WO2006085707A1 - Boitier d'un microphone electrostatique possedant une fente de ventilation - Google Patents

Boitier d'un microphone electrostatique possedant une fente de ventilation Download PDF

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Publication number
WO2006085707A1
WO2006085707A1 PCT/KR2005/002614 KR2005002614W WO2006085707A1 WO 2006085707 A1 WO2006085707 A1 WO 2006085707A1 KR 2005002614 W KR2005002614 W KR 2005002614W WO 2006085707 A1 WO2006085707 A1 WO 2006085707A1
Authority
WO
WIPO (PCT)
Prior art keywords
case
base ring
ring
insulating base
disposed above
Prior art date
Application number
PCT/KR2005/002614
Other languages
English (en)
Inventor
Jong Sub Lee
Suk Jin Kim
Original Assignee
Bse Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bse Co., Ltd. filed Critical Bse Co., Ltd.
Publication of WO2006085707A1 publication Critical patent/WO2006085707A1/fr

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B63—SHIPS OR OTHER WATERBORNE VESSELS; RELATED EQUIPMENT
    • B63B—SHIPS OR OTHER WATERBORNE VESSELS; EQUIPMENT FOR SHIPPING 
    • B63B35/00—Vessels or similar floating structures specially adapted for specific purposes and not otherwise provided for
    • B63B35/44—Floating buildings, stores, drilling platforms, or workshops, e.g. carrying water-oil separating devices
    • B63B35/4406—Articulated towers, i.e. substantially floating structures comprising a slender tower-like hull anchored relative to the marine bed by means of a single articulation, e.g. using an articulated bearing
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10—General applications
    • H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's

Definitions

  • the present invention relates to a condenser microphone having ventilation slit and a case thereof.
  • a size of electronic devices such as a cellular phone, telephone and a camcorder is reduced.
  • a size of a condenser microphone which is an acoustic input component used for the electronic devices is also reduced. As shown in Fig.
  • a back type condenser microphone commonly used generally includes a case 10 for defining an external shape and for providing a electrical path between a PCB 70 and a diaphragm 22, a vibrating plate 20 comprising the diaphragm 22 vibrating according to an acoustic pressure and a polar ring 24 for fixing the diaphragm 22 and for providing an electrical path between the diaphragm 22 and the case 10, a back electret 50 for accumulating a charge and facing the diaphragm 22 to form a capacitor, a metal base ring 60 for providing an electrical path between the back electret 50 and the PCB 70, and an insulating base ring 40 for providing an electrical insulation between the metal base ring 60 and the case 10.
  • positions of the vibrating plate 20 and the back electret 50 are interchanged.
  • FIG. 1 An arrow shown in Fig. 1 denotes the ventilation path between the outside air and the air inside the chamber of the condenser microphone 100.
  • the air inside the c hamber passes between the metal base ring 60 and the PCB 70 through a ventilation pattern (a pattern such as a groove formed on a bottom surface of the PCB to discharge an air inside the metal base ring 60 to outside of the metal base ring 60) formed on the PCB 70, and then flows between the insulating base ring 40 and the metal base ring 60.
  • a ventilation pattern a pattern such as a groove formed on a bottom surface of the PCB to discharge an air inside the metal base ring 60 to outside of the metal base ring 60
  • the air inside the chamber is again connected to the outside air through a microscopic gap which may be formed between a spacer ring 30 and the insulating base ring 40, and through a space between an inner wall of the case 10 and the polar ring 24 of the vibrating plate 20.
  • the air may be ventilated between the polar ring 24 and the case 10 by forming a ventilation pattern at a bottom surface of the case 10 similar to that of the PCB 70.
  • an inner diameter of the insulating base ring 40 and an outer diameter of the metal base ring 60 may be almost the same although they are within a tolerable error range so that the both base rings 40 and 60 are adhered during assembly. In such case, the ventilation path is not secured, resulting in a defect by degradation of a sensitivity of the condenser microphone.
  • a degree of process precision of the insulating base ring 40 and the metal base ring 60 must be improved, resulting in a problem of an increase in manufacturing cost of components.
  • a case of a condenser microphone for enclosing an internal component of the condenser microphone comprising a side ventilation slit for providing a ventilation path between an air inside a chamber and an outside air, wherein the side ventilation slit includes a groove extending from an inner portion of a bottom surface of the case where an acoustic hole is disposed to an inner sidewall of the case.
  • a condenser microphone comprising a case having an acoustic hole disposed at a bottom portion thereof for enclosing an internal component, a vibrating plate for converting an acoustic pressure to a vibration, the vibrating plate including a polar ring in contact with the bottom portion of the case and a diaphragm, a spacer ring disposed above the vibrating plate, an insulating base ring disposed above the spacer ring, the insulating base ring being in contact with an inner sidewall of the case, a dielectric plate enclosed by the insulating base ring, dielectric plate having a penetration hole therethrough and being disposed above the spacer ring, a metal base ring enclosed by the insulating base ring, the metal base ring being disposed above the dielectric plate, and a PCB disposed above the metal base ring, wherein the PCB comprises a first ventilation pattern for ventilating an air through an interface between the PCB and the metal base ring, the case
  • a condenser microphone comprising a case having an acoustic hole disposed at a bottom portion thereof for enclosing an internal component, a dielectric plate having a penetration hole therethrough, the dielectric plate being in contact with the case, a spacer ring disposed above the dielectric plate, an insulating base ring disposed above the spacer ring, the insulating base ring being in contact with an inner sidewall of the case, a vibrating plate for converting an acoustic pressure to a vibration including a polar ring and a diaphragm, the vibrating plate being enclosed by the insulating base ring and disposed above the spacer ring, a metal base ring enclosed by the insulating base ring, metal base ring being disposed above the vibrating plate, and a PCB disposed above the metal base ring, wherein the PCB comprises a first ventilation pattern for ventilating an air through an interface between the PCB and the metal base ring, the case comprising:
  • a condenser microphone comprising a case having an acoustic hole disposed at a bottom portion thereof for enclosing an internal component, an insulating base ring enclosed to be in contact with an inner sidewall and the bottom portion of the case, a vibrating plate for converting an acoustic pressure to a vibration including a polar ring and a diaphragm, the vibrating plate being enclosed by the insulating base ring and being in contact with the bottom portion of the case, a spacer ring enclosed by the insulating base ring, the spacer ring being disposed above the vibrating plate, a dielectric plate enclosed by the insulating base ring, the dielectric plate having a penetration hole therethrough and being disposed above the spacer ring, a metal base ring enclosed by the insulating base ring, the metal base ring being disposed above the dielectric plate, and a PCB disposed above the metal base ring, wherein the PCB comprises a first ventilation pattern for ventilating
  • a condenser microphone comprising a case having an acoustic hole disposed at a bottom portion thereof for enclosing an internal component, an insulating base ring enclosed by the case, the insulating base ring being in contact with an inner sidewall and the bottom portion of the case, a dielectric plate enclosed by the insulating base ring, the dielectric plate having a penetration hole therethrough and being in contact with the bottom portion of the case, a spacer ring enclosed by the insulating base ring, the spacer ring disposed above the dielectric plate, a vibrating plate for converting an acoustic pressure to a vibration including a polar ring and a diaphragm, the vibrating plate being enclosed by the insulating base ring and being disposed above the spacer ring, a metal base ring enclosed by the insulating base ring, the metal base ring being disposed above the vibrating plate, and a PCB disposed above the metal base ring, wherein the PCB
  • FIG. 1 is cross-sectional view illustrating a structure of an air flow of a conventional the condenser microphone.
  • FIG. 2 is perspective view illustrating a condenser microphone case in accordance with the present invention.
  • FIG. 3 is cross-sectional view illustrating a structure of an air flow in accordance with a first embodiment of the present invention.
  • FIG. 4 is cross-sectional view illustrating a structure of an air flow in accordance with a second embodiment of the present invention.
  • FIG. 5 is cross-sectionalview illustrating a structure of an air flow in accordance with a third embodiment of the present invention.
  • FIG. 6 is cross-sectional view illustrating a structure of an air flow in accordance with a fourth embodiment of the present invention. Best Mode for Carrying Out the Invention
  • Fig. 2 illustrates a condenser microphone case 10 in accordance with the present invention.
  • the condenser microphone case 10 is a circular-shaped or rectangular- shaped metallic case having an acoustic hole 12, and encloses internal components 20, 30, 40, 50, 60and 70. When an assembly is complete, an upper portion of the condenser microphone case 10 is curled inward for sealing.
  • the condenser microphone case lOin accordance with the present invention comprises a side ventilation slit 14 for providing a ventilation path between an air inside a chamber and an outside air, wherein the side ventilation slit 14 includes a groove disposed on an inner sidewall of the case 10, and extends from an inner portion of a bottom surface of the case 10 where an acoustic hole 12 is disposed.
  • the side ventilation slit 14 may be formed by drawing or cutting the inner sidewall of the case 10 perpendicular to the bottom surface, or by casting the case 10 to form the groove.
  • the number of two side ventilation slits 14 may be formed so that the two side ventilation slits 14 faces each other as shown, or one or more than two side ventilation slits 14 may be formed according to an acoustic characteristic to adjust a sensitivity characteristic.
  • a ventilation path may be enlarged or shrunk by controlling a width and a depth of the side ventilation slit 14 to have a desired acoustic characteristic for facile adjustment of characteristics.
  • the condenser microphone case 10 having the side ventilation slit 14 even when outer sidewalls of the internal components 20, 30, 40, 50, 60 and 70 of the condenser microphones 200, 300, 400 and 500 are enclosed to be adhered to a inner sidewall of the condenser microphone case 10, includes an outer ventilation path through the side ventilation slit 14shown as arrows in Figs. 3 through 6, a degradation of the sensitivity characteristic due to a faulty assembly defect or component size does not occur when compared to the ventilation path formed between the conventional base rings 40, 60 shown in Fig. 1 so that a stable yield can be expected.
  • the side ventilation slit 14 formed in such manner that the side ventilation slit 14 is connected to a bottom ventilation pattern disposed at the inner portion of the bottom surface for an outflow of the air that has passed through the side ventilation slit 14.
  • Figs. 4 through 6 illustrate embodiments wherein the case of the present invention is applied to various condenser microphones.
  • a back type condenser microphone 200 wherein a polar ring 24 of a vibrating plate 20 is in contact with a bottom surface of a case the condenser microphone case 10 is shown.
  • a front type condenser microphone 300 wherein a dielectric plate 50 is in contact with a bottom surface of a condenser microphone case 10 is shown.
  • a back type condenser microphone 400 wherein an insulating base ring 40 is in contact with a bottom surface of a condenser microphone case 10 is shown.
  • a front type condenser microphone 500 wherein an insulating base ring 40 is in contact with a bottom surface of a case the condenser microphone case 10 is shown.
  • the condenser microphone 200 similar to the conventional condenser microphone 100, comprises a case 10 having an acoustic hole 12 at a bottom portion thereof for enclosing an internal component, a vibrating plate 20 for converting an acoustic pressure to a vibration, the vibrating plate 20 including a polar ring 24 which is in contact with the bottom portion of the case 10 and a diaphragm 22, a spacer ring 30 disposed above the vibrating plate 20, an insulating base ring 40 disposed above the spacer ring 30, the insulating base ring 40 being in contact with an inner sidewall of the case 10, a dielectric plate 50 enclosed by the insulating base ring 40, dielectric plate 50 having a penetration hole 52 therethrough and being disposed above the spacer ring 30, a metal base ring 60 enclosed by the insulating base ring 40, the metal base ring 60 being disposed above the dielectric plate 50, and a PCB 70 disposed above the metal base ring
  • the case 10 comprises a side ventilation slit 14 including a groove for ventilating the air through an interface between the case 10 and the insulating base ring 40, and a second ventilation pattern 16 for ventilating the air through an interface between the case 10 and the polar ring 24.
  • the condenser microphone 300of the second embodiment is identical to that of the first embodiment except that position relations of the vibrating plate 20 and the spacer ring 30 are interchanged. Therefore, a description in detail is omitted.
  • the insulating base ring 40 encloses internal components 20, 30, 50, and 60 except a PCB 70.
  • the condenser microphone 400 in accordance with the third embodiment comprises a case 10 having an acoustic hole 12 at a bottom portion thereof for enclosing the internal components 20, 30, 40, 50, 60 and 70, an insulating base ring 40 enclosed to be in contact with an inner sidewall and the bottom portion of the case 10, a vibrating plate 20 for converting an acoustic pressure to a vibration including a polar ring 24 and a diaphragm 22, the vibrating plate 20 being enclosed by the insulating base ring 40 and being in contact with the bottom portion of thecase 10, a spacer ring 30 enclosed by the insulating base ring 40, the spacer ring 30 being disposed above the vibrating plate 20, a dielectric plate 50 enclosed by the insulating base ring 40, the dielectric plate 50 having a penetration hole 52 therethrough and being disposed above the spacer ring 30, a metal base ring 60 enclosed by the insulating base ring 40, the metal base ring 60 being disposed above the dielectric plate 50,
  • the PCB 70 comprises a first ventilation pattern for ventilating an air through an interface between the PCB 70 and the metal base ring 60
  • the case 10 comprises a side ventilation slit 14 including a groove for ventilating the air through an interface betweenthe case 10 and the insulating base ring 40 at the inner sidewall of the case 10
  • a second ventilation pattern 16 for ventilating the air through an interface between the insulating base ring 40 at the bottom portion of the case 10 and the polar ring 24.
  • the condenser microphone 500 of the fourth embodiment is identical to that of the third embodiment except that position relations of the vibrating plate 20 and the dielectric plate 50 are interchanged. Therefore, a description in detail is omitted.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Architecture (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
  • Ocean & Marine Engineering (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)

Abstract

La présente invention concerne un microphone électrostatique et son boîtier. Ledit boîtier du microphone électrostatique servant à contenir un composant interne dudit microphone présente une fente de ventilation latérale engendrant une voie de ventilation entre l'air de l'intérieur d'une chambre et l'air de l'extérieur. Ladite fente de ventilation latérale comprend une rainure s'étendant d'une partie interne d'une surface inférieure du boîtier, où un trou acoustique est situé par rapport à une paroi latérale interne du boîtier. Ceci permet de prévenir une défaillance de la sensibilité provoquée par une fermeture de la voie de ventilation, au cours de l'assemblage dudit microphone en raison d'une adhésion du composant ou d'une dimension défectueuse des composants internes, et d'ajuster facilement la caractéristique du microphone électrostatique par commande de la largeur, de la profondeur et du nombre de fentes de ventilation formées sur le boîtier.
PCT/KR2005/002614 2005-02-14 2005-08-11 Boitier d'un microphone electrostatique possedant une fente de ventilation WO2006085707A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2005-0011936 2005-02-14
KR1020050011936A KR20060091399A (ko) 2005-02-14 2005-02-14 공기유동 슬릿을 포함하는 콘덴서마이크로폰 케이스

Publications (1)

Publication Number Publication Date
WO2006085707A1 true WO2006085707A1 (fr) 2006-08-17

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PCT/KR2005/002614 WO2006085707A1 (fr) 2005-02-14 2005-08-11 Boitier d'un microphone electrostatique possedant une fente de ventilation

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KR (1) KR20060091399A (fr)
WO (1) WO2006085707A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1898666A2 (fr) * 2006-09-05 2008-03-12 BSE Co., Ltd. Microphone à condensateur électret
EP2190215A1 (fr) * 2007-09-10 2010-05-26 Hosiden Corporation Microphone à condensateur

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100797439B1 (ko) * 2006-11-21 2008-01-23 주식회사 비에스이 다각형 콘덴서 마이크로폰 조립체

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0371620A2 (fr) * 1988-11-30 1990-06-06 Matsushita Electric Industrial Co., Ltd. Microphone à électret
US5410608A (en) * 1992-09-29 1995-04-25 Unex Corporation Microphone
US6496588B1 (en) * 1999-03-11 2002-12-17 Ching-Lu Chang Directional dynamic microphone interchangeable to have unidirectional and superdirectional characteristics
EP1427250A2 (fr) * 2002-12-03 2004-06-09 Hosiden Corporation Microphone à électret
US6857569B1 (en) * 1989-04-24 2005-02-22 Ultracard, Inc. Data storage card having a non-magnetic substrate and data surface region and method for using same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0371620A2 (fr) * 1988-11-30 1990-06-06 Matsushita Electric Industrial Co., Ltd. Microphone à électret
US6857569B1 (en) * 1989-04-24 2005-02-22 Ultracard, Inc. Data storage card having a non-magnetic substrate and data surface region and method for using same
US5410608A (en) * 1992-09-29 1995-04-25 Unex Corporation Microphone
US6496588B1 (en) * 1999-03-11 2002-12-17 Ching-Lu Chang Directional dynamic microphone interchangeable to have unidirectional and superdirectional characteristics
EP1427250A2 (fr) * 2002-12-03 2004-06-09 Hosiden Corporation Microphone à électret

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1898666A2 (fr) * 2006-09-05 2008-03-12 BSE Co., Ltd. Microphone à condensateur électret
EP1898666A3 (fr) * 2006-09-05 2012-04-18 BSE Co., Ltd. Microphone à condensateur électret
EP2190215A1 (fr) * 2007-09-10 2010-05-26 Hosiden Corporation Microphone à condensateur
EP2190215A4 (fr) * 2007-09-10 2012-06-27 Hosiden Corp Microphone à condensateur

Also Published As

Publication number Publication date
KR20060091399A (ko) 2006-08-21

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