WO2006099837A1

WO2006099837A1 - Cooling system for cooling components of electronic appliances, for example of computers, an electronic appliance, for example a computer with a cooling system such as this, as well as a heatpipe

Info

Publication number: WO2006099837A1
Application number: PCT/DE2006/000437
Authority: WO
Inventors: Roland Dilsch; Ernst Hammel; Alexander Rogg; Jürgen SCHULZ-HARDER
Original assignee: Curamik Electronics Gmbh; Electrovac Ag
Priority date: 2005-03-21
Filing date: 2006-03-14
Publication date: 2006-09-28
Also published as: DE102005013457A1; DE102005013457B4

Abstract

In a cooling system for cooling a hard disk (2) or similar components which produce heat losses in an electronic appliance, for example a computer, using a heatpipe (11) which can be thermally connected to an area (5) which absorbs heat and can be connected over an area to the component (2) to be cooled, and at least one area (12) which emits heat projects away at the side beyond the functional element, the heatpipe is flat, is cuboid, or is in the form of a plate or board.

Description

Cooling system for cooling components of electronic devices, such as computers, electronic device, such as computers with such a cooling system and heat pipe

The invention relates to a cooling system according to the preamble of claim 1, to an electronic device, such as computer according to the preamble of claim 16 and to a heat pipe according to the preamble of claim 17.

For cooling of electrical and electronic components so-called heat pipes, especially flat heat pipes are known (DE 198 188 39 A1, DE 102 614 02 A1).

It is also known to use for cooling hard disks of computers, a heatpipe arrangement with several, each tubular heatpipes (US 5 982 616), which are arranged with their axes in a common plane parallel to each other and connected at their ends in each case via a plate. Of these plates forms a first, heat-absorbing area and is thermally connected to the drive to be cooled. The second forms a second, to be cooled or heat dissipating from the respective heat pipe region of the heatpipe arrangement.

The use of a plurality of tubular heatpipes results in a complex design, especially with sufficient cooling capacity and a relatively large-volume design alone because of the unused volume between the individual tubular heatpipes.

The object of the invention is to show a cooling system, which is an effective cooling of hard disks or the like. Components of an electronic device, For example, allows a computer, and in particular even if the at least one component to be cooled, which is preferably a hard drive, densely packed with other components in a relatively small volume of a device interior is housed, as especially in computers because of the plug-in training Such components and the compact design is the case.

To solve this problem, a cooling system according to claim 1 and an electronic device according to claim 16 is formed.

By forming at least one heat pipe as a flat, plate-shaped or quarderförmige heat pipe results for this heat pipe even in very cramped conditions a sufficiently large effective cross-section, so that a high cooling capacity is possible and between the component to be cooled, for example, hard disk and an adjacent component , For example, a drive or another hard drive remaining space is used optimally. Cooling capacities of 3 - 5 KVWm ⁰ K are easily achievable.

Another significant advantage is that with an external active cooling system, i. H. in an external cooling system with a circuit for a liquid heat transporting medium (eg water) the corresponding heat exchanger through which the cooling medium flows is arranged at a sufficient distance from the component to be cooled, in particular also in a part of the device interior in which Part) enough space is available.

The invention further relates to a heat pipe according to claim 17. This heat pipe is suitable for the cooling system according to the invention or for this cooling system exhibiting electrical device, such as computers, but not exclusively, but can also be used elsewhere for the cooling of components, assemblies and / or components.

Further developments of the invention are the subject of the dependent claims. The invention will be explained in more detail below with reference to the figures of various embodiments. Show it:

Fig. 1 is a cooling system according to the invention in plan view;

FIG. 2 is a simplified perspective illustration of a hard disk and a flat heat pipe of the cooling system of FIG. 1 provided on the upper side of the hard disk; FIG. Fig. 3 in a simplified representation and in side view of another cooling system according to the invention;

4 to 6 each show in a simplified representation of further possible embodiments of the cooling system according to the invention;

Fig. 7 in simplified detail a heat pipe with integrated

Heat exchangers for a heat-transporting liquid medium, for example water;

Fig. 8 - 14 respectively in different sectional views and in plan view possible embodiments of the heat pipe or its elements.

The generally designated 1 in Figures 1 and 2 cooling system is used for cooling a hard disk 2, in close arrangement with further, in Figure 2 schematically indicated by broken lines 3 flat components, such as hard drives, drives, etc. of a computer in a volume 4 of a housing interior of this computer is provided.

Particularly in the case of computers of high performance and with a high data flow to or from the hard disk 2, an active cooling of the hard disk 2 is required. For this serves the cooling system 1. This consists essentially of a flat, plate or cuboid heat pipe 5, which is held with its bottom in the figure 2 bottom 5.1 in a suitable manner on the top of the hard disk 2, in such a way that the bottom 5.1 the heat pipe 5 is in a thermal contact with an extremely low heat transfer resistance with the hard disk 2. To achieve this, a thin layer 6 made of a thermal compound is provided between the top of the hard disk 2 and the bottom 5.1 of the heat pipe 5.

In the illustrated embodiment, the heat pipe 5 has a width B, which is equal to the size or width of the also cuboid hard drive 2 and the likewise cuboid housing of this hard drive. The length L of the heat pipe 5 is greater than the dimension that has the hard disk 2 in the corresponding axial direction, so that the hard disk 2 is completely covered on its upper side by the heat pipe 5 or its partial length M, but the heat pipe 5 with a partial length 12 on the hard disk 2 and thereby in particular from the hard disk 2 and other components 3 receiving volume 4 protrudes. The partial length 11 forms the first heat from the hard disk 2 receiving area of the heat pipe 5. The partial length 12 forms the second, to be cooled or heat from the heat pipe 5 laxative area. The heat pipe 5 has a height H, which is smaller by a multiple than the width B, for example, at most 25% of the width B corresponds.

On the partial length 12, a heat exchanger 7 is provided, which is part of an outer cooling circuit and flows through a heat-transporting medium, for example water. The heat exchanger is embodied, for example, in the manner known to the person skilled in the art from DE 197 10 783 A1, ie it consists of a stack of a plurality of interconnected plates of a material that conducts heat well, for example in the form of copper foils. The inside of this stack plates are structured with openings such that between the inlet 7.1 and the outlet 7.2 of the heat exchanger 7 results in a manifold branching flow path for the heat-transporting medium.

Part of the cooling circuit are also an electrically operated circulation pump 8, a storage and equalizing vessel 9 for the heat-transporting medium and an outer cooler or heat exchanger 10 with blower 1. 1. The heat exchanger 10 is formed for example by a plurality of plate-shaped heat exchanger elements, which are parallel to each other and are provided spaced from each other and are flowed through by the heat-transporting medium. The spaces between these heat exchanger plates are then flowed through by the air flow generated by the fan 11, as indicated in the figure 1 by the arrow A. Of course, other embodiments of the outer heat exchanger 10 are possible.

The heat generated by the hard disk 2 causes on the part length 11 evaporation of the heat-transporting medium in the outwardly completely or hermetically sealed interior of the heat pipe 5. The vaporized medium then passes within the interior of the heat pipe to the heat exchanger 7 having partial length 12 and is cooled there, with the loss of heat loss, so that the medium can then flow back as condensate or in the liquid state to the part lying above the hard drive 2 part of the heat pipe or to the local area of the interior of the heat pipe 5.

As a heat-transporting medium for the heat pipe is z. As alcohol or an alcohol / water mixture. Also, pure water is suitable as a heat-transporting medium for the heat pipe 5, wherein the pressure inside the heat pipe is set so that evaporation of the heat-transporting medium at the operating temperature of the hard disk 2 is reached on the part length 11 and this medium condenses again on the over the hard disk 2 wegstehende part length 12 of the heat pipe by the cooling effect of the heat exchanger 7.

The particular advantage of the cooling system 1 is that the heat exchanger 7 is arranged outside the volume 4, that is, where there is sufficient space, the height of the heat exchanger 7 in an axial direction to the bottom 5.1 and 5.2 top side of the heat pipe 5, is selected so that the heat exchanger 7 does not protrude above the level of the top of another, the hard disk 2 adjacent functional element, so that on this further functional element 3, if necessary, a further heat pipe 5 are provided with a connected to a coolant circuit heat exchanger 7 can.

It was assumed above that the heat exchanger 7 is located on the upper side 5.2 of the heat pipe 5. Basically, of course, there is also the possibility to install this heat exchanger on the bottom 5.1 of the heat pipe or to arrange both on the bottom 5.1 and on the top 5.2 each have a heat exchanger.

The heat exchanger 7 is suitably connected to the heat pipe 5 to achieve an extremely good heat transfer, this is the heat exchanger 7, for example, soldered to the heat pipe 5 or connected to the heat pipe 5 with mechanical fasteners, and then again preferably using a layer made of thermal compound between the heat exchanger 7 and the heat pipe. 5

Advantageously, the heat exchanger 10 may be provided with an associated fan 1 1 on an outer side of the housing of the electrical device, so that the heat exchanger 10 flows through the cooling flow at a corresponding fan opening of the device housing passes directly into the environment. FIG. 3 shows, in simplified representation and in side view as a further possible embodiment, a cooling system 1 a, which differs from the cooling system 1 essentially in that, instead of an external cooling circuit for a liquid heat transporting medium, at the partial length 12 projecting beyond the hard disk 2 the heat pipe 5, ie in turn outside of the volume 4, a cooling ribs exhibiting cooler or heat sink 12 is provided together with an electrically operated fan 13, so that here the cooling of the heat pipe 5 is done directly by the flowing past the heat sink 12 air.

FIG. 4 shows, as a further possible embodiment, a cooling system 1b, which differs from the cooling system 1 in that, in addition to the heat exchanger 7, a further heat exchanger 14 is provided in the outer cooling circuit of the liquid heat transporting medium, which, for example, is similar to the heat exchanger 7 is executed, in this embodiment, but directly for cooling another, for example, not housed in the volume 4 component of the device, for example, for cooling a processor 15 is used.

The heat exchanger 14 is arranged directly on the housing of the further component 15 and is also flowed through by the heat-transporting medium of the outer cooling circuit. In the illustration of Figure 4, the heat exchanger 14 is in series with the heat exchanger 7, in such a way that the heat-transporting medium first flows through the heat exchanger 7 and then the heat exchanger 14.

FIG. 5 shows a similar cooling system 1 c, which differs from the cooling system 1 b only in that the heat exchanger 7 or the further heat exchanger 14 are functionally arranged in parallel in the outer cooling circuit, in each case in a branch of this cooling circuit, the one own Circulation pump 8 has. This ensures that both heat exchangers 7 and 14 are optimally flowed through by the heat-transporting medium. Furthermore, it is possible to optimally regulate the circulating pumps 8 as a function of the temperature of the heat exchangers 7 or 14 and thus depending on the temperature of the heat pipe 5 or the further component 15.

In the system 1 c, but it is also possible to provide only a single circulation pump 8, for example, between the reservoir and surge tank 9 and the branch point at which the cooling circuit in the two, through the heat exchanger 7 and durch die Wärmetauscher 14 leading flow paths branches.

Of course, it is also possible in the cooling system 1 b or 1 c to provide more than two heat exchangers in the cooling circuit and / or to arrange the heat exchanger 14 on a further heat pipe 5, which then for cooling a further component, for example a further in the volume 4 underused component, for example, another hard drive 2 or another drive is used.

FIG. 6 shows, as a further possible embodiment, a cooling system 1d which serves for cooling at least one component, for example another hard disk 2, but preferably for cooling a plurality of components, for example a further hard disk 2. For cooling each component or each hard disk 2 is a separate, flat heat pipe 5 is provided, the heat loss their receiving end or partial length M on the housing of the respective

Component, for example, the hard disk 2 is secured in good thermal contact and extends with their projecting beyond the component part length 12 in a cooling channel 16, which is flowed through by a cooling medium, for example in the simplest case of cooling air or by a liquid cooling medium. By corresponding seals 17, the cooling channel 16 is sealed at the passage point of the respective heat pipe 5 to the outside. The cooling channel 16 is for example in the housing of an electronic device, eg. As a computer together with the necessary components for the coolant flow and formed on its wall so that even when retrofitting other functional elements or components to be cooled these functional elements associated heatpipes 5 are introduced through prepared openings in the wall of the cooling channel 16 in this can, again using the seals 17th

For the sake of simplicity, the components to be cooled or hard disks 2 are shown arranged side by side in FIG. Of course, it is also possible to use these components, e.g. Disks 2 in turn to be arranged one above the other so that the heat pipes 5 lie with their surface sides in planes perpendicular to the longitudinal extent of the cooling channel 16.

Furthermore, it is also possible to arrange the components or functional elements to be cooled in each case in groups, the functional elements of each group are then in the selected representation for the figure 6 in an axial direction perpendicular to the plane behind the other and the top and bottom of the heat pipes in planes parallel to the longitudinal extent of the cooling channel 16th

FIG. 7 shows, in a schematic representation as a further possible embodiment, a heat pipe 5a that differs from the heat pipe 5 essentially in that the heat exchanger 7a through which the heat transporting medium of the external cooling circuit flows and which corresponds to the heat exchanger 7 is integrated into the heat pipe 5a that is, the projecting over the hard disk 2 part length 12 of the heat pipe 5a and the closed to the outside flat cuboid or plate-shaped housing of this heat pipe not only forms the condensation region for the heat-transporting, evaporable medium of the heat pipe 5a, but at the same time also the heat exchanger 7a or the part of this heat exchanger through which the heat-transporting medium of the outer cooling circuit flows.

The heat pipe 5a is flat over its entire area at the top and bottom, and also in the region of the heat exchanger 7a, so that this heat pipe is particularly suitable for electronic devices that have a very narrow or compact design.

FIGS. 8ff show, in a simplified representation and in section, further embodiments of the heat pipe, which can be used instead of the heat pipes 5 and 5a, respectively.

FIG. 8 shows a construction, known for example from DE 198 188 39 A1, of the flat, cuboid or plate-shaped heat pipe 5b in such a way that, for example, FIG. B. by a plurality of interconnected layers in a stack and by correspondingly structured openings in the layers at least one over the entire length and width of the heat pipe 5b extending gas path or gas channel 18 and at least one also extending over the entire length and width of the heat pipe , capillary liquid channel 19 are formed, said capillary liquid channel is formed by finer openings in the corresponding plates of the heat pipe and / or by incorporation of the capillary structure forming filler material and / or by a capillary structure forming porous surface coating, etc.

In the gas channel 18, the vaporized heat transporting medium flows from the part 11 of the heat pipe connected to the hard disk or another functional element to be cooled to the cooled part 12 of the heat pipe 5, where the heat transporting medium condenses and flows back through the liquid channel 19 to the heated part 11 of the heat pipe.

In order to achieve for the heat pipe 5b a required for the heat transfer disk 2 / heat pipe 5 or heat pipe 5 / heat exchanger 7, the most flat bottom 5.1 and 5.2 top, despite the significant pressure differences between the ambient pressure and the pressure inside the heat pipe 5b, the heat pipe-forming plates are structured such that a plurality of continuous posts 21 results, each of which extends from the bottom 5.1 to the top 5.2.

FIG. 9 shows, as a further possible embodiment, a heat pipe 5c in which the entire, hermetically sealed interior of the heat pipe 5c is filled with a material 22 having a high thermal conductivity which forms a capillary structure, that is to say structurally visible no separate gas and fluid paths are provided. Via the posts 21 or via corresponding webs, which extend for example in the longitudinal direction of the formed as a flat plate or a flat cuboid heat pipe 5c and are each interrupted, in turn, the required stability of the heat pipe 5c in particular against deformation due to the pressure differences between Environment and interior of the heatpipe reached.

As a material 22 is z. A fine woven fabric or nonwoven fabric made of a heat-conductive material, e.g. Metal fibers, for example copper fibers and / or ceramic fibers and / or carbon fibers, for example also of nano-carbon, silicon carbide (SiC).

According to FIG. 10, the heat pipe 5c is produced in that two identical plates 23 are made of a material that conducts heat well, for example Metal, e.g. B. copper, each with a flat side and with a protruding, peripheral edge portion 24, recesses 25 and with internal webs or posts 26 are made that introduced into the recesses 25, the material 22 and that the plates 23 then in a suitable manner to the Edge region 24 and to the webs 26 are connected to each other, to form an outwardly closed interior with formed by the projections or webs 26 through posts 21st

Another way of producing, according to FIG. 11, is that only one plate 23 is used instead of two plates 23, but preferably with deeper recesses 25, and that after the capillary material 22 has been introduced into the recesses 25 on the plate 23 another, flat plate made of a heat-conducting material, such as copper is applied.

FIG. 12 shows a plan view of the heat pipe of FIGS. 10 or 11.

Another possibility for the production of the heat pipe 5c is shown in FIGS. 13 and 14, of which FIG. 13 is again a sectional illustration and FIG. 14 is a plan view of the underside of the heat pipe. On a plate 28 by deep drawing from a heat well-conductive material, such as a

Copper sheet is provided with a peripheral edge 29, with recesses 30 and protrusions 31, after the introduction of the capillary material 22 in the interior formed by the recesses 30, the plate 27 in a suitable manner, for example, again by soldering, by DCB process or active soldering attached. In this embodiment, for example, only the side of the heat pipe formed by the plate 27 is connected to the component to be cooled and the radiator or heat sink. Basically, the production of the respective heat pipe 5 - 5c in the form that after completion of the outer housing of the heat pipe and the respective capillary structure within the housing via at least one remaining opening, the heat-transporting medium is introduced into the interior of the heat pipe, and Although such a way that still a certain gas space remains, which is then evacuated for example and / or filled with a corrosion-preventing protective gas, in such a way that in the hermetically sealed interior of the heat pipe then necessary for the operation of the heat pipe pressure (also Negative pressure) is present.

The invention has been described above by means of exemplary embodiments. It is understood that numerous changes and modifications are possible without thereby departing from the inventive idea underlying the invention.

LIST OF REFERENCE NUMBERS

1, 1 a, 1 b, 1 c, 1 d Kü hl system

2 hard disk

3 other functional element, such as drive

4 volumes of the device interior

5, 5a, 5b, 5c heat pipe

5.1 bottom

5.2 Heatp i pe top

6 layer of thermal compound

7 heat exchangers

7.1 inlet

7.2 outlet

8 circulation pump

9 storage and equalization tanks

10 outer heat exchanger

11 fans

12 heat sinks

13 fans

14 heat exchangers

15 other components, such as processor

16 cooling channel

17 seal

18 plate of thermally conductive material, for example

metal

19 gas channel

20 fluid channel

21 posts

22 capillary material 23 plate

24 peripheral edge

25 deepening

26 bridge 27 plate

28 plate

29 peripheral edge

30 deepening

31 bridge or projection

A cooling air flow

B width of the heat pipe

L Overall length of the heat pipe

I Part length of the heat pipe H Height of the heat pipe

Claims

claims

1. Cooling system for cooling a hard disk (2) or the like. Functional element or component of an electronic device, such as a computer, with at least one heat pipe (5, 5a, 5b, 5c), with a first heat receiving area (M) and thermally is connected flat with the component to be cooled (2) and with at least one heat-emitting second region (12) laterally beyond the component (2), characterized in that the heat pipe (5, 5b, 5c) as a flat, cuboid or plate-shaped heat pipe is formed.

2. Cooling system according to claim 1, characterized in that the at least one heat pipe (5, 5a, 5b, 5c) covers the component to be cooled (2) with its first region (M) completely or almost completely on one side.

3. Cooling system according to claim 1 or 2, characterized in that at least one cooler or cooling element (7, 12) is provided for dissipating the heat at the second region (12) of the at least one heat pipe (5, 5a, 5b, 5c).

4. Cooling system according to claim 3, characterized in that the at least one cooling element is a heat sink (12), preferably with associated fan (13).

5. Cooling system according to claim 3 or 4, characterized in that the at least one cooling element is at least one of a heat-transporting medium flowed through cooler or heat exchanger (7).

6. Cooling system according to claim 5, characterized in that the at least one heat exchanger (7) is part of an external cooling circuit for a liquid, heat-transporting medium, and that the cooling circuit at least one Circulation pump (8) and an outer cooler or heat exchanger (10) preferably with at least one fan (1 1).

7. Cooling system according to one of the preceding claims, characterized in that at least two heat exchangers (7, 14) are provided in parallel or in series in the outer cooling circuit.

8. Cooling system according to one of the preceding claims, characterized in that the at least one heat pipe (5, 5a, 5b, 5c) has at least one hermetically sealed, a heat-transporting medium holding interior.

9. Cooling system according to claim 8, characterized in that the at least one, hermetically sealed interior at least one from the first region (H) to the second region (12) of the heat pipe extending gas path and one from the second region (12) back to the first Has area (11) extending capillary liquid path.

10. Cooling system according to claim 9, characterized in that the gas path and the fluid path run side by side.

11.Kühlsystem according to one of the preceding claims, characterized in that the at least one hermetically sealed interior of the heat pipe (5c) is completely or almost completely filled with a capillary structure forming material (22), so that within this material, the gas path and the Train fluid path automatically.

12. Cooling system according to claim 1 1, characterized in that the capillary

Material (22) made of a material with high thermal conductivity, for example Metal, e.g. As copper, ceramic, z. As silicon carbide ceramic and / or carbon fibers, for. B. consists of nano-carbon fiber.

13. Cooling system according to one of the preceding claims, characterized in that the capillary material (22) is a fiber material, for example a fabric or a flow.

14. Cooling system according to one of the preceding claims, characterized in that the upper side (5.2) and lower side (5.1) of the heat pipe (5, 5a, 5b, 5c) by a plurality of connecting elements, such as posts and / or webs (21) are interconnected ,

15. Cooling system according to one of the preceding claims, characterized in that the at least one heat exchanger (7a) in the heat pipe (5a) is integrated.

16. Electronic device, such as computer, with at least one component to be cooled, for example, hard disk (2), which is housed together with other components (3) in a volume (4) of a housing interior, for example in densely packed design, characterized in that Heat pipe (5, 5a, 5b, 5c) for cooling the at least one component (2) laterally beyond this component and over the volume (4).

17.Heatpipe, for example, for use in the cooling system or an electronic device according to one of the preceding claims, comprising at least one formed in a heatpipe body, hermetically sealed to the outside and containing a heat-transporting medium interior space, characterized in that the interior is completely or almost completely is filled with a capillary structure forming material.

18.Heatpipe according to claim 17, characterized by its design as a flat, cuboid or plate-shaped heat pipe.