WO2006084064A3 - Selective catalytic activation of non-conductive substrates - Google Patents
Selective catalytic activation of non-conductive substrates Download PDFInfo
- Publication number
- WO2006084064A3 WO2006084064A3 PCT/US2006/003730 US2006003730W WO2006084064A3 WO 2006084064 A3 WO2006084064 A3 WO 2006084064A3 US 2006003730 W US2006003730 W US 2006003730W WO 2006084064 A3 WO2006084064 A3 WO 2006084064A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- metal
- catalytic
- conductive substrate
- pattern
- catalytic ink
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/208—Multistep pretreatment with use of metal first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
- H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0709—Catalytic ink or adhesive for electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1157—Using means for chemical reduction
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacturing Of Electric Cables (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
A process of providing a pattern of a metal on a non-conductive substrate to create loop antennae for wireless articles, for creating circuitry for smart cards, such as phone cards, and for providing electromagnetic shielding of electronic devices is provided. The method comprises the steps of catalyzing the non-conductive substrate by applying a catalytic ink, reducing a source of catalytic metal ions in the catalytic ink to its associated metal, depositing electroless metal on the pattern of catalytic ink on the surface of the substrate; and plating electrolytic metal on the electroless metal layer to produce the desired pattern of metal on the non-conductive substrate. The catalytic ink typically comprises one or more solvents, a source of catalytic metal ions, a crosslinking agent, one or more copolymers, a polyurethane polymer, and, optionally, one or more fillers.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP06734240A EP1856309A4 (en) | 2005-02-03 | 2006-02-02 | Selective catalytic activation of non-conductive substrates |
BRPI0607133A BRPI0607133B1 (en) | 2005-02-03 | 2006-02-02 | method for galvanizing a non-conductive substrate to provide shielding against electromagnetic interference |
JP2007554216A JP2008528812A (en) | 2005-02-03 | 2006-02-02 | Selective catalyst activation of non-conductive substrates |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/049,828 | 2005-02-03 | ||
US11/049,828 US20050241951A1 (en) | 2004-04-30 | 2005-02-03 | Selective catalytic activation of non-conductive substrates |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2006084064A2 WO2006084064A2 (en) | 2006-08-10 |
WO2006084064A3 true WO2006084064A3 (en) | 2007-10-25 |
Family
ID=36777926
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2006/003730 WO2006084064A2 (en) | 2005-02-03 | 2006-02-02 | Selective catalytic activation of non-conductive substrates |
Country Status (6)
Country | Link |
---|---|
US (1) | US20050241951A1 (en) |
EP (1) | EP1856309A4 (en) |
JP (1) | JP2008528812A (en) |
CN (1) | CN101142343A (en) |
BR (1) | BRPI0607133B1 (en) |
WO (1) | WO2006084064A2 (en) |
Families Citing this family (26)
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DE102007037248A1 (en) * | 2006-09-15 | 2008-03-27 | Samsung Electro - Mechanics Co., Ltd., Suwon | Method for producing a metal film conductor forming body |
GB0619539D0 (en) * | 2006-10-04 | 2006-11-15 | Hexcel Composites Ltd | Curable resin films |
JP2008184679A (en) * | 2007-01-31 | 2008-08-14 | Okuno Chem Ind Co Ltd | Activation composition for electroless palladium plating |
US20090128417A1 (en) * | 2007-11-16 | 2009-05-21 | Rcd Technology, Inc. | Electroless/electrolytic seed layer process |
JP5418497B2 (en) * | 2008-06-11 | 2014-02-19 | コニカミノルタ株式会社 | Metal pattern forming method and metal pattern |
KR20100013033A (en) * | 2008-07-30 | 2010-02-09 | 삼성전자주식회사 | Conductive ink/paste printed circuit board having plating layer and method for manufacturing the same |
JP5396871B2 (en) * | 2009-01-20 | 2014-01-22 | コニカミノルタ株式会社 | Ink jet ink and metal pattern forming method |
EP2227075B1 (en) * | 2009-03-03 | 2012-03-14 | Konica Minolta IJ Technologies, Inc. | Forming method of metallic pattern |
JP5375725B2 (en) * | 2010-04-12 | 2013-12-25 | コニカミノルタ株式会社 | Metal pattern manufacturing method and metal pattern |
JP2011222797A (en) * | 2010-04-12 | 2011-11-04 | Konica Minolta Ij Technologies Inc | Catalyst pattern manufacturing method and metal pattern manufacturing method |
US8620271B2 (en) * | 2011-04-29 | 2013-12-31 | Apple Inc. | Compact form factor integrated circuit card and methods |
KR101904095B1 (en) * | 2011-08-17 | 2018-10-04 | 롬 앤드 하스 일렉트로닉 머트어리얼즈 엘엘씨 | Stable tin free catalysts for electroless metallization |
WO2013169345A1 (en) * | 2012-05-11 | 2013-11-14 | Unipixel Displays, Inc. | Ink composition for manufacture of high resolution conducting patterns |
CN103572263B (en) * | 2012-07-28 | 2016-05-11 | 比亚迪股份有限公司 | The method of metallization of plastic surface and surface have the plastic product of metal pattern |
KR101735223B1 (en) * | 2012-07-30 | 2017-05-12 | 이스트맨 코닥 캄파니 | Ink formulations for flexographic printing of high-resolution conducting patterns |
CN103700930A (en) * | 2012-09-27 | 2014-04-02 | 启碁科技股份有限公司 | Manufacturing method for metallic component and manufacturing method for antenna component |
USD749062S1 (en) * | 2013-01-02 | 2016-02-09 | Callas Enterprises Llc | Combined floor mat and EAS antenna |
JP6266353B2 (en) * | 2013-02-20 | 2018-01-24 | 三菱製紙株式会社 | Conductive material precursor and method for producing conductive material |
CN203721710U (en) * | 2013-11-06 | 2014-07-16 | 上海蓝沛新材料科技股份有限公司 | Intelligent card module |
CN104716423A (en) * | 2013-12-12 | 2015-06-17 | 位速科技股份有限公司 | Three-dimensional antenna manufacturing method |
CN104407729B (en) * | 2014-10-14 | 2018-01-09 | 业成光电(深圳)有限公司 | Electronic installation, touch screen, the preparation method of nesa coating and nesa coating |
KR101681663B1 (en) * | 2016-07-12 | 2016-12-12 | 문길환 | Conductive Pattern Laminate and Producing Method Thereof |
EP3364190A1 (en) * | 2017-02-20 | 2018-08-22 | Panka Cancer Research AG | Method of detecting cancer or cancer cells |
GB201805131D0 (en) * | 2018-03-29 | 2018-05-16 | Imperial Innovations Ltd | Metal fabrics and membranes |
CN108624907A (en) * | 2018-04-26 | 2018-10-09 | 复旦大学 | Nonmetal basal body efficient catalytic electrode and preparation method thereof |
US11015255B2 (en) | 2018-11-27 | 2021-05-25 | Macdermid Enthone Inc. | Selective plating of three dimensional surfaces to produce decorative and functional effects |
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US5403649A (en) * | 1989-12-21 | 1995-04-04 | Monsanto Company | Fabricating metal articles from printed images |
US6054507A (en) * | 1997-03-10 | 2000-04-25 | Japan Science And Technology Corporation | Metal-organic polymer composite structure and production thereof |
US6461678B1 (en) * | 1997-04-29 | 2002-10-08 | Sandia Corporation | Process for metallization of a substrate by curing a catalyst applied thereto |
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-
2005
- 2005-02-03 US US11/049,828 patent/US20050241951A1/en not_active Abandoned
-
2006
- 2006-02-02 WO PCT/US2006/003730 patent/WO2006084064A2/en active Application Filing
- 2006-02-02 EP EP06734240A patent/EP1856309A4/en not_active Withdrawn
- 2006-02-02 BR BRPI0607133A patent/BRPI0607133B1/en active IP Right Grant
- 2006-02-02 JP JP2007554216A patent/JP2008528812A/en active Pending
- 2006-02-02 CN CNA200680002175XA patent/CN101142343A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5403649A (en) * | 1989-12-21 | 1995-04-04 | Monsanto Company | Fabricating metal articles from printed images |
US6054507A (en) * | 1997-03-10 | 2000-04-25 | Japan Science And Technology Corporation | Metal-organic polymer composite structure and production thereof |
US6461678B1 (en) * | 1997-04-29 | 2002-10-08 | Sandia Corporation | Process for metallization of a substrate by curing a catalyst applied thereto |
Non-Patent Citations (1)
Title |
---|
See also references of EP1856309A4 * |
Also Published As
Publication number | Publication date |
---|---|
EP1856309A2 (en) | 2007-11-21 |
CN101142343A (en) | 2008-03-12 |
US20050241951A1 (en) | 2005-11-03 |
JP2008528812A (en) | 2008-07-31 |
EP1856309A4 (en) | 2009-10-28 |
BRPI0607133B1 (en) | 2016-11-29 |
BRPI0607133A2 (en) | 2009-08-04 |
WO2006084064A2 (en) | 2006-08-10 |
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