WO2006130365A2 - Appareil d'eclairage intraluminal - Google Patents

Appareil d'eclairage intraluminal Download PDF

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Publication number
WO2006130365A2
WO2006130365A2 PCT/US2006/019522 US2006019522W WO2006130365A2 WO 2006130365 A2 WO2006130365 A2 WO 2006130365A2 US 2006019522 W US2006019522 W US 2006019522W WO 2006130365 A2 WO2006130365 A2 WO 2006130365A2
Authority
WO
WIPO (PCT)
Prior art keywords
array
members
flexible
rigid
probe
Prior art date
Application number
PCT/US2006/019522
Other languages
English (en)
Other versions
WO2006130365A3 (fr
Inventor
Philip Levin
Peter Kazlas
Paul Zalesky
Original Assignee
Lumerx, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lumerx, Inc. filed Critical Lumerx, Inc.
Publication of WO2006130365A2 publication Critical patent/WO2006130365A2/fr
Publication of WO2006130365A3 publication Critical patent/WO2006130365A3/fr

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Classifications

    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N5/00—Radiation therapy
    • A61N5/06—Radiation therapy using light
    • A61N5/0601—Apparatus for use inside the body
    • A61N5/0603—Apparatus for use inside the body for treatment of body cavities
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N5/00—Radiation therapy
    • A61N2005/002—Cooling systems
    • A61N2005/005—Cooling systems for cooling the radiator
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N5/00—Radiation therapy
    • A61N5/06—Radiation therapy using light
    • A61N5/0601—Apparatus for use inside the body
    • A61N2005/0602—Apparatus for use inside the body for treatment of blood vessels
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N5/00—Radiation therapy
    • A61N5/06—Radiation therapy using light
    • A61N5/0601—Apparatus for use inside the body
    • A61N5/0603—Apparatus for use inside the body for treatment of body cavities
    • A61N2005/0609—Stomach and/or esophagus
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N5/00—Radiation therapy
    • A61N5/06—Radiation therapy using light
    • A61N2005/065—Light sources therefor
    • A61N2005/0651—Diodes
    • A61N2005/0652—Arrays of diodes

Definitions

  • This invention relates to apparatus and methods for delivering radiation, including delivering radiation to a surface on or within a living body and, more particularly, to apparatus and methods for using light to debilitate or kill microorganisms on or within a body cavity of a patient.
  • H. pylori Helicobacter pylori
  • Pylori is associated with serious conditions including gastritis, gastric ulcer, duodenal ulcer, gastric cancer, and gastric lymphoma. This organism is believed to be responsible for approximately 90% of all reported duodenal ulcers, 50% of gastric ulcers, 85% of gastric cancer, and virtually 100% of gastric lymphoma.
  • Photodynamic therapy is a light therapy that includes pretreatment with a photosensitizing drug, followed by illumination of the treatment area to kill cells having a high concentration of the drug, which preferentially absorbs light at specific wavelengths.
  • a typical application of this method is to debilitate or destroy malignant tumor cells that have preferentially retained the photosensitizing drug, while preserving adjacent normal tissue.
  • Direct deactivation or killing of H. Pylori and other microorganisms has been demonstrated using light, without requiring pretreatment with a photosensitizer.
  • a light-emitting instrument that could be used to routinely treat internal H. Pylori infections could dramatically improve public health worldwide.
  • An alternative approach for developing minimally invasive probes for intraluminal light therapy is to deploy electrically excited light-emitting devices such as light-emitting diodes within an intraluminal probe.
  • This approach presents many engineering challenges with regard to the production of safe, effective and reliable devices.
  • One such challenge is that light-emitting devices confined within an elongated probe produce waste heat when electrically excited, thereby significantly limiting the maximum average light output power achievable without thermally damaging the probe, and without exceeding safe temperatures for nearby living tissue.
  • Low optical power may also require undesirably long exposure times to deliver a specified dose of light or radiation to tissue during a medical procedure.
  • the probe must be small in diameter and physically flexible to be safely guided through narrow passages in the body to a treatment site.
  • the present invention in-part relates to delivering radiation or light to an interior of an object or an organism to effect or facilitate a chemical or biological reaction, including devices and methods for delivering light to the interior of a lumen, to effect a treatment at a wall of the lumen.
  • the invention is particularly useful for performing therapeutic medical procedures on the interior of a lumen, for example, the gastrointestinal tract of a living human or animal.
  • the invention can also be applied to deliver light to the interior surface of any structure into which the apparatus can be disposed.
  • the invention also relates to systems for the diagnosis and treatment of infections within a lumen in a patient.
  • Embodiments of the invention deliver very high optical power, of selectable wavelength, by means of forced convective cooling. Further, embodiments are well suited to applications that benefit from very high power, deliverable over a very high aspect ratio (long and thin) and highly flexible geometry.
  • One embodiment of the present invention is a probe for disposition in the interior of a lumen.
  • the probe includes a plurality of substantially rigid members. At least one of the plurality of substantially rigid members has one or more electronic device mounted on a first external surface and adapted for electrical connection to a source of electrical power.
  • the one or more electronic device may be a passive device or an active electronic device such as a light-emitting diode or another radiation-emitting source.
  • the one or more electronic device may also be a type of electronic sensor for sensing temperature, radiation, pressure, or another environmental aspect.
  • one or more substantially rigid member has a second external surface that is non-coplanar with the first external surface, and on which one or more electronic device is mounted, hi other embodiments; the one or more substantially rigid member includes additional external surfaces to which are mounted one or more electronic device.
  • the external surface or surfaces of a substantially rigid member may define a cylinder or a polygonal prism or another three-dimensional shape.
  • the plurality of substantially rigid members may be interconnected by a plurality of flexible members into a longitudinal array having a longitudinal axis and being flexible in any rotational orientation of a plane that contains the axis.
  • One or more of the plurality of flexible members may be convoluted within or out of the plane.
  • adjacent flexible members along the axis define planes that are rotated about the axis with respect to one another.
  • the array is substantially enclosed by a tubular envelope having a tubular wall that in an embodiment is optically transmissive of radiation emitted by a light-emitting device mounted on a surface of a rigid member.
  • the array may be positioned transversely to the axis within the tubular member by one or more convolution, by one or more rigid member, or by inward projections from the tubular wall.
  • the array includes a first fluid conduit adapted to conduct a fluid in a first direction substantially parallel to the axis, and a second internal conduit adapted to conduct the fluid in a second, opposite direction parallel to the axis, m an embodiment, the array is adapted for immersion in the fluid.
  • the fluid is a cooling fluid. In a further embodiment, the fluid is cooled before flowing through the probe.
  • the modular probe includes a plurality of substantially rigid members interconnected into a longitudinal array having a longitudinal axis, by a plurality of connectors that provide both electrical and mechanical connections between adjacent substantially rigid members in the array.
  • one or more connector is integral with one or more rigid member.
  • the array may be flexible in any plane that contains the axis.
  • One or more of the plurality of rigid members may include one or more surfaces on which is mounted an electronic device adapted for electrical connection to a source of electrical power.
  • the array is constructed at least in part by longitudinally interconnecting the plurality of substantially rigid members with the plurality of connectors, with at least one of the plurality of connectors being adapted to connect to the source of electrical power.
  • Yet another embodiment of the present invention is a method for constructing a flexible electronic array.
  • the method includes steps of fabricating a pattern of electrical conductors on a substantially planar substrate, and folding or bending the substrate and the pattern of electrical conductors thereon into a longitudinal array having substantially rigid portions longitudinally alternating with flexible portions, where at least two consecutive flexible portions along the array are non-coplanar.
  • one or more light- emitting electronic device is mounted to the pattern of electrical conductors.
  • the substrate may be substantially rigid or flexible, and may be locally thinned, modified chemically or removed to form the flexible portions of the array.
  • the substantially rigid portions are in the form of hollow polygonal prisms having an axis along the longitudinal array.
  • the substantially rigid portions are in the form of hollow cylinders having an axis along the longitudinal array.
  • one or more of the substantially rigid portions defines a substantially closed polyhedron.
  • Still another embodiment of the present invention is a flexible array.
  • the array includes a plurality of substantially rigid members interconnected by a plurality of flexible members into a longitudinal array; each one of the plurality of flexible members extending longitudinally between a first and a second rigid member of the plurality of rigid members and including a convolution that may lie in or extend out of a plane defined by the first and the second rigid member,
  • the array includes at least three rigid members and at least two flexible members.
  • the each one of the flexible members includes both electrical and mechanical connections between the first and the second rigid member.
  • the each one of the flexible members is connected to the first and the second rigid member by a connection selected from the group consisting of a snap-fitting, a weld, a mechanical crimp, a thermally compressed joint, a conductive adhesive, and a solder joint.
  • the array may also include one or more electronic device that may include one or more light-emitting solid-state electronic device that may be a light-emitting diode or a laser diode. The one or more electronic device may be mounted either directly on one of the plurality of rigid members or on a portion of one of the plurality of flexible members abutting a rigid member.
  • the rigid members are constructed using rigid or flexible substrates selected form the group consisting of ceramics, metals, and polymers.
  • the plurality of rigid members or the plurality of flexible members or both may be adapted to position the array transversely within a channel that may be a tubular envelope.
  • Another embodiment of the present invention is a radiation-emitting device.
  • the radiation-emitting device may include a flexible tube defining a first interior channel in which is disposed a flexible array.
  • the flexible array includes a plurality of flexible members interconnecting a plurality of substantially rigid members into a longitudinal array, each flexible member extending from a first rigid member to a second adjacent rigid member and forming a convolution.
  • Radiation-emitting devices may be mounted either directly on the rigid members or on a portion of the flexible members that abut a rigid member.
  • One or more of the plurality of convolutions and the plurality of rigid members is adapted to position the flexible array in the first channel.
  • the first channel is adapted to contain a flowing liquid coolant that immerses the array.
  • tube defines a second channel adapted to contain the flowing coolant, the first and the second channels together defining a cooling loop within the tube.
  • the second channel defines an annular passage within the tube.
  • FIG. 1 a illustrates in plan view an embodiment of an array including substantially planar rigid members interconnected by flexible members.
  • FIG. Ib is a side view an embodiment of the array of FIG Ia, illustrating convoluted flexible members having a single orientation interconnect the rigid members.
  • FIG. Ic is a side view of another embodiment of the array of FIG. 1, wherein convoluted flexible members having a plurality of orientations interconnect the rigid members.
  • FIG. Id illustrates in side view a two-sided embodiment of an array.
  • FIG. 2a illustrates in top plan view an embodiment of an array wherein light- emitting devices are mounted on a first surface and electrical busses are mounted on a second surface.
  • FIG. 2b illustrates in bottom plan view the array of FIG. 2a.
  • FIG. 3 a illustrates in top plan view another embodiment of an array wherein two rows of light-emitting devices are mounted on a first surface and electrical buses are mounted on a second surface.
  • FIG. 3b illustrates in bottom plan view the array of FIG. 3a.
  • FIG. 4 illustrates in side view an embodiment of an array wherein rigid members are reinforced with stiffening members.
  • FIG. 5 a illustrates in side view an embodiment of a flexible member interconnecting two rigid members.
  • FIG. 5b illustrates flexion of the flexible member of FIG. 5a in a first plane.
  • FIG. 6a illustrates in isometric view the flexible member of FIG. 5a.
  • FIG. 6b illustrates flexion of the flexible member of FIG. 6a (and FIG. 5a), in a plane orthogonal to the plane of flexion illustrated in FIG. 5b
  • FIG. 7a illustrates in plan view two adjacent uncoupled sections of an embodiment of an array.
  • FIG. 7b illustrates the array of FIG. 7a in side view.
  • FIG. 7c illustrates an embodiment of the array of FIG. 7a and 7b joined together.
  • FIG. 7d illustrates an embodiment of an external electrical connection of an array.
  • FIG. 7e illustrates in plan view the interconnections illustrated in FIG. 7c and FIG.
  • FIGs. 8a and 8b illustrate embodiments of external electrical connections to interior portions of an array.
  • FIGs. 9a and 9b illustrate an embodiment of interconnections between rigid members using interlocking connectors.
  • FIGs. 10a and 10b illustrate end. and side views, respectively, of embodiments of probes wherein an array is positioned within a tubular envelope.
  • FIG. 11a illustrates an embodiment of a probe including a plurality of arrays positioned within a multi-lumen tubular envelope.
  • FIG. 1 Ib illustrates an embodiment of a flow pattern for a coolant in the probe of
  • FIG. 11a is a diagrammatic representation of FIG. 11a.
  • FIG. lie illustrates another embodiment of a probe including a plurality of arrays positioned within a multi-lumen tubular envelope and having an annular coolant return lumen.
  • FIG. 1 Id illustrates an embodiment of a 2-array probe having an annular coolant return lumen.
  • FIG. l ie illustrates another embodiment of a 2-array probe. (00521 [0053]
  • FIG. 12 illustrates an embodiment of an array including cylindrical cross-section rigid members.
  • FIG. 13a illustrates an embodiment of an array including triangular cross-section rigid members.
  • FIG. 13b illustrates in end view a probe including the array of FIG. 13a and having a circular cross-section longitudinal bore
  • FIG. 13c illustrates in end view an alternate embodiment of the probe o£ FIG. 13b, including a polygonal cross-section longitudinal bore.
  • FIG. 14a illustrates an embodiment of a printed circuit board and circuit pattern for assembly of a triangular cross-section array.
  • FIG. 14b illustrates a view of an array and probe assembled from the printed circuit board and pattern illustrated in FIG. 14a.
  • FIG. 15a illustrates an embodiment of a planar pattern for folding to form a three- dimensional array.
  • FIG. 15b illustrates an embodiment of an array folded from the pattern of FIG. 15a.
  • FIG. 16 illustrates a probe including the array of FIGs. 15b and 15c, and further including a central fluid conduit.
  • FIGs. 17a and 17b illustrate another embodiment of an array that may be assembled from a planar pattern.
  • FIG. 18 illustrates an embodiment of a probe wherein an array is positioned within the probe by inward projections from a tubular envelope.
  • FIG. 19 illustrates an embodiment of a probe wherein an array is positioned within the probe by waists in a tubular envelope.
  • FIG. 20 illustrates in end view an embodiment of a probe wherein an array is positioned within the probe by an internally longitudinally ribbed tubular member.
  • FIG. 21 illustrates a partially exploded view of an embodiment of a probe.
  • the present invention in-part relates to devices, systems and methods for delivering radiation including light to an interior, including to an interior of a lumen.
  • the term lumen includes the interior of a hollow organ in a human or animal body, and more generally to refer to any tubular or hollow item that may be either part of a living organism, or an inanimate object.
  • Light includes any electromagnetic radiation in the infrared, visible, or ultraviolet electromagnetic spectrum.
  • the invention also relates to systems for the diagnosis and treatment of infections within a lumen in a patient.
  • FIG. Ia illustrates in plan view an embodiment of a flexible elongated array 100.
  • the array 100 includes a plurality of substantially rigid members 102 interconnected into a substantially alternating longitudinal pattern with a plurality of flexible members 104.
  • array herein to refer to any embodiment of a plurality of substantially rigid members thus interconnected with at least one substantially flexible member.
  • An array can be of any length.
  • the Figures herein illustrate representative sections of arrays.
  • Mounted to one or more substantially rigid member of the plurality of substantially rigid members 102 is one or more electrical device 106 that may be any type of electrical device.
  • the one or more electrical device 106 includes one or more light-emitting device. In an embodiment, the one or more light-emitting device emits light substantially within a predetermined wavelength band. In a further embodiment, the wavelength band is chosen to activate or accelerate a chemical reaction without causing thermal damage to material adjacent to a site of the chemical reaction. In one embodiment, the predetermined wavelength band treats a bacterial infection. In a further embodiment, the treatment causes substantially no damage to adjacent living tissue. In other embodiments, the one or more light-emitting device 106 emits light in a plurality of wavelength bands. [0072] In another embodiment, the one or more electrical device 106 includes an electronic sensor. In one embodiment, the sensor senses temperature, hi another embodiment, the sensor senses pressure.
  • the senor is an optical sensor.
  • the one or more electrical device includes a combination of more than one type of electrical device. The inclusion of more than one type of electrical device mounted on a substantially rigid member may provide means for monitoring the performance of other electrical components mounted to the substantially rigid member or of the entire array 100.
  • the one or more electrical device 106 may be mounted to one of the plurality of rigid members 102 or interconnected with other electrical devices by soldering, welding, electrically conductive adhesive or another type of electrical and mechanical coupling. Connections may also be reinforced with an added drop of curable composition such as an epoxy encapsulant. hi an embodiment, an electrical connection to a surface of a light- emitting diode in an array is encapsulated with a droplet of a substantially optically transparent encapsulant.
  • the droplet is shaped to direct light from the light emitting diode in a predetermined direction
  • the array is immersed in a fluid and the value of refractive index of the encapsulant is between the refractive index of the optical emitter and the refractive index of the fluid.
  • the rigidity for a particular substantially rigid member may be determined in part by requirements to support operation of the one or more electrical device 106 mounted thereon, as well as durability of the array 100.
  • an active electronic component such as a light-emitting diode may have mounting and substrate rigidity requirements different from the requirements for a passive component such as an incandescent lamp.
  • the term rigid member includes any substantially rigid member meeting the mounting and operational requirements of electrical devices mounted thereon.
  • the array 100 also includes two electrically conductive busses 108 that are adapted for electrical connection of the one or more electrical device 106 to an external source of electrical power. In an embodiment, the two electrical busses 108 are electrically connected to an external power supply that provides a DC potential between the two electrical busses 108.
  • the array 100 includes supplementary electrical busses in addition to the two electrical busses 108. Supplementary electrical busses may provide additional electrical power, or serve as signal conduits between the one or more electrical device 106 and external electrical or electronic equipment.
  • the one or more electrical device 106 mounted to a rigid member of the plurality of rigid members 102 is a plurality of light-emitting diodes 110 connected electrically in series 112 between the two electrical busses 108.
  • the array 100 includes a substrate 114 that in different embodiments may be substantially rigid or may be flexible, hi one embodiment, the substrate 114 is rigid and provides inherent rigidity for the plurality of rigid members.
  • portions of the substrate 114 are reduced in rigidity to provide flexibility for the plurality of flexible members 104.
  • Reductions in rigidity may include narrowing or thinning of the substrate 114 at the positions of the plurality of flexible members 104, or other mechanical, material or chemical modifications to make the substrate 114 locally more flexible
  • the plurality of flexible members 104 does not include a substrate
  • the substrate 114 is a rigid-flex substrate that provides rigidity for the plurality of rigid members 102 and provides flexibility for the plurality of flexible members 104.
  • the substrate 114 is flexible and one or more rigid member of the plurality of rigid members 102 is individually reinforced by a stiffening member.
  • the substrate 114 is an epoxy board material, hi another embodiment, the substrate 114 is made of apolyimide. hi yet another embodiment, the substrate is a ceramic. In still another embodiment, the substrate is a multilayer composite including conductive and insulating layers, hi a further embodiment, conductive layers in the multilayer composite are adapted to function as electrical power busses for the array 100.
  • FIG. Ib is a side view of the array 100 of FIG. Ia, illustrating an embodiment that includes a convolution 116 in each flexible member of the plurality of flexible members 104.
  • one or more flexible member of the plurality of flexible members 104 includes a plurality of convolutions.
  • a convolution 116 may not be required for every flexible member of the plurality of flexible members 106.
  • the array 100 is seen to be substantially planar except for the convolution 116.
  • the out-of-plane positioning of the convolution 116 contributes to flexibility of the array 100 in multiple planes.
  • the array 100 may be constructed in any manner that provides the convolution 116.
  • the array 100 is constructed using a substrate that is preformed to include convoluted flexible sections corresponding to the plurality of flexible members 104.
  • the array 100 is partially constructed as a planar array, and convolutions are formed as a construction step using any sheet-forming method that does not damage the array 100.
  • convolutions are formed in an array using a custom die.
  • FIG. Ic illustrates another embodiment of the array 100 wherein convolutions 118 vary in orientation with respect to the array 100.
  • one or more convolution is formed coplanar with the plurality of rigid members 102 of the array 100. [0078] FIG.
  • Id illustrates in side view an embodiment of a double-sided array 120.
  • the double-sided array 120 is similar in construction to the array 100 of FIG. Ia through FIG. Ic except that the double-sided array 120 includes electronic devices 122 on an upper surface 124 and a lower surface 126 of the double-sided array 120.
  • the double-sided array 120 is constructed from two arrays, each having electronic components mounted on a single face.
  • the double-sided array 120 is assembled from two of the arrays 100 illustrated in FIGs. Ia through Ic.
  • the double- sided array 120 is constructed using a double-sided circuit board.
  • FIGs. 2a and 2b illustrate in plan view another embodiment of an array 130.
  • the array 130 includes a plurality of rigid members 132 interconnected by a plurality of flexible members 134.
  • One or more electrical device 136 is mounted to a top surface 138 of each of the plurality of rigid members 132, and electrical busses 140 are positioned along a bottom surface 142 of the array 130.
  • the electrical busses 140 are electrically connected to the one or more electrical device 136 through vias 144 that pass through a substrate 146.
  • FIGs. 3a and 3b illustrate yet another embodiment of an array 150.
  • the array 150 resembles the array 130 of FIGS.
  • FIG. 4 illustrates an embodiment of an array 160 including a plurality of rigid members 162 interconnected by a plurality of flexible members 164, constructed using a flexible substrate 166.
  • One or more electrical device 168 is mounted to one or more of the plurality of rigid members 162.
  • One or more of the plurality of rigid members 162 is reinforced by a stiffening member 170 fabricated from a rigid material.
  • the stiffening member 170 is bonded to the substrate 166.
  • the rigid material is the same type of material as the substrate.
  • the rigid material is a ceramic.
  • the rigid material includes an electrical conductor, hi an embodiment, at least one of the plurality of flexible members 164 includes a convolution 172.
  • FIGs. 5a illustrates a side view of an embodiment of an array section 180, showing two rigid members 182 positioned in a common plane 184 and interconnected by a flexible member 186 that includes an out-of plane convolution 188.
  • FIG. 5b illustrates flexion of the flexible member 1.86 for out-of-plane bending of the array section 180, comprising bending of the material of the flexible member 186 and compression of the convolution 188. Flexion in a direction opposite of that illustrated in FIG. 5b would result in expansion of the convolution 188.
  • FIG. 6a illustrates the array section 180 in an isometric view, also illustrating an axis 190 of the array section 180 in the plane 184.
  • FIG. 6b shows flexion of the array section 180 in the plane 184.
  • the convolution 188 enables the array section 180 to flex in the plane 184 where a first (inner with respect to the flexion) edge 192 of the convolution 184 undergoes compression while a second (outer with respect to the flexion) edge 194 of the convolution undergoes expansion.
  • the convoluted flexible member 186 can thus flex in any direction about the axis 190.
  • FIG. 7a illustrates in plan view an embodiment of a portion of a modular array 200.
  • the modular array 200 includes a plurality of modules 202.
  • Each module of the plurality of modules 202 includes one or more rigid member 204.
  • a module includes one rigid member 204.
  • a module includes more than one rigid member 204, interconnected by one or more flexible member 206.
  • the one or more rigid member 204 and the flexible member 206 can be constructed in the same manner as any of the rigid members and flexible members described in association with FIGs. Ia through 6b.
  • a plurality of light- emitting diodes 207 is mounted to a rigid member 204.
  • Each module of the plurality of modules 202 includes at least one connection member 208 for connecting longitudinally to another one of the plurality of modules 202 to form the array 200.
  • a first module 210 having a first connection member 212 and a second module 214 having a second connection member 216 are shown separated along the array 200.
  • the at least one connection member 208 may be any type of connection member compatible with the assembly of a substantially flexible array.
  • FIG. 7b illustrates a side view of the array 200, illustrating one embodiment that includes joint-type connection members 218.
  • FIG. 7b also illustrates a flexible member 206 that includes a convolution 220.
  • the joint-type connection members 218 are constructed from metallic conductors.
  • the joint-type connection members include an electrically insulating substrate.
  • FIG. 7c illustrates the array 200 assembled using the joint-type connection members 218.
  • the assembled joint-type connection members 218 are flexible along the array 200.
  • the assembled joint-type connection members include a convolution to provide flexibility along the array.
  • the joint-type flexible members 218 are joined with solder.
  • the joint-type flexible members 218 are joined by welding.
  • the joint-type flexible members 218 are joined with an electrically conductive adhesive.
  • the joint-type flexible members 218 are joined by a mechanical interlock.
  • the mechanical interlock is a snap-fit connector.
  • the mechanical interlock is one or more mechanical crimp.
  • the mechanical interlock comprises thermal compression.
  • FIGs. 7d and 7e illustrate the assembled array 200 in side view and plan view, respectively, additionally illustrating electrical connections 224 to external electrical equipment.
  • the electrical connections 224 may be formed using any means described herein for joining the at least one connection member 208, or another electrical connection means.
  • FIG. 8a illustrates in side view an embodiment of an array 240 including rigid members 242 and flexible interconnects 244, the array 240 further including one or more supplementary electrical connection 246 at one or more intermediate position 248 along the array 240.
  • the one or more supplementary electrical connection 242 provides more electrical current to the array from an external power source than can be provided through electrical connections only at a single longitudinal position along the array 240.
  • the one or more supplementary electrical connection 246 enables sections of the array 240 to be operated independently from one another by providing one or more open circuit point 250 along the array 240.
  • the one or more supplementary electrical connection 246 at a first intermediate position 252 is electrically isolated from the one or more supplementary electrical connection 246 at a second intermediate position 254.
  • the one or more supplementary electrical connection 246 at the first intermediate position 252 shares a common electrical connection 256 with the one or more supplementary electrical connection 246 at a second intermediate position 254.
  • FIGS. 9a and 9b illustrate an embodiment of a portion of a modular array 260 including a plurality of rigid members 262 interconnected by a plurality of flexible fittings 264.
  • each one of the plurality of rigid members 262 is manufactured to include at least one flexible fitting 264 as a subassembly 266, and a plurality of the subassemblies 266 is longitudinally assembled to form the array 260.
  • one or more of the subassemblies 266 includes a plurality of electrical devices 268 mounted thereon.
  • the plurality of electrical devices 268 is a plurality of light- emitting diodes.
  • the flexible fittings 264 snap together to assemble the array 260.
  • an additional processing step is used to complete assembly of the array.
  • the additional step provides a permanent connection between adjacent rigid members in the array.
  • FIG. 10a An embodiment of a probe 300 is illustrated in end view in FIG. 10a. and in side view in FIG. 10b.
  • the probe 300 includes an array 302 positioned within an elongated flexible tubular envelope 304 having an outer tubular wall 306. Any embodiment of an array may be assembled into a probe.
  • the array 302 as illustrated in FIGs. 10a and 10b includes a plurality of rigid members 308 interconnected by a plurality of flexible members 310 that may be convoluted flexible members.
  • a plurality of light-emitting devices 312 is mounted on one or more of the plurality of rigid members 308, and the tubular wall 306 is at least partially optically transmissive of light emitted by the plurality of light-emitting devices. That is, the material of the tubular wall 306, either in whole or in part, is chosen to be optically transparent, translucent or reflective at an optical emission wavelength of the plurality of light-emitting devices 312. The optical properties of the tubular wall 306 may also be patterned to selectively transmit, scatter, reflect, or absorb light emitted by the plurality of light-emitting devices 312 at selected positions on the tubular wall 306.
  • the probe 300 includes a distal end 314 where the tubular envelope 304 is closed.
  • the probe 300 is adapted to receive a cooling fluid (coolant) within the tubular envelope 304 for cooling the plurality light- emitting devices 312.
  • the coolant is at least partially optically transmissive.
  • the array 302 is positioned transversely within the tubular envelope 304 by one or more of the plurality of rigid members 308 and the plurality of flexible members 310.
  • the array 302 and the tubular envelope 304 are respectively dimensioned to constrain the position of the array 302 within the tubular member 304 so as to protect the light emitting devices 312 or other potentially delicate components of the array 302.
  • the one or more array and the tubular envelope may be dimensioned to constrain the position of the array within the tubular envelope.
  • the positioning of the array 302 within the tubular envelope 304 defines one or more conduit for the coolant.
  • the probe 300 is adapted for the coolant to flow distally through a first conduit 316, to reverse direction substantially at the distal end 314, and to flow proximally through a second conduit 318.
  • the directions of flow through the first 316 and the second conduit 318 are reversed.
  • one of the first 316 and the second conduit 318 comprises a flexible tube 320.
  • materials appropriate for constructing the tubular envelope 304 include natural and synthetic polymers such as polyolefms, fluoropolymers, polyurethanes, polyesters, and rubber products.
  • the material of the tubular envelope 304 is also chosen to be compatible with the coolant.
  • the material of the tubular envelope 304 is preferably chosen to. be biocompatible, hi an embodiment, the tubular envelope 304 is preferably made of Fluorinated Ethylene Propylene polymer (FEP). In another embodiment, the tubular envelope 304 is preferably made of polyethylene.
  • FEP Fluorinated Ethylene Propylene polymer
  • the tubular envelope 304 is preferably made of polyethylene.
  • the selection criteria described above for materials for the tubular envelope 304 may be applied to any embodiment of a probe.
  • coolants suitable for use in a probe of the present invention include fluorinated organic compounds, silicone oils, hydrocarbon oils and deionized water.
  • a coolant may also be selected to have a boiling temperature that is lower than a scalding temperature of living tissue. Such a fluid vaporizes before becoming hot enough to scald tissue.
  • the coolant is selected to have a boiling temperature lower than about 45 degrees Celsius. Coolants having a boiling point suitable for preventing scalding of tissue are available commercially. For example, 3M Corporation manufactures such a coolant under the trade name Fluorinert.
  • a coolant for use with probes may be selected for operation at temperatures above or below room temperature.
  • the coolant is refrigerated for use in a probe.
  • a recirculating refrigeration unit is used to cool the coolant for use in a probe. The selection criteria described above for coolant materials may be applied to any embodiment of a probe of the present invention.
  • a probe can include a plurality of arrays. FIGs.
  • the multi-array probe 350 includes a plurality of array's 352 that may be any of the arrays disclosed herein. In an embodiment, the multi- array probe 350 includes three arrays.
  • the multi-array probe 350 also includes a multilumen tubular envelope 354 that has an outer tubular wall 356 and a plurality of internal longitudinal lumens 358. In an embodiment, each array of the plurality of arrays 352 is positioned within one of the plurality of lumens 358.
  • one or more of the plurality of arrays 352 and a corresponding one or more of the plurality of internal lumens 358 is dimensioned to constrain the position of the one or more array of the plurality of arrays 352 within the corresponding one or more of the plurality of internal lumens so as to position and protect delicate components of the plurality of arrays 352.
  • one or more of the plurality of arrays 352 includes one or more light-emitting device 360 mounted thereon.
  • the one or more light- emitting device 360 is positioned to emit light substantially radially outward from the multi-array probe 350.
  • the plurality of arrays 352 within the probe 350 is adapted for mounting a larger number of light-emitting devices per unit length of the probe 350 than the number of light-emitting devices per unit length in a probe that includes a single array.
  • a predetermined spatial distribution of light intensity emitted by the probe 350 is established by mounting the one or more light: -emitting device 360 on (rigid members of) the plurality of arrays 352 in a corresponding predetermined distribution.
  • one or more lumen of the plurality of lumens 358 is adapted to conduct a coolant distally within the multi-array probe 350, and another one or more lumen of the plurality of lumens 358 is adapted to conduct the coolant proximally within the probe 350.
  • a central lumen 362 of the plurality of lumens 358 is adapted to conduct the coolant in a distal direction, and the remainder of the lumens of the plurality of lumens 358 are circumferentially distributed within the tubular envelope 354 and are adapted to conduct the coolant in a proximal direction, with the flow direction reversing substantially at a distal end of the probe 350 as described for the probe 300 of FIG. 10b.
  • the directions of flow are reversed in each of the central lumen 362 and the remainder of the plurality of lumens 358.
  • the outer tubular wall 356 and the cooling fluid are at least partially optically transmissive of light emitted by the one or more light-emitting device 360.
  • the one or more light-emitting device 360 is immersed in the coolant.
  • the multi-array probe 370 includes a plurality of arrays 372 that may be any of the arrays disclosed herein. In an embodiment, the multi-array probe 370 includes three arrays.
  • the multi-array probe 370 also includes a multi-lumen tubular envelope 374 that has an outer tubular wall 376 and an inner tubular wall 378 forming an annular lumen 380 therebetween.
  • the multi-lumen tubular envelope 374 also includes a plurality of central lumens 382. In an embodiment, each array of the plurality of arrays 372 is positioned within one of the plurality of central lumens 382.
  • the plurality of central lumens is adapted to conduct a coolant distally through the probe, and the annular lumen is adapted to conduct a coolant proximally through the probe 370.
  • the temperature of coolant entering the plurality of central lumens 382 from an external coolant source is at a temperature lower than would be desirable at the outer tubular wall 376. The coolant is warmed during distal travel so that it is within a desirable temperature range for the outer tubular wall 376, for proximal return flow through the annular lumen 380.
  • FIG. Hd illustrates another embodiment of a probe 384 including a tubular envelope 386 having an annular lumen 388 between an outer wall 390 and an inner wall 392, and adapted for conducting flow of a coolant proximally through the probe 382.
  • the probe also includes at least one central lumen 394 defined by the inner wall 392.
  • two arrays 396 are positioned within the at least one central lumen 394.
  • FIG. lie illustrates yet another embodiment of a probe 395 wherein a multilumen tubular envelope 396 includes a first lumen 397 for distal flow of a coolant and a second lumen 398 for proximal flow of the coolant, with arrays 399 positioned in each of the first 397 and the second lumen 398.
  • Still another embodiment is a probe that includes three-dimensionally configured rigid members interconnected by flexible members to form an array.
  • Three-dimensionally configured rigid members include substantially rigid members upon which electrical devices can be mounted on more than one non-coplanar exterior surface, or more than one non-coplanar section of an exterior surface.
  • FIG. 12 illustrates an embodiment of an array 400 including a plurality of rigid members 402 shaped as hollow cylinders having a cylindrical outer surface 404 and a longitudinal bore 406 aligned with a longitudinal axis 408 of the array 400.
  • the plurality of rigid members 402 are interconnected by a plurality of flexible members 410 that may be any type of flexible member disclosed hereinbefore for interconnecting rigid members in an array.
  • one or more electrical device 412 is mounted on the cylindrical outer surface 404.
  • electrical conductors 414 positioned on the cylindrical outer surface 404 provide electrical power connections to the one or more electrical device 412.
  • the longitudinal bore 406 is adapted to receive a flexible tubular member 414 for carrying a cooling fluid through the array 400.
  • the plurality of rigid, members 402 are made from a ceramic material. In another embodiment, the material is a polymer. [00101] Three-dimensionally configured rigid members in an array may also have a polygonal cross section. FIG.
  • FIG. 13a illustrates an embodiment of an array 420 having a longitudinal axis 422 and including a plurality of triangular cross section rigid members 424 interconnected by a plurality of flexible members 426.
  • Each rigid member of the plurality of rigid members 424 has a first end 428, a second end 430 and three substantially planar exterior surfaces 432 onto which one or more electrical device 434 can be mounted.
  • the first end 428 of at least one rigid member 436 is connected to a first adjacent rigid member 438 through a first flexible member 440 substantially coplanar with a first face 442 of the three faces 432.
  • the second end 430 of the at least one rigid member 436 is connected to a second adjacent rigid member 444 through a second flexible member 446 substantially coplanar with a second face 448 of the three faces 432.
  • the first flexible member 440 and the second flexible member 446 are non- coplanar.
  • flexibility of the array 420 about the axis 422 derives substantially from out-of plane flexion of the plurality of flexible members 426, in different planes at different positions along the array.
  • the flexible members of the plurality of flexible members 426 are substantially planar when not being flexed, that is, they are not convoluted.
  • the plane of flexible members of the plurality of flexible members increments by 120 degrees for each consecutive flexible member, in a helical fashion about the axis 422 along the array 420.
  • the array 420 includes a plurality of rigid members having a cross section that is another polygon other than a triangle.
  • the plurality of rigid members 424 includes a longitudinal bore 450, In a further embodiment, the longitudinal bore 450 is adapted to receive a flexible tubular member 452 for carrying a cooling fluid through the array 420.
  • the longitudinal bore 450 has a circular cross-section. In another embodiment, the longitudinal bore 450 has a polygonal cross section.
  • FIG. 13b illustrates in end view an embodiment of a probe 460 including the array 420 illustrated in FIG. 13a positioned within a flexible tubular envelope 462.
  • a coolant flows distally through the flexible tubular member 452 and proximally around the plurality of rigid members 424.
  • the one or more electrical device 434 is immersed in the coolant.
  • FIG. 13c illustrates an embodiment of a probe 470 that resembles the probe 460 of FIG. 13b, but is assembled from an array 472 including a plurality of rigid members 474 having a triangular longitudinal bore 476.
  • FIG. 14a illustrates a planar circuit board 500 for constructing an array having a physical configuration similar to the array 472 illustrated in FIG. 13c.
  • the circuit board 500 includes a longitudinal direction 502 and a plurality of component-bearing sections 504, each having three subsections 506 separated by longitudinal fold lines 508.
  • the circuit board 500 also includes a plurality of connecting members 510 that alternate longitudinally with the plurality of component-bearing sections 504. Any type of electrical components may be mounted to the circuit board 500.
  • a plurality of light-emitting devices 512 is mounted to the circuit board 500.
  • the plurality of light-emitting devices 512 is a plurality of light-emitting diodes.
  • Consecutive connecting members of the plurality of connecting members 510 along the longitudinal direction 502 connect different subsections of consecutive component- bearing sections of the plurality of component-bearing sections 504, in a cyclic pattern.
  • Conductive traces 514 on the circuit board 500 interconnect the plurality of component- bearing sections 504 and the plurality of connecting members 510 to form an electrical circuit adapted to connect electrically to an external source of power.
  • the circuit board 500 is adapted for folding along the fold lines without damage to either the conductive traces 514 or to any electrical devices that may be mounted to the circuit board 500.
  • the circuit board 500 is constructed using standard circuit board fabrication methods.
  • FIG. 14b illustrates an embodiment of an array 520 assembled from the circuit board 500 of FIG. 14a by folding the component-bearing sections 504 along the fold lines 508 to form rigid triangular cross-section members 522.
  • the connecting members 510 function as flexible members in the assembled array 520.
  • the plurality of light-emitting devices 512 is mounted to the circuit board 500 before the component- bearing sections are folded, hi another embodiment the plurality of light-emitting devices 512 is mounted to the circuit board 500 after the component-bearing sections are folded.
  • the array 520 can be inserted into a tubular envelope 524 for further assembly into an embodiment of a probe.
  • meeting edges 526 of the circuit board 500 to form the array 520 are bonded together to maintain the triangular cross sectional shape of the array 520.
  • the circuit board 500 may be made from a flexible circuit board. After the component-bearing sections 504 are folded along the fold lines 508 the triangular cross-section members 522 may be made. Substantial rigidity of these cross- section members 522 may be achieved by the configuration of the cross-section members 522 and may not require the use of rigid materials.
  • FIG. 15a illustrates schematically a plane circuit board 550 having fold lines 552 along which the circuit board 550 can be folded to construct an array 554 illustrated in FIG. 15b.
  • the array 554 includes substantially tetrahedral rigid members 556 interconnected by flexible members 558 formed along fold lines 552 of the circuit board 550.
  • electrical circuits are patterned and electrical components are mounted on the plane circuit board 550 before it is folded to construct the array.
  • FIG. 16 illustrates an embodiment of a portion of a probe 600 including a flexible tubular envelope 602 and an array 604 having a plurality of substantially tetrahedral rigid members 606 interconnected by a plurality of flexible members 608.
  • the array 604 resembles the array 550 of FIG. 15b, but with the addition of a longitudinal conduit 610 adapted to receive a tubular member 612 for carrying a coolant through the probe 600.
  • FIG. 16 also illustrates flexion of the array 604 by bending of the plurality of flexible members 608. FIGs.
  • 17a and 17b illustrate yet another embodiment of a plane pattern 650 for a circuit board having fold lines 652 along which the pattern 650 can be folded to form a flexible array 654 that includes three-dimensional rigid sections 656, and flexibility at flexible members 658 derived from fold lines 652 of the pattern 650.
  • the transverse positioning of an array within a tubular envelope of a probe can influence the performance of the probe, for example, with regard to coolant flow through the probe, flexural characteristics of the probe, and the distribution of light emitted by a light-emitting probe.
  • One way to transversely position an array within a probe is to dimension the array to fit within the tubular envelope without excessive transverse motion. This type of transverse positioning is illustrated, for example, in FIGs. 10a, 11a, 13b, 13c, and 16 herein.
  • FIG. 18 illustrates an embodiment of a probe 700 including an array 702 positioned within a tubular envelope 704 having a tubular wall 706.
  • the array 702 is transversely positioned within the tubular envelope 704 by a plurality of inwardly directed projections 708 from the wall 706.
  • the projections are substantially point projections inward from the wall 706. In another embodiment, the projections are substantially annular.
  • the array 702 is positioned in the tubular envelope 704 after the inwardly directed projections are formed, hi another embodiment, the inwardly directed projections 708 are formed in the wall 706 after the array is longitudinally positioned in the tubular envelope 704. hi one embodiment, the projections 708 position rigid members 710 of the array 702. In another embodiment, the projections 708 position flexible members 712 of the array 702. [00110] FIG. 19 illustrates an embodiment of a probe 720 including an array 722 having a plurality of triangular cross section rigid members 724 that are transversely positioned within a tubular envelope 726 by a plurality of waists 728 positioned longitudinally between the rigid members of the plurality of rigid members 724.
  • the plurality of waists 728 is formed after the array 722 is longitudinally positioned within the tubular envelope 726. In one embodiment, the plurality of waists is formed by mechanical crimping of the tubular envelope 726. hi another embodiment, the plurality of waists 728 is formed thermally.
  • FIG. 20 illustrates an embodiment of a probe 740 wherein an array 742 is transversely positioned within a tubular envelope 744 by one or more internal longitudinal ribs 746.
  • FIG. 21 illustrates in a partially exploded view of yet another embodiment of a probe 750.
  • the probe 750 is seen to include a tubular envelope 752 having an annular lumen 754 between an outer wall 756 and an inner wall 758.
  • the inner wall 758 defines a central lumen 760 adapted for conducting flow of a coolant in a first longitudinal direction 762 through the probe 750, and the annular lumen 754 is adapted for conducting a flow of the fluid in a second longitudinal direction 764 opposite the first longitudinal direction 762.
  • the probe 750 also includes one or more substantially cylindrical member 766 adapted to fit within the annular lumen 754.
  • a plurality of light emitting devices 768 is mounted to an outer surface 770 of the one or more cylindrical member 766 and electrically interconnected to receive electrical power from an external power source.
  • a plurality of cylindrical members 766 are positioned in and longitudinally distributed along the annular lumen 754, and electrically interconnected to receive electrical power from the external power source.
  • the one or more cylindrical member is constructed from a flexible circuit board bent and joined 770 into a cylindrical form.
  • the one or more cylindrical member 766 comprises a rigid member used in an array.
  • Embodiments of flexible arrays and probes disclosed herein can be advantageous for many applications requiring a flexible, durable, elongated probe for the disposition and operation of electronic components in a lumen, and particularly for applications requiring physically flexible, high power density light-emitting probes for use in a body lumen, for example, for treating an intraluminal bacterial infection such as H. Pylori infection.
  • a probe may include a circulating coolant that may be a liquid coolant, that enables the probe to be operated at high electrical power density and therefore high output light intensity per unit length and per unit surface area of the probe.
  • the high optical power achievable using embodiments of probes of the present invention may enable a medical treatment procedure to be performed in less time than would be required using a probe without liquid cooling.
  • a plurality of arrays may be included in a probe. Including a plurality of arrays in a probe provides enhanced control of the distribution of light intensity about the probe, and may increase the total output light power achievable with a probe, relative to a probe that includes a single array. Embodiments of probes may also facilitate immersive contact between electrical power-consuming devices including light-emitting devices and a coolant in a fluid-cooled probe, for improved heat transfer.
  • Examples of non-medical applications of light-emitting probes disclosed herein include internal disinfection of pipes and ventilation ducts, rapid curing of internal coatings such as epoxy repairs of pipes, chemical cross-linking of polymeric surfaces to reduce susceptibility to chemical damage or wear, and photochemical deposition of optical or electronic materials within confined spaces.
  • a probe to be used in a specific application may be designed to include light-emitting elements that emit light in a predetermined wavelength band for accelerating specific target chemical reactions for the application. For example, ultraviolet light is used in the automotive industry and in and other industries to cure paint rapidly without thermal damage to the paint or an underlying part.
  • Probes disclosed herein may include elongated arrays having substantially rigid members for mounting electrical devices, the rigid members being interconnected by flexible members.
  • the rigid members advantageously provide stable mounting platforms for the electrical devices thereby supporting reliability and durability of the probe.
  • Examples of electrical devices that may be included in probes include passive and active electronic devices, including light-emitting devices such as light-emitting diodes.
  • the rigid members may also be adapted for mounting more than one type of electrical or electronic device thereon, for example, a combination of light-emitting diodes and light or temperature sensors for monitoring the performance of the probe.
  • the flexible members may include convolutions to advantageously provide flexibility in any direction about an axis of the probe.
  • An array including rigid members interconnected by flexible members in probes disclosed herein is also advantageous in that it can be constructed in any of several different ways.
  • Arrays disclosed herein can variously be constructed as unitary structures including pluralities of rigid and flexible members, as a modular structures assembled from individual rigid and flexible members, or as intermediate structures assembled from subassemblies of any length. This flexibility of design supports the optimization of probe specifications for a particular, application. Modularity may also enable the mass production of subassemblies, for improving manufacturability and reducing the manufacturing costs of a probe. Reduced manufacturing costs of probes may be particularly advantageous for the broad deployment of light-emitting probes for the treatment of intraluminal infections such as H. Pylori infection in the human gut, a worldwide public health issue.
  • Modularity may also advantageously supports the incorporation into a probe of electrical connections at a plurality of positions along the length of a probe, thereby increasing the total electrical power deliverable to a probe, as well as providing means to separately control a plurality of segments of a probe.
  • Arrays for probes disclosed herein may be advantageously assembled from planar circuit boards that can be folded to form pluralities of rigid members interconnected by flexible members.
  • This construction method provides three-dimensionally configured rigid members that may include a plurality of mounting surfaces for electrical devices, and that may be inexpensively manufactured using known circuit board manufacturing methods.
  • this construction method provides flexibility of the array in all directions about a longitudinal axis without the inclusion of convolutions in the flexible members.
  • the structure of the arrays enables the arrays to be flexed in any direction about a longitudinal array axis.
  • Known flexible arrays of light-emitting diodes are built on substrates that restrict flexibility in the substrate plane. Flexibility can be especially important, for example, in probes that include circumferentially-distributed arrays of light-emitting diodes, where the arrays are oriented at fixed angular orientations about their respective longitudinal axes within the probe.

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  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Radiology & Medical Imaging (AREA)
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Abstract

L'invention concerne de sondes à émission de rayonnement physiquement souple destinées à délivrer un rayonnement ou une lumière à l'intérieur d'une lumière ou d'une cavité. Les sondes comportent plusieurs éléments sensiblement rigides supportant les dispositifs électroniques et assemblés dans un réseau longitudinal par des interconnexions conçues de manière à fournir une souplesse à la sonde dans n'importe quelle orientation autour d'un axe. Les dispositifs électroniques peuvent comprendre des dispositifs à émission de lumière montés sur une ou plusieurs surfaces des éléments rigides. Les interconnexions peuvent être conçues de manière à fournir des connexions électriques ainsi que mécaniques entre les éléments rigides, et la sonde peut comporter un ou plusieurs conduits internes destinés à un refroidisseur.
PCT/US2006/019522 2005-05-31 2006-05-19 Appareil d'eclairage intraluminal WO2006130365A2 (fr)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014147497A1 (fr) * 2013-03-19 2014-09-25 Medlight S.A. Dispositif médical pour l'illumination de cavités de formes complexes
JP2020043897A (ja) * 2018-09-14 2020-03-26 株式会社セイバー 発光型治療具
WO2022118360A1 (fr) * 2020-12-01 2022-06-09 日本ライフライン株式会社 Dispositif d'irradiation de lumière
JP2022136319A (ja) * 2018-09-14 2022-09-15 株式会社ビー・アンド・プラス 発光型治療具
DE102022201337A1 (de) 2022-02-09 2023-08-10 Richard Wolf Gmbh Bestrahlungsvorrichtung für die photodynamische Therapie

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WO2004082736A2 (fr) * 2003-03-14 2004-09-30 Light Sciences Corporation Dispositif de production de lumiere a usage intravasculaire
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WO2005058407A1 (fr) * 2003-12-16 2005-06-30 Inomicrotec Ltd Methode et dispositif permettant de liberer des substances chimiques et biologiques de façon controlee au moyen de reactions photochimiques

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WO1998032493A1 (fr) * 1997-01-29 1998-07-30 Light Sciences Limited Partnership Configuration de circuit souple compact
WO1998043703A1 (fr) * 1997-03-31 1998-10-08 Prescott Marvin A Procede et dispositif aux fins d'une therapie au laser
WO2004082736A2 (fr) * 2003-03-14 2004-09-30 Light Sciences Corporation Dispositif de production de lumiere a usage intravasculaire
US20050106710A1 (en) * 2003-11-14 2005-05-19 Friedman Marc D. Phototherapy device and system
WO2005058407A1 (fr) * 2003-12-16 2005-06-30 Inomicrotec Ltd Methode et dispositif permettant de liberer des substances chimiques et biologiques de façon controlee au moyen de reactions photochimiques

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014147497A1 (fr) * 2013-03-19 2014-09-25 Medlight S.A. Dispositif médical pour l'illumination de cavités de formes complexes
JP2020043897A (ja) * 2018-09-14 2020-03-26 株式会社セイバー 発光型治療具
JP2022136319A (ja) * 2018-09-14 2022-09-15 株式会社ビー・アンド・プラス 発光型治療具
JP7186389B2 (ja) 2018-09-14 2022-12-09 株式会社ビー・アンド・プラス 発光型治療具
JP7274708B2 (ja) 2018-09-14 2023-05-17 株式会社ビー・アンド・プラス 発光型治療具
WO2022118360A1 (fr) * 2020-12-01 2022-06-09 日本ライフライン株式会社 Dispositif d'irradiation de lumière
DE102022201337A1 (de) 2022-02-09 2023-08-10 Richard Wolf Gmbh Bestrahlungsvorrichtung für die photodynamische Therapie
WO2023151768A1 (fr) * 2022-02-09 2023-08-17 Richard Wolf Gmbh Dispositif d'irradiation pour thérapie photodynamique

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