CN101185161A - 用激光光束切割电子元件的方法和设备 - Google Patents

用激光光束切割电子元件的方法和设备 Download PDF

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CN101185161A
CN101185161A CNA2006800189873A CN200680018987A CN101185161A CN 101185161 A CN101185161 A CN 101185161A CN A2006800189873 A CNA2006800189873 A CN A2006800189873A CN 200680018987 A CN200680018987 A CN 200680018987A CN 101185161 A CN101185161 A CN 101185161A
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J·L·J·齐芝洛
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials, e.g. fibre reinforced
    • B23K2103/166—Multilayered materials
    • B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards

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  • Engineering & Computer Science (AREA)
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  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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  • Condensed Matter Physics & Semiconductors (AREA)
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Abstract

本发明涉及用激光光束切割电子元件的方法。本发明也涉及用于分离电子元件的设备，其至少包括：用于产生切割光束的激光源以及用于支撑未分离的电子元件的支撑器，其中，支撑器和激光源相对于彼此可移动。

Description

用激光光束切割电子元件的方法和设备
技术领域
本发明涉及用激光光束切割电子元件的方法。本发明也涉及用于分离电子元件的设备，其至少包括：用于产生切割光束的激光源以及用于支撑未分离的电子元件组件的至少一个支撑器，其中，支撑器和激光源相对于彼此可移动。这样的相对移动可以理解为，使用定向装置，如可移动反射镜和/或棱镜使激光源相对于支撑器移位，这种情况发生在例如激光测头的设备中。
背景技术
在半导体产品生产中，通常大量的半导体产品结合在半导体产品的一个组合组件(也指例如导向架或支撑板的组件)中。在完成绝大部分产品步骤后，组合的半导体产品通过切割或锯切操作被彼此分离。也为此目的而使用激光切割技术。现存激光切割技术的重大缺点是元件分离时发生材料沉积在元件上的现象。其解释为由材料蒸发(例如金属、来源于胶、环氧树脂等的完全或没有完全燃烧的碳氢化合物)引起随后的材料沉积。沉积物包括例如来自生产塑料封装物中的聚合体和填充材料，如无机氧化物、更特别多的是硅氧化物。在使用激光分离技术加工半导体产品中，材料沉积现象是不令人满意的或不被人接受的。
发明内容
为解决上述问题，本发明的目的是，在分离载运器上的电子元件的过程中，使用激光减少沉积损害，而不需要为此目的附加处理步骤。
为此目的，本发明提出一种前述类型的方法，其中激光束产生脉冲，至少一些单个激光脉冲的脉冲延迟时间长于500ns(纳秒)。至少一些单个激光脉冲的脉冲延迟时间优选长于600ns(纳秒)和/或短于900ns。至少现在，用至少一些单个激光脉冲的脉冲延迟时间少于800ns，更特别在700至740ns内的激光脉冲，已实现最优结果。理想的激光脉冲延迟时间也取决于用于处理的材料和所希望的最终结果。对于处理铜材料，满意的激光脉冲长度经过测试定在750ns至800ns之间，而对于硅，至少激光脉冲的长度大约为680ns，观察到获得满意的结果。需强调的是，应用在根据本发明技术中的脉冲长度比应用在前述现有技术中激光脉冲的长度要长。由于增强的热量发生在处理区域附近，因此特别是在如半导体电路的热敏感产品情况下可能发生损害。如果能量散失在要分离的电子元件中，就降低了分离的效率。然而，研究发现，加长的脉冲延迟时间有减少沉积的优点。对这种意想不到的现象的可能解释是，由于激光脉冲长时间供给材料能量，能使材料蒸发，产生了增加了化学反应的方式。蒸发的材料的实际部分将转换为气态形式，而没有升华，或仅少量升华。这里考虑的是未完全的燃烧产生烟灰颗粒；增强的燃烧(增加脉冲延迟时间)将导致一些烟灰颗粒的燃烧，结果是少量烟灰沉积下来。
在本发明方法的一个优选应用中，形成激光束的所有激光脉冲的脉冲延迟时间是相同的。这简化了对激光源的控制。使用固定长度的激光脉冲的进一步优点是，可以获得对要分离的电子元件均匀的处理，也将获得更恒定的处理结果。
本发明还提供一种前述类型的设备，其特征在于，激光源适于产生这样的激光束，即至少一些单个激光脉冲的脉冲延迟时间长于500ns，更优选长于600ns。此外，更满意的是至少一些单个激光脉冲的脉冲延迟时间短于900ns，应注意的是，根据条件(特别是如处理材料)，用至少一些单个激光脉冲的脉冲延迟时间在700至740ns内的激光脉冲，已实现最佳结果。对于这种设备的优点，可参考如上所述根据本发明的方法的优点。然而，要注意的是，需要较大容量的晶体激光缓冲器(压电元件)和由于该增大的容量而需要热量排放。在所有元件快速加热后，较大容量的压电元件将降低精度(由于改变元件的折射系数导致的其它原因等)。包括片激光器的激光源的特殊应用可提供获得本发明所需满意的脉冲长度，而并不只是困难的消极的副影响。特别的优点是由片激光器产生的激光束具有精确的控制能力，甚至是在相当高功率的情况下。
附图说明
以下基于下面附图中的非限制性示例性实施例对本发明作进一步的阐述。
图1表示使用激光束分离电子元件的设备的概略视图；
图2A是用于分离电子元件的传统激光源的输出的示意表示；
图2B是根据本发明用于分离电子元件的激光源的输出的示意表示。
具体实施方式
图1表示具有框架2的设备1，框架2带有可移动的载运器3。载运器3适于支撑要处理的电子元件4的组件。框架2也通过臂5支撑产生激光束7的激光源6，激光源根据电子元件4的组件被定向，这样电子元件4的组件上有切口8。
图2A是根据背景技术的脉冲激光束的示意表示。这样激光束的脉冲长度τ1有一个限制的长度。图2B中示意表示的根据本发明脉冲激光束的脉冲长度τ2至少为500ns，这里τ1明显小于τ2。

Claims (10)

1.用激光束切割电子元件的方法，其中，激光束发出脉冲，至少一些单个激光脉冲的脉冲延迟时间长于500ns。
2.如权利要求1所述的方法，其特征在于，至少一些单个激光脉冲的脉冲延迟时间长于600ns。
3.如权利要求1或2所述的方法，其特征在于至少一些单个激光脉冲的脉冲延迟时间短于900ns。
4.如上述任意一项权利要求所述的方法，其特征在于，至少一些单个激光脉冲的脉冲延迟时间在700ns至740ns范围内。
5.如上述任意一项权利要求所述的方法，其特征在于，形成激光束的所有激光脉冲的脉冲延迟时间是相同的。
6.分离电子元件的设备，至少包括：
--用于产生切割光束的激光源；
--用于支撑未分离的电子元件组件的至少一个支撑器，其中支撑器和激光源相对于彼此可移动，其特征在于，激光源适于产生发出脉冲的激光束，使得至少一些单个激光脉冲的脉冲延迟时间长于500ns。
7.如权利要求6所述的设备，其特征在于，激光源适于产生发出脉冲的激光束，使得至少一些单个激光脉冲的脉冲延迟时间长于600ns。
8.如权利要求6或7所述的设备，其特征在于，激光源适于产生发出脉冲的激光束，使得至少一些单个激光脉冲的脉冲延迟时间短于900ns。
9.如权利要求6-8中任意一项所述的设备，其特征在于，至少一些单个激光脉冲的脉冲延迟时间在700ns至740ns范围内。
10.如权利要求6-9中任意一项所述的设备，其特征在于，激光源是片激光器。
CNA2006800189873A 2005-06-02 2006-06-01 用激光光束切割电子元件的方法和设备 Pending CN101185161A (zh)

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NL1029172A NL1029172C2 (nl) 2005-06-02 2005-06-02 Werkwijze en inrichting voor het met een laserstraal snijden van elektronische componenten.
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CN103921003A (zh) * 2014-04-16 2014-07-16 苏州工业职业技术学院 用激光进行切割的电子元件切脚装置及使用方法

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DE102009049750A1 (de) * 2009-10-17 2011-04-21 Bayerische Motoren Werke Aktiengesellschaft Verfahren und Vorrichtung zum Schneiden von Material mittels eines modulierten Laserstrahls

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WO1998052257A1 (en) * 1997-05-12 1998-11-19 Dahm Jonathan S Improved laser cutting apparatus
US6525296B2 (en) * 1998-10-20 2003-02-25 Sharp Kabushiki Kaisha Method of processing and optical components
JP2005513741A (ja) * 2001-12-21 2005-05-12 アイファイア テクノロジー コーポレーション エレクトロルミネセンス表示装置の薄膜層をパターン形成するレーザ・アブレーション法
JP4050534B2 (ja) * 2002-03-12 2008-02-20 浜松ホトニクス株式会社 レーザ加工方法
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CN103921003A (zh) * 2014-04-16 2014-07-16 苏州工业职业技术学院 用激光进行切割的电子元件切脚装置及使用方法
CN103921003B (zh) * 2014-04-16 2016-06-29 苏州工业职业技术学院 用激光进行切割的电子元件切脚装置及使用方法

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NL1029172C2 (nl) 2006-12-05
WO2006135236A3 (en) 2007-03-08

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