WO2006114726A3 - A cooling device for a light-emitting semiconductor device and a method of manufacturing such a cooling device - Google Patents

A cooling device for a light-emitting semiconductor device and a method of manufacturing such a cooling device Download PDF

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Publication number
WO2006114726A3
WO2006114726A3 PCT/IB2006/051206 IB2006051206W WO2006114726A3 WO 2006114726 A3 WO2006114726 A3 WO 2006114726A3 IB 2006051206 W IB2006051206 W IB 2006051206W WO 2006114726 A3 WO2006114726 A3 WO 2006114726A3
Authority
WO
WIPO (PCT)
Prior art keywords
light
cooling device
emitting semiconductor
semiconductor device
charge
Prior art date
Application number
PCT/IB2006/051206
Other languages
French (fr)
Other versions
WO2006114726A2 (en
Inventor
Graaf Jan De
Celine C S Nicole
Marcus A Verschuuren
Sprang Hans Van
Theo A Kop
Johan Marra
Ronald M Wolf
Original Assignee
Koninkl Philips Electronics Nv
Graaf Jan De
Celine C S Nicole
Marcus A Verschuuren
Sprang Hans Van
Theo A Kop
Johan Marra
Ronald M Wolf
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv, Graaf Jan De, Celine C S Nicole, Marcus A Verschuuren, Sprang Hans Van, Theo A Kop, Johan Marra, Ronald M Wolf filed Critical Koninkl Philips Electronics Nv
Priority to EP06727967A priority Critical patent/EP1878061A2/en
Priority to JP2008508359A priority patent/JP5320060B2/en
Priority to KR1020077027452A priority patent/KR101240999B1/en
Priority to US11/912,751 priority patent/US7855449B2/en
Priority to CN2006800143564A priority patent/CN101167194B/en
Publication of WO2006114726A2 publication Critical patent/WO2006114726A2/en
Publication of WO2006114726A3 publication Critical patent/WO2006114726A3/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/043—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure forming loops, e.g. capillary pumped loops
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/04—Constructions of heat-exchange apparatus characterised by the selection of particular materials of ceramic; of concrete; of natural stone
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/648—Heat extraction or cooling elements the elements comprising fluids, e.g. heat-pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/641—Heat extraction or cooling elements characterized by the materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Led Device Packages (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A cooling device for cooling a light-emitting semiconductor device, such as a LED device (20), comprises a ceramic plate (15) having coolant-conveying channels (12) incorporated therein. The ceramic plate (15) is adapted for forming an integral part of the optical system of the light-emitting semiconductor device (20) and to cool a light-emitting portion (26) of the light-emitting semiconductor device (20). A method of forming a cooling device comprises the steps of forming a charge of ceramic particles, embossing the charge with a stamp to form coolant-conveying channels in the charge, hardening the charge, and providing a cover on top of the channels to seal them.
PCT/IB2006/051206 2005-04-27 2006-04-19 A cooling device for a light-emitting semiconductor device and a method of manufacturing such a cooling device WO2006114726A2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
EP06727967A EP1878061A2 (en) 2005-04-27 2006-04-19 A cooling device for a light-emitting semiconductor device and a method of manufacturing such a cooling device
JP2008508359A JP5320060B2 (en) 2005-04-27 2006-04-19 Cooling device for light emitting semiconductor device and method of manufacturing such a cooling device
KR1020077027452A KR101240999B1 (en) 2005-04-27 2006-04-19 A cooling device for a light-emitting semiconductor device and a method of manufacturing such a cooling device
US11/912,751 US7855449B2 (en) 2005-04-27 2006-04-19 Cooling device for a light-emitting semiconductor device and a method of manufacturing such a cooling device
CN2006800143564A CN101167194B (en) 2005-04-27 2006-04-19 A cooling device for a light-emitting semiconductor device and a method of manufacturing such a cooling device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP05103467.6 2005-04-27
EP05103467 2005-04-27

Publications (2)

Publication Number Publication Date
WO2006114726A2 WO2006114726A2 (en) 2006-11-02
WO2006114726A3 true WO2006114726A3 (en) 2007-02-15

Family

ID=37102459

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2006/051206 WO2006114726A2 (en) 2005-04-27 2006-04-19 A cooling device for a light-emitting semiconductor device and a method of manufacturing such a cooling device

Country Status (7)

Country Link
US (1) US7855449B2 (en)
EP (1) EP1878061A2 (en)
JP (1) JP5320060B2 (en)
KR (1) KR101240999B1 (en)
CN (1) CN101167194B (en)
TW (1) TW200727516A (en)
WO (1) WO2006114726A2 (en)

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Also Published As

Publication number Publication date
US20080191236A1 (en) 2008-08-14
JP2008539576A (en) 2008-11-13
WO2006114726A2 (en) 2006-11-02
US7855449B2 (en) 2010-12-21
KR20080008381A (en) 2008-01-23
KR101240999B1 (en) 2013-03-08
CN101167194A (en) 2008-04-23
EP1878061A2 (en) 2008-01-16
CN101167194B (en) 2011-07-06
JP5320060B2 (en) 2013-10-23
TW200727516A (en) 2007-07-16

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