WO2006135236A3 - Procede et dispositif de decoupe de composants electroniques par faisceau laser - Google Patents

Procede et dispositif de decoupe de composants electroniques par faisceau laser Download PDF

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Publication number
WO2006135236A3
WO2006135236A3 PCT/NL2006/050130 NL2006050130W WO2006135236A3 WO 2006135236 A3 WO2006135236 A3 WO 2006135236A3 NL 2006050130 W NL2006050130 W NL 2006050130W WO 2006135236 A3 WO2006135236 A3 WO 2006135236A3
Authority
WO
WIPO (PCT)
Prior art keywords
electronic components
laser beam
cutting
cutting electronic
holder
Prior art date
Application number
PCT/NL2006/050130
Other languages
English (en)
Other versions
WO2006135236A2 (fr
Inventor
Joannes Leonardus Jurrian Zijl
Original Assignee
Fico Bv
Joannes Leonardus Jurrian Zijl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fico Bv, Joannes Leonardus Jurrian Zijl filed Critical Fico Bv
Priority to JP2008514574A priority Critical patent/JP2008542033A/ja
Publication of WO2006135236A2 publication Critical patent/WO2006135236A2/fr
Publication of WO2006135236A3 publication Critical patent/WO2006135236A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B23K2103/166—Multilayered materials
    • B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Lasers (AREA)

Abstract

L'invention concerne un procédé de découpe de composants électroniques par faisceau laser. L'invention concerne également un dispositif de séparation de composants électroniques comprenant au moins : une source laser permettant de générer un faisceau de coupe et un support permettant de soutenir les composants électroniques non séparés, le support et la source laser pouvant se déplacer l'un par rapport à l'autre.
PCT/NL2006/050130 2005-06-02 2006-06-01 Procede et dispositif de decoupe de composants electroniques par faisceau laser WO2006135236A2 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008514574A JP2008542033A (ja) 2005-06-02 2006-06-01 レーザービームを用いて電子部品を切断するための方法および装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL1029172A NL1029172C2 (nl) 2005-06-02 2005-06-02 Werkwijze en inrichting voor het met een laserstraal snijden van elektronische componenten.
NL1029172 2005-06-02

Publications (2)

Publication Number Publication Date
WO2006135236A2 WO2006135236A2 (fr) 2006-12-21
WO2006135236A3 true WO2006135236A3 (fr) 2007-03-08

Family

ID=35717588

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/NL2006/050130 WO2006135236A2 (fr) 2005-06-02 2006-06-01 Procede et dispositif de decoupe de composants electroniques par faisceau laser

Country Status (6)

Country Link
JP (1) JP2008542033A (fr)
KR (1) KR20080011367A (fr)
CN (1) CN101185161A (fr)
NL (1) NL1029172C2 (fr)
TW (1) TW200702093A (fr)
WO (1) WO2006135236A2 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009049750A1 (de) * 2009-10-17 2011-04-21 Bayerische Motoren Werke Aktiengesellschaft Verfahren und Vorrichtung zum Schneiden von Material mittels eines modulierten Laserstrahls
CN103921003B (zh) * 2014-04-16 2016-06-29 苏州工业职业技术学院 用激光进行切割的电子元件切脚装置及使用方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998052257A1 (fr) * 1997-05-12 1998-11-19 Dahm Jonathan S Dispositif de decoupe par laser ameliore
US20030168975A1 (en) * 2001-12-21 2003-09-11 Dave Lovell Patterning thin film layers for electroluminescent displays
EP1502695A1 (fr) * 2002-05-07 2005-02-02 Disco Corporation Machine de traitement mettant en oeuvre un faisceau laser
US20060009008A1 (en) * 2004-07-12 2006-01-12 Disco Corporation Method for the laser processing of a wafer

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6525296B2 (en) * 1998-10-20 2003-02-25 Sharp Kabushiki Kaisha Method of processing and optical components
JP4050534B2 (ja) * 2002-03-12 2008-02-20 浜松ホトニクス株式会社 レーザ加工方法
TWI520269B (zh) * 2002-12-03 2016-02-01 Hamamatsu Photonics Kk Cutting method of semiconductor substrate

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998052257A1 (fr) * 1997-05-12 1998-11-19 Dahm Jonathan S Dispositif de decoupe par laser ameliore
US20030168975A1 (en) * 2001-12-21 2003-09-11 Dave Lovell Patterning thin film layers for electroluminescent displays
EP1502695A1 (fr) * 2002-05-07 2005-02-02 Disco Corporation Machine de traitement mettant en oeuvre un faisceau laser
US20060009008A1 (en) * 2004-07-12 2006-01-12 Disco Corporation Method for the laser processing of a wafer

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
"METHOD OF PREVENTING DAMAGE TO INTEGRATED CIRCUIT CHIPS DURING WAFER DICING", IBM TECHNICAL DISCLOSURE BULLETIN, IBM CORP. NEW YORK, US, vol. 34, no. 12, 1 May 1992 (1992-05-01), pages 311 - 312, XP000308530, ISSN: 0018-8689 *
J.I. RAFFEL ET AL: "A wafer-scale digital integratior using restructurable VLSI", IEEE JOUR. OF SOLID-STATE CIRCUITS, vol. sc-20, no. 1, February 1985 (1985-02-01), pages 399 - 406, XP002366919 *
KOREN G ET AL: "CO2 LASER CLEANING OF BLACK DEPOSITS FORMED DURING THE EXCIMER LASER ETCHING OF POLYMIDE IN AIR", APPLIED PHYSICS B. PHOTOPHYSICS AND CHEMISTRY, SPRINGER VERLAG. HEIDELBERG, DE, vol. B45, no. 1, January 1988 (1988-01-01), pages 45 - 46, XP000119126 *

Also Published As

Publication number Publication date
TW200702093A (en) 2007-01-16
JP2008542033A (ja) 2008-11-27
KR20080011367A (ko) 2008-02-04
WO2006135236A2 (fr) 2006-12-21
NL1029172C2 (nl) 2006-12-05
CN101185161A (zh) 2008-05-21

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