, the glass tends to be devitrified.
  • SiO is preferably 5 to 10% by weight.
  • the acid resistance can be improved without increasing the soft soft spot.
  • SiO is 6 to 9% by weight.
  • ZnO is an essential component for melting the glass at a low temperature.
  • the component range is 3 to 12% by weight. If it is less than 3% by weight, the glass will not be sufficiently melted. On the other hand, if it exceeds 12% by weight, the acid resistance of the glass will decrease and become insufficient.
  • ZnO is preferably 3 to 6% by weight.
  • Al 2 O is an essential component for improving the acid resistance of glass.
  • the component range is 3 to: L0% by weight. If it is less than 3% by weight, the acid resistance of the glass It drops and becomes insufficient. On the other hand, if it exceeds 10% by weight, it tends to devitrify when the glass melts.
  • Al 2 O is preferably 3 to 8% by weight.
  • the acid resistance can be improved without deteriorating the binder performance as a binder.
  • ZrO is an essential component for improving acid resistance.
  • the component range is 0.1 to 5% by weight. If it is less than 1% by weight, it will not be effective in improving the acid resistance of the glass. On the other hand, if it exceeds 5% by weight, it tends to devitrify when the glass melts. Further, the binder performance as a sintering aid is lowered.
  • ZrO is preferably 0.5 to 3% by weight.
  • Acid resistance can be improved without deteriorating the binder performance as a sintering aid.
  • garnite ZnAl 2 O 3
  • the reason why the acid resistance is improved is as follows: Bi 2 O, B 2 O, SiO, ZnO,
  • the glass softens during the heating process and becomes an adhesive.
  • BaO, SrO, CaO, MgO, FeO, CuO, CoO, TiO, etc. are used for the purpose of improving the stability during glass melting and adjusting the softening point and crystal precipitation of the glass.
  • 2 3 2 nO, CeO, Ln 2 O (lanthanoid), etc. may be added up to 2% by weight in total.
  • the lead-free glass composition of the present invention is dry pulverized as glass, the particle size is adjusted by the conditions of wet pulverization using an aqueous solvent or an organic solvent solvent, and the average particle size is 0.5 to 2 111.
  • the maximum particle size is 10 ⁇ m or less.
  • the average particle size is less than 0.5 m, the specific surface area of the glass powder increases, which makes foaming difficult to design. If the average grain size exceeds 2 m and the maximum grain size force S 10 m, fine patterning of wiring becomes difficult.
  • the average particle size is 0.5 to 1. O ⁇ m, and the maximum particle size is 4 / zm or less. It is more preferable that the average particle size is 0.5 to 0.7 / ⁇ ⁇ and the maximum particle size is 3 m or less.
  • the obtained glass powder is mixed with a single substance or a metal powder for constituting a conductor, for example, Ag powder. Then, after printing or dispensing with a dispenser, firing is performed in a temperature range of 550 to 600 ° C. which is generally used in the manufacture of plasma display panels.
  • the raw materials were prepared and mixed for Examples 1 to 5 so as to have the component composition shown in Table 1, and placed in a platinum crucible and melted at 1200-1300 ° C for 2 hours. A lux body was produced. Separately, the molten glass was quenched to obtain glass flakes. Furthermore, glass flakes and ion-exchanged water were put in a pot mill, and wet pulverization was performed until the average particle size became 0.8 to 0.9 ⁇ m, followed by drying with hot air to produce a glass powder.
  • glass powders were produced for Comparative Examples 1 to 5 so as to have the component compositions shown in Table 2.
  • the glass load soft spot Td (° C) and acid resistance were measured. Moreover, about the Example, the identification of the deposit was performed.
  • the average particle diameter of glass powder, glass load softening point Td, and acid resistance were measured using the following methods.
  • the value of D in the volume distribution mode was determined using a laser scattering particle size distribution analyzer.
  • the glass barta body obtained by pouring into a mold was cut out to about 5 ⁇ 5 ⁇ 15 mm to prepare a test piece.
  • a glass load softening point Td (.C) was obtained with the yield point of the thermal expansion curve obtained when the temperature was raised from room temperature at 10 ° C. Zmim.
  • the lead-free glass of Examples 1 to 5 has a soft spot equivalent to that of the lead-based glass of Comparative Example 1 and also exhibits excellent acid resistance.
  • the lead-free glass of Examples 4 and 5 has relatively low BiO, so it is excellent in cost.
  • the lead-free glasses of Comparative Examples 2 to 5 have a soft spot as low as that of lead-based glass, but are inferior in acid resistance.

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  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Glass Compositions (AREA)
  • Gas-Filled Discharge Tubes (AREA)
  • Inorganic Insulating Materials (AREA)

Abstract

A nonlead glass composition that solving the problem of conventional Bi2O3 glass with respect to glass softening point and acid resistance, not only can retain the same level of softening point as that of conventionally employed lead glass but also realizes excellent acid resistance. There is provided a nonlead glass composition comprising, in terms of oxide, 55 to 75 wt.% Bi2O3, 5 to 15 wt.% B2O3, 4 to 12 wt.% SiO2, 3 to 12 wt.% ZnO, 3 to 10 wt.% Al2O3 and 0.1 to 5 wt.% ZrO2.

Description

明 細 書  Specification
無鉛ガラス組成物  Lead-free glass composition
技術分野  Technical field
[0001] 本発明は無鉛ガラス組成物に関する。より詳しくは、耐酸性が求められる電子部品 の形成、接着、被覆又は封着等に使用される無鉛ガラス組成物に関する。更に詳し くはプラズマディスプレイパネルにぉ ヽて耐酸性が求められる Ag導体等の導体配線 部に添加される無鉛ガラス、或いは電子部品、素子の耐酸性が求められる表面の保 護に用いられる無鉛ガラスについてのガラス組成物に関する。  [0001] The present invention relates to a lead-free glass composition. More specifically, the present invention relates to a lead-free glass composition used for the formation, adhesion, coating or sealing of electronic components that require acid resistance. More specifically, lead-free glass added to conductor wiring parts such as Ag conductors that require acid resistance over plasma display panels, or lead-free glass used to protect surfaces that require acid resistance of electronic components and elements. Relates to a glass composition.
背景技術  Background art
[0002] プラズマディスプレイパネル等の表示装置においては、例えば配線に使用される導 体を Ag粉末にガラス粉末を混ぜて焼結して構成し、またガラスによって素子の表面 保護を図る等、ガラスが有用に用いられてきた。従来これらのガラスとしては、主に鉛 系ガラスが用いられてきたが、近年、鉛を含む製品は環境上の観点からその使用が 避けられる傾向にある。  [0002] In a display device such as a plasma display panel, for example, a conductor used for wiring is formed by mixing Ag powder with glass powder and sintering the glass, and protecting the surface of the element with glass. It has been usefully used. Conventionally, lead glass has been mainly used as these glasses, but in recent years, products containing lead have a tendency to be avoided from an environmental point of view.
鉛を含まない低融点ガラスとしては、 P O ZnO系、 P O— SnO系、 Bi O系の  Low melting glass that does not contain lead includes P O ZnO, P O—SnO, and Bi O
2 5 2 5 2 3 ガラスなどが知られている。しかしィ匕学的耐久性の点から、最近は Bi O系ガラスが  2 5 2 5 2 3 Glass is known. However, from the point of mechanical durability, Bi O glass has recently been used.
2 3 使用される場合が多い。  2 3 Often used.
特許文献 1:特開 2002— 270035号公報  Patent Document 1: JP 2002-270035 A
特許文献 2 :特開 2000— 67750号公報  Patent Document 2: JP 2000-67750 A
特許文献 3 :特開平 10— 231141号公報  Patent Document 3: Japanese Patent Laid-Open No. 10-231141
発明の開示  Disclosure of the invention
発明が解決しょうとする課題  Problems to be solved by the invention
[0003] ところが上記 Bi O系ガラスは、従来の鉛系ガラスと比較して、ガラス軟ィ匕点を同程 [0003] However, the above-mentioned BiO glass has the same glass soft spot as that of conventional lead glass.
2 3  twenty three
度にした場合、耐酸性が劣るという問題があった。  In the case where the temperature is too high, the acid resistance is poor.
このためプラズマディスプレイパネルの製造にぉ 、て、ガラス基板上に導体による 配線を金属粉末と前記 Bi O系ガラス粉末とを用いて焼結形成し、更に配線を形成  For this reason, when manufacturing a plasma display panel, a conductor wiring is formed on a glass substrate by sintering using a metal powder and the BiO glass powder, and further forming a wiring.
2 3  twenty three
したガラス基板上に積層された層から隔壁を形成する際において、この隔壁形成を 酸によるエッチングを用いて行う場合には、該酸によるエッチングによって前記ガラス が配合された導体が腐食されるという問題があった。 When forming a partition from a layer laminated on a glass substrate, the partition is formed. When etching is performed using an acid, there has been a problem that the conductor containing the glass is corroded by the etching using the acid.
前記特許文献 1では、ほう珪酸亜鉛ビスマス系ガラスを主体とするガラス質粉末を 用いることが開示されており、また前記特許文献 2では酸ィ匕亜鉛を主成分とする非結 晶性ガラス又はビスマス系を主成分とする非結晶質ガラスを用いることが開示されて おり、何れの特許文献 1、 2においても、ガラスの安定性の向上、ガラス軟化点の調整 を目的としている。しかし、何れの特許文献 1、 2においてもガラス自体の耐酸性を向 上させるものではない。  Patent Document 1 discloses the use of vitreous powder mainly composed of bismuth zinc borosilicate glass, and Patent Document 2 discloses non-crystalline glass or bismuth composed mainly of zinc oxide. It is disclosed to use an amorphous glass mainly composed of a system, and both Patent Documents 1 and 2 aim at improving the stability of the glass and adjusting the glass softening point. However, neither Patent Document 1 or 2 improves the acid resistance of the glass itself.
また前記特許文献 3では、ほう珪酸ビスマス系ガラスにおいて、 ZnOと Al Oの含有  In Patent Document 3, the bismuth borosilicate glass contains ZnO and AlO.
2 3 量を調整することでガラスの耐酸性を向上させる試みがなされているが、軟ィ匕点が鉛 系ガラスと比べて上昇する問題があり、また耐酸性による剥離の問題を解決するに至 つていない。  Although attempts have been made to improve the acid resistance of glass by adjusting the amount, there is a problem that the soft spot rises compared to lead glass, and it also solves the problem of peeling due to acid resistance. Not yet.
[0004] そこで本発明は上記従来の Bi O系ガラスにおける問題を解決し、従来使用されて  [0004] Therefore, the present invention solves the above-mentioned problems in the conventional BiO-based glass and has been used in the past.
2 3  twenty three
いた鉛系ガラスと同等の軟ィ匕温度を有することができると共に、良好な耐酸性を有す る無鉛ガラス組成物の提供を課題とする。  It is an object of the present invention to provide a lead-free glass composition that can have a soft temperature equivalent to that of the conventional lead-based glass and has good acid resistance.
課題を解決するための手段  Means for solving the problem
[0005] 本発明者らは上記課題を解決すべく鋭意研究を重ねた結果、 Bi O— B O— Si [0005] As a result of intensive studies to solve the above problems, the present inventors have found that Bi O— B O— Si.
2 3 2 3 2 3 2 3
O— ZnO— Al O— ZrO系のガラス組成物における一定の成分組成範囲においO—ZnO—Al O—ZrO glass composition in a certain component range.
2 2 3 2 2 2 3 2
て、鉛系ガラスに代わるものとして、鉛系ガラスと同等の軟ィ匕温度を有し、且つ良好な 耐酸性を兼ね備えた特性を示すことを見出し、本発明を完成した。  Thus, as a substitute for lead-based glass, the inventors have found that it has a soft temperature equivalent to that of lead-based glass and exhibits good acid resistance, and has completed the present invention.
即ち、本発明の無鉛ガラス組成物は、酸化物換算で、 Bi O : 55〜75重量%、 B  That is, the lead-free glass composition of the present invention is, in terms of oxide, Bi 2 O: 55 to 75% by weight, B
2 3 2 2 3 2
O : 5〜15重量%、SiO :4〜12重量%、ZnO : 3〜12重量%、A1 0 : 3〜10重量O: 5 to 15% by weight, SiO: 4 to 12% by weight, ZnO: 3 to 12% by weight, A1 0: 3 to 10% by weight
3 2 2 3 3 2 2 3
%、ZrO : 0. 1〜5重量%を含有する組成であることを第 1の特徴としている。  %, ZrO: 0.1 to 5% by weight of the composition is the first feature.
2  2
また本発明の無鉛ガラス組成物は、酸化物換算で、 Bi O : 65〜72重量%、 B O  In addition, the lead-free glass composition of the present invention is, in terms of oxide, Bi O: 65 to 72% by weight, B 2 O
2 3 2 3 2 3 2 3
: 10〜15重量%、 SiO : 5〜10重量%、∑110 : 3〜6重量%、八1 0 : 3〜8重量%、 : 10-15% by weight, SiO: 5-10% by weight, ∑110: 3-6% by weight, 8 10: 3-8% by weight,
2 2 3  2 2 3
ZrO : 0. 5〜3重量%を含有する組成であることを第 2の特徴としている。  The second feature is that the composition contains ZrO: 0.5 to 3% by weight.
2  2
また本発明の無鉛ガラス組成物は、上記第 1又は第 2の特徴に加えて、 600°C以下 で焼成したときにガーナイト (ZnAl O )又はジルコン (ZrSiO )の結晶を析出すること を第 3の特徴としている。 In addition to the first or second feature, the lead-free glass composition of the present invention precipitates garnite (ZnAl 2 O 3) or zircon (ZrSiO 2) crystals when fired at 600 ° C. or lower. Is the third feature.
また本発明の無鉛ガラス組成物は、上記第 1〜第 3の何れかの特徴に加えて、耐 酸性が求められる導体を形成するものとして金属粉に添加され、共に焼結される焼 結助剤としてのガラス粉末であることを第 4の特徴としている。  The lead-free glass composition of the present invention is added to the metal powder as a conductor that requires acid resistance in addition to any of the first to third features described above, and is sintered together. The fourth feature is that it is a glass powder as an agent.
また本発明の無鉛ガラス組成物は、上記第 1〜第 4の何れかの特徴に加えて、ブラ ズマディスプレイパネルのガラス基板上に構成される金属電極の添加用ガラス粉末 であることを第 5の特徴として 、る。  Further, the lead-free glass composition of the present invention is, in addition to any of the first to fourth features described above, a glass powder for adding a metal electrode formed on a glass substrate of a plasma display panel. As a feature of
また本発明の無鉛ガラス組成物は、上記第 1〜第 3の何れかの特徴に加えて、電 子部品表面の被覆用ガラスとして用いられることを第 6の特徴としている。  The lead-free glass composition of the present invention has a sixth feature that it is used as a glass for coating an electronic component surface in addition to any of the first to third features.
発明の効果  The invention's effect
[0006] 請求項 1に記載の無鉛ガラス組成物によれば、酸化物換算で、 Bi O : 55〜75重  [0006] According to the lead-free glass composition of claim 1, Bi O: 55 to 75 layers in terms of oxide
2 3  twenty three
量%、 0 : 5〜15重量%、SiO :4〜12重量%、ZnO : 3〜12重量%、A1 0 : 3  Amount%, 0: 5-15% by weight, SiO: 4-12% by weight, ZnO: 3-12% by weight, A1 0: 3
2 3 2 2 3 2 3 2 2 3
〜10重量0 /0、ZrO : 0. 1〜5重量%を含有する組成であるので、 10wt 0/0, ZrO: since a composition containing 1-5 wt% 0.,
2  2
従来用いられて 、た鉛系ガラスを用いることなぐよって環境に悪影響を与えること なぐ且つガラスとして鉛系ガラスと同等の軟ィ匕温度特性、より端的には 530°C以下 の軟ィ匕点を維持し且つ耐酸性が非常に良好な特性を備えたガラス材料の提供が可 能となる。よってまた、製造工程やその他の使用条件において酸にさらされるプラズ マディスプレイパネル等の種々の部材、部品、装置に用いられるガラス材料として、 鉛フリーで、酸性雰囲気に耐えることが可能となった。  It has been used in the past and does not adversely affect the environment due to the use of lead-based glass, and it has a soft temperature characteristic equivalent to that of lead-based glass as a glass, more specifically, a soft spot of 530 ° C or lower. It is possible to provide a glass material having characteristics that are maintained and have very good acid resistance. Therefore, as a glass material used for various components, parts, and devices such as plasma display panels that are exposed to acid in the manufacturing process and other usage conditions, it is possible to withstand an acidic atmosphere that is lead-free.
[0007] また請求項 2に記載の無鉛ガラス組成物によれば、ガラス組成を酸ィ匕物換算で、 Bi [0007] In addition, according to the lead-free glass composition of claim 2, the glass composition is converted into an oxide, Bi
O : 65〜72重量%、B O : 10〜15重量%、 SiO : 5〜10重量%、∑110 : 3〜6重 O: 65 to 72% by weight, B O: 10 to 15% by weight, SiO: 5 to 10% by weight, ∑ 110: 3 to 6%
2 3 2 3 2 2 3 2 3 2
0 /0、Al O : 3〜8重量0 /0、ZrO : 0. 5〜3重量%を含有する組成であるので、 The amount 0/0, Al O: 3~8 wt 0/0, ZrO: since a composition containing from 0.5 to 3 wt%,
2 3 2  2 3 2
上記請求項 1に記載の無鉛ガラス組成物と同様な作用効果を得ることができる。更 に一層確実に 520°C以下の軟ィ匕点を確保しつつ、且つ良好な耐酸性を有することが できる。  The same effects as those of the lead-free glass composition according to claim 1 can be obtained. Furthermore, it is possible to secure a soft saddle point of 520 ° C. or lower and more reliably have good acid resistance.
[0008] また請求項 3に記載の無鉛ガラス組成物によれば、上記請求項 1又は 2に記載の構 成による効果にカ卩えて、 600°C以下で焼成したときにガーナイト (ZnAl O )又はジル  [0008] In addition, according to the lead-free glass composition according to claim 3, garnite (ZnAl 2 O 3) when fired at 600 ° C or less in view of the effect of the structure according to claim 1 or 2. Or Jill
2 4 コン (ZrSiO )の結晶を析出することにより、 ガラスの耐酸性を十分に向上させることができる。 By precipitating crystals of 2 4con (ZrSiO), The acid resistance of the glass can be sufficiently improved.
[0009] また請求項 4に記載の無鉛ガラス組成物によれば、請求項 1〜3の何れかに記載の 構成による効果に加えて、耐酸性が求められる導体を形成するものとして金属粉に 添加され、共に焼結される焼結助剤としてのガラス粉末であることにより、  [0009] Further, according to the lead-free glass composition according to claim 4, in addition to the effect of the structure according to any one of claims 1 to 3, the metal powder is formed to form a conductor that requires acid resistance. By being a glass powder as a sintering aid that is added and sintered together,
本発明の無鉛ガラス組成物が混合された金属粉の焼結された導体は、装置、部材 、部品の一部として、好ましい耐酸侵蝕性を発揮することができる。  The sintered conductor of the metal powder mixed with the lead-free glass composition of the present invention can exhibit preferable acid corrosion resistance as a part of the apparatus, member, and component.
[0010] また請求項 5に記載の無鉛ガラス組成物によれば、請求項 1〜4の何れかに記載の 構成による効果にカ卩えて、プラズマディスプレイパネルのガラス基板上に構成される 金属電極の添加用ガラス粉末であることにより、  [0010] According to the lead-free glass composition according to claim 5, the metal electrode configured on the glass substrate of the plasma display panel in consideration of the effect of the configuration according to any one of claims 1 to 4. By adding glass powder for
このガラス粉末を添加してなる金属電極がガラス基板上に馴染んで構成されると共 に、製造工程におけるプラズマディスプレイパネルの製造時において、製造工程に ぉ 、て酸性液を用いたエッチング等がなされても金属電極が容易に腐食で損傷させ られたりするのを防止することができる。  The metal electrode formed by adding this glass powder is adapted to the glass substrate, and at the time of manufacturing the plasma display panel in the manufacturing process, etching using an acidic solution is performed during the manufacturing process. However, it is possible to prevent the metal electrode from being easily damaged by corrosion.
[0011] また請求項 6に記載の無鉛ガラス組成物によれば、請求項 1〜3の何れかに記載の 構成による効果に加えて、電子部品表面の被覆用ガラスとして用いられることにより、 酸性雰囲気下において、耐久性のよい部品保護の効果を発揮することができる。 発明を実施するための最良の形態  [0011] According to the lead-free glass composition according to claim 6, in addition to the effect of the structure according to any one of claims 1 to 3, the lead-free glass composition is acidic by being used as a glass for coating an electronic component surface. In the atmosphere, it is possible to exert a durable component protecting effect. BEST MODE FOR CARRYING OUT THE INVENTION
[0012] 本発明の無鉛ガラス組成物は、プラズマディスプレイパネルのガラス基板やその他 のガラス基板、セラミック基板の上に積層される電極や電線を構成するため、金属紛 等の導体主成分に対して添加されるガラス粉末として、主として用いられる。また耐酸 性が要求される電子部品の素子表面等を被覆する電子部品表面の被覆用ガラスや その他のガラス部材、ガラス部品、ガラス装置として用いることができる。  [0012] The lead-free glass composition of the present invention constitutes electrodes and electric wires laminated on a glass substrate of a plasma display panel, other glass substrates, and ceramic substrates. Mainly used as added glass powder. In addition, it can be used as glass for coating the surface of an electronic component that covers the surface of an electronic component that requires acid resistance, other glass members, glass components, and glass devices.
また本発明にお ヽて「実質的に Pbを含有せず」とは、 PbO等の鉛を含む原料を一 切使用しないという意味であり、ガラスを構成する各成分の原料及び無機フイラ一等 に含まれる不純物としての鉛が混入したものを排除するものではない。  Further, in the present invention, “substantially free of Pb” means that no raw material containing lead such as PbO is used, and the raw materials of each component constituting the glass, the inorganic filler, etc. It does not exclude the case where lead as an impurity contained in is mixed.
[0013] 本発明に係る無鉛ガラス組成物の組成の範囲にっ ヽて説明する。  [0013] The composition range of the lead-free glass composition according to the present invention will be described.
Bi Oは、ガラスの網目形成とガラスを低溶融化させるのに必須の成分である。  Bi 2 O is an essential component for forming a glass network and melting the glass.
2 3  twenty three
その成分範囲としては、 55〜75重量%とする。 55重量%未満ではガラスの低溶融 化が不十分であり、一方、 75重量%を超えるとガラスの耐酸性が低下して不十分とな る。 The component range is 55 to 75% by weight. Less than 55% by weight of glass has low melting On the other hand, when it exceeds 75% by weight, the acid resistance of the glass is lowered and becomes insufficient.
Bi Oは、好ましくは 65〜72重量%とする。このような含有量の範囲とすることで、 BiO is preferably 65 to 72% by weight. By making such a content range,
2 3 twenty three
ガラスの軟ィ匕点を上昇させずに耐酸性を向上させることができる。  Acid resistance can be improved without increasing the soft spot of the glass.
Bi Oは、更に好ましくは 66〜69重量%とするのがよい。  Bi O is more preferably 66 to 69% by weight.
2 3  twenty three
[0014] B Oは、ガラスの網目を形成し、ガラスの溶融時における安定性を向上させるため  [0014] B 2 O forms a glass network and improves stability when the glass melts
2 3  twenty three
に必須の成分である。  Is an essential ingredient.
その成分範囲としては、 5〜15重量%とする。 5重量%未満ではガラスが不安定に なる。また 15重量%を超えるとガラスの耐酸性が低下するため、好ましくない。  The component range is 5 to 15% by weight. If it is less than 5% by weight, the glass becomes unstable. On the other hand, if it exceeds 15% by weight, the acid resistance of the glass decreases, which is not preferable.
B Oは、好ましくは 10〜15重量%とする。このような含有量の範囲とすることで、ガ B 2 O is preferably 10 to 15% by weight. By setting this content range,
2 3 twenty three
ラスの軟ィ匕点を上昇させずに耐酸性を向上させることができる。  The acid resistance can be improved without increasing the soft saddle point of the lath.
B Oは、更に好ましくは 10〜13重量%とするのがよい。  B 2 O is more preferably 10 to 13% by weight.
2 3  twenty three
[0015] SiOはガラスの網目を形成し、ガラスの耐酸性、溶融時の安定性を向上させるため  [0015] SiO forms a glass network to improve the acid resistance and stability of the glass when melted.
2  2
に必須の成分である。  Is an essential ingredient.
その成分範囲としては、 4〜12重量%とする。 4重量%未満ではガラスの耐酸性、 溶融時の安定性が低下して不十分となる、一方、 12重量%を超えるとガラス溶融時 に失透しやすくなる。  The component range is 4 to 12% by weight. If it is less than 4% by weight, the acid resistance of the glass and the stability at the time of melting are lowered and become insufficient. On the other hand, if it exceeds 12% by weight, the glass tends to be devitrified.
SiOは、好ましくは 5〜10重量%とする。このような含有量の範囲とすることで、ガラ SiO is preferably 5 to 10% by weight. By making such a content range,
2 2
スの軟ィ匕点を上昇させずに耐酸性を向上させることができる。  The acid resistance can be improved without increasing the soft soft spot.
SiOは、更に好ましくは 6〜9重量%とするのがよい。  More preferably, SiO is 6 to 9% by weight.
2  2
[0016] ZnOは、ガラスを低溶融化させるために必須の成分である。  [0016] ZnO is an essential component for melting the glass at a low temperature.
その成分範囲としては、 3〜12重量%とする。 3重量%未満ではガラスの低溶融化 が不十分となる。一方、 12重量%を超えるとガラスの耐酸性が低下して不十分となる  The component range is 3 to 12% by weight. If it is less than 3% by weight, the glass will not be sufficiently melted. On the other hand, if it exceeds 12% by weight, the acid resistance of the glass will decrease and become insufficient.
ZnOは、好ましくは 3〜6重量%とする。このような含有量の範囲とすることで、ガラ スの軟ィ匕点を上昇させずに耐酸性を向上させることができる。 ZnO is preferably 3 to 6% by weight. By setting the content to such a range, the acid resistance can be improved without increasing the soft soft spot of glass.
[0017] Al Oは、ガラスの耐酸性を向上させるために必須の成分である。 [0017] Al 2 O is an essential component for improving the acid resistance of glass.
2 3  twenty three
その成分範囲としては、 3〜: L0重量%とする。 3重量%未満ではガラスの耐酸性が 低下して不十分となる。一方、 10重量%を超えるとガラス溶融時に失透しやすくなるThe component range is 3 to: L0% by weight. If it is less than 3% by weight, the acid resistance of the glass It drops and becomes insufficient. On the other hand, if it exceeds 10% by weight, it tends to devitrify when the glass melts.
。また焼結助剤としてのバインダー性能が低下する。 . Further, the binder performance as a sintering aid is lowered.
Al Oは、好ましくは 3〜8重量%とする。このような含有量の範囲とすることで、焼 Al 2 O is preferably 3 to 8% by weight. By setting the content to such a range,
2 3 twenty three
結助剤としてのバインダー性能を低下させずに耐酸性を向上させることができる。  The acid resistance can be improved without deteriorating the binder performance as a binder.
[0018] ZrOは、耐酸性を向上させるために必須の成分である。 [0018] ZrO is an essential component for improving acid resistance.
2  2
その成分範囲としては、 0. 1〜5重量%とする。 0. 1重量%未満ではガラスの耐酸 性向上に効果を発揮しない。一方、 5重量%を超えるとガラス溶融時に失透しやすく なる。また焼結助剤としてのバインダー性能が低下する。  The component range is 0.1 to 5% by weight. If it is less than 1% by weight, it will not be effective in improving the acid resistance of the glass. On the other hand, if it exceeds 5% by weight, it tends to devitrify when the glass melts. Further, the binder performance as a sintering aid is lowered.
ZrOは、好ましくは 0. 5〜3重量%とする。このような含有量の範囲とすることで、 ZrO is preferably 0.5 to 3% by weight. By making such a content range,
2 2
焼結助剤としてのバインダー性能を低下させずに耐酸性を向上させることができる。  Acid resistance can be improved without deteriorating the binder performance as a sintering aid.
[0019] 本発明のガラス組成物の焼成に関しては、焼成時にガーナイト(ZnAl O )又はジ  Regarding the firing of the glass composition of the present invention, garnite (ZnAl 2 O 3) or
2 4 ルコン (ZrSiO )の結晶が析出しやすぐ耐酸性が向上する傾向がある。  2 4 Rucon (ZrSiO 2) crystals tend to precipitate and the acid resistance tends to improve immediately.
4  Four
一般的には、ガラス中に ZnOが多量に含まれると、耐酸性が悪ィ匕する傾向にある。 しかし本発明の場合は、耐酸性が向上する理由として、 Bi O、 B O、 SiO、 ZnO、  In general, when glass contains a large amount of ZnO, the acid resistance tends to deteriorate. However, in the case of the present invention, the reason why the acid resistance is improved is as follows: Bi 2 O, B 2 O, SiO, ZnO,
2 3 2 3 2 2 3 2 3 2
Al O、 ZrOを適当な範囲で含むことにより、(1)ガラスが昇温過程で軟ィ匕し接着剤By including Al O and ZrO in an appropriate range, (1) the glass softens during the heating process and becomes an adhesive.
2 3 2 2 3 2
としての役割を低下させることがな ヽこと、 (2)ガラス相の耐酸性を低下させる ZnOの 一部が結晶に変化することによりガラスネットワーク中の ZnOが減少すること、等によ る結果としてガラスの耐酸性が向上したと推測される。  (2) Decreasing the acid resistance of the glass phase As a result of a decrease in ZnO in the glass network due to part of the ZnO changing to crystals, etc. It is estimated that the acid resistance of the glass has improved.
[0020] 上記成分に加えて、ガラス溶融時の安定性を高めたり、ガラスの軟化点及び結晶 析出の調整を行う目的で、 BaO、 SrO、 CaO、 MgO、 Fe O、 CuO、 CoO、 TiO、 S [0020] In addition to the above components, BaO, SrO, CaO, MgO, FeO, CuO, CoO, TiO, etc. are used for the purpose of improving the stability during glass melting and adjusting the softening point and crystal precipitation of the glass. S
2 3 2 nO、 CeO、 Ln O (ランタノイド)等を合計で 2重量%以下力卩えてもよい。  2 3 2 nO, CeO, Ln 2 O (lanthanoid), etc. may be added up to 2% by weight in total.
2 2 2 3  2 2 2 3
[0021] 本発明の無鉛ガラス組成物は、ガラスとして乾式粉砕され、水系溶媒または有機溶 剤系溶媒を用いた湿式粉砕の条件により粒径を調整し、平均粒径を 0. 5〜2 111、 最大粒径を 10 μ m以下とする。  [0021] The lead-free glass composition of the present invention is dry pulverized as glass, the particle size is adjusted by the conditions of wet pulverization using an aqueous solvent or an organic solvent solvent, and the average particle size is 0.5 to 2 111. The maximum particle size is 10 μm or less.
平均粒径が 0. 5 m未満では、ガラス粉末の比表面積が増加することにより、発泡 しゃすくなることによりペーストの設計が難しくなる。平均粒径が 2 m及び最大粒径 力 S 10 mを超えると、配線のファインパターンが困難になる。  If the average particle size is less than 0.5 m, the specific surface area of the glass powder increases, which makes foaming difficult to design. If the average grain size exceeds 2 m and the maximum grain size force S 10 m, fine patterning of wiring becomes difficult.
好ましくは平均粒径を 0. 5〜1. O ^ m,最大粒径を 4 /z m以下とする。 また平均粒径を 0. 5〜0. 7 /ζ πι、最大粒径を 3 m以下とすることが更に好ましい 得られたガラス粉末を単体、或いは導体構成用の金属粉末、例えば Ag粉末と混合 し、印刷もしくはディスペンサーにて塗布した後、プラズマディスプレイパネルの製造 で一般的に用いられる 550〜600°Cの温度範囲で焼成する。 Preferably, the average particle size is 0.5 to 1. O ^ m, and the maximum particle size is 4 / zm or less. It is more preferable that the average particle size is 0.5 to 0.7 / ζ πι and the maximum particle size is 3 m or less. The obtained glass powder is mixed with a single substance or a metal powder for constituting a conductor, for example, Ag powder. Then, after printing or dispensing with a dispenser, firing is performed in a temperature range of 550 to 600 ° C. which is generally used in the manufacture of plasma display panels.
実施例  Example
[0022] 以下に、実施例を挙げて本発明を更に説明する。し力しながら本発明は、これらの 実施例により何ら限定されるものではない。  Hereinafter, the present invention will be further described with reference to examples. However, the present invention is not limited to these examples.
(実施例 1〜5及び比較例 1〜5)  (Examples 1 to 5 and Comparative Examples 1 to 5)
表 1に示す成分組成となるように、実施例 1〜5について原料を調合、混合し、これ を白金ルツボに入れて 1200-1300°Cで 2時間溶融後、型に流し出してガラスのバ ルク体を作製した。また別に溶融ガラスを急冷してガラスフレークを得た。更にポットミ ルにガラスフレークとイオン交換水を入れ、平均粒径が 0. 8〜0. 9 μ mになるまで湿 式粉砕を行い、その後、熱風乾燥にて乾燥し、ガラス粉末を作製した。  The raw materials were prepared and mixed for Examples 1 to 5 so as to have the component composition shown in Table 1, and placed in a platinum crucible and melted at 1200-1300 ° C for 2 hours. A lux body was produced. Separately, the molten glass was quenched to obtain glass flakes. Furthermore, glass flakes and ion-exchanged water were put in a pot mill, and wet pulverization was performed until the average particle size became 0.8 to 0.9 μm, followed by drying with hot air to produce a glass powder.
同様に表 2に示す成分組成となるように比較例 1〜5についてガラス粉末を作製し た。  Similarly, glass powders were produced for Comparative Examples 1 to 5 so as to have the component compositions shown in Table 2.
[0023] 各実施例、比較例について、ガラス荷重軟ィ匕点 Td(°C)、耐酸性を測定した。また 実施例については析出物の同定を行った。  [0023] For each example and comparative example, the glass load soft spot Td (° C) and acid resistance were measured. Moreover, about the Example, the identification of the deposit was performed.
なお、ガラス粉末の平均粒径、ガラス荷重軟ィ匕点 Td、耐酸性は次の方法により測 し 7こ。  The average particle diameter of glass powder, glass load softening point Td, and acid resistance were measured using the following methods.
(1)ガラス粉末の平均粒径  (1) Average particle size of glass powder
レーザー散乱式粒度分布計を用いて、体積分布モードの D の値を求めた。  The value of D in the volume distribution mode was determined using a laser scattering particle size distribution analyzer.
50  50
(2)ガラス荷重軟ィ匕点 Td (°C)  (2) Glass load soft spot Td (° C)
上記 1200〜1300°Cで 2時間溶融後、型に流し出して得たガラスのバルタ体を約 5 X 5 X 15mmに切り出し、試験片を作製した。 TMA測定装置を用いて、室温から 10 °CZmimで昇温したときに得られる熱膨張曲線の屈服点をもってガラス荷重軟ィ匕点 Td(。C)を得た。  After melting at 1200 to 1300 ° C. for 2 hours, the glass barta body obtained by pouring into a mold was cut out to about 5 × 5 × 15 mm to prepare a test piece. Using a TMA measuring device, a glass load softening point Td (.C) was obtained with the yield point of the thermal expansion curve obtained when the temperature was raised from room temperature at 10 ° C. Zmim.
(3)耐酸性 得られたガラス粉末を φ 20mmに乾式プレスにて成形し、 600°Cで焼結後、 10 X 1 O X 3mmに切り出し、試験片を作製した。この試験片を 45°Cの 10%硝酸水溶液に 6 0秒間浸漬し、重量減少量と嵩密度から浸蝕速度( μ m/mim)を測定した。 (3) Acid resistance The obtained glass powder was formed into a diameter of 20 mm by a dry press, sintered at 600 ° C., cut into 10 × 1 OX 3 mm, and a test piece was prepared. This specimen was immersed in a 10% aqueous nitric acid solution at 45 ° C. for 60 seconds, and the erosion rate (μm / mim) was measured from the weight loss and the bulk density.
[表 1] [table 1]
Figure imgf000009_0001
[表 2]
Figure imgf000009_0001
[Table 2]
Figure imgf000010_0001
Figure imgf000010_0001
表 1、 2より、実施例 1〜5の無鉛ガラスは、比較例 1の鉛系ガラスと同等の軟ィ匕点を 有すると共に、優れた耐酸性を示すことが判る。 From Tables 1 and 2, it can be seen that the lead-free glass of Examples 1 to 5 has a soft spot equivalent to that of the lead-based glass of Comparative Example 1 and also exhibits excellent acid resistance.
特に実施例 4、 5の無鉛ガラスは、 Bi Oが比較的少ないので、コスト的にも優れて  In particular, the lead-free glass of Examples 4 and 5 has relatively low BiO, so it is excellent in cost.
2 3  twenty three
いる。 Yes.
実施例の無鉛ガラスに対して、比較例 2〜5の無鉛ガラスは、軟ィ匕点は鉛系ガラスと 同等に低いが、耐酸性に劣ることがわかる。  Compared to the lead-free glass of the examples, the lead-free glasses of Comparative Examples 2 to 5 have a soft spot as low as that of lead-based glass, but are inferior in acid resistance.

Claims

請求の範囲 The scope of the claims
[1] 酸化物換算で、  [1] Oxide conversion
Bi O : 55〜75重量%  Bi O: 55 to 75% by weight
2 3  twenty three
B O : 5〜15重量%  B O: 5 to 15% by weight
2 3  twenty three
SiO : 4〜12重量%  SiO: 4 to 12% by weight
2  2
ZnO : 3〜12重量%  ZnO: 3-12% by weight
Al O : 3〜10重量%  Al O: 3 to 10% by weight
2 3  twenty three
ZrO : 0. 1〜5重量%  ZrO: 0.1-5% by weight
2  2
を含有する組成であることを特徴とする無鉛ガラス組成物。  The lead-free glass composition characterized by the above-mentioned.
[2] 酸化物換算で、  [2] Oxide conversion
Bi O : 65〜72重量%  Bi O: 65-72% by weight
2 3  twenty three
B O : 10〜15重量%  B O: 10-15% by weight
2 3  twenty three
SiO : 5〜10重量%  SiO: 5 to 10% by weight
2  2
ZnO : 3〜6重量%  ZnO: 3-6% by weight
Al O : 3〜8重量%  Al O: 3 to 8% by weight
2 3  twenty three
ZrO : 0. 5〜3重量%  ZrO: 0.5 to 3% by weight
2  2
を含有する組成であることを特徴とする無鉛ガラス組成物。  The lead-free glass composition characterized by the above-mentioned.
[3] 600°C以下で焼成したときにガーナイト(ZnAl O )又はジルコン (ZrSiO )の結晶  [3] Garnite (ZnAl 2 O 3) or zircon (ZrSiO 2) crystals when fired at 600 ° C or lower
2 4 4 を析出することを特徴とする請求項 1又は 2に記載の無鉛ガラス組成物。  The lead-free glass composition according to claim 1, wherein 2 4 4 is precipitated.
[4] 耐酸性が求められる導体を形成するものとして金属粉に添加され、共に焼結される 焼結助剤としてのガラス粉末であることを特徴とする請求項 1〜3の何れかに記載の 無鉛ガラス組成物。 [4] The glass powder according to any one of claims 1 to 3, which is a glass powder as a sintering aid that is added to a metal powder as a conductor that requires acid resistance and sintered together. Lead-free glass composition.
[5] プラズマディスプレイパネルのガラス基板上に構成される金属電極の添加用ガラス 粉末であることを特徴とする請求項 1〜4の何れかに記載の無鉛ガラス組成物。  [5] The lead-free glass composition according to any one of [1] to [4], wherein the lead-free glass composition is a glass powder for adding a metal electrode formed on a glass substrate of a plasma display panel.
[6] 電子部品表面の被覆用ガラスとして用いられることを特徴とする請求項 1〜3の何 れかに記載の無鉛ガラス組成物。  [6] The lead-free glass composition according to any one of [1] to [3], which is used as a glass for coating an electronic component surface.
PCT/JP2006/314761 2005-09-02 2006-07-26 Nonlead glass composition WO2007029425A1 (en)

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JP5796281B2 (en) * 2010-08-17 2015-10-21 日本電気硝子株式会社 Electrode forming material
CN102603196B (en) * 2012-02-13 2015-04-01 江苏瑞德新能源科技有限公司 Glass mixing powder, preparation method thereof and conductive silver paste containing glass mixing powder
WO2014010621A1 (en) * 2012-07-13 2014-01-16 日本電気硝子株式会社 Light extraction layer forming glass, and light extraction layer forming glass powder, method for forming light extraction layer, material for forming light extraction layer, glass paste for forming light extraction layer, glass substrate for organic el element, organic el element and method for manufacturing glass substrate for organic el element which use same
JP6295625B2 (en) * 2013-02-07 2018-03-20 日本電気硝子株式会社 Glass substrate for organic EL device and manufacturing method thereof
JP6206832B2 (en) 2013-08-09 2017-10-04 日本電気硝子株式会社 Bismuth glass composition, powder material and powder material paste
CN106430988A (en) * 2015-08-11 2017-02-22 电子科技大学中山学院 Low-temperature lead-free glass powder for automobile front windshield laminated glass ink and preparation method thereof
KR102023990B1 (en) * 2016-08-03 2019-09-24 페로 코포레이션 Passivation Glass for Semiconductor Devices
CN112573829A (en) * 2020-12-15 2021-03-30 黄山市晶特美新材料有限公司 Glass slurry for automobile press-formed front windshield and preparation method thereof

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