WO2006109121A3 - Nanocomposite photosensitive composition and use thereof - Google Patents

Nanocomposite photosensitive composition and use thereof Download PDF

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Publication number
WO2006109121A3
WO2006109121A3 PCT/IB2006/000738 IB2006000738W WO2006109121A3 WO 2006109121 A3 WO2006109121 A3 WO 2006109121A3 IB 2006000738 W IB2006000738 W IB 2006000738W WO 2006109121 A3 WO2006109121 A3 WO 2006109121A3
Authority
WO
WIPO (PCT)
Prior art keywords
composition
iii
photoresist composition
photoresist
negative photoresist
Prior art date
Application number
PCT/IB2006/000738
Other languages
French (fr)
Other versions
WO2006109121A2 (en
Inventor
Chunwei Chen
Ping-Hung Lu
Hong Zhuang
Mark Neisser
Original Assignee
Az Electronic Materials Usa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Az Electronic Materials Usa filed Critical Az Electronic Materials Usa
Priority to EP06727393.8A priority Critical patent/EP1877864B1/en
Publication of WO2006109121A2 publication Critical patent/WO2006109121A2/en
Publication of WO2006109121A3 publication Critical patent/WO2006109121A3/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/106—Binder containing

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  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials For Photolithography (AREA)

Abstract

The present invention relates to a photoresist composition suitable for image-wise exposure and development as a negative photoresist comprising a negative photoresist composition and an inorganic particle material having an average particle size equal or greater than 10 nanometers, wherein the photoresist composition is capable of forming a photoresist coating film having a thickness of greater than 5 µm. The negative photoresist composition is selected from (1) a composition comprising (i) a resin binder, (ii) a photoacid generator, and (iii) a cross-linking agent; or (2) a composition comprising (i) a resin binder, (ii) optionally, addition-polymerizeable, ethylenically unsaturated compound(s) and (iii) a photoinitiator; or (3) a composition comprising (i) a photopolymerizable compound containing at least two pendant unsaturated groups; (ii) ethylenically unsaturated photopolymerizable polyalkylene oxide hydrophilic compound(s); and (iii) a photoinitiator.
PCT/IB2006/000738 2005-04-11 2006-03-10 Nanocomposite photosensitive composition and use thereof WO2006109121A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP06727393.8A EP1877864B1 (en) 2005-04-11 2006-03-10 Nanocomposite photosensitive composition and use thereof

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/103,134 US7247419B2 (en) 2005-04-11 2005-04-11 Nanocomposite photosensitive composition and use thereof
US11/103,134 2005-04-11

Publications (2)

Publication Number Publication Date
WO2006109121A2 WO2006109121A2 (en) 2006-10-19
WO2006109121A3 true WO2006109121A3 (en) 2007-04-12

Family

ID=36687999

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2006/000738 WO2006109121A2 (en) 2005-04-11 2006-03-10 Nanocomposite photosensitive composition and use thereof

Country Status (5)

Country Link
US (2) US7247419B2 (en)
EP (1) EP1877864B1 (en)
MY (1) MY137955A (en)
TW (1) TWI391785B (en)
WO (1) WO2006109121A2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4724073B2 (en) 2006-08-17 2011-07-13 富士通株式会社 Resist pattern forming method, semiconductor device and manufacturing method thereof
JP4724072B2 (en) * 2006-08-17 2011-07-13 富士通株式会社 Resist pattern forming method, semiconductor device and manufacturing method thereof
EP2527379A1 (en) * 2011-05-27 2012-11-28 Rohm and Haas Electronic Materials LLC Polymer and photoresist comprising the polymer
US10345700B2 (en) 2014-09-08 2019-07-09 International Business Machines Corporation Negative-tone resist compositions and multifunctional polymers therein
US20190204727A1 (en) * 2017-12-28 2019-07-04 Shenzhen China Star Optoelectronics Technology Co., Ltd. Photoresist and preparation method thereof

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11338144A (en) * 1998-05-25 1999-12-10 Fujifilm Olin Co Ltd Photosensitive resinous composition

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JPS5660432A (en) 1979-10-23 1981-05-25 Fuji Photo Film Co Ltd Photosolubilizing composition
US4522958A (en) * 1983-09-06 1985-06-11 Ppg Industries, Inc. High-solids coating composition for improved rheology control containing chemically modified inorganic microparticles
DE3340154A1 (en) * 1983-11-07 1985-05-15 Basf Ag, 6700 Ludwigshafen METHOD FOR PRODUCING IMAGERALLY STRUCTURED RESIST LAYERS AND DRY FILM RESIST SUITABLE FOR THIS METHOD
GB2168981B (en) * 1984-12-27 1988-07-06 Asahi Chemical Ind Porous fluorine resin membrane and process for preparation thereof
US4792517A (en) * 1987-07-24 1988-12-20 Eastman Kodak Company Luminate for the formation of beam leads for IC chip bonding
US5070002A (en) * 1988-09-13 1991-12-03 Amp-Akzo Corporation Photoimageable permanent resist
US5043184A (en) * 1989-02-06 1991-08-27 Somar Corporation Method of forming electrically conducting layer
EP0555749B1 (en) * 1992-02-14 1999-05-19 Shipley Company Inc. Radiation sensitive compositions and processes
TW277204B (en) * 1994-12-02 1996-06-01 Nippon Paint Co Ltd
US5994023A (en) 1996-07-19 1999-11-30 Agfa-Gevaert, N.V. Acid-sensitive substance and photosensitive compositions therewith
JP4050370B2 (en) 1998-01-07 2008-02-20 株式会社Ｋｒｉ Inorganic-containing photosensitive resin composition and inorganic pattern forming method
US6159656A (en) 1998-06-26 2000-12-12 Fuji Photo Film Co., Ltd. Positive photosensitive resin
EP1096313A1 (en) 1999-11-01 2001-05-02 Kansai Research Institute, Inc. Active particle, photosensitive resin composition, and process for forming pattern
US6783914B1 (en) 2000-02-25 2004-08-31 Massachusetts Institute Of Technology Encapsulated inorganic resists
JP2002064276A (en) * 2000-08-22 2002-02-28 Nippon Steel Chem Co Ltd Photosetting or thermosetting resin component, and multilayer printed wiring board
US6534235B1 (en) 2000-10-31 2003-03-18 Kansai Research Institute, Inc. Photosensitive resin composition and process for forming pattern
US6642295B2 (en) * 2001-12-21 2003-11-04 Eastman Kodak Company Photoresist nanocomposite optical plastic article and method of making same
US7521168B2 (en) * 2002-02-13 2009-04-21 Fujifilm Corporation Resist composition for electron beam, EUV or X-ray
US7232650B2 (en) * 2002-10-02 2007-06-19 3M Innovative Properties Company Planar inorganic device
US20040170925A1 (en) 2002-12-06 2004-09-02 Roach David Herbert Positive imageable thick film compositions
US7078157B2 (en) 2003-02-27 2006-07-18 Az Electronic Materials Usa Corp. Photosensitive composition and use thereof
US6852465B2 (en) 2003-03-21 2005-02-08 Clariant International Ltd. Photoresist composition for imaging thick films

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11338144A (en) * 1998-05-25 1999-12-10 Fujifilm Olin Co Ltd Photosensitive resinous composition

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
DATABASE WPI Section Ch Week 200009, Derwent World Patents Index; Class A21, AN 2000-101288, XP002392426 *

Also Published As

Publication number Publication date
TWI391785B (en) 2013-04-01
WO2006109121A2 (en) 2006-10-19
EP1877864B1 (en) 2018-09-19
MY137955A (en) 2009-04-30
US7247419B2 (en) 2007-07-24
US20070141510A1 (en) 2007-06-21
TW200643620A (en) 2006-12-16
EP1877864A2 (en) 2008-01-16
US20060228645A1 (en) 2006-10-12

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