WO2006104886A3 - Resilient probes for electrical testing - Google Patents

Resilient probes for electrical testing Download PDF

Info

Publication number
WO2006104886A3
WO2006104886A3 PCT/US2006/010779 US2006010779W WO2006104886A3 WO 2006104886 A3 WO2006104886 A3 WO 2006104886A3 US 2006010779 W US2006010779 W US 2006010779W WO 2006104886 A3 WO2006104886 A3 WO 2006104886A3
Authority
WO
WIPO (PCT)
Prior art keywords
holder
contact pads
probes
attached
sheet
Prior art date
Application number
PCT/US2006/010779
Other languages
French (fr)
Other versions
WO2006104886A2 (en
Inventor
Daniel J Stillman
Original Assignee
Texas Instruments Inc
Daniel J Stillman
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/116,884 external-priority patent/US8438645B2/en
Application filed by Texas Instruments Inc, Daniel J Stillman filed Critical Texas Instruments Inc
Priority to EP06739525.1A priority Critical patent/EP2569646A4/en
Publication of WO2006104886A2 publication Critical patent/WO2006104886A2/en
Publication of WO2006104886A3 publication Critical patent/WO2006104886A3/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06744—Microprobes, i.e. having dimensions as IC details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G01R1/07321—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support the probes being of different lengths
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

An apparatus for electrical testing having probes (201) constructed of metal elements (201a) of about equal size bonded together in substantially linear sequence. Further an insulating holder (202) having first and second surfaces and a plurality of metal-filled vias (210) traversing the holder from the first to the second surface; the vias form contact pads on the first and second surfaces. The contact pads (210a) of the first holder surface have a probe attached so that the probe is positioned about normal to the surface. A sheet (203) of resilient insulating material, which has first and second surfaces and a thickness traversed by a plurality of conducting traces (220), has its first sheet surface attached to the second holder surface so that at least one of the traces contacts one of the contact pads, respectively, to provide an electrical path to the second sheet surface. A printed circuit board, suitable for insertion into an electrical test apparatus, is attached to the second sheet surface so that a continuous electrical path is established from the apparatus to each of the probes.
PCT/US2006/010779 2005-03-28 2006-03-23 Resilient probes for electrical testing WO2006104886A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP06739525.1A EP2569646A4 (en) 2005-03-28 2006-03-23 Resilient probes for electrical testing

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US66567605P 2005-03-28 2005-03-28
US60/665,676 2005-03-28
US11/116,884 2005-04-27
US11/116,884 US8438645B2 (en) 2005-04-27 2005-04-27 Secure clock with grace periods

Publications (2)

Publication Number Publication Date
WO2006104886A2 WO2006104886A2 (en) 2006-10-05
WO2006104886A3 true WO2006104886A3 (en) 2007-03-01

Family

ID=37053934

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2006/010779 WO2006104886A2 (en) 2005-03-28 2006-03-23 Resilient probes for electrical testing

Country Status (2)

Country Link
EP (1) EP2569646A4 (en)
WO (1) WO2006104886A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI827809B (en) * 2019-04-04 2024-01-01 丹麥商卡普雷斯股份有限公司 Method for measuring an electric property of a test sample, and multilayer test sample

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5998228A (en) * 1993-11-16 1999-12-07 Form Factor, Inc. Method of testing semiconductor
US7109731B2 (en) * 1996-08-08 2006-09-19 Cascade Microtech, Inc. Membrane probing system with local contact scrub

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08139142A (en) * 1994-11-09 1996-05-31 Tokyo Electron Ltd Probe unit
US6483328B1 (en) * 1995-11-09 2002-11-19 Formfactor, Inc. Probe card for probing wafers with raised contact elements
US5828226A (en) * 1996-11-06 1998-10-27 Cerprobe Corporation Probe card assembly for high density integrated circuits
JPH11160356A (en) * 1997-11-25 1999-06-18 Matsushita Electric Ind Co Ltd Probe card for wafer collective measurement and inspection and ceramic multilayer interconnection board as well as their manufacture
JP3557887B2 (en) * 1998-01-14 2004-08-25 日立ハイテク電子エンジニアリング株式会社 Contact device for IC device
US6812718B1 (en) * 1999-05-27 2004-11-02 Nanonexus, Inc. Massively parallel interface for electronic circuits
US6970005B2 (en) * 2000-08-24 2005-11-29 Texas Instruments Incorporated Multiple-chip probe and universal tester contact assemblage
WO2004034068A2 (en) * 2002-10-10 2004-04-22 Advantest Corporation Contact structure and production method thereof and probe contact assembly using same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5998228A (en) * 1993-11-16 1999-12-07 Form Factor, Inc. Method of testing semiconductor
US7109731B2 (en) * 1996-08-08 2006-09-19 Cascade Microtech, Inc. Membrane probing system with local contact scrub

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2569646A4 *

Also Published As

Publication number Publication date
EP2569646A4 (en) 2014-01-22
WO2006104886A2 (en) 2006-10-05
EP2569646A2 (en) 2013-03-20

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