WO2006132168A1

WO2006132168A1 - Electronic component package, method for manufacturing the same, and lid material for electronic component package

Info

Publication number: WO2006132168A1
Application number: PCT/JP2006/311189
Authority: WO
Inventors: Kazuhiro Shiomi; Masaaki Ishio; Kojiro Kobayashi; Akio Hirose
Original assignee: Neomax Materials Co., Ltd.
Priority date: 2005-06-08
Filing date: 2006-06-05
Publication date: 2006-12-14
Also published as: JP5025471B2; JPWO2006132168A1

Abstract

[PROBLEMS] To provide an electronic component package in which a deposition layer excellent in heat resistance can be formed quickly between a lid and a case even if they are soldered at a low temperature. [MEANS FOR SOLVING PROBLEMS] The electronic component package comprises a case (1) having a recess in which an electronic component is contained and a lid (8) soldered to the case (1) through a deposition layer (20) such that the recess is closed. The case (1) has a first metal layer (5) formed of an Ni-Fe alloy containing 5.0-20 mass% of Fe at the outer circumference of the opening of the recess, and the lid (8) has a second metal layer (10) formed of the Ni-Fe alloy. The deposition layer (20) has a solder layer (12A) formed of a solder principally comprising Sn, and first and second intermetallic compound layers (5A, 10A) formed on both sides of the solder layer through diffuse reaction of Ni atoms and Fe atoms in the first and second metal layers (5, 10) and Sn atoms in the solder.

Description

Specification

Electronic component package, method for manufacturing the same, and lid material for electronic component package

[0001] The present invention relates to an electronic component package for housing an electronic component.

Background art

[0002] Various electronic components such as semiconductor devices, quartz oscillators and piezoelectric oscillators are often housed in electronic component packages in order to protect the electronic components as well as external environmental forces. The electronic component package has, for example, a case formed such that a recess for housing an electronic component is open at the top, and a lid brazed to the periphery of the opening of the case so as to seal the recess. Prepare with the body. The concave portion forms a storage space portion of the electronic component isolated from the outside by welding of the lid. The lid usually comprises a base layer formed of a metal having a low thermal expansion coefficient lower than that of Fe such as Kovar (trade name), and a Ni layer formed of Ni is laminated on both sides thereof. ing. As the brazing material, various soft brazing alloys such as Sn-Ag alloy, Bi-Ag alloy and In-Sn alloy are used.

[0003] An electronic component package containing electronic components is fixed by brazing to a predetermined position on a wiring board along with other electronic components. In the brazing, usually, the electronic components such as the electronic component cage are disposed on a wiring substrate for mass production and the like, and the entire substrate is passed through a heating furnace to simultaneously substrate each electronic component. A method of brazing to

[0004] Thus, the electronic component package is heated when the case containing the electronic component and the lid are soldered, and is again heated when brazing is performed on the wiring substrate. . For this reason, the brazing material used to braze the lid to the case is preferably a material with a high melting point, but if brazing is performed at a high temperature, the electronic components stored in the package will deteriorate or their durability will deteriorate. There is a fear.

[0005] In order to address such problems, as disclosed in International Publication WO 02Z078085 (Patent Document 1), when brazing a case and a lid via a welding layer, Sn-based brazing filler metal is used as a soft brazing material. Alloy and using Sn atoms of the brazing material during brazing and Ni provided on the case and lid Diffusion reaction with Ni atoms of the layer to form a NiSn-based intermetallic compound layer, and the welding layer is a brazing material layer consisting of a non-diffusion reaction portion of the brazing material, and the brazing material layer is a NiSn-based metal It has been proposed to use a structure sandwiched by compound layers. The formation of the welding layer makes it possible to improve the heat resistance of the welding layer which joins the case and the lid while enabling brazing at a low temperature.

Patent Document 1: International Publication WO02Z078085

Disclosure of the invention

Problem that invention tries to solve

Although the heat resistance of the welded layer can be improved by the technique of Patent Document 1 above, it takes time to grow the NiSn intermetallic compound layer during brazing, and the electronic component package There is a problem that the productivity of In addition, even if the brazing temperature is low, if the holding time at that temperature is long, the performance of the electronic components housed in the package may be degraded.

The present invention has been made in view of the strong problem, and the heat resistance is excellent between the case and the lid even if the lid is brazed to the case at a relatively low temperature near the melting point of the brazing material. An electronic component package and a method for manufacturing the same, and a lid of the electronic component package, the welding layer can be formed quickly, which makes it possible to obtain excellent productivity and to prevent characteristic deterioration of the electronic component housed in the package. It aims at providing a lid material suitable as a body.

Means to solve the problem

The inventors of the present invention have intensively studied the above problems, and have found the following facts. The intermetallic compound (mainly Ni Sn) which also forms Ni and Sn forces formed at the interface of the Ni layer by the diffusion reaction between the Ni atoms of the Ni layer and the Sn atoms of the brazing material has a large effect of suppressing the diffusion of Ni atoms

3 4

Therefore, heating for a long time is required to sufficiently form the intermetallic compound. However, since intermetallic compounds (mainly (NiFe) Sn) formed by the diffusion reaction between the Sn atoms of the brazing material and the Ni atoms and Fe atoms of the Ni-Fe alloy do not easily prevent the diffusion, the intermetallization occurs in a very short time.

3 4

The compound grows. The present invention has been completed based on strong findings.

That is, the electronic component package according to the present invention has a recess for housing the electronic component, and the recess is configured to seal the case including the opening, the welding layer, and the recess of the case. The lid is brazed to the outer periphery of the recess opening of the case via the welding layer, the case is laminated on the outer periphery of the recess opening, and contains 5.0% to 20 mas _{S of} Fe. A first metal layer formed of a Ni—Fe alloy, and the lid is laminated on the base layer and the case side surface of the base layer, and the second metal formed of the Ni—Fe alloy Layer, the welding layer is pure Sn or a brazing material layer formed of a Sn-based brazing alloy having Sn-based alloy power as a main component, and a first intermetallic compound formed on both sides of the brazing material layer Layer and a second intermetallic compound layer, wherein the first intermetallic compound layer and the second intermetallic compound layer are connected to Ni atoms and Fe atoms of the first metal layer and the second metal layer during brazing. It is formed by the diffusion reaction of the brazing material with Sn.

According to this electronic component package, since the first metal layer and the second metal layer are formed of a Ni—Fe alloy containing 5.0 to 20 ma _SS % of Fe, the first and second intermetallic compounds are formed. The layer is formed of an Fe-containing NiSn-based intermetallic compound which hardly hinders the diffusion of Ni atoms. For this reason, an intermetallic compound layer is rapidly formed during brazing of the lid. Therefore, the electronic component package according to the present invention is excellent in productivity and can prevent the characteristic deterioration of the electronic component housed in the package. The first intermetallic compound layer and the second intermetallic compound layer are formed by the diffusion reaction between the N source element of the first metal layer and the second metal layer and the Fe atom and the Sn atom of the brazing material. Thus, the brazing material layer of the welding layer is formed in a form in which it is interspersed between the uneven first and second intermetallic compound layers. For this reason, the welding layer has good bondability and heat resistance. For this reason, the electronic component package according to the present invention in which pinholes and micro cracks are difficult to occur in the molten brazing material layer even when exposed to a high temperature state exceeding the melting point of the brazing material is excellent in airtightness.

[0011] In the electronic component package, as the brazing material, a Pb-free brazing material is preferable because Pb is likely to cause environmental pollution or an adverse effect on the human body. Further, the average thickness of the welding layer is preferably 10 to 50 / ιπι. In the longitudinal section of the welding layer, the total area of the first intermetallic compound layer and the second intermetallic compound layer may be 25% or more and 98% or less of the total area of the welding layer. Preferred.

Further, according to the method of manufacturing an electronic component package of the present invention, there is provided a recess for housing the electronic component, and the recess is provided in the case main body provided with the opening and the outer periphery of the recess opening. A case having a first metal layer formed of a Ni—Fe alloy containing 5.0 to 20 mass% of Fe, a base material layer, and the Ni—Fe alloy; Providing a second metal layer laminated on one surface, a preparation step of preparing a brazing material formed of pure Sn or a Sn-based brazing alloy mainly composed of Sn, and the first metal layer A package assembly in which the case and the lid are stacked so as to sandwich the brazing material between the second metal layer and the second metal layer, and heating the package assembly to weld the case and the lid; And the welding layer is formed by a diffusion reaction between the N source element and the Fe atoms of the first and second metal layers and the Sn atoms of the brazing material during the brazing. Of the first intermetallic compound layer and the second intermetallic compound layer formed correspondingly, and the non-diffusion of the brazing material It composed of a brazing material layer made of 応部, in which the brazing material layer on both sides in the first intermetallic compound layer and the second intermetallic compound layer was formed.

According to this manufacturing method, since the first and second metal layers are formed of a Ni—F e alloy containing 5.0 to 20 mass% of Fe, it is about 10 to 30 ° C. higher than the melting point of the brazing material. After heating to a high, relatively low temperature brazing temperature, holding it for at least 100 seconds and cooling it, a brazing material layer is formed between the uneven first intermetallic compound layer and the second intermetallic compound layer. The sandwiched welding layer can be formed quickly. Therefore, the productivity of the electronic component package is excellent.

In the above manufacturing method, it is preferable to form a surface layer of Au on the first metal layer or the second metal layer. Thereby, the formation of the first and second intermetallic compound layers can be further promoted, and the productivity can be improved. Further, the brazing material may be prepared as a brazing material layer laminated on the second metal layer of the lid. In addition, the brazing material should preferably contain no Pb in view of environment and safety. Further, the welding layer may have an average thickness of 10 to 50 μm.

Further, the lid for an electronic component package of the present invention comprises a base material layer, a metal layer, and a brazing material layer, and the base material layer, the metal layer and the brazing material layer are joined in the same order. The brazing material layer is formed of pure Sn or a Sn-based brazing alloy having an Sn-based alloy power, and the metal layer is formed of a Ni—Fe alloy containing 5.0 to 20 mass% of Fe. It is According to this lid, it is easy to manufacture, and a lid manufactured from the lid can be brazed directly to the case of the electronic component package without preparing the brazing material separately. this Therefore, the electronic component / cage can be easily manufactured, and is suitable as a material of the electronic component / cage lid.

As described above, according to the electronic component package of the present invention, the first and second metal layers are formed of a Ni—Fe alloy containing 5.0 to 20 mass% of Fe. At the time of application, Ni atoms and Fe atoms of the first and second metal layers diffusely react with Sn atoms of the brazing material, and Fe is contained in the interface between the first and second metal layers and the brazing material. An intermediate compound can be formed. Since this intermetallic compound does not prevent the diffusion of Ni atoms and Fe atoms, first and second intermetallic compound layers are rapidly formed on both sides of the brazing material layer. For this reason, the electronic component package of the present invention is excellent because it is excellent in productivity, and pinholes and cracks do not easily occur in the remelted brazing material layer even when exposed to a temperature exceeding the melting point of the brazing material. Have an air tightness.

Brief description of the drawings

FIG. 1 is a schematic cross-sectional view of an electronic component package according to an embodiment of the present invention.

FIG. 2 is an enlarged cross-sectional view of a welding layer of the electronic component package.

FIG. 3 is a schematic cross-sectional view of the package assembly before brazing the lid.

FIG. 4 is a plan view of a case used for an electronic component package.

Explanation of sign

[0018] 1 case

5 First metal layer

8 lid

10 Second metal layer

20 welding layer

5A First Intermetallic Compound Layer

10A Second Intermetallic Compound Layer

12A brazing material layer

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, embodiments of the electronic component package according to the present invention will be described with reference to the drawings.

FIG. 1 shows an electronic component package useful in the embodiment, which has an opening and a case 1 having a recess 3 for housing an electronic component P, a welding layer 20, and A lid 8 brazed to the outer periphery of the recess opening of the case 1 via the welding layer 20 so as to seal the recess 3 is provided.

The case 1 includes a case main body 2 provided with the recess 3 and made of a ceramic material, a metallized layer 4 integrally laminated on the outer peripheral upper portion of the side wall of the case main body 2, and And a first metal layer 5 integrally laminated to the The metallized layer 4 is usually formed of a refractory metal such as W (tungsten) or Mo (molybdenum). The first metal layer 5 is formed of a Ni—Fe alloy containing 5.0 to 20 mass% of Fe, preferably 7.5 to 15 mass%, and the balance Ni and unavoidable impurities.

On the other hand, the lid 8 is provided on a base layer 9, a second metal layer 10 provided on the lower surface (case side surface) of the base layer 9, and an upper surface of the base layer 9. And a surface protection metal layer 11. The base material layer 9 is made of at least a metal having a thermal expansion coefficient lower than that of Fe, preferably a low thermal expansion coefficient Fe such as Kovar (trade name) which approximates the thermal expansion coefficient of ceramics which is the main component of Case 1 It is formed of an FeNi-based alloy containing Ni as a main component and an FeNiCo-based alloy containing Fe, Ni, and Co as a main component. Specifically, Fe- (36 to 50 mass%) Ni alloy, Fe-(20 to 3 Omass%) Ni- (l to 20 mass%) Co alloy can be exemplified. Similar to the first metal layer 5, the second metal layer 10 also contains 5.0 to 20 mass% of Fe, preferably 7.5 to 15 mass%, and the balance is Ni and an Ni-Fe alloy which also has an unavoidable impurity power. It is done. The surface protective metal layer 11 is laminated to improve the corrosion resistance, and is formed of a corrosion resistant Ni alloy mainly composed of pure Ni or Ni. The surface protective metal layer 11 is not necessarily required if it is formed as needed.

The welding layer 20 interposed between the case 1 and the lid 8 is, as shown in FIG. 2, a first formed integrally on the first metal layer 5 and the second metal layer 10. Intermetallic compound layer 5A and second intermetallic compound layer 1 OA, and brazing material layer 12A sandwiched therebetween.

The brazing material layer 12A is formed of a pure Sn or a Sn-based brazing alloy having Sn as a main component. The Sn-based brazing alloy preferably contains 85% by mass or more of Sn, and contains Ag, Au, Cu, Zn, Pb, Bi, Sb, etc. which form eutectic and peritectic with Sn as other components. Can. Among these alloys, especially those of eutectic composition, such as Sn-3. 5 mass% Ag alloy, Sn-10 mass% Au alloy, Sn-7. 7 mass% Cu alloy have a low melting point and a low melting point. It is suitable for low temperature brazing since the whole melts quickly. Sn-based brazing alloys are preferably Pb-free because Pb may cause environmental pollution and adverse effects on the human body.

The first and second intermetallic compound layers 5 A and 10 A form the first and second metal layers 5 and 10 when the lid 8 is brazed (welded) to the case 1. It is formed by the diffusion of Ni atoms and Fe atoms of the Fe alloy to the melted brazing material side and the reaction with the atoms of Sn which is the main component of the brazing material. For this reason, as shown in FIG. 2, the first and second intermetallic compound layers 5A and 10A have an irregular shaped concavoconvex shape, and the brazing material layer 12A is integrally formed in a form in which they are intertwined. It is being done.

The total area of the first and second intermetallic compound layers 5A and 10A in the longitudinal cross section of the welding layer 20 is 25 to 98%, preferably 40 to 50, in area ratio to the total area of the welding layer 20. It is desirable to occupy 90%. If the first and second intermetallic compound layers are less than 25%, the amount of uneven intermetallic compounds is small, so when the electronic component package is reheated, a wide region between the first and second intermetallic compound layers is formed. Since the brazing material layer is remelted, defects such as pinholes are likely to occur in the solidified brazing material layer. On the other hand, if it exceeds 98%, the amount of the brazing material sandwiched between the first and second intermetallic compound layers decreases, so the entire deposited layer becomes brittle and the bondability is lowered. The area of each layer in the longitudinal cross section of the welding layer 20 can be obtained by obtaining a composition image photograph of the cross section by means of EPMA, and the area of each layer can be determined from the contrast of the color of the image. Image analysis software can be used to calculate the area.

Here, a method of manufacturing the electronic component cage will be described. First, as shown in FIG. 3, a case 1 and a lid 8 provided with a brazing material layer 12 are prepared. This process is called a preparation process. Next, the case 1 and the lid 8 are stacked to assemble the package assembly, and the assembly is heated to braze the case 1 and the lid 8 through the welding layer 20 (see FIG. 1). It will This process is called a brazing process.

FIG. 3 shows the package assembly before the lid 8 is brazed to the case 1, and the lid 8 is placed on the opening upper surface of the case 1. Although the structure of the case is slightly different before and after brazing as described later, for convenience of explanation, the same or corresponding members are denoted by the same reference numerals. Case 1 is substantially the same as the configuration after brazing lid 8 except for the following point. Before soldering, a surface layer 6 formed of Au is formed on the first metal layer 5. This surface layer 6 has the function of promoting welding and also the diffusion of Ni atoms and Fe atoms from the first metal layer 5 to the brazing material side. The thickness of the first metal layer 5 before brazing may be about 10 to 2 O / zm, and the thickness of the surface layer 6 may be a very thin layer of about 1 to 3 m. Since the surface layer 6 is so thin, it diffuses into the molten brazing material and disappears during brazing. For this reason, it is not shown in FIG. The first metal layer 5 and the surface layer 6 of the case 1 are usually formed by plating. The surface layer 6 is not necessarily formed if necessary.

On the other hand, the lid 8 has a surface protection metal layer 11 on one surface of the base material layer 9, a second metal layer 10 on the other surface, and an Sn-based brazing alloy containing pure Sn or Sn as a main component thereon. A brazing filler metal layer 12 formed of a brazing filler metal which is also a force is laminated. The Ni atoms and Fe atoms diffused from the first metal layer 5 and the second metal layer 10 at the time of brazing react with the Sn atoms of the brazing material forming the brazing material layer 12 to form the first intermetallic compound. The layer 5A and the second intermetallic compound layer 10A are formed. Since the first metal layer 5 is not present in the recess opening of the case 1, naturally only the second intermetallic compound layer (not shown in FIG. 1) is formed. The thickness of the second metal layer 10 before brazing is about 3 to 20 / ζπι, and the thickness of the brazing material layer 12 is about 30 to 50 / ζπι.

The lid 8 is manufactured, for example, by punching using a lid having the same layer configuration as this. The lid is usually manufactured as follows. First, the material sheet for the surface protection metal layer, the material sheet for the base material layer, and the material sheet for the second metal layer are superposed in the same order and roll pressure welding is performed. A three-layer clad material is obtained by diffusion annealing (softening annealing) of the three-layer pressure-welded material obtained by roll pressure welding. Next, a brazing material layer material sheet is stacked on the second metal layer of the clad material, and cold rolling contact is performed. The lid is manufactured by these steps.

In brazing the lid 8 to the case 1 in the brazing step, the cage assembly is heated to a temperature (brazing temperature) higher by about 10 to 30 ° C. than the melting point of the brazing material. The material is melted, held for at least 100 seconds at the brazing temperature, and solidified by cooling. Thus, it is possible to obtain a deposited layer in which a NiSn-based intermetallic compound layer containing Fe is formed to a sufficient thickness.

The first and second metal layers 5 and 10 are formed of a Ni—Fe alloy containing 5.0 to 20 mass% of Fe In particular, when the Fe content is 7.5 to 15 mass%, After heating to the brazing temperature, it is not necessary to maintain the temperature. However, preferably, the intermetallic compound can be sufficiently grown by holding the film for about 10 seconds or less or about 5 seconds or less. In addition, when the Fe content is about 5. Omass% or about 20mass%, although the holding at the brazing temperature is slightly required, the required amount of intermetallic compound is still maintained by a short holding time of about 100 seconds. Can grow. If the amount of Fe is less than 5.0%, the amount of Fe in the intermetallic compound formed at the interface between the first and second metal layers is insufficient, and the diffusion of Ni atoms is suppressed. Therefore, in the present invention, the lower limit of the Fe content is 5. Omass%, preferably 7.5 mass%. On the other hand, if the amount of Fe exceeds 20 mass% and becomes excessive, (NiFe) Sn will be formed, and the formation of the intermetallic compound of (NiFe) Sn is suppressed.

2 3 4

And the latter amount of intermetallic compounds will be insufficient. In the case of a soft solder such as a Sn-based braze alloy, the melting point means the solid-liquid onset temperature, that is, the eutectic temperature.

In addition, during brazing, the lid 8 may be placed on the lower side and the case 1 may be placed on the upper side so that the case 1 and the lid 8 are pressed to each other. May be positively pressurized. Thus, during brazing, the formation of voids in the intermetallic compound layer of the welding layer can be suppressed, and welding stability can be improved. As a pressing method, a pressing plate made of a material, for example, a ceramic, which does not react with the surface of the package assembly is prepared, and a weight is placed on the cage assembly via the pressing plate. Even pressing can be done by biasing the plate with a spring. Pressure is, ^{usually, 2 X 10- 4 ~1 X 10} " by ² about ² N / mm!ヽ.

The heating atmosphere for brazing is preferably vacuum or an inert gas atmosphere such as nitrogen gas. By brazing in such an atmosphere, it is possible to prevent the oxidation of the electronic component due to heating and to make the storage space of the electronic component after welding a vacuum or an inert gas atmosphere. Can be prevented from changing over time. In particular, when a vibrator such as a crystal vibrator is accommodated, brazing is performed under vacuum from the viewpoint of improving the resonance characteristic. It is desirable to

In the above embodiment, since the brazing material layer 12 uses the lid 8 integrally joined to the second metal layer 10, the brazing workability is good. However, the brazing material does not necessarily have to be integrally provided as a component of the lid 8. If a brazing material is prepared separately, the brazing work will be performed as follows. First, a lid having a three-layer structure, which also has a surface protection metal layer 11, a base layer 9, and a second metal layer 10, and a brazing material are separately prepared. Next, the lid is placed on the case 1 via the brazing material to form a package assembly, and the assembly is heated and cooled to braze the lid and the case. The brazing material to be separately prepared is not limited to a thin brazing filler metal, and may be a paste-like brazing material containing a brazing alloy powder in a flux.

Hereinafter, the present invention will be more specifically described based on examples, but the present invention is not to be limitedly interpreted by the above embodiment and the following examples.

Example

[0037] Various cases and various lids were prepared in the following manner, and these were used to produce various electronic component package force samples.

[0038] A ceramic case body is provided, and a W metallized layer (layer thickness of 30 m) is formed on the outer periphery of the recess opening, and Ni or a first Ni-Fe alloy of various compositions shown in Table 1 is formed. A case was prepared in which metal layers (layer thickness 15 μm) were integrally laminated in this order. In some cases, an Au layer (layer thickness 1 m) was additionally laminated on the first metal layer. The first metal layer and the Au layer were formed by plating. The planar size of each case is, as shown in FIG. 4, the length A = 4. 1 mm, the full width B = 2. 6 mm, and the width C of the longitudinal side wall 14 surrounding the recess C = 0. 35 mm.

On the other hand, a base layer formed of FeNiCo alloy (trade name: Kovar) is provided, a Ni layer for surface protection is bonded on one side of the base layer, Ni on the other side, or various compositions shown in Table 1. A lid was prepared in which a second metal layer formed of a Ni—Fe alloy and a brazing filler metal layer made of a Sn—Ag alloy on top of that were joined in this order. The flat size of the lid is almost the same as the flat size of the case.

The lid was manufactured by punching into a predetermined flat size of a lid material force manufactured in the following manner. The lid material is a thin Ni plate on one side of FeNiCo alloy sheet (material sheet for base layer). After laminating the material thin plate of the second metal layer on the other surface, cold-rolling (rolling reduction 60%) by pressure, and performing diffusion annealing to hold the obtained pressure-bonded material at 1000 ° C for several minutes It was made. By the diffusion annealing, the Ni layer, the base layer, and the second metal layer, which constitute the pressure contact material, were diffusion bonded together and each layer was softened. A brazing material consisting of 10 mass% Ag-balance Sn (eutectic point: 220 ° C) is superimposed on the second metal layer of the three-layer clad material manufactured in this way, and cold rolling contact ( The brazing material layer was laminated on the second metal layer. The lid material of the four-layer structure manufactured in this manner is composed of a base layer of 80 / z m, a Ni layer of about 5 m stacked on one side, and the other side of the base layer. The second metal layer of about 30 m and the brazing material layer of about 30 m were also formed.

The lid was overlaid on the case such that the brazing material layer of the lid was on the first metal layer side or the Au plating layer side of the case, to obtain a package assembly. The package assembly was placed on the mounting plate with the lid facing downward, and the lid was brazed to the case in a nitrogen gas atmosphere. Brazing was carried out by heating to 240 ° C., holding at the same temperature or holding at the same temperature for the time shown in Table 1, and then cooling. The materials of the first metal layer, the second metal layer, the presence or absence of the Au layer, the thickness of the brazing material layer, and the holding time at 240 ° C. of the samples of each package manufactured as described above are shown in Table 1 Show.

Using each package manufactured as described above, the package is cut in the width direction at the central portion in the lengthwise direction, and the longitudinal cross section of the welding layer (cross section at position X-X in FIG. 4) Was observed by EPMA. The areas of the first and second intermetallic compound layers and the brazing material layer are measured by image analysis software using the composition image photograph obtained as a result, and the first and the first with respect to the total area of these (total area of the welding layer) The ratio of the total area of the two intermetallic compound layers (both are collectively referred to as "the intermetallic compound layer") was determined. The image analysis software used the product name Image-Pro (manufacturer: MEDIA CYVERNETICS).

Further, the package of each sample was subjected to reflow (reheating) to hold at 260 ° C. for 30 seconds, and after cooling, it was subjected to an airtight test to check airtightness. Airtightness tests were conducted as follows. First, the package after reflow was placed in a closed vessel, depressurized to 0.1 kPa, and then pressurized for 2 hours at 0.5 MPa of He gas. After that, the package was removed from the closed container, and the He force was also measured by the He detector. Measurement result is 1 x 10 " ⁹ Pa • It is considered that there is no penetration of He gas in the package if it is less than mVsec, so the value less than this value was accepted. In addition, the package that passed the He gas detection test was immersed in fluorocarbon to check for the generation of open cells. The package which did not generate | occur | produce an open cell finally passed (O), and the one which the open cell generate | occur | produced evaluated as disqualified (X). These measurements and observation results are also shown in Table 1.

From Table 1, in the packages of sample Nos. 1 to 4 in which the first metal layer and the second metal layer were formed of Ni, the metallized samples No. 1 and 3 in which the heating and holding time was 100 seconds were used. Since the area ratio of the compound layer was low and the ratio occupied by the brazing material layer was high, the airtightness after reflow deteriorated. On the other hand, in Nos. 2 and 4, the required amount of intermetallic compound layer was formed, and good airtightness was obtained, but the heating retention time was 600 seconds, and heating retention was required for a long time.

On the other hand, for samples No. 5 to 16 in which the first metal layer and the second metal layer were formed of Ni— (5.0 to 20) mass% Fe alloy, the heating temperature was maintained for 100 seconds. Even in the packages No. 5, 6, 15, 16 and the packages No. 7 to 14 which were cooled immediately after heating, the intermetallic compound layer had a sufficient area ratio, and therefore the airtightness after reflowing Was also good. In this case, it was also confirmed that the formation of the intermetallic compound was more promoted in the case where the Au layer was formed in the case.

[Table 1]

(Note) Samples with * attached to sample Να are comparative examples, others are invention examples

Claims

The scope of the claims

[1] The welding layer has a recess for housing electronic components, and the recess has a case having an opening, a welding layer, and the outer periphery of the opening of the case opening so as to seal the recess of the case. An electronic component cage with a lid brazed through the

The case has a first metal layer formed of a Ni—Fe alloy containing 5.0 to 20 mas _S % of Fe laminated on the outer peripheral portion of the recess opening,

The lid has a base material layer, and a second metal layer laminated on the case side surface of the base material layer and formed of the Ni—Fe alloy.

The welding layer includes a brazing filler metal layer formed of pure Sn or a brazing filler metal that also has Sn base brazing alloy power based on Sn, and a first intermetallic compound layer and a second metal formed on both sides of the brazing filler material layer. The first intermetallic compound layer and the second intermetallic compound layer have an intermetallic compound layer, and during brazing, Ni atoms and Fe atoms of the first metal layer and the second metal layer, and Sn of the brazing material Is formed by diffusion reaction, electronic component package.

[2] The electronic component package according to claim 1, wherein the brazing material does not contain Pb.

[3] The electronic component according to claim 1 or 2, wherein the welding layer has an average thickness of 10 to 50 μm.

[4] In the longitudinal section of the welding layer, the total area of the first intermetallic compound layer and the second intermetallic compound layer is 25% or more and 98% or less with respect to the total area of the welding layer. The electronic component package described in any one of 1) and 3).

[5] A Ni—Fe alloy having a recess for housing electronic components, wherein the recess is provided on the case main body having the opening and the outer periphery of the opening of the recess, and contains 5.0 to 20 mass% of Fe. And a second metal layer formed of the base layer and the Ni—Fe alloy and laminated on one surface of the base layer. And a preparation step of preparing a brazing filler metal formed of pure Sn or a Sn-based brazing alloy containing Sn as a main component.

A package assembly in which the case and the lid are stacked is assembled so as to sandwich the brazing material between the first metal layer and the second metal layer, and the package assembly is heated to heat the case and the lid. And brazing through the welding layer, The welding layer is formed by diffusion reaction between Ni atoms and Fe atoms of the first metal layer and the second metal layer and Sn atoms of the brazing material during brazing. The first intermetallic compound layer and the second intermetallic compound layer are formed on both sides of the brazing material layer, which is composed of a bimetallic compound layer and a brazing material layer consisting of undiffused reaction parts of the brazing material. , How to manufacture electronic component knocks.

[6] The method according to claim 5, wherein the first metal layer or the second metal layer has a surface layer formed of Au on the surface thereof.

[7] The manufacturing method according to [5] or [6], wherein the brazing is performed by heating to a temperature higher by 10 to 30 ° C. than the melting point of the brazing material in the brazing step.

[8] The manufacturing method according to any one of claims 5 to 7, wherein the brazing material comprises a brazing material layer laminated on the second metal layer of the lid.

[9] The method according to any one of claims 5 to 8, wherein the brazing material does not contain Pb.

[10] The manufacturing method according to any one of claims 5 to 9, wherein the welding layer has an average thickness of 10 to 50 m.

[11] A lid material for an electronic component package, comprising a base material layer, a metal layer, and a brazing material layer, wherein the base material layer, the metal layer and the brazing material layer are joined in the same order,

The brazing filler metal layer is formed of a pure Sn or a Sn-based brazing filler metal which also has Sn as a main component, and the metal layer is formed of a Ni-Fe alloy containing 5.0 to 20 mass% of Fe. , Lid for electronic component package.

[12] The lid for an electronic component package according to claim 11, wherein the brazing material does not contain Pb.