WO2006122195A2 - Magnetic composites and methods of making and using - Google Patents

Magnetic composites and methods of making and using Download PDF

Info

Publication number
WO2006122195A2
WO2006122195A2 PCT/US2006/018111 US2006018111W WO2006122195A2 WO 2006122195 A2 WO2006122195 A2 WO 2006122195A2 US 2006018111 W US2006018111 W US 2006018111W WO 2006122195 A2 WO2006122195 A2 WO 2006122195A2
Authority
WO
WIPO (PCT)
Prior art keywords
magnetic
nanoparticle
paste
equal
component
Prior art date
Application number
PCT/US2006/018111
Other languages
French (fr)
Other versions
WO2006122195A3 (en
Inventor
T. Danny Xiao
Xinqing Ma
Heng Zhang
Junfeng Zhou
Original Assignee
Inframat Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Inframat Corporation filed Critical Inframat Corporation
Priority to CN200680016208.6A priority Critical patent/CN101208165B/en
Publication of WO2006122195A2 publication Critical patent/WO2006122195A2/en
Publication of WO2006122195A3 publication Critical patent/WO2006122195A3/en

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/16Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y25/00Nanomagnetism, e.g. magnetoimpedance, anisotropic magnetoresistance, giant magnetoresistance or tunneling magnetoresistance
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/0027Thick magnetic films
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/0036Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties showing low dimensional magnetism, i.e. spin rearrangements due to a restriction of dimensions, e.g. showing giant magnetoresistivity
    • H01F1/0045Zero dimensional, e.g. nanoparticles, soft nanoparticles for medical/biological use
    • H01F1/0054Coated nanoparticles, e.g. nanoparticles coated with organic surfactant
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/0036Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties showing low dimensional magnetism, i.e. spin rearrangements due to a restriction of dimensions, e.g. showing giant magnetoresistivity
    • H01F1/0045Zero dimensional, e.g. nanoparticles, soft nanoparticles for medical/biological use
    • H01F1/0063Zero dimensional, e.g. nanoparticles, soft nanoparticles for medical/biological use in a non-magnetic matrix, e.g. granular solids
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/34Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites
    • H01F1/36Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites in the form of particles
    • H01F1/37Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites in the form of particles in a bonding agent
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00Fixed inductances of the signal type 
    • H01F17/0006Printed inductances
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/14Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates
    • H01F41/16Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates the magnetic material being applied in the form of particles, e.g. by serigraphy, to form thick magnetic films or precursors therefor
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M3/00Conversion of dc power input into dc power output
    • H02M3/003Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0233Filters, inductors or a magnetic substance
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203Fillers and particles
    • H05K2201/0242Shape of an individual particle
    • H05K2201/0257Nanoparticles
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08Magnetic details
    • H05K2201/083Magnetic materials
    • H05K2201/086Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/26Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/29Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982Particulate matter [e.g., sphere, flake, etc.]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/32Composite [nonstructural laminate] of inorganic material having metal-compound-containing layer and having defined magnetic layer

Definitions

  • the present disclosure generally relates to magnetic composites and more specifically to magnetic pastes for use in high frequency applications.
  • One method for integrating higher frequency magnetic devices into a circuit is through thick film screen-printing. Thick film screen-printing allows for the deposition of a magnetic material in paste form onto a ceramic substrate.
  • the paste material generally consists of ceramic or metallic particles suspended in a polymer paste. Unfortunately, the permeabilities of these pastes are very low (e.g., less than about 3), resulting in large eddy current losses.
  • the paste undergoes a heat treatment that ultimately burns off the polymer and densifies, or sinters, the ceramic or metallic material.
  • the result is a dense pattern formed from the ceramic or metallic material.
  • a conducting coil can be printed onto a layer of ferrite, and then covered with another layer of ferrite to form an inductive coil. Successive layers can be printed to increase the inductance of the device.
  • the heat treatments result in increased permeabilities, but are accompanied by increased eddy current losses at higher frequencies.
  • a magnetic paste includes a magnetic component and a liquid organic component, wherein the magnetic component comprises a plurality of discrete nanoparticles, a plurality of nanoparticle-containing assemblies, wherein each assembly of the plurality of nanoparticle-containing assemblies has an average longest dimension of about 0.5 to about 150 micrometers, or both.
  • a magnetic device includes a magnetic component and a solid organic component, wherein the magnetic component comprises a plurality of discrete nanoparticles, a plurality of nanoparticle-containing assemblies, wherein each assembly of the plurality of nanoparticle-containing assemblies has an average longest dimension of about 0.5 to about 150 micrometers, or both.
  • a power converter includes a substrate, wherein the substrate comprises a printed circuit board, silicon wafer, or a ceramic material; and a film disposed on the substrate of the power converter, wherein the film comprises a magnetic component and a solid organic component, wherein the magnetic component comprises a plurality of discrete nanoparticles, a plurality of nanoparticle-containing assemblies, wherein each assembly of the plurality of nanoparticle-containing assemblies has an average longest dimension of about 0.5 to about 150 micrometers, or both.
  • a transformer includes a substrate, wherein the substrate comprises a printed circuit board, silicon wafer, or a ceramic material; and a film disposed on the substrate of the transformer, wherein the film comprises a magnetic component and a solid organic INF-OO 15-PCT 3
  • the magnetic component comprises a plurality of discrete nanoparticles, a plurality of nanoparticle-containing assemblies, wherein each assembly of the plurality of nanoparticle-containing assemblies has an average longest dimension of about 0.5 to about 150 micrometers, or both.
  • An inductor includes a substrate, wherein the substrate comprises a printed circuit board, silicon wafer, or a ceramic material; and a film disposed on the substrate of the inductor, wherein the film comprises a magnetic component and a solid organic component, wherein the magnetic component comprises a plurality of discrete nanoparticles, a plurality of nanoparticle-containing assemblies, wherein each assembly of the plurality of nanoparticle-containing assemblies has an average longest dimension of about 0.5 to about 150 micrometers, or both.
  • a method for making a magnetic paste includes combining a magnetic component and a liquid organic component, wherein the magnetic component comprises a plurality of discrete nanoparticles, a plurality of nanoparticle-containing assemblies, wherein each assembly of the plurality of nanoparticle-containing assemblies has an average longest dimension of about 0.5 to about 150 micrometers, or both.
  • a method for making a magnetic device includes combining a magnetic component and a liquid organic component to form a paste, wherein the magnetic component comprises a plurality of discrete nanoparticles, a plurality of nanoparticle-containing assemblies, wherein each assembly of the plurality of nanoparticle-containing assemblies has an average longest dimension of about 0.5 to about 150 micrometers, or both; disposing the paste onto a substrate; and solidifying the paste.
  • Figure 1 is a schematic representation of a composite assembly
  • Figure 2 is a schematic representation of a microscale particle assembly
  • Figure 3 is a schematic representation of a magnetic paste with a multi-modal magnetic component
  • Figure 4 is a high resolution transmission electron microscope (TEM) image of a plurality of (Ni 0 . 5 Zn 0 . S )Fe 2 O 4 grains prior to agglomeration;
  • TEM transmission electron microscope
  • Figure 5 is a scanning electron microscope (SEM) image showing a plurality substantially spherical, spray dried (Nio. 5 Zn 0 , 5 )Fe 2 0 4 agglomerates;
  • Figure 6 depicts a representative cross-sectional image of a multi-modal paste after hardening
  • Figure 7 is a graphical representation of the tapping density of pastes having different ratios of 10 and 35 micrometer (Nio, 5 Zn 0 . 5 )Fe 2 0 4 agglomerates;
  • Figure 8 is a graphical representation of the tapping density of pastes having one, two, and three groups of agglomerates
  • Figure 9 is a representative optical microscope image of an inductor formed using a multimodal paste
  • Figure 10 is a graphical representation of the permeability as a function of frequency for four samples having different (Nio, 5 Zn 0 . 5 )Fe 2 0 4 loading levels;
  • Figure 11 is a graphical representation of the inductance as a function of frequency for a bare copper coil and for an inductor
  • Figure 12 is a graphical representation of the inductance as a function of film thickness for (Nio. 5 Zn 0 , 5 )Fe 2 0 4 coated copper coils;
  • Figure 13 is a graphical representation of the inductance as a function of diameter for 1 millimeter and 1.5 millimeter thick (Ni 0 , 5 Zno. 5 )Fe 2 0 4 films deposited on copper coils; INF-OO 15-PCT 5
  • Figure 14 is a TEM image of discrete 10 nanometer cobalt particles (dark field) dispersed in benzocyclobutane (bright field);
  • Figure 15 is a representative optical microscope image of an inductor formed using a discrete nanoparticle paste.
  • Figure 16 is a graphical representation of the permeability as a function of frequency for an inductor made using a paste having about 90 weight percent cobalt nanoparticles.
  • Magnetic nanocomposite pastes, methods of making and using the pastes, and devices comprising the magnetic nanocomposite pastes are described.
  • the pastes, methods, and devices disclosed herein make use of discrete nanoparticles and/or assemblies of nanoparticles to form the paste.
  • the use of a high temperature heat treatment to remove the organic component and to sinter (i.e., density) the paste after it has been deposited onto a substrate is not necessary, and therefore the paste is compatible with, or may be used in, a printed wiring board (PWB)/printed circuit board (PCB) process.
  • PWB printed wiring board
  • PCB printed circuit board
  • nanoparticle refers to a particle having a grain dimension of less than about 250 nanometers (nm).
  • paste refers to non-solid compositions having a range of viscosities, and includes thick, viscous compositions as well as free-flowing compositions.
  • the terms “first”, “second”, and the like do not denote any order or importance, but rather are used to distinguish one element from another, and the terms “the”, “a”, and “an” do not denote a limitation of quantity, but rather denote the presence of at least one of the referenced item. Furthermore, all ranges directed to the same quantity of a given component or measurement are inclusive of the endpoints and independently combinable.
  • the magnetic paste generally comprises a liquid organic component and a magnetic component comprising a plurality of discrete nanoparticles and/or nanoparticle- containing assemblies.
  • the liquid organic component may be an organic resin composition INF-OOl 5-PCT 6
  • liquid organic component that is compatible with (i.e., does not substantially adversely affect the manufacture or processing of the compositions and articles described herein) both the magnetic component and the substrate onto which the paste will be disposed.
  • the liquid organic component also has a viscosity that is sufficiently low to enable dispersal of the magnetic component, dispensing by the desired means, and flow (if desired) when disposed onto the substrate.
  • Suitable liquid organic component compositions may accordingly comprise thermoplastic resins, thermosetting resins, or combinations thereof. In general, thermosetting compositions are useful because they are flowable prior to cure and solid after cure.
  • Suitable resin compositions include thermoplastics such as polystyrenes, polyamides, polycarbonates, polyphenylene oxides, polysulfones, polyimides, and the like; and thermosets such as epoxies, polyurethanes, alkyds, diallyl phthalates, melamines, phenolics, polyesters, and silicones ethyl cellulose, benzocyclobutene (BCB), and the like. Combinations of different thermoplastic and/or thermosetting compositions may also be used.
  • the liquid organic component may further comprise catalysts, initiators, promoters, crosslinkers, stabilizers, surfactants, dispersants, viscosity modifiers, and other additives or combinations of additives.
  • the nanoparticles generally comprise a magnetic metal (e.g., Fe, Ni, Cu, Mo, Co, Mn, Cr, Zn, alloys comprising at least one of the foregoing metals, and the like).
  • a magnetic metal e.g., Fe, Ni, Cu, Mo, Co, Mn, Cr, Zn, alloys comprising at least one of the foregoing metals, and the like.
  • the nanoparticles may comprise the metal itself.
  • Oxides, nitrides, or other multinary magnetic metal containing combinations may be used, for example iron oxide based compositions (e.g., ferrite), nitride based compositions (e.g., Fe 3 N, Fe 4 N, Fei 6 N 2 , and the like), or combinations comprising at least one of the foregoing (e.g., Ni-ferrite, Co-ferrite, Zn-ferrite, Ni-Zn-ferrite, Mn-Zn-ferrite, YIG-ferrite, and the like).
  • the magnetic metal containing nanoparticles can individually be coated with an insulator, which may or may not have the same composition as the liquid organic component.
  • nanoparticles When discrete nanoparticles are used, they may be of any geometry. Desirably, they are spherical or substantially spherical to facilitate attaining high packing densities of the magnetic component within the paste. In an exemplary embodiment, the nanoparticle-nanoparticle separation within the paste is about 1 nm to about 100 nm.
  • assemblies of nanoparticles When assemblies of nanoparticles are used, the assemblies also may be of any geometry; however they too are desirably spherical or substantially spherical to facilitate INF-OO 15-PCT 7
  • the average longest dimension of the assemblies may be about 0.5 to about 150 micrometers ( ⁇ m).
  • the assembly is itself a solid composite comprising a plurality of separate magnetic nanoparticles dispersed in an insulating matrix.
  • An exemplary assembly 10 of this type is shown in Figure 1 and fully described in commonly assigned U.S. Patent No. 6,720,074, which is incorporated herein in its entirety.
  • the individual nanoparticles 12 are dispersed such that the particle-particle separation is about 1 to about 100 nm. While inter-grain interactions between the immediate neighboring individual metallic nanoparticles 12 provide the desired magnetic properties, the insulating matrix 14 material provides high resistivity, which significantly reduces any eddy current loss.
  • the particle size of these composite assemblies 10 is about 10 to about 50 micrometers ( ⁇ m). Specifically, an average particle size for the composite assembles is about 30 ⁇ m.
  • Suitable insulating matrix 14 materials for the composite assembly 10 include high dielectric materials (i.e., dielectric constant greater than or equal to about 3) including amorphous or crystalline ceramics such as alumina, silica, zirconia, and the like, and high dielectric polymers and polymer composites.
  • the insulating matrix material can be either a nonmagnetic or magnetic (such as a highly resistive ferrite) material. It is important to note that the insulating matrix material of this type of assembly 10 may have the same composition as the liquid organic component of the paste, except that it will already have been polymerized into a solid prior to disposal of the composite assembly 10 into the liquid organic component to form the paste. Examples of these composite assemblies 10 include Co/SiC- 2 , Fe-Ni/SiO 2 , Fe/SiO 2 , Co/polymer, and Fe/NiFe 2 O 4 .
  • At least a portion of the magnetic nanoparticles are coated with an insulating composition (not shown) prior to being dispersed into the insulating matrix 14.
  • the composition of the insulating coat may be different from the composition of the insulating matrix 14.
  • a method to manufacture the composite assembly 10 comprises fabricating a precomposite from a precursor composition; forming magnetic nanostructured particles INF-OO 15-PCT 8
  • the assembly is a microscale particle comprising a plurality of agglomerated nanoparticles.
  • a plurality of nanoparticles can be sintered to form a microscale particle.
  • An exemplary microscale particle assembly 15 is shown in Figure 2.
  • the nanoparticles 12 used to form the microscale particle assembly 15 can be highly resistive magnetic materials or highly conductive magnetic materials.
  • the nanoparticles 12 can be of the same or different compositions.
  • the particle size of the microscale particle assembly 15 is about 0.5 to about 150 micrometers ( ⁇ m).
  • the microscale particle assemblies 15 are formed by mixing magnetic nanoparticles and/or nanocomposites with a polymeric binder in solution, ball milling the solution mixture to form a uniform slurry, agglomerating the nanoparticles from the slurry to form microscale particles, and plasma densifying the microscale particles.
  • the process may further comprise separating the microscale particles by their size prior to the plasma densification. Malting the paste comprises mixing the densified microscale particles with the liquid organic component.
  • Suitable organic binders for mixing the starting materials include commercially available polyvinyl alcohol (PVA), polyvinylpyrrolidone (PVP), carboxymethyl cellulose (CMC), or other water soluble polymeric binders.
  • PVA polyvinyl alcohol
  • PVP polyvinylpyrrolidone
  • CMC carboxymethyl cellulose
  • the binder comprises about 0.5 to about 10 weight percent (wt %) of the total solution. More specifically, the binder comprises about 1 to about 5 wt % of the total solution.
  • the balance of the solution is desirably deionized distilled water (DD water).
  • the mixture is then ball milled, for example in a high- energy attrition mill, to "de-agglomerate" the particles and form a uniform slurry.
  • the parameters that may be optimized during ball milling include the ball milling energy, time, and loading ratio of balls to powder to lubricant. These parameters may be readily determined by those skilled in the art in view of this disclosure without undue experimentation. INF-OOl 5-PCT 9
  • a surfactant may also be added to the solution during ball milling to homogenize the dispersed nanoparticles in the slurry.
  • the parameters to consider for optimization with respect to the surfactant include the solid ratio, solvent loading, and rheology of the slurry. Similarly, these parameters may be readily determined by those skilled in the art in view of this disclosure without undue experimentation.
  • the next step is the agglomeration or reconstitution of the individual nanoparticles into microscale particles wherein each microscale particle is an assembly of individual nanoparticles that are adhered by the organic binder.
  • This may be accomplished using a spray drying process.
  • the parameters to consider for optimization of the agglomeration process include slurry concentration, slurry delivery rate, drying temperature, and atomizing speed. These parameters also may be readily determined by those skilled in the art in view of this disclosure without undue experimentation.
  • agglomerated powders of different may be isolated by size range. In one embodiment, this is accomplished by using chamber and cyclone collectors.
  • the chamber collects particles larger than about 15 micrometers through gravitational fall out.
  • the cyclone collects fine particles (e.g., smaller than about 15 micrometers), which are carried by the hot gas that dries the slurry.
  • the reconstituted microscale powder is then densified by a flash sintering process.
  • the flash sintering process burns-off the organic binder, sinters and/or melts the microscale particles to form dense bodies, and quenches the sintered and/or molten droplets for powder collection, all very rapidly.
  • the densification should permit a rapid sintering followed by rapid quenching so as not to allow any particle growth.
  • the flash sintering process can be accomplished using any localized high energy heating source, such as a plasma torch (air plasma, microwave plasma, inductive plasma), or high velocity oxygen fuel (HVOF) torch.
  • a plasma torch air plasma, microwave plasma, inductive plasma
  • HVOF high velocity oxygen fuel
  • the agglomerated particles larger than about 1 ⁇ m collected by the cyclone or chamber collectors may be directly fed into an industrial plasma or HVOF feeder. However, particles smaller than about 1 ⁇ m require an INF-OO 15-PCT 10
  • agglomerated particles of about 0.5 to about 1 ⁇ m are dispersed into DD water to form another slurry, which may then be fed into a plasma or HVOF torch directly via a liquid feeder.
  • water molecules rapidly evaporate and further heating of the solid results in the rapid sintering and/or melting of the particles into spherical droplets that are subjected to rapid quenching.
  • the particle size of the microscale particles are about 0.5 to about 150 ⁇ m.
  • the microscale particle assemblies 15 are formed by fabricating a precursor composition, forming a spherical hydroxide from the precursor composition, converting the spherical hydroxide into a magnetic nanoparticle, and sintering a plurality of nanoparticles into densely packed microscale particles.
  • Making the paste subsequently comprises mixing the densified microscale particles with the liquid organic component. This process is described in commonly assigned U.S. Patent No. 6,162,530, which is incorporated herein in its entirety.
  • fabricating the precursor composition comprises dissolving desired stoichiometric ratios of starting materials (e.g., metal salts) in DD water.
  • Forming the spherical hydroxide comprises atomizing the precursor composition and a solution of a dilute hydroxide (e.g., NH 4 OH). Adding a controlled amount of solid seed material will result in the formation of nucleation centers for spherical particle growth at elevated temperatures. This is followed by the sintering step to form the desired final microscale product. These densely packed hydroxide microscale particles are then washed and filtered to obtain dry powders.
  • starting materials e.g., metal salts
  • particles of either metallic, metal/insulator nanocomposite, or ferrite can be formed.
  • the parameters to consider for optimization are heating rate, dwell time, and cooling time. These parameters may be readily determined by those skilled in the art in view of this disclosure without undue experimentation.
  • the paste may formed.
  • formation of the paste comprises dispersal of the magnetic component (i.e., the plurality of discrete nanoparticles and/or the plurality of nanoparticle assemblies) into the liquid organic component followed by mixing for a sufficient period of time to form a uniform composite.
  • the magnetic component i.e., the plurality of discrete nanoparticles and/or the plurality of nanoparticle assemblies
  • Isolated individual nanoparticles possess undesirable magnetic properties, owing to the high magnetic anisotropy of the individual particles.
  • reducing the separation between neighboring nanoparticles down to the nanoscale leads to novel magnetic coupling phenomena resulting in higher permeability and lower magnetic anisotropy.
  • this enhancement in permeability is due to the inter-particle exchange coupling effect.
  • the exchange interaction which leads to magnetic ordering within a grain or assembly, extends out to neighboring environments (through either a spin polarization or super-exchange interaction mechanism) within a characteristic distance.
  • the exchange interaction in the assembly also leads to a cancellation of magnetic anisotropy of the individual particles and a demagnetizing effect, leading to significantly superior magnetic properties.
  • the pastes disclosed herein comprise greater than or equal to 40 volume percent (vol %) of the magnetic component. Specifically, the pastes comprise about 40 to about 92 vol % magnetic component and about 8 to about 60 vol % liquid organic component. Furthermore, the each assembly of the magnetic component may have a packing density greater than or equal to about 90% of the theoretical density.
  • the magnetic component is multi-modal (i.e., the magnetic component can comprise two or more different sized groups of agglomerates or discrete nanoparticles).
  • An exemplary magnetic paste 20 with a multi-modal magnetic component 22 in the liquid organic component 24 is shown in Figure 3.
  • the magnetic component comprises microscale assemblies of three different sizes 26, 28, and 30. The arrangement of these three particle size groups will be in such a way that the first group 26 comprising the largest particles will form the main body of the magnetic component.
  • the second group 28 will fill the voids or interstices that are left vacant by the close packing of the particles of the first group 26.
  • the third group 30 will fill the voids or interstices INF-OOl 5-PCT 12
  • the ratio of the size of the particles of the third group 30 to the size of the particles of the second group 28 is about 0.1 :1 to about 0.8:1.
  • the ratio of the size of the particles of the second group 28 to the size of the particles of the first group 26 is about 0.1:1 to about 0.8:1.
  • the paste can readily be deposited onto a substrate using known deposition or lithography techniques.
  • the paste is screen printed onto the substrate.
  • the paste is inkjetted onto the substrate as tiny droplets.
  • the liquid organic component of the paste may be cured, for example crosslinked, to form a magnetic device.
  • the cure can be accomplished using methods suitable for the chosen resin, for example, in the presence of a catalyst, heat or radiation, for example infrared, ultraviolet or e-beam radiation. Combinations of cure mechanisms may also be used. If heat is used, it is particularly desirable for the temperature not to exceed a temperature at which the substrate is substantially adversely affected (e.g., melts, decomposes, pyrolyzes, and the like).
  • the pastes may be employed in numerous applications that require a magnetic device.
  • the pastes may be deposited on PWBs/PCBs, silicon wafers, ceramic substrate materials, or the like. Suitable applications include antennae, power converters or switching power supplies (e.g., DC-DC converters), inductors, magnetic filters or noise filters, radiofrequency (RF) components (e.g., radiofrequency identification tags or transponders), microwave and millimeter wave circulators, broadband devices, electronic sensors, cellular phones, cable televisions (CATV), radar devices, sensors, telemetry devices, implantable medical devices, and the like.
  • the cured or hardened pastes can replace the bulky donut- shaped and/or E-shaped inductors used in existing high-frequency applications.
  • the devices formed from the magnetic pastes disclosed herein have permeabilities greater than or equal to about 3, and even greater than or equal to 10, at INF-OO 15-PCT 13
  • the devices formed from the magnetic pastes also have permitivities greater than or equal to about 3, and even greater than or equal to 10, and/or inductances greater than or equal to about 0.4 microHenry ( ⁇ -Henry), and even greater than or equal to about 1 ⁇ -Henry, at frequencies greater than or equal to about 1 megaHertz.
  • the devices formed from the magnetic pastes also have inductances that are at least two times, and even up to at least five times, higher than a device without the magnetic component such as a bare inductor (e.g., bare copper coil).
  • the formed slurry was then spray dried to form agglomerated substantially spherical particles.
  • Spray drying parameters included a feeding rate of 600g/min, an inlet temperature of 475 degrees Fahrenheit ( 0 F), and outlet temperature of 125 degrees Celsius ( 0 C). Powders were collected using chamber and cyclone ports. The total powder collected at the chamber was about 6.5 lbs with about 2.5 lbs collected at the cyclone.
  • these powders were fed into a plasma torch (Metco 9MB thermal spray device) for sintering into the densified assemblies.
  • the plasma spray process parameters included using Argon as the primary plasma working gas flowing at about 80-120 standard cubic feet per hour (SCFH), a plasma power of 25-45KW and a powder feeding rate of about 2-5 Ibs/hr).
  • SCFH standard cubic feet per hour
  • a plasma power of 25-45KW and a powder feeding rate of about 2-5 Ibs/hr
  • powders were fed into a plasma torch via a powder injection port, subsequently heated to remove any organic binders, followed by rapid melting/sintering/quenching of these liquid droplets from over 2000 0 C to room temperature in a few milliseconds.
  • the resulting assemblies formed from spray dried powders collected INF-OO 15-PCT 14
  • pastes having higher ferrite loadings were associated with higher tapping densities of the powders and also resulted in higher inductance values for fabricated films as will be further illustrated below.
  • Cat 105 is used to initiate the hardening of the epoxy resin (ETC 30-3019R CLR) under thermal heating during film fabrication, by mixing approximately 16 parts by weight of paste formed in Cat 105 with 100 parts by weight of the paste formed with ETC 30-3019R CLR. INF-OO 15-PCT 16
  • FIG. 4 is a high resolution transmission electron microscope (TEM) image of the original nickel-zinc ferrite before agglomeration. As indicated in the micrograph, the average grain size is less than about 10 nm. For illustrative purposes, the arrow points to a grain boundary of two adjacent grains.
  • Spray drying a slurry of the (Nio.sZno. 5 )Fe 2 0 4 produced substantially spherical agglomerates, as illustrated in the scanning electron microscope (SEM) image shown in Figure 5. Agglomerates, each formed of a plurality of individual (Nio.
  • the quality and/or the magnetic performance of the paste could be tailored by varying the loading of the magnetic particles. For example, tapping densities of about 2 g/cc to about 4 g/cc were observed by using different mixtures of agglomerates.
  • Figure 7 highlights the variance in tapping density for so-called "bimodal" pastes made from different ratios of 35 micrometer and 2 micrometer sized agglomerates. As seen in the graph, the highest tapping densities were obtained for samples having about 40 wt% to about 60 wt%, and more specifically about 50 wt%, of the 35 ⁇ m agglomerates.
  • FIG. 8 illustrates the observed change in tapping density for unimodal, bimodal, and trimodal pastes. As indicated in the graph, a tapping density of about 4g/cc, which represents about 80% of the theoretical density, was achieved for the trimodal paste.
  • FIG. 9 is a representative optical microscope image of an inductor, and illustrates the positional relationship between the substrate, thick film of (Ni 0 , 5 Zn 0 . 5 )Fe 2 O 4 , and the copper coil.
  • the bonding between the film and the patterned structure was excellent, and no delamination of the film from the substrate was observed.
  • each inductor was measured from about 10 kHz to about 13 MHz.
  • Figure 10 illustrates the permeabilities of four samples made from pastes having from about 87 wt% to about 90 wt% ferrite. A permeability of about 19 was obtained. It should be emphasized that for each sample, the eddy current losses were quite small, and the Q factor was greater than about 70 throughout the entire frequency range.
  • the inductance of each sample was also measured.
  • the uncoated (i.e., before screen printing and hardening of the (Ni 0 . 5 Zn 0 . 5 )Fe 2 O 4 magnetic paste) patterned copper coil had an inductance of 0.183 ⁇ -Henry for a 5 mm diameter, 100 micrometer thick coil at the measured frequency. After an approximately 1 mm thick magnetic paste was screened and hardened onto the copper coil, the inductance increased to greater than 1 ⁇ -Henry.
  • Figure 11 illustrates the inductance as a function of frequency for about 0.9 mm thick (Ni 0 . 5 Zno. 5 )Fe 2 0 4 film deposited on the coil. As illustrated in the graph, a fourfold increase, from about 200 nanoHenry to about 800-1000 nanoHenry, was observed upon deposition of the ferrite coating.
  • Figure 12 illustrates the inductance as a function of film thickness for a given coil. As seen in the graph, the inductance increases dramatically with INF-OO 15-PCT 18
  • Figure 13 illustrates the inductance as a function of overall inductor diameter for both 1 mm and 1.5 mm thick films.
  • the required inductance is about 1 microHenry at 5 MHz.
  • a film thickness of about 1 mm using the pastes disclosed herein would be sufficient to achieve the desired inductance.
  • Cobalt carbonyl was reduced to a Co nanoparticle dispersion at 110°C in toluene.
  • the average particle size of the cobalt nanoparticles were about 1 Onni.
  • Addition of benzocyclobutene (BCB) into the Co/toluene mixture resulted in the BCB coating the Co particles.
  • a thick paste was then obtained after evaporation of the toluene under an argon atmosphere.
  • Figure 14 is a TEM image of the paste after curing of the BCB at 25O 0 C for 1 hour using a heating rate of 1 °C/min under nitrogen.
  • FIG. 15 is a representative optical microscope image of an inductor, and illustrates the positional relationship between the substrate, thick film of Co, and the copper coil. Among the inductors that were fabricated, the bonding between the film and the patterned structure was excellent, and no delamination of the film from the substrate was observed.
  • the permeability of the inductors were measured from about 1 MHz to about 600 MHz.
  • the inductors exhibited increased permeability of as a function of cobalt loading. With up to 90% cobalt loading, a permeability of about 6 was observed at about 600 MHz, as shown in Figure 16.
  • the top line in the graph represents ⁇ ', or the real component of the complex permeability, and is indicative of the softness of the magnetization process in an alternating magnetic field.
  • the bottom line in the graph represents ⁇ ", or the imaginary component of the complex permeability, and is indicative of the loss of the energy in the magnetization process. It should be emphasized that for each sample, the eddy current losses INF-OOl 5-PCT 19

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Molecular Biology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biomedical Technology (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Dispersion Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Soft Magnetic Materials (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

Disclosed herein is a magnetic paste that generally includes a magnetic component and a liquid organic component. The magnetic component includes a plurality of discrete nanoparticles, a plurality of nanoparticle-containing assemblies, or both. Magnetic devices can be formed from the magnetic paste. Methods of making and using the magnetic paste are also described.

Description

MAGNETIC COMPOSITES AND METHODS OF MAKING AND USING
STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH
The United States Government has certain rights in this invention pursuant to National Science Foundation Grant Number DMI-0512262.
BACKGROUND
[0001] The present disclosure generally relates to magnetic composites and more specifically to magnetic pastes for use in high frequency applications.
[0002] The integration of magnetic components into electronic circuits has become a significant barrier to reducing the size of electronic devices. Current micrometer sized magnetic materials can only be used at low frequencies. For example, high permeability bulk ferrites can only be used at frequencies less than 1 megahertz (MHz) and bulk Ni-ferrites, which may be used up to about 100 MHz, have non-optimal initial permeabilities. Accordingly, existing commercial converters are designed to operate at frequencies less than about 2 MHz.
[0003] One method for integrating higher frequency magnetic devices into a circuit is through thick film screen-printing. Thick film screen-printing allows for the deposition of a magnetic material in paste form onto a ceramic substrate. The paste material generally consists of ceramic or metallic particles suspended in a polymer paste. Unfortunately, the permeabilities of these pastes are very low (e.g., less than about 3), resulting in large eddy current losses.
[0004] After printing, the paste undergoes a heat treatment that ultimately burns off the polymer and densifies, or sinters, the ceramic or metallic material. The result is a dense pattern formed from the ceramic or metallic material. Using this technique, for example, a conducting coil can be printed onto a layer of ferrite, and then covered with another layer of ferrite to form an inductive coil. Successive layers can be printed to increase the inductance of the device. The heat treatments, result in increased permeabilities, but are accompanied by increased eddy current losses at higher frequencies. Furthermore, the high temperature INF-OOl 5-PCT 2
(about 700 to about 900 degrees Celsius) of the heat treatment makes these pastes incompatible with low temperature printed wiring board (PWB) or printed circuit board (PCB) processing procedures.
[0005] Accordingly, there remains a need in the art for new and improved magnetic pastes that have a desirable combination of properties, such as inductance, permeability, and/or permittivity at the desired frequency, and that may be used in devices that are processed at low temperatures.
BRIEF SUMMARY
[0006] A magnetic paste includes a magnetic component and a liquid organic component, wherein the magnetic component comprises a plurality of discrete nanoparticles, a plurality of nanoparticle-containing assemblies, wherein each assembly of the plurality of nanoparticle-containing assemblies has an average longest dimension of about 0.5 to about 150 micrometers, or both.
[0007] A magnetic device includes a magnetic component and a solid organic component, wherein the magnetic component comprises a plurality of discrete nanoparticles, a plurality of nanoparticle-containing assemblies, wherein each assembly of the plurality of nanoparticle-containing assemblies has an average longest dimension of about 0.5 to about 150 micrometers, or both.
[0008] A power converter includes a substrate, wherein the substrate comprises a printed circuit board, silicon wafer, or a ceramic material; and a film disposed on the substrate of the power converter, wherein the film comprises a magnetic component and a solid organic component, wherein the magnetic component comprises a plurality of discrete nanoparticles, a plurality of nanoparticle-containing assemblies, wherein each assembly of the plurality of nanoparticle-containing assemblies has an average longest dimension of about 0.5 to about 150 micrometers, or both.
[0009] A transformer includes a substrate, wherein the substrate comprises a printed circuit board, silicon wafer, or a ceramic material; and a film disposed on the substrate of the transformer, wherein the film comprises a magnetic component and a solid organic INF-OO 15-PCT 3
component, wherein the magnetic component comprises a plurality of discrete nanoparticles, a plurality of nanoparticle-containing assemblies, wherein each assembly of the plurality of nanoparticle-containing assemblies has an average longest dimension of about 0.5 to about 150 micrometers, or both.
[0010] An inductor includes a substrate, wherein the substrate comprises a printed circuit board, silicon wafer, or a ceramic material; and a film disposed on the substrate of the inductor, wherein the film comprises a magnetic component and a solid organic component, wherein the magnetic component comprises a plurality of discrete nanoparticles, a plurality of nanoparticle-containing assemblies, wherein each assembly of the plurality of nanoparticle-containing assemblies has an average longest dimension of about 0.5 to about 150 micrometers, or both.
[001 I] A method for making a magnetic paste includes combining a magnetic component and a liquid organic component, wherein the magnetic component comprises a plurality of discrete nanoparticles, a plurality of nanoparticle-containing assemblies, wherein each assembly of the plurality of nanoparticle-containing assemblies has an average longest dimension of about 0.5 to about 150 micrometers, or both.
[0012] A method for making a magnetic device includes combining a magnetic component and a liquid organic component to form a paste, wherein the magnetic component comprises a plurality of discrete nanoparticles, a plurality of nanoparticle-containing assemblies, wherein each assembly of the plurality of nanoparticle-containing assemblies has an average longest dimension of about 0.5 to about 150 micrometers, or both; disposing the paste onto a substrate; and solidifying the paste.
[0013] The above described and other features are exemplified by the following figures and detailed description.
BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Referring now to the figures, which are exemplary embodiments and wherein like elements are numbered alike: INF-OO 15-PCT 4
[0015] Figure 1 is a schematic representation of a composite assembly;
[0016] Figure 2 is a schematic representation of a microscale particle assembly;
[0017] Figure 3 is a schematic representation of a magnetic paste with a multi-modal magnetic component;
[0018] Figure 4 is a high resolution transmission electron microscope (TEM) image of a plurality of (Ni0.5Zn0. S)Fe2O4 grains prior to agglomeration;
[0019] Figure 5 is a scanning electron microscope (SEM) image showing a plurality substantially spherical, spray dried (Nio.5Zn0,5)Fe204 agglomerates;
[0020] Figure 6 depicts a representative cross-sectional image of a multi-modal paste after hardening;
[0021] Figure 7 is a graphical representation of the tapping density of pastes having different ratios of 10 and 35 micrometer (Nio,5Zn0.5)Fe204 agglomerates;
[0022] Figure 8 is a graphical representation of the tapping density of pastes having one, two, and three groups of agglomerates;
[0023] Figure 9 is a representative optical microscope image of an inductor formed using a multimodal paste;
[0024] Figure 10 is a graphical representation of the permeability as a function of frequency for four samples having different (Nio,5Zn0.5)Fe204 loading levels;
[0025] Figure 11 is a graphical representation of the inductance as a function of frequency for a bare copper coil and for an inductor;
[0026] Figure 12 is a graphical representation of the inductance as a function of film thickness for (Nio.5Zn0,5)Fe204 coated copper coils;
[0027] Figure 13 is a graphical representation of the inductance as a function of diameter for 1 millimeter and 1.5 millimeter thick (Ni0,5Zno.5)Fe204 films deposited on copper coils; INF-OO 15-PCT 5
[0028] Figure 14 is a TEM image of discrete 10 nanometer cobalt particles (dark field) dispersed in benzocyclobutane (bright field);
[0029] Figure 15 is a representative optical microscope image of an inductor formed using a discrete nanoparticle paste; and
[0030] Figure 16 is a graphical representation of the permeability as a function of frequency for an inductor made using a paste having about 90 weight percent cobalt nanoparticles.
DETAILED DESCRIPTION
[0031] Magnetic nanocomposite pastes, methods of making and using the pastes, and devices comprising the magnetic nanocomposite pastes are described. In contrast to the prior art, the pastes, methods, and devices disclosed herein make use of discrete nanoparticles and/or assemblies of nanoparticles to form the paste. Advantageously, the use of a high temperature heat treatment to remove the organic component and to sinter (i.e., density) the paste after it has been deposited onto a substrate is not necessary, and therefore the paste is compatible with, or may be used in, a printed wiring board (PWB)/printed circuit board (PCB) process. The term "nanoparticle", as used herein, refers to a particle having a grain dimension of less than about 250 nanometers (nm). The term "paste" as used herein, refers to non-solid compositions having a range of viscosities, and includes thick, viscous compositions as well as free-flowing compositions.
[0032] Also, as used herein, the terms "first", "second", and the like do not denote any order or importance, but rather are used to distinguish one element from another, and the terms "the", "a", and "an" do not denote a limitation of quantity, but rather denote the presence of at least one of the referenced item. Furthermore, all ranges directed to the same quantity of a given component or measurement are inclusive of the endpoints and independently combinable.
[0033] The magnetic paste generally comprises a liquid organic component and a magnetic component comprising a plurality of discrete nanoparticles and/or nanoparticle- containing assemblies. The liquid organic component may be an organic resin composition INF-OOl 5-PCT 6
that is compatible with (i.e., does not substantially adversely affect the manufacture or processing of the compositions and articles described herein) both the magnetic component and the substrate onto which the paste will be disposed. The liquid organic component also has a viscosity that is sufficiently low to enable dispersal of the magnetic component, dispensing by the desired means, and flow (if desired) when disposed onto the substrate. Suitable liquid organic component compositions may accordingly comprise thermoplastic resins, thermosetting resins, or combinations thereof. In general, thermosetting compositions are useful because they are flowable prior to cure and solid after cure. Suitable resin compositions include thermoplastics such as polystyrenes, polyamides, polycarbonates, polyphenylene oxides, polysulfones, polyimides, and the like; and thermosets such as epoxies, polyurethanes, alkyds, diallyl phthalates, melamines, phenolics, polyesters, and silicones ethyl cellulose, benzocyclobutene (BCB), and the like. Combinations of different thermoplastic and/or thermosetting compositions may also be used. The liquid organic component may further comprise catalysts, initiators, promoters, crosslinkers, stabilizers, surfactants, dispersants, viscosity modifiers, and other additives or combinations of additives.
[0034] The nanoparticles generally comprise a magnetic metal (e.g., Fe, Ni, Cu, Mo, Co, Mn, Cr, Zn, alloys comprising at least one of the foregoing metals, and the like). For example, the nanoparticles may comprise the metal itself. Oxides, nitrides, or other multinary magnetic metal containing combinations may be used, for example iron oxide based compositions (e.g., ferrite), nitride based compositions (e.g., Fe3N, Fe4N, Fei6N2, and the like), or combinations comprising at least one of the foregoing (e.g., Ni-ferrite, Co-ferrite, Zn-ferrite, Ni-Zn-ferrite, Mn-Zn-ferrite, YIG-ferrite, and the like). Alternatively, the magnetic metal containing nanoparticles can individually be coated with an insulator, which may or may not have the same composition as the liquid organic component.
[0035] When discrete nanoparticles are used, they may be of any geometry. Desirably, they are spherical or substantially spherical to facilitate attaining high packing densities of the magnetic component within the paste. In an exemplary embodiment, the nanoparticle-nanoparticle separation within the paste is about 1 nm to about 100 nm.
[0036] When assemblies of nanoparticles are used, the assemblies also may be of any geometry; however they too are desirably spherical or substantially spherical to facilitate INF-OO 15-PCT 7
attaining high packing densities of the magnetic component within the paste. The average longest dimension of the assemblies may be about 0.5 to about 150 micrometers (μm).
[0037] In one embodiment, the assembly is itself a solid composite comprising a plurality of separate magnetic nanoparticles dispersed in an insulating matrix. An exemplary assembly 10 of this type is shown in Figure 1 and fully described in commonly assigned U.S. Patent No. 6,720,074, which is incorporated herein in its entirety. The individual nanoparticles 12 are dispersed such that the particle-particle separation is about 1 to about 100 nm. While inter-grain interactions between the immediate neighboring individual metallic nanoparticles 12 provide the desired magnetic properties, the insulating matrix 14 material provides high resistivity, which significantly reduces any eddy current loss. The particle size of these composite assemblies 10 is about 10 to about 50 micrometers (μm). Specifically, an average particle size for the composite assembles is about 30 μm.
[0038] Suitable insulating matrix 14 materials for the composite assembly 10 include high dielectric materials (i.e., dielectric constant greater than or equal to about 3) including amorphous or crystalline ceramics such as alumina, silica, zirconia, and the like, and high dielectric polymers and polymer composites. The insulating matrix material can be either a nonmagnetic or magnetic (such as a highly resistive ferrite) material. It is important to note that the insulating matrix material of this type of assembly 10 may have the same composition as the liquid organic component of the paste, except that it will already have been polymerized into a solid prior to disposal of the composite assembly 10 into the liquid organic component to form the paste. Examples of these composite assemblies 10 include Co/SiC-2, Fe-Ni/SiO2, Fe/SiO2, Co/polymer, and Fe/NiFe2O4.
[0039] In one embodiment, at least a portion of the magnetic nanoparticles are coated with an insulating composition (not shown) prior to being dispersed into the insulating matrix 14. The composition of the insulating coat may be different from the composition of the insulating matrix 14.
[0040] A method to manufacture the composite assembly 10 comprises fabricating a precomposite from a precursor composition; forming magnetic nanostructured particles INF-OO 15-PCT 8
surrounded by, or coated with, a matrix layer from the precomposite; and passivating the surface of the surrounded nanostructured particles.
[0041] In another embodiment, the assembly is a microscale particle comprising a plurality of agglomerated nanoparticles. For example, a plurality of nanoparticles can be sintered to form a microscale particle. An exemplary microscale particle assembly 15 is shown in Figure 2. The nanoparticles 12 used to form the microscale particle assembly 15 can be highly resistive magnetic materials or highly conductive magnetic materials. In addition, the nanoparticles 12 can be of the same or different compositions. The particle size of the microscale particle assembly 15 is about 0.5 to about 150 micrometers (μm).
[0042] In one embodiment, the microscale particle assemblies 15 (e.g., microscale particles comprising a plurality of sintered nanoparticles) are formed by mixing magnetic nanoparticles and/or nanocomposites with a polymeric binder in solution, ball milling the solution mixture to form a uniform slurry, agglomerating the nanoparticles from the slurry to form microscale particles, and plasma densifying the microscale particles. The process may further comprise separating the microscale particles by their size prior to the plasma densification. Malting the paste comprises mixing the densified microscale particles with the liquid organic component.
[0043] Suitable organic binders for mixing the starting materials (i.e., the nanoparticles and/or nanocomposites) include commercially available polyvinyl alcohol (PVA), polyvinylpyrrolidone (PVP), carboxymethyl cellulose (CMC), or other water soluble polymeric binders. The binder comprises about 0.5 to about 10 weight percent (wt %) of the total solution. More specifically, the binder comprises about 1 to about 5 wt % of the total solution. The balance of the solution is desirably deionized distilled water (DD water).
[0044] After sufficient mixing, the mixture is then ball milled, for example in a high- energy attrition mill, to "de-agglomerate" the particles and form a uniform slurry. The parameters that may be optimized during ball milling include the ball milling energy, time, and loading ratio of balls to powder to lubricant. These parameters may be readily determined by those skilled in the art in view of this disclosure without undue experimentation. INF-OOl 5-PCT 9
[0045] Depending on the desired characteristics of the final agglomerated or reconstituted microscale particles, a surfactant may also be added to the solution during ball milling to homogenize the dispersed nanoparticles in the slurry. The parameters to consider for optimization with respect to the surfactant include the solid ratio, solvent loading, and rheology of the slurry. Similarly, these parameters may be readily determined by those skilled in the art in view of this disclosure without undue experimentation.
[0046] Once a suitable slurry has been formed, the next step is the agglomeration or reconstitution of the individual nanoparticles into microscale particles wherein each microscale particle is an assembly of individual nanoparticles that are adhered by the organic binder. This may be accomplished using a spray drying process. The parameters to consider for optimization of the agglomeration process include slurry concentration, slurry delivery rate, drying temperature, and atomizing speed. These parameters also may be readily determined by those skilled in the art in view of this disclosure without undue experimentation.
[0047] During the spray drying process, agglomerated powders of different may be isolated by size range. In one embodiment, this is accomplished by using chamber and cyclone collectors. The chamber collects particles larger than about 15 micrometers through gravitational fall out. The cyclone collects fine particles (e.g., smaller than about 15 micrometers), which are carried by the hot gas that dries the slurry.
[0048] The reconstituted microscale powder is then densified by a flash sintering process. The flash sintering process burns-off the organic binder, sinters and/or melts the microscale particles to form dense bodies, and quenches the sintered and/or molten droplets for powder collection, all very rapidly. The densification should permit a rapid sintering followed by rapid quenching so as not to allow any particle growth.
[0049] The flash sintering process can be accomplished using any localized high energy heating source, such as a plasma torch (air plasma, microwave plasma, inductive plasma), or high velocity oxygen fuel (HVOF) torch. The agglomerated particles larger than about 1 μm collected by the cyclone or chamber collectors may be directly fed into an industrial plasma or HVOF feeder. However, particles smaller than about 1 μm require an INF-OO 15-PCT 10
additional feeding technique. In one embodiment, agglomerated particles of about 0.5 to about 1 μm are dispersed into DD water to form another slurry, which may then be fed into a plasma or HVOF torch directly via a liquid feeder. In this manner, water molecules rapidly evaporate and further heating of the solid results in the rapid sintering and/or melting of the particles into spherical droplets that are subjected to rapid quenching. As previously discussed, the particle size of the microscale particles are about 0.5 to about 150 μm.
[0050] In another embodiment, the microscale particle assemblies 15 are formed by fabricating a precursor composition, forming a spherical hydroxide from the precursor composition, converting the spherical hydroxide into a magnetic nanoparticle, and sintering a plurality of nanoparticles into densely packed microscale particles. Making the paste subsequently comprises mixing the densified microscale particles with the liquid organic component. This process is described in commonly assigned U.S. Patent No. 6,162,530, which is incorporated herein in its entirety.
[0051] Fabricating the precursor composition comprises dissolving desired stoichiometric ratios of starting materials (e.g., metal salts) in DD water. Forming the spherical hydroxide comprises atomizing the precursor composition and a solution of a dilute hydroxide (e.g., NH4OH). Adding a controlled amount of solid seed material will result in the formation of nucleation centers for spherical particle growth at elevated temperatures. This is followed by the sintering step to form the desired final microscale product. These densely packed hydroxide microscale particles are then washed and filtered to obtain dry powders. Depending on the gaseous environment used in the heat treatment, particles of either metallic, metal/insulator nanocomposite, or ferrite can be formed. The parameters to consider for optimization are heating rate, dwell time, and cooling time. These parameters may be readily determined by those skilled in the art in view of this disclosure without undue experimentation.
[0052] Once the discrete nanoparticles and/or assemblies of nanoparticles have been formed the paste may formed. In one embodiment, formation of the paste comprises dispersal of the magnetic component (i.e., the plurality of discrete nanoparticles and/or the plurality of nanoparticle assemblies) into the liquid organic component followed by mixing for a sufficient period of time to form a uniform composite. INF-OO 15-PCT 11
[0053] Isolated individual nanoparticles possess undesirable magnetic properties, owing to the high magnetic anisotropy of the individual particles. However, reducing the separation between neighboring nanoparticles down to the nanoscale leads to novel magnetic coupling phenomena resulting in higher permeability and lower magnetic anisotropy. Without being bound by theory, this enhancement in permeability is due to the inter-particle exchange coupling effect. The exchange interaction, which leads to magnetic ordering within a grain or assembly, extends out to neighboring environments (through either a spin polarization or super-exchange interaction mechanism) within a characteristic distance. The exchange interaction in the assembly also leads to a cancellation of magnetic anisotropy of the individual particles and a demagnetizing effect, leading to significantly superior magnetic properties. By choosing a system with high tunneling excitation energy, a huge increase in the resistivity can be achieved through the technique wherein formation of the assemblies of nanoparticles prior to their addition into a liquid organic component to form the paste occurs. Because of the nanoscale particles, the eddy currents produced within the assembly are also negligibly small, leading to much lower eddy current loss for closely packed discrete nanoparticles and/or assemblies of nanoparticles compared to that of existing microscale materials.
[0054] The pastes disclosed herein comprise greater than or equal to 40 volume percent (vol %) of the magnetic component. Specifically, the pastes comprise about 40 to about 92 vol % magnetic component and about 8 to about 60 vol % liquid organic component. Furthermore, the each assembly of the magnetic component may have a packing density greater than or equal to about 90% of the theoretical density.
[0055] In one embodiment, the magnetic component is multi-modal (i.e., the magnetic component can comprise two or more different sized groups of agglomerates or discrete nanoparticles). An exemplary magnetic paste 20 with a multi-modal magnetic component 22 in the liquid organic component 24 is shown in Figure 3. The magnetic component comprises microscale assemblies of three different sizes 26, 28, and 30. The arrangement of these three particle size groups will be in such a way that the first group 26 comprising the largest particles will form the main body of the magnetic component. The second group 28 will fill the voids or interstices that are left vacant by the close packing of the particles of the first group 26. Finally, the third group 30 will fill the voids or interstices INF-OOl 5-PCT 12
that are left vacant by the close packing of the particles of the first group 26 and the second group 28. The ratio of the size of the particles of the third group 30 to the size of the particles of the second group 28 is about 0.1 :1 to about 0.8:1. Similarly, the ratio of the size of the particles of the second group 28 to the size of the particles of the first group 26 is about 0.1:1 to about 0.8:1. In this manner, a considerably greater volume percent and/or packing density of the magnetic component may be achieved than for pastes comprising uniformly sized assemblies 10.
[0056] Once the paste is formed, it can readily be deposited onto a substrate using known deposition or lithography techniques. For example, in one embodiment, the paste is screen printed onto the substrate. In another embodiment, the paste is inkjetted onto the substrate as tiny droplets.
[0057] Subsequent to depositing the paste onto the substrate, the liquid organic component of the paste may be cured, for example crosslinked, to form a magnetic device. The cure can be accomplished using methods suitable for the chosen resin, for example, in the presence of a catalyst, heat or radiation, for example infrared, ultraviolet or e-beam radiation. Combinations of cure mechanisms may also be used. If heat is used, it is particularly desirable for the temperature not to exceed a temperature at which the substrate is substantially adversely affected (e.g., melts, decomposes, pyrolyzes, and the like).
[0058] The pastes may be employed in numerous applications that require a magnetic device. The pastes may be deposited on PWBs/PCBs, silicon wafers, ceramic substrate materials, or the like. Suitable applications include antennae, power converters or switching power supplies (e.g., DC-DC converters), inductors, magnetic filters or noise filters, radiofrequency (RF) components (e.g., radiofrequency identification tags or transponders), microwave and millimeter wave circulators, broadband devices, electronic sensors, cellular phones, cable televisions (CATV), radar devices, sensors, telemetry devices, implantable medical devices, and the like. The cured or hardened pastes can replace the bulky donut- shaped and/or E-shaped inductors used in existing high-frequency applications.
[0059] Advantageously, the devices formed from the magnetic pastes disclosed herein have permeabilities greater than or equal to about 3, and even greater than or equal to 10, at INF-OO 15-PCT 13
frequencies greater than or equal to about 1 megaHertz. The devices formed from the magnetic pastes also have permitivities greater than or equal to about 3, and even greater than or equal to 10, and/or inductances greater than or equal to about 0.4 microHenry (μ-Henry), and even greater than or equal to about 1 μ-Henry, at frequencies greater than or equal to about 1 megaHertz. In addition, the devices formed from the magnetic pastes also have inductances that are at least two times, and even up to at least five times, higher than a device without the magnetic component such as a bare inductor (e.g., bare copper coil).
[0060] The disclosure is further illustrated by the following non-limiting examples.
EXAMPLE 1. Formation of a microscale particle assembly:
[0061] 10 pounds (lbs) of nickel-zinc ferrite (Nio,5Zn0.5)Fe204 with a grain size of less than about 100 nm were blended with 45.4 grams (g) of a 10 weight percent (wt %) solution of PVA in deionized distilled water (DD water) and dispersed into DD water to form a mixture that was ball milled to obtain a homogeneous slurry. The ball milling was performed using a Union Process Stegvari Attritor System type 18 with a ball/powder-loading ratio of about 4:1, ball milling speed of 300 revolutions per minute (rpm), and time of 1 h.
[0062] The formed slurry was then spray dried to form agglomerated substantially spherical particles. Spray drying parameters included a feeding rate of 600g/min, an inlet temperature of 475 degrees Fahrenheit (0F), and outlet temperature of 125 degrees Celsius (0C). Powders were collected using chamber and cyclone ports. The total powder collected at the chamber was about 6.5 lbs with about 2.5 lbs collected at the cyclone.
[0063] Next, these powders were fed into a plasma torch (Metco 9MB thermal spray device) for sintering into the densified assemblies. The plasma spray process parameters included using Argon as the primary plasma working gas flowing at about 80-120 standard cubic feet per hour (SCFH), a plasma power of 25-45KW and a powder feeding rate of about 2-5 Ibs/hr). In the plasma densification process, powders were fed into a plasma torch via a powder injection port, subsequently heated to remove any organic binders, followed by rapid melting/sintering/quenching of these liquid droplets from over 20000C to room temperature in a few milliseconds. The resulting assemblies formed from spray dried powders collected INF-OO 15-PCT 14
from the cyclone (less than about 20 μm) and chamber (about 20 to about 80 μm) ports are listed in Table 1.
Table 1. Densifϊcation power levels and tapping densities of assemblies
Figure imgf000015_0001
EXAMPLE 2. Fabrication of a magnetic paste
[0064] About 26 g of a plasma densified cyclone collected (Ni0.5Zno.5)Fe204 powder having a tapping density of 2.94 was hand mixed with 4.27 g of epoxy resin (ETC 30-3019R CLR obtained from Epoxies, ETC) in a beaker using a spatula for about 0.5 hours until a uniform paste was formed. The paste composition was 14.1 wt % epoxy with 85.9 wt % (Nio.5Zn0.5)Fe204.
[0065] Similarly, about 20 g of plasma densified cyclone collected (Ni0.5Zno,5)Fe204 powder having a tapping density of 2.94 was hand mixed with 23.5 g of Cat 105 (Epoxies, ETC) by hand mixing in a beaker using a spatula. It should be noted that the Cat 105 is used to initiate the hardening of the epoxy resin (ETC 30-3019R CLR) described above under thermal heating during device fabrication, by mixing approximately 16 parts by wt of paste formed in Cat 105 with 100 parts by wt of the paste formed with the ETC 30-3019R CLR resin.
[0066] Different ratios of epoxy to ferrite were tried, and the resulting properties of films formed from various pastes are listed in Table 2. INF-OOl 5-PCT 15
Table 2. Properties of films formed from magnetic paste
Figure imgf000016_0001
[0067] It is noted that pastes having higher ferrite loadings were associated with higher tapping densities of the powders and also resulted in higher inductance values for fabricated films as will be further illustrated below.
EXAMPLE 3. Fabrication of a multi-modal magnetic paste:
[0068] About 29 g of chamber collected (Nio,5Zn0.5)Fe204 powder having average particle size of about 30 micrometers were mixed with 9.45 g of cyclone (Nio.5Zn0.5)Fe204 powders having an average particle size of about 3 micrometers. This powder mixture was then hand mixed with 2.8 g of epoxy resin (ETC 30-3019R CLR from Epoxies, ETC) in a beaker using a spatula for about 0.5 hours until a uniform paste was formed. The paste composition was 11.8 wt% epoxy with 88.2 wt% (NiS0Zn50)Fe2O4 loading.
[0055] Similarly, about 10 g of chamber collected (Ni0.5Zn0.5)Fe2O4 powder having an average particle size of about 30 micrometers were mixed with 3.75 g of cyclone collected (Ni05ZnO15)Fe2O4 powders having an average particle size of about 3 micrometers. This powder mixture was then hand mixed with 1.9 grams of Cat 105 (Epoxies, ETC) by in a beaker using a spatula. The paste composition was 12 wt % Cat 105 with 88 wt % (Nio.5Zno.5)Fe204 loading. Again the Cat 105 is used to initiate the hardening of the epoxy resin (ETC 30-3019R CLR) under thermal heating during film fabrication, by mixing approximately 16 parts by weight of paste formed in Cat 105 with 100 parts by weight of the paste formed with ETC 30-3019R CLR. INF-OO 15-PCT 16
EXAMPLE 4. Characterization of a multi-modal magnetic paste
[0056] Various multi-modal magnetic pastes of (Ni0.5Zno.5)Fe2θ4 was fabricated and characterized. Figure 4 is a high resolution transmission electron microscope (TEM) image of the original nickel-zinc ferrite before agglomeration. As indicated in the micrograph, the average grain size is less than about 10 nm. For illustrative purposes, the arrow points to a grain boundary of two adjacent grains. Spray drying a slurry of the (Nio.sZno.5)Fe204 produced substantially spherical agglomerates, as illustrated in the scanning electron microscope (SEM) image shown in Figure 5. Agglomerates, each formed of a plurality of individual (Nio.5Zn0.5)Fe204 grains, of various sizes were combined with an epoxy resin as described above to form densely packed pastes. A representative cross-sectional image of a multi -modal paste after curing of the epoxy is shown in the SEM image of Figure 6.
[0057] The quality and/or the magnetic performance of the paste could be tailored by varying the loading of the magnetic particles. For example, tapping densities of about 2 g/cc to about 4 g/cc were observed by using different mixtures of agglomerates.
[0058] Figure 7 highlights the variance in tapping density for so-called "bimodal" pastes made from different ratios of 35 micrometer and 2 micrometer sized agglomerates. As seen in the graph, the highest tapping densities were obtained for samples having about 40 wt% to about 60 wt%, and more specifically about 50 wt%, of the 35μm agglomerates.
[0059] Analogously, when three different sized agglomerates were used to make pastes, an increased tapping density was observed. Figure 8 illustrates the observed change in tapping density for unimodal, bimodal, and trimodal pastes. As indicated in the graph, a tapping density of about 4g/cc, which represents about 80% of the theoretical density, was achieved for the trimodal paste.
[0060] By extension of the data in Figures 7 and 8, it should be understood that the use of additional groups of agglomerates and/or or different ratios of the groups of agglomerates can be used to increase the tapping density as would be desired for a particular application. The tapping densities of various (Ni0.5Zn0,5)Fe2θ4 agglomerates are shown in Table 3. INF-OO 15-PCT 17
Table 3. Tapping densities for different sized (Nio.5Zn0,5)Fe204 agglomerates
Figure imgf000018_0001
EXAMPLE 5. Formation of an inductor using a multimodal paste
[0061] Several inductors were formed by screen-printing a multimodal paste of (Ni0.5Zno,s)Fe204 onto a FR-4 (i.e., fire-resistant, woven glass reinforced epoxy) printed circuit board. Pastes having ferrite loadings of about 80 to about 90 wt%, with the balance being an epoxy binder, were used. Figure 9 is a representative optical microscope image of an inductor, and illustrates the positional relationship between the substrate, thick film of (Ni0,5Zn0.5)Fe2O4, and the copper coil. Among the inductors that were fabricated, the bonding between the film and the patterned structure was excellent, and no delamination of the film from the substrate was observed.
[0062] The permeability of each inductor was measured from about 10 kHz to about 13 MHz. Figure 10 illustrates the permeabilities of four samples made from pastes having from about 87 wt% to about 90 wt% ferrite. A permeability of about 19 was obtained. It should be emphasized that for each sample, the eddy current losses were quite small, and the Q factor was greater than about 70 throughout the entire frequency range.
[0063] The inductance of each sample was also measured. The uncoated (i.e., before screen printing and hardening of the (Ni0.5Zn0.5)Fe2O4 magnetic paste) patterned copper coil had an inductance of 0.183 μ-Henry for a 5 mm diameter, 100 micrometer thick coil at the measured frequency. After an approximately 1 mm thick magnetic paste was screened and hardened onto the copper coil, the inductance increased to greater than 1 μ-Henry.
[0064] Figure 11 illustrates the inductance as a function of frequency for about 0.9 mm thick (Ni0.5Zno.5)Fe204 film deposited on the coil. As illustrated in the graph, a fourfold increase, from about 200 nanoHenry to about 800-1000 nanoHenry, was observed upon deposition of the ferrite coating. Figure 12 illustrates the inductance as a function of film thickness for a given coil. As seen in the graph, the inductance increases dramatically with INF-OO 15-PCT 18
film thickness up to about 1 mm. Finally, Figure 13 illustrates the inductance as a function of overall inductor diameter for both 1 mm and 1.5 mm thick films.
[0065] In applications such as switch power supplies for cell phones, the required inductance is about 1 microHenry at 5 MHz. Thus, from the data in Figures 11-13, a film thickness of about 1 mm using the pastes disclosed herein would be sufficient to achieve the desired inductance.
EXAMPLE 6. Fabrication of a magnetic paste from discrete nanoparticles
[0066] Cobalt carbonyl was reduced to a Co nanoparticle dispersion at 110°C in toluene. The average particle size of the cobalt nanoparticles were about 1 Onni. Addition of benzocyclobutene (BCB) into the Co/toluene mixture resulted in the BCB coating the Co particles. A thick paste was then obtained after evaporation of the toluene under an argon atmosphere. Figure 14 is a TEM image of the paste after curing of the BCB at 25O0C for 1 hour using a heating rate of 1 °C/min under nitrogen.
EXAMPLE 7. Formation of an inductor using discrete nanoparticles paste
[0067] The discrete Co nanoparticle paste of Example 6 was deposited onto a FR-4 printed circuit board via screen-printing or plotting, followed by curing of the BCB. Figure 15 is a representative optical microscope image of an inductor, and illustrates the positional relationship between the substrate, thick film of Co, and the copper coil. Among the inductors that were fabricated, the bonding between the film and the patterned structure was excellent, and no delamination of the film from the substrate was observed.
[0068] The permeability of the inductors were measured from about 1 MHz to about 600 MHz. The inductors exhibited increased permeability of as a function of cobalt loading. With up to 90% cobalt loading, a permeability of about 6 was observed at about 600 MHz, as shown in Figure 16. The top line in the graph represents μ', or the real component of the complex permeability, and is indicative of the softness of the magnetization process in an alternating magnetic field. The bottom line in the graph represents μ", or the imaginary component of the complex permeability, and is indicative of the loss of the energy in the magnetization process. It should be emphasized that for each sample, the eddy current losses INF-OOl 5-PCT 19
were quite small, and the Q factor (which is represented by the quotient of μ' divided by μ") was greater than about 50 throughout the entire frequency range.
[0069] While the disclosure has been described with reference to exemplary embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the scope of the disclosure. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the disclosure without departing from the essential scope thereof. Therefore, it is intended that the disclosure not be limited to the particular "embodiment disclosed as the best mode contemplated for carrying out this disclosure, but that the disclosure will include all embodiments falling within the scope of the appended claims.

Claims

INF-OOl 5-PCT 20CLAIMS
1. A magnetic paste, comprising:
a magnetic component and a liquid organic component, wherein the magnetic component comprises a plurality of discrete nanoparticles, a plurality of nanoparticle- containing assemblies, wherein each assembly of the plurality of nanoparticle-containing assemblies has an average longest dimension of about 0.5 to about 150 micrometers, or both.
2. The magnetic paste of Claim 1, wherein an assembly of the plurality of nanoparticle-containing assemblies is a solid composite comprising a plurality of separate conductive nanoparticles dispersed in an insulating matrix.
3. The magnetic paste of Claim 2, wherein a nanoparticle-nanoparticle separation distance is about 1 to about 100 nanometers.
4. The magnetic paste of Claim 2, wherein the insulating matrix comprises a high dielectric material.
5. The magnetic paste of Claim 2, wherein at least a portion of the separate conductive nanoparticles is coated with an insulating composition.
6 The magnetic paste of Claim 1, wherein an assembly of the plurality of nanoparticle-containing assemblies is a microscale particle comprising a plurality of agglomerated nanoparticles.
7. The magnetic paste of Claim 1, wherein the liquid organic component is an epoxy, a polyimide, a polystyrene, ethyl cellulose, or benzocyclobutene.
8. The magnetic paste of Claim 1, wherein the magnetic component is multimodal.
9. The magnetic paste of Claim 1, wherein the magnetic component comprises greater than or equal to about 40 volume percent of the magnetic paste. INF-OO 15-PCT 21
10. The magnetic paste of Claim 1, wherein the magnetic component comprises about 40 to about 92 volume percent of the magnetic paste.
11. The magnetic paste of Claim 1 , wherein each assembly of the plurality of assemblies has a packing density greater than or equal to about 75 percent of a theoretical density.
12. The magnetic paste of Claim 1, wherein each of the plurality of nanoparticle- containing assemblies are in direct contact with an other of the plurality of nanoparticle- containing assemblies.
13. The magnetic paste of Claim 1, wherein each of the plurality of discrete nanoparticles has a nanoparticle-nanoparticle separation distance of about 1 to about 100 nanometers.
14. A magnetic device, comprising:
a magnetic component and a solid organic component, wherein the magnetic component comprises a plurality of discrete nanoparticles, a plurality of nanoparticle- containing assemblies, wherein each assembly of the plurality of nanoparticle-containing assemblies has an average longest dimension of about 0.5 to about 150 micrometers, or both.
15. The magnetic device of Claim 14, wherein the magnetic device is a power converter, antenna, inductor, magnetic filter, radiofrequency component, wave circulator, cellular phone, broadband device, cable television, radar device, sensor, telemetry device, or implantable medical device.
16. The magnetic device of Claim 14, further comprising a substrate onto which the magnetic component and the solid organic component are disposed.
17. The magnetic device of Claim 16, wherein the substrate is a printed circuit board, silicon wafer, or a ceramic material.
18. The magnetic device of Claim 14, wherein the magnetic device has a permeability greater than or equal to about 3 at a frequency greater than or equal to about 1 megahertz. INF-OOl 5-PCT 22
19. The magnetic device of Claim 14, wherein the magnetic device has a permeability greater than or equal to about 10 at a frequency greater than or equal to about 1 megahertz.
20. The magnetic device of Claim 14, wherein the magnetic device has a permitivity greater than or equal to about 3.
21. The magnetic device of Claim 14, wherein the magnetic device has an inductance greater than or equal to about 0.4 microHenry.
22. The magnetic device of Claim 14, wherein the magnetic device has an inductance greater than or equal to about 1 microHenry.
23. The magnetic device of Claim 14, wherein the magnetic device has an inductance at least two times greater than for the magnetic device without the magnetic component.
24. The magnetic device of Claim 14, wherein an assembly of the plurality of nanoparticle-containing assemblies is a solid composite comprising a plurality of separate conductive nanoparticles dispersed in an insulating matrix.
25. The magnetic device of Claim 14, wherein an assembly of the plurality of nanoparticle-containing assemblies is a microscale particle comprising a plurality of agglomerated nanoparticles.
26. The magnetic device of Claim 14, wherein each of the plurality of discrete nanoparticles has a nanoparticle-nanoparticle separation distance of about 1 to about 100 nanometers. INF-OOl 5-PCT 23
27. A power converter, comprising:
a substrate, wherein the substrate comprises a printed circuit board, silicon wafer, or a ceramic material; and
a film disposed on the substrate of the power converter, wherein the film comprises a magnetic component and a solid organic component, wherein the magnetic component comprises a plurality of discrete nanoparticles, a plurality of nanoparticle-containing assemblies, wherein each assembly of the plurality of nanoparticle-containing assemblies has an average longest dimension of about 0.5 to about 150 micrometers, or both.
28. The power converter of Claim 27, wherein the power converter has a permeability greater than or equal to about 3 at a frequency greater than or equal to about 1 megahertz.
29. The power converter of Claim 27, wherein an inductance of the power converter is greater than or equal to about 0.4 microHenry at a frequency greater than or equal to about 1 megahertz.
30. The power converter of Claim 27, wherein an inductance of the power converter is at least two times greater than for the power converter without the film.
31. A transformer, comprising:
a substrate, wherein the substrate comprises a printed circuit board, silicon wafer, or a ceramic material; and
a film disposed on the substrate of the transformer, wherein the film comprises a magnetic component and a solid organic component, wherein the magnetic component comprises a plurality of discrete nanoparticles, a plurality of nanoparticle-containing assemblies, wherein each assembly of the plurality of nanoparticle-containing assemblies has an average longest dimension of about 0.5 to about 150 micrometers, or both.
32. The transformer of Claim 31, wherein a permeability of the transformer is greater than or equal to about 3 at a frequency greater than or equal to about 1 megahertz. INF-OOl 5-PCT 24
33. The transformer of Claim 31, wherein an inductance of the transformer is greater than or equal to about 0.4 microHenry at a frequency greater than or equal to about 1 megahertz.
34. The transformer of Claim 31, wherein an inductance of the transformer is at least two times greater than for the transformer without the film.
35. An inductor, comprising:
a substrate, wherein the substrate comprises a printed circuit board, silicon wafer, or a ceramic material; and
a film disposed on the substrate of the inductor, wherein the film comprises a magnetic component and a solid organic component, wherein the magnetic component comprises a plurality of discrete nanoparticles, a plurality of nanoparticle-containing assemblies, wherein each assembly of the plurality of nanoparticle-containing assemblies has an average longest dimension of about 0.5 to about 150 micrometers, or both.
36. The inductor of Claim 35, wherein an inductance of the inductor is at least two times greater than for the inductor without the film.
37. The inductor of Claim 35, wherein a permeability of the inductor is greater than or equal to about 3 at a frequency greater than or equal to about 1 megahertz.
38. The inductor of Claim 35, wherein the inductance of the inductor is greater than or equal to about 0.4 microHenry at a frequency greater than or equal to about 1 megahertz.
-n ./ i!Ui fcftZ ,: . . ,:i..:i.
INF-OOl 5-PCT 25
39. A method for making a magnetic paste, the method comprising:
combining a magnetic component and a liquid organic component, wherein the magnetic component comprises a plurality of discrete nanoparticles, a plurality of nanoparticle-containing assemblies, wherein each assembly of the plurality of nanoparticle- containing assemblies has an average longest dimension of about 0.5 to about 150 micrometers, or both.
40. A method for making a magnetic device, the method comprising:
combining a magnetic component and a liquid organic component to form a paste, wherein the magnetic component comprises a plurality of discrete nanoparticles, a plurality of nanoparticle-containing assemblies, wherein each assembly of the plurality of nanoparticle-containing assemblies has an average longest dimension of about 0.5 to about 150 micrometers, or both;
disposing the paste onto a substrate; and
solidifying the paste.
PCT/US2006/018111 2005-05-11 2006-05-11 Magnetic composites and methods of making and using WO2006122195A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN200680016208.6A CN101208165B (en) 2005-05-11 2006-05-11 Magnetic composites and methods of making and using

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US67985905P 2005-05-11 2005-05-11
US60/679,859 2005-05-11

Publications (2)

Publication Number Publication Date
WO2006122195A2 true WO2006122195A2 (en) 2006-11-16
WO2006122195A3 WO2006122195A3 (en) 2007-01-18

Family

ID=36952502

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2006/018111 WO2006122195A2 (en) 2005-05-11 2006-05-11 Magnetic composites and methods of making and using

Country Status (3)

Country Link
US (1) US8377576B2 (en)
CN (1) CN101208165B (en)
WO (1) WO2006122195A2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2915845A1 (en) * 2007-05-04 2008-11-07 Thales Sa POWER SUPPLY MODULE BASED ON MAGNETIC MATERIAL AND METHOD FOR MAKING THE SAME.
EP2131373A1 (en) * 2008-06-05 2009-12-09 TRIDELTA Weichferrite GmbH Soft magnetic material and method for producing objects from this soft magnetic material

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7879269B1 (en) * 2006-09-13 2011-02-01 Rf Micro Devices, Inc. Ferrite powder optimized for fabrication of ferrite features and related methods
US9175885B2 (en) * 2007-02-12 2015-11-03 Vacuumschmelze Gmbh & Co. Kg Article made of a granular magnetocalorically active material for heat exchange
DE102007050256B4 (en) * 2007-10-20 2019-05-23 Schaeffler Technologies AG & Co. KG Bearing component with an encoder element for indicating a position or movement of the bearing component
JP5065960B2 (en) * 2008-03-28 2012-11-07 株式会社東芝 High-frequency magnetic material and method for producing the same.
CN101981720B (en) 2008-04-01 2013-10-23 Nxp股份有限公司 Vertical phase change memory cell
DE102008026887B4 (en) * 2008-06-05 2012-02-23 Tridelta Weichferrite Gmbh Soft magnetic composite material
CN101847479B (en) * 2009-03-24 2012-08-15 中国科学院物理研究所 Microwave composite material and preparation method thereof
WO2011060825A1 (en) * 2009-11-19 2011-05-26 Nokia Corporation Deformable apparatus
US20110151377A1 (en) * 2009-12-18 2011-06-23 Simon Fraser University Compositions Including Magnetic Materials
JP5614135B2 (en) * 2010-07-06 2014-10-29 デクセリアルズ株式会社 Anisotropic conductive adhesive, manufacturing method thereof, connection structure and manufacturing method thereof
CN105684107A (en) * 2013-11-01 2016-06-15 户田工业株式会社 Soft magnetic ferrite resin composition, soft magnetic ferrite resin composition molded body, and power transmission device for non-contact power supply system
WO2016013183A1 (en) * 2014-07-22 2016-01-28 パナソニックIpマネジメント株式会社 Composite magnetic material, coil component using same, and composite magnetic material manufacturing method
JP6215163B2 (en) * 2014-09-19 2017-10-18 株式会社東芝 Method for producing composite magnetic material
KR102093158B1 (en) * 2014-09-23 2020-03-25 삼성전기주식회사 Magnetic material for high-frequency electronic component and their manufacturing method
JP2016219683A (en) * 2015-05-25 2016-12-22 ソニー株式会社 Wiring board and manufacturing method
CN108370095A (en) * 2015-08-06 2018-08-03 薄膜电子有限公司 Wireless communication device and production and preparation method thereof with integrated ferrite shielding and antenna
EP4159345A1 (en) * 2016-04-11 2023-04-05 AP&C Advanced Powders And Coatings Inc. Reactive metal powders in-flight heat treatment processes
CN106601419B (en) * 2016-11-18 2019-04-16 日照亿鑫电子材料有限公司 A kind of magnetic material and preparation method with interstitial structure
CN111886939A (en) 2018-03-23 2020-11-03 味之素株式会社 Paste for filling through-hole
JP7338560B2 (en) * 2020-05-26 2023-09-05 味の素株式会社 resin composition
CN112133513A (en) * 2020-08-24 2020-12-25 天津大学 Low-temperature curing high-permeability magnetic composite material for power electronic integration and preparation method thereof
CN113358800A (en) * 2021-05-26 2021-09-07 吉林化工学院 Magnetic nitrogen-doped carbon material and method for extracting and analyzing phthalic acid ester in plastic bottled water by using same

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5851568A (en) * 1995-08-07 1998-12-22 Huang; Xiaodi Hex-directional press for consolidating powdered materials
EP1050889A2 (en) * 1999-04-19 2000-11-08 Kawatetsu Mining Co., LTD. Magnetic ferrite film and preparation method
US6162530A (en) * 1996-11-18 2000-12-19 University Of Connecticut Nanostructured oxides and hydroxides and methods of synthesis therefor
US20030129405A1 (en) * 2000-10-26 2003-07-10 Yide Zhang Insulator coated magnetic nanoparticulate composites with reduced core loss and method of manufacture thereof
US20030202234A1 (en) * 2002-04-26 2003-10-30 Corning Intellisense Corporation Magnetically actuated microelectromechanical devices and method of manufacture

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4237189A (en) * 1973-10-31 1980-12-02 Robert J. Deffeyes Polymodal magnetic recording media process for making and verifying the same and compositions useful therein
JPS5817143B2 (en) 1979-02-22 1983-04-05 鳴海製陶株式会社 Ceramic tape manufacturing method
US4719026A (en) 1985-03-11 1988-01-12 Savin Corporation Electrophoretic method of producing high-density magnetic recording media and a composition and a suspension for practicing the same
JPH076072B2 (en) 1986-08-08 1995-01-25 日本ペイント株式会社 Method for forming ferrite film
JPS6365085A (en) 1986-09-05 1988-03-23 Nippon Paint Co Ltd Method for coating ferrite on particle or fibrous material
US6183568B1 (en) 1989-01-26 2001-02-06 Fuji Photo Film Co., Ltd. Method for preparing a magnetic thin film
US5230729A (en) 1989-11-09 1993-07-27 Rutgers, The State University Of New Jersey Carbothermic reaction process for making nanophase WC-Co powders
US5279994A (en) 1993-02-11 1994-01-18 W. R. Grace & Co.-Conn. Aqueous processing of green ceramic tapes
US6048920A (en) 1994-08-15 2000-04-11 Xerox Corporation Magnetic nanocomposite compositions and processes for the preparation and use thereof
US5460704A (en) 1994-09-28 1995-10-24 Motorola, Inc. Method of depositing ferrite film
US5667715A (en) * 1996-04-08 1997-09-16 General Motors Corporation Magnetorheological fluids
GB2313832B (en) 1996-06-03 1999-11-24 Minnesota Mining & Mfg Surface modification of magnetic particle pigments
JPH09326624A (en) 1996-06-05 1997-12-16 Murata Mfg Co Ltd Chip antenna
US5667716A (en) 1996-07-01 1997-09-16 Xerox Corporation High magnetization aqueous ferrofluids and processes for preparation and use thereof
US6933331B2 (en) * 1998-05-22 2005-08-23 Nanoproducts Corporation Nanotechnology for drug delivery, contrast agents and biomedical implants
US5952040A (en) 1996-10-11 1999-09-14 Nanomaterials Research Corporation Passive electronic components from nano-precision engineered materials
US5905000A (en) * 1996-09-03 1999-05-18 Nanomaterials Research Corporation Nanostructured ion conducting solid electrolytes
US6045925A (en) 1997-08-05 2000-04-04 Kansas State University Research Foundation Encapsulated nanometer magnetic particles
US6392525B1 (en) 1998-12-28 2002-05-21 Matsushita Electric Industrial Co., Ltd. Magnetic element and method of manufacturing the same
JP3831179B2 (en) 1999-06-29 2006-10-11 株式会社東芝 Semiconductor device manufacturing method and pattern forming method
JP4139882B2 (en) 2000-02-14 2008-08-27 国立大学法人大阪大学 Photo-induced magnetization control method
JP2001244123A (en) 2000-02-28 2001-09-07 Kawatetsu Mining Co Ltd Surface-mounted planar magnetic element and method of manufacturing
JP2001267725A (en) 2000-03-16 2001-09-28 Matsushita Electric Ind Co Ltd Method for manufacturing ceramic thick film printed circuit board
JP3700085B2 (en) 2001-03-30 2005-09-28 ミネベア株式会社 Ferrite thin film manufacturing method
JP2002355544A (en) * 2001-05-30 2002-12-10 Tdk Corp Method of producing spherical ceramic powder, spherical ceramic powder, and composite material
US6716488B2 (en) 2001-06-22 2004-04-06 Agere Systems Inc. Ferrite film formation method
US6899947B2 (en) * 2001-08-14 2005-05-31 Purdue Research Foundation Nanoparticle arrays and sensors using same
CN100515504C (en) 2001-10-12 2009-07-22 美国英佛曼公司 Coating, coated articles and methods of manufacture thereof
US20040210289A1 (en) * 2002-03-04 2004-10-21 Xingwu Wang Novel nanomagnetic particles

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5851568A (en) * 1995-08-07 1998-12-22 Huang; Xiaodi Hex-directional press for consolidating powdered materials
US6162530A (en) * 1996-11-18 2000-12-19 University Of Connecticut Nanostructured oxides and hydroxides and methods of synthesis therefor
EP1050889A2 (en) * 1999-04-19 2000-11-08 Kawatetsu Mining Co., LTD. Magnetic ferrite film and preparation method
US20030129405A1 (en) * 2000-10-26 2003-07-10 Yide Zhang Insulator coated magnetic nanoparticulate composites with reduced core loss and method of manufacture thereof
US20030202234A1 (en) * 2002-04-26 2003-10-30 Corning Intellisense Corporation Magnetically actuated microelectromechanical devices and method of manufacture

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2915845A1 (en) * 2007-05-04 2008-11-07 Thales Sa POWER SUPPLY MODULE BASED ON MAGNETIC MATERIAL AND METHOD FOR MAKING THE SAME.
WO2008135400A1 (en) * 2007-05-04 2008-11-13 Thales Method for making a supply module based on magnetic material
EP2131373A1 (en) * 2008-06-05 2009-12-09 TRIDELTA Weichferrite GmbH Soft magnetic material and method for producing objects from this soft magnetic material

Also Published As

Publication number Publication date
WO2006122195A3 (en) 2007-01-18
CN101208165B (en) 2013-03-27
CN101208165A (en) 2008-06-25
US8377576B2 (en) 2013-02-19
US20070102663A1 (en) 2007-05-10

Similar Documents

Publication Publication Date Title
US8377576B2 (en) Magnetic composites and methods of making and using
US5952040A (en) Passive electronic components from nano-precision engineered materials
JP5574395B2 (en) Composite material and manufacturing method thereof
US8070974B2 (en) Soft-magnetic material and process for producing articles composed of this soft-magnetic material
US6720074B2 (en) Insulator coated magnetic nanoparticulate composites with reduced core loss and method of manufacture thereof
KR20090103951A (en) Composite magnetic body, its manufacturing method, circuit substrate using the same, and electronic device using the same
WO1998018741A9 (en) Passive electronic components prepared from suspensions of nanoscale ceramic powders
EP3468326A1 (en) Ferrite particles, resin composition and electromagnetic shielding material
CN101620909B (en) Soft magnetic material and method for producing objects from this soft magnetic material
Wang et al. Epsilon-negative behavior of BaTiO3/Ag metacomposites prepared by an in situ synthesis
JP2008263098A (en) Compound magnetic body, circuit substrate using the same, and electronic equipment using the same
EP1262450A1 (en) Method for manufacturing single crystal ceramic powder, and single crystal ceramic powder, composite material, and electronic element
EP3522179B1 (en) Ni-zn-cu ferrite particles, resin composition and resin molded body
CN111164050A (en) Mn-Zn ferrite particles, resin molded body, soft magnetic mixed powder, and magnetic core
JP2008311255A (en) Compound magnetic substance and its manufacturing method
KR100933371B1 (en) Electromagnetic wave absorber including soft magnetic layer imparted with function of dielectric layer and method of forming soft magnetic layer
US20210168974A1 (en) Composite particles, powder, resin composition and moulded body
CN111902036A (en) Electromagnetic wave noise suppression sheet and high-frequency electronic equipment
KR20160014936A (en) Composite magnetic powder and chip coil component using thereof
JP7338644B2 (en) Sintered compact and its manufacturing method
He et al. Greatly enhanced magneto-dielectric performance of the Ni 0.5 Zn 0.5 Fe 2 O 4/polyvinylidene fluoride composites with annealed ferrite powders for antenna applications
Mathur et al. Processing of nano-crystallite spinel ferrite prepared by co-precipitation method
Raju Microwave processing of multilayer chip inductors using MgCuZn ferrites
Murthy Copper/Nizn Ferrite Nanocomposite for Microinductor Applications
Zhang et al. Insulator coated magnetic nanoparticulate composites with reduced core loss and method of manufacture thereof

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200680016208.6

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application
NENP Non-entry into the national phase

Ref country code: DE

NENP Non-entry into the national phase

Ref country code: RU

122 Ep: pct application non-entry in european phase

Ref document number: 06770187

Country of ref document: EP

Kind code of ref document: A2