WO2006041656A3 - Methods and apparatus for monitoring a process in a plasma processing system by measuring a plasma frequency - Google Patents
Methods and apparatus for monitoring a process in a plasma processing system by measuring a plasma frequency Download PDFInfo
- Publication number
- WO2006041656A3 WO2006041656A3 PCT/US2005/034312 US2005034312W WO2006041656A3 WO 2006041656 A3 WO2006041656 A3 WO 2006041656A3 US 2005034312 W US2005034312 W US 2005034312W WO 2006041656 A3 WO2006041656 A3 WO 2006041656A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- plasma
- plasma processing
- value
- processing chamber
- processing system
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32917—Plasma diagnostics
- H01J37/3299—Feedback systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32917—Plasma diagnostics
- H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
Abstract
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007533684A JP2008515199A (en) | 2004-09-27 | 2005-09-23 | Process monitoring method and apparatus for plasma processing system by plasma frequency measurement |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/952,562 | 2004-09-27 | ||
US10/952,562 US20060065632A1 (en) | 2004-09-27 | 2004-09-27 | Methods and apparatus for monitoring a process in a plasma processing system by measuring a plasma frequency |
Publications (3)
Publication Number | Publication Date |
---|---|
WO2006041656A2 WO2006041656A2 (en) | 2006-04-20 |
WO2006041656A3 true WO2006041656A3 (en) | 2007-06-14 |
WO2006041656B1 WO2006041656B1 (en) | 2007-08-09 |
Family
ID=36097838
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2005/034312 WO2006041656A2 (en) | 2004-09-27 | 2005-09-23 | Methods and apparatus for monitoring a process in a plasma processing system by measuring a plasma frequency |
Country Status (6)
Country | Link |
---|---|
US (1) | US20060065632A1 (en) |
JP (1) | JP2008515199A (en) |
KR (1) | KR20070068420A (en) |
CN (1) | CN101088149A (en) |
TW (1) | TW200624600A (en) |
WO (1) | WO2006041656A2 (en) |
Families Citing this family (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4416569B2 (en) * | 2004-05-24 | 2010-02-17 | キヤノン株式会社 | Deposited film forming method and deposited film forming apparatus |
US7323116B2 (en) * | 2004-09-27 | 2008-01-29 | Lam Research Corporation | Methods and apparatus for monitoring a process in a plasma processing system by measuring self-bias voltage |
KR100784824B1 (en) * | 2005-11-04 | 2007-12-14 | 한국표준과학연구원 | Plasma diagnostic apparatus and method |
US7902991B2 (en) * | 2006-09-21 | 2011-03-08 | Applied Materials, Inc. | Frequency monitoring to detect plasma process abnormality |
US8501631B2 (en) | 2009-11-19 | 2013-08-06 | Lam Research Corporation | Plasma processing system control based on RF voltage |
US10128090B2 (en) | 2012-02-22 | 2018-11-13 | Lam Research Corporation | RF impedance model based fault detection |
US10157729B2 (en) | 2012-02-22 | 2018-12-18 | Lam Research Corporation | Soft pulsing |
US9390893B2 (en) | 2012-02-22 | 2016-07-12 | Lam Research Corporation | Sub-pulsing during a state |
US9462672B2 (en) | 2012-02-22 | 2016-10-04 | Lam Research Corporation | Adjustment of power and frequency based on three or more states |
US9320126B2 (en) | 2012-12-17 | 2016-04-19 | Lam Research Corporation | Determining a value of a variable on an RF transmission model |
US9171699B2 (en) | 2012-02-22 | 2015-10-27 | Lam Research Corporation | Impedance-based adjustment of power and frequency |
US9114666B2 (en) | 2012-02-22 | 2015-08-25 | Lam Research Corporation | Methods and apparatus for controlling plasma in a plasma processing system |
US10325759B2 (en) | 2012-02-22 | 2019-06-18 | Lam Research Corporation | Multiple control modes |
US9502216B2 (en) | 2013-01-31 | 2016-11-22 | Lam Research Corporation | Using modeling to determine wafer bias associated with a plasma system |
US9530620B2 (en) | 2013-03-15 | 2016-12-27 | Lam Research Corporation | Dual control modes |
US9842725B2 (en) | 2013-01-31 | 2017-12-12 | Lam Research Corporation | Using modeling to determine ion energy associated with a plasma system |
US9197196B2 (en) | 2012-02-22 | 2015-11-24 | Lam Research Corporation | State-based adjustment of power and frequency |
US9295148B2 (en) | 2012-12-14 | 2016-03-22 | Lam Research Corporation | Computation of statistics for statistical data decimation |
US9368329B2 (en) | 2012-02-22 | 2016-06-14 | Lam Research Corporation | Methods and apparatus for synchronizing RF pulses in a plasma processing system |
CN102721670B (en) * | 2012-06-28 | 2014-06-04 | 南京邮电大学 | Method for measuring frequency of semiconductor plasma |
JP6113450B2 (en) * | 2012-09-07 | 2017-04-12 | 株式会社ダイヘン | Impedance adjustment device |
US9408288B2 (en) | 2012-09-14 | 2016-08-02 | Lam Research Corporation | Edge ramping |
US9043525B2 (en) | 2012-12-14 | 2015-05-26 | Lam Research Corporation | Optimizing a rate of transfer of data between an RF generator and a host system within a plasma tool |
US9155182B2 (en) | 2013-01-11 | 2015-10-06 | Lam Research Corporation | Tuning a parameter associated with plasma impedance |
US9620337B2 (en) | 2013-01-31 | 2017-04-11 | Lam Research Corporation | Determining a malfunctioning device in a plasma system |
US9779196B2 (en) | 2013-01-31 | 2017-10-03 | Lam Research Corporation | Segmenting a model within a plasma system |
US9107284B2 (en) | 2013-03-13 | 2015-08-11 | Lam Research Corporation | Chamber matching using voltage control mode |
US9119283B2 (en) | 2013-03-14 | 2015-08-25 | Lam Research Corporation | Chamber matching for power control mode |
US9502221B2 (en) * | 2013-07-26 | 2016-11-22 | Lam Research Corporation | Etch rate modeling and use thereof with multiple parameters for in-chamber and chamber-to-chamber matching |
US9594105B2 (en) | 2014-01-10 | 2017-03-14 | Lam Research Corporation | Cable power loss determination for virtual metrology |
KR102021961B1 (en) * | 2014-01-13 | 2019-11-04 | 삼성전자주식회사 | method for managing a semiconductor manufacturing equipment |
US10950421B2 (en) | 2014-04-21 | 2021-03-16 | Lam Research Corporation | Using modeling for identifying a location of a fault in an RF transmission system for a plasma system |
US9536749B2 (en) | 2014-12-15 | 2017-01-03 | Lam Research Corporation | Ion energy control by RF pulse shape |
JP2018041217A (en) * | 2016-09-06 | 2018-03-15 | 東京エレクトロン株式会社 | Abnormality detection method and semiconductor manufacturing apparatus |
CN111937114A (en) * | 2018-04-13 | 2020-11-13 | 东京毅力科创株式会社 | Apparatus and method for controlling ion energy distribution while processing plasma |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20010025691A1 (en) * | 2000-03-24 | 2001-10-04 | Seiichiro Kanno | Semiconductor manufacturing apparatus and method of processing semiconductor wafer using plasma, and wafer voltage probe |
US20030178140A1 (en) * | 2002-03-25 | 2003-09-25 | Mitsubishi Denki Kabushiki Kaisha | Plasma processing apparatus capable of evaluating process performance |
US20040027209A1 (en) * | 2002-08-09 | 2004-02-12 | Applied Materials, Inc. | Fixed matching network with increased match range capabilities |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5863376A (en) * | 1996-06-05 | 1999-01-26 | Lam Research Corporation | Temperature controlling method and apparatus for a plasma processing chamber |
US6197116B1 (en) * | 1996-08-29 | 2001-03-06 | Fujitsu Limited | Plasma processing system |
US6063234A (en) * | 1997-09-10 | 2000-05-16 | Lam Research Corporation | Temperature sensing system for use in a radio frequency environment |
US6123775A (en) * | 1999-06-30 | 2000-09-26 | Lam Research Corporation | Reaction chamber component having improved temperature uniformity |
US6302966B1 (en) * | 1999-11-15 | 2001-10-16 | Lam Research Corporation | Temperature control system for plasma processing apparatus |
-
2004
- 2004-09-27 US US10/952,562 patent/US20060065632A1/en not_active Abandoned
-
2005
- 2005-09-23 TW TW094133157A patent/TW200624600A/en unknown
- 2005-09-23 WO PCT/US2005/034312 patent/WO2006041656A2/en active Application Filing
- 2005-09-23 KR KR1020077009424A patent/KR20070068420A/en not_active Application Discontinuation
- 2005-09-23 JP JP2007533684A patent/JP2008515199A/en not_active Withdrawn
- 2005-09-23 CN CNA2005800398380A patent/CN101088149A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20010025691A1 (en) * | 2000-03-24 | 2001-10-04 | Seiichiro Kanno | Semiconductor manufacturing apparatus and method of processing semiconductor wafer using plasma, and wafer voltage probe |
US20030178140A1 (en) * | 2002-03-25 | 2003-09-25 | Mitsubishi Denki Kabushiki Kaisha | Plasma processing apparatus capable of evaluating process performance |
US20040027209A1 (en) * | 2002-08-09 | 2004-02-12 | Applied Materials, Inc. | Fixed matching network with increased match range capabilities |
Also Published As
Publication number | Publication date |
---|---|
JP2008515199A (en) | 2008-05-08 |
US20060065632A1 (en) | 2006-03-30 |
WO2006041656B1 (en) | 2007-08-09 |
WO2006041656A2 (en) | 2006-04-20 |
TW200624600A (en) | 2006-07-16 |
CN101088149A (en) | 2007-12-12 |
KR20070068420A (en) | 2007-06-29 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2006041656A3 (en) | Methods and apparatus for monitoring a process in a plasma processing system by measuring a plasma frequency | |
WO2006036820A3 (en) | Methods and apparatus for monitoring a process in a plasma processing system by measuring impedance | |
WO2006036821A3 (en) | Methods and apparatus for monitoring a process in a plasma processing system by measuring self-bias voltage | |
WO2005045890A3 (en) | Method and apparatus for etch endpoint detection | |
WO2010005930A3 (en) | Capacitively-coupled electrostatic (cce) probe arrangement for detecting strike step in a plasma processing chamber and methods thereof | |
WO2010005931A3 (en) | Capacitively-coupled electrostatic (cce) probe arrangement for detecting dechucking in a plasma processing chamber and methods thereof | |
WO2007109252A3 (en) | Method of plasma processing with in-situ monitoring and process parameter tuning | |
JP2008515198A5 (en) | ||
SG196801A1 (en) | Methods and systems for high confidence utilization of datasets | |
WO2003096382A3 (en) | Methods and apparatus for plasma processing control | |
WO2004011905A8 (en) | Quality assurance/quality control for electrospray ionization processes | |
WO2007143625A3 (en) | Method and apparatus for tire pressure monitoring | |
WO2007046996A3 (en) | Methods of network access configuration in an ip network | |
WO2006011996A3 (en) | Methods and apparatus for the optimization of etch resistance in a plasma processing system | |
IL194430A0 (en) | Audio gain control using specific-loudness-based auditory event detection | |
EP1637616A3 (en) | System and method for monitoring laser shock processing | |
WO2008092936A3 (en) | Method and apparatus for measuring process parameters of a plasma etch process | |
TW200801445A (en) | Method of measuring warpage of rear surface of substrate | |
WO2007002132A3 (en) | High frequency or multifrequency resistivity tool | |
WO2007142798A3 (en) | Methods and apparatuses for detecting deviations from legitimate operation on a wireless network | |
AU2001268327A1 (en) | Tire defect detection system and method | |
WO2007001838A3 (en) | Methods and apparatus for igniting a low pressure plasma | |
WO2003103017A3 (en) | Method and system of determining chamber seasoning condition by optical emission | |
WO2007068501A3 (en) | Determining timing accuracy of an oscillator in an electronic apparatus | |
WO2004099751A3 (en) | Sealing process inspection device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A2 Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KM KP KR KZ LC LK LR LS LT LU LV LY MA MD MG MK MN MW MX MZ NA NG NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SM SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW |
|
AL | Designated countries for regional patents |
Kind code of ref document: A2 Designated state(s): GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LT LU LV MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
WWE | Wipo information: entry into national phase |
Ref document number: 2007533684 Country of ref document: JP |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
WWE | Wipo information: entry into national phase |
Ref document number: 1020077009424 Country of ref document: KR |
|
WWE | Wipo information: entry into national phase |
Ref document number: 200580039838.0 Country of ref document: CN |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 05805641 Country of ref document: EP Kind code of ref document: A2 |